RUICHIPS RU6H9P

RU6H9P
N-Channel Advanced Power MOSFET
MOSFET
Features
Pin Description
•600V/9.5A,
RDS (ON) =0.7Ω (Typ.) @ VGS=10V
• Gate charge minimized
• Low Crss( Typ. 20pF)
• Extremely high dv/dt capability
• 100% avalanche tested
TO-220F
• Lead Free and Green Available
Applications
• High efficiency switch mode power
supplies
• Lighting
N-Channel MOSFET
Absolute Maximum Ratings
Symbol
Parameter
Rating
Unit
Common Ratings (TC=25°C Unless Otherwise Noted)
VDSS
Drain-Source Voltage
600
VGSS
Gate-Source Voltage
±30
Maximum Junction Temperature
150
°C
-55 to 150
°C
TC=25°C
9.5
A
TC=25°C
38
TJ
TSTG
IS
Storage Temperature Range
Diode Continuous Forward Current
Mounted on Large Heat Sink
IDP
300μs Pulse Drain Current Tested
ID
PD
RθJC
Continuous Drain Current
Maximum Power Dissipation
Thermal Resistance-Junction to Case
①
V
A
①
TC=25°C
9.5
TC=100°C
TC=25°C
6.2
30
TC=100°C
12
①
A
W
4.2
°C/W
10
mJ
Drain-Source Avalanche Ratings
EAS
②
Avalanche Energy, Single Pulsed
Copyright Ruichips Semiconductor Co., Ltd
Rev. A – FEB., 2012
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RU6H9P
Electrical Characteristics
Symbol
(TC=25°C Unless Otherwise Noted)
Parameter
Test Condition
RU6H9P
Min.
Typ.
Max.
Unit
Static Characteristics
BVDSS
Drain-Source Breakdown Voltage
IDSS
Zero Gate Voltage Drain Current
VGS(th)
IGSS
RDS(ON)
③
VGS=0V, IDS=250µA
V
600
VDS= 600V, VGS=0V
1
TJ=85°C
Gate Threshold Voltage
VDS=VGS, IDS=250µA
Gate Leakage Current
VGS=±30V, VDS=0V
Drain-Source On-state Resistance
VGS= 10V, IDS=4.75A
30
2
3
0.7
µA
4
V
±100
nA
0.8
Ω
1.2
V
Diode Characteristics
VSD
③
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
ISD=9.5A, VGS=0V
ISD=9.5A, dlSD/dt=100A/µs
450
ns
4.2
µC
10
Ω
④
Dynamic Characteristics
RG
Gate Resistance
VGS=0V,VDS=0V,F=1MHz
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
td(ON)
Turn-on Delay Time
tr
Turn-on Rise Time
td(OFF)
Turn-off Delay Time
tf
VGS=0V,
VDS= 300V,
Frequency=1.0MHz
1570
190
pF
20
40
VDD=300V, RL=32Ω,
IDS=9.5A, VGEN= 10V,
RG=25Ω
Turn-off Fall Time
60
ns
180
80
④
Gate Charge Characteristics
Qg
Total Gate Charge
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
Notes:
30
VDS=480V, VGS= 10V,
IDS=9.5A
5
nC
14
①Current limited by maximum junction temperature.
②Limited by TJmax, IAS =4.5A, VDD = 100V, RG = 50Ω , Starting TJ = 25°C.
③Pulse test ; Pulse width≤300µs, duty cycle≤2%.
④Guaranteed by design, not subject to production testing.
Copyright Ruichips Semiconductor Co., Ltd
Rev. A – FEB., 2012
2
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RU6H9P
Typical Characteristics
Drain Current
Ptot - Power (W)
ID - Drain Current (A)
Power Dissipation
Tj - Junction Temperature (°C)
Tj - Junction Temperature (°C)
Safe Operation Area
ID - Drain Current (A)
Normalized Effective Transient
Thermal Transient Impedance
VDS - Drain-Source Voltage (V)
Copyright Ruichips Semiconductor Co., Ltd
Rev. A – FEB., 2012
Square Wave Pulse Duration (sec)
3
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RU6H9P
Typical Characteristics
Drain-Source On Resistance
ID - Drain Current (A)
RDS(ON) - On Resistance (Ω)
Output Characteristics
VDS - Drain-Source Voltage (V)
ID - Drain Current (A)
Gate Threshold Voltage
RDS(ON) - On - Resistance ()
Normalized Threshold Voltage
Drain-Source On Resistance
VGS - Gate-Source Voltage (V)
Copyright Ruichips Semiconductor Co., Ltd
Rev. A – FEB., 2012
Tj - Junction Temperature (°C)
4
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RU6H9P
Typical Characteristics
Source-Drain Diode Forward
IS - Source Current (A)
Normalized On Resistance
Drain-Source On Resistance
Tj - Junction Temperature (°C)
VSD - Source-Drain Voltage (V)
Gate Charge
C - Capacitance (pF)
VGS - Gate-Source Voltage (V)
Capacitance
VDS - Drain-Source Voltage (V)
Copyright Ruichips Semiconductor Co., Ltd
Rev. A – FEB., 2012
QG - Gate Charge (nC)
5
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RU6H9P
Avalanche Test Circuit and Waveforms
Switching Time Test Circuit and Waveforms
Copyright Ruichips Semiconductor Co., Ltd
Rev. A – FEB., 2012
6
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RU6H9P
Ordering and Marking Information
Device
Marking
Package
Packaging
Quantity
Reel Size
Tape width
RU6H9P
RU6H9P
TO-220F
Tube
50
-
-
Copyright Ruichips Semiconductor Co., Ltd
Rev. A – FEB., 2012
7
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RU6H9P
Package Information
TO-220F-3L
SYMBOL
MM
INCH
MM
MIN
NOM
MAX
MIN
NOM
MAX
SYMBOL
MIN
NOM
INCH
MAX
MIN
NOM
MAX
E
9.96
10.16
10.36
0.392
0.400
0.408
Øp3
-
3.450
-
-
0.136
-
A
4.50
4.70
4.90
0.177
0.185
0.193
θ1
5°
7°
9°
5°
7°
9°
A1
2.34
2.54
2.74
0.092
0.100
0.108
θ2
-
45°
-
-
45°
-
A2
0.95
1.05
1.15
0.037
0.041
0.045
DEP
0.05
0.10
0.15
0.002
0.004
0.006
A3
0.42
0.52
0.62
0.017
0.020
0.024
F1
1.90
2.00
2.10
0.075
0.079
0.083
A4
2.65
2.75
2.85
0.104
0.108
0.112
F2
13.61
13.81
14.01
0.536
0.544
0.552
c
-
0.50
-
-
0.020
-
F3
3.20
3.30
3.40
0.126
0.130
0.134
D
15.67
15.87
16.07
0.617
0.625
0.633
G
3.25
3.45
3.65
0.128
0.136
0.144
Q
8.80
9.00
9.20
0.346
0.354
0.362
G1
5.90
6.00
6.10
0.232
0.236
0.240
H1
6.48
6.68
6.88
0.255
0.263
0.271
G2
6.90
7.00
7.10
0.272
0.276
0.280
b1
1.17
1.20
0.046
0.047
0.048
b2
0.77
0.8
0.85
0.030
0.031
0.033
e
2.54BSC
0.1BSC
Øp
-
3.183
-
-
0.125
-
1.24
L
12.78
12.98
13.18
0.503
0.511
0.519
b3
1.10
1.30
1.50
0.043
0.051
0.059
D1
8.99
9.19
9.39
0.354
0.362
0.370
E1
9.8
10.00
10.20
0.386
0.394
0.412
Øp1
1.40
1.50
1.60
0.055
0.059
0.063
K1
0.75
0.8
0.85
0.030
0.031
0.033
Øp2
1.15
1.20
1.25
0.045
0.047
0.049
ALL DIMENSIONS REFER TO JEDEC STANDARD
DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS
Copyright Ruichips Semiconductor Co., Ltd
Rev. A – FEB., 2012
8
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RU6H9P
Customer Service
Worldwide Sales and Service:
[email protected]
Technical Support:
[email protected]
Investor Relations Contacts:
[email protected]
Marcom Contact:
[email protected]
Editorial Contact:
[email protected]
HR Contact:
[email protected]
Legal Contact:
[email protected]
Shen Zhen RUICHIPS Semiconductor CO., LTD
Room 501, the 5floor An Tong Industrial Building,
NO.207 Mei Hua Road Fu Tian Area Shen Zhen City, CHINA
TEL: (86-755) 8311-5334
FAX: (86-755) 8311-4278
E-mail: [email protected]
Copyright Ruichips Semiconductor Co., Ltd
Rev. A – FEB., 2012
9
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