LC5523F

LC5523F
Single-Stage Power Factor Corrected
Off-Line Switching Regulator IC
Features and Benefits
Description
• Integrated on-time control circuit (it realizes high power
factor by average current control)
• Integrated startup circuit (no external startup circuit
necessary)
• Integrated soft-start circuit (reduces power stress during
start-up on the incorporated power MOSFET and
output rectifier)
• Integrated bias assist circuit (improves startup
performance, suppresses VCC voltage droop during
operation, and allows use of low-rated ceramic capacitor
on VCC pin)
• Integrated Leading Edge Blanking (LEB) circuit
• Integrated maximum on-time limit circuit
• Protection features:
▫ Overcurrent protection (OCP): pulse-by-pulse
▫ Overvoltage protection (OVP): pins VCC, OVP, and
OCP, auto restart
▫ Overload protection (OLP): auto restart
▫ Thermal shutdown (TSD): latched shutdown
The LC5500 series is the power IC for the LED driver
which has an incorporated power MOSFET, designed for
input capacitorless applications, and making it possible for
systems to comply with the harmonics standard (IEC610003-2 class C). The controller adapts the average current
control method for realizing high power factors, and the
quasi-resonant topology contributes to high efficiency and
low EMI noise.
The rich set of protection features helps to realize low component counts, and high performance-to-cost power supply.
The LC5523F is intended for isolated designs. The incorporated MOSFET has a VDSS(min) rating of 650 V and
RDS(on)(max) of 1.9 Ω. It is capable of a maximum output
power of 60 W on 230 VAC supply and 40 W on universal
input supply (85 to 265VAC) based on the thermal rating.
Note that the maximum output power can be up to 120% to
140% of this value. However, it may be limited in applications with low output voltage or short duty cycle.
Package: 7-pin TO-220F
Not to scale
Applications
• LED lighting fixtures
• LED light bulbs
LF 3052
LF 3051
LF 3054
Typical Application
F1
VA C
L1
D1
D2
D3
D4
C11
T1
L2
C1
C8
D8
R5
C2
C9
D9
U1
LC5523F
D5
Vcc
R10
PC2
R1
R9
PC1
DZ1
D6
C17
LED
R13
R11
C13 R17
DZ2
PC2
R6
Q1
R12
C4
Control
Part
R8
C10
C12 U2
+
C14
R14
R15
R18
C15
R19 R20
R16
C16
D/ST S/GND NC VCC OCP FB OVP
1
2
3 4
5
6
7
R7
C3
C5
ROCP
LC5523F-DS
R3
C6
PC1
R21
D7
C18 DZ3
R4
C7
SANKEN ELECTRIC CO., LTD.
http://www.sanken-ele.co.jp/en/
November 26, 2012
Single-Stage Power Factor Corrected
Off-Line Switching Regulator IC
LC5523F
Selection Guide
Part Number
LC5523F
Package
TO-220F
(specify leadform when ordering)
The polarity value for current specifies a sink as "+," and a source as “−,” referencing the IC.
Absolute Maximum Ratings TA = 25°C, unless otherwise specified
Characteristic
Drain Current1
Single Pulse Avalanche Energy2
Symbol
IDPeak
EAS
Pins
Rating
Single pulse
Notes
1–2
9.2
Unit
A
ILPeak = 2.9 A, VDD = 99 V, L = 20 mH
1–2
99
mJ
Control Part Input Voltage
VCC
4–2
35
V
OCP Pin Voltage
VOCP
5–2
−2.0 to 5.0
V
FB Pin Voltage
VFB
6–2
−0.3 to 7.0
V
OVP Pin Voltage
VOVP
7–2
−0.3 to 5.0
V
Allowable Power Dissipation of
MOSFET3
PD1
With infinite heatsink
1–2
20.2
W
Without heatsink
1–2
1.8
W
Internal Frame Temperature in
Operation
TF
―
−20 to 115
°C
Operating Ambient Temperature
TOP
―
−55 to 115
°C
Storage Temperature
Tstg
―
−55 to 125
°C
Channel Temperature
Tch
―
150
°C
1Refer
to MOSFET Safe Operating Area Curve.
to MOSFET Avalanche Energy Derating Coefficient Curve.
3Refer to MOSFET Temperature versus Power Dissipation Curve.
2Refer
LC5523F-DS
SANKEN ELECTRIC CO., LTD.
2
November 26, 2012
Single-Stage Power Factor Corrected
Off-Line Switching Regulator IC
LC5523F
ELECTRICAL CHARACTERISTICS of Control Part TA = 25°C, VCC = 20 V, unless otherwise specified
Characteristic
Symbol
Test Conditions
Pins
Min.
Typ.
Max.
Unit
Startup Operation
Operation Start Voltage
VCC(ON)
4–2
13.8
15.1
17.3
V
Operation Stop Voltage*
VCC(OFF)
4–2
8.4
9.4
10.7
V
ICC(ON)
4–2
–
–
3.7
mA
VSTARTUP
1–2
42
57
72
V
4–2
−5.5
−3.0
−1.0
mA
Operating Current
Startup Circuit Operation Voltage
Startup Current
ICC(STARTUP) VCC = 13 V
Startup Current Threshold Biasing
Voltage-1*
VCC(BIAS)1
4–2
9.5
11.0
12.5
V
Startup Current Threshold Biasing
Voltage-2
VCC(BIAS)2
4–2
14.4
16.6
18.8
V
fOSC
1–2
11.0
14.0
18.0
kHz
Maximum On-Time
tON(MAX)
1–2
30.0
40.0
50.0
μs
FB Pin Voltage Minimum Limit
VFB(MIN)
6–2
0.55
0.90
1.25
V
Maximum Feedback Current
IFB(MAX)
6–2
−40
−25
−10
μA
Leading Edge Blanking Time
tON(LEB)
5–2
−
500
−
ns
Quasi-Resonant Operation Threshold
Voltage-1
VBD(TH1)
5–2
0.14
0.24
0.34
V
Quasi-Resonant Operation Threshold
Voltage-2
VBD(TH2)
5–2
0.12
0.17
0.22
V
OCP Pin Overcurrent Protection
(OCP) Threshold Voltage
VOCP
5–2
−0.66
−0.60
−0.54
V
OCP Pin Source Current
IOCP
5–2
−120
−40
−10
μA
OCP Pin Overvoltage Protection
(OVP) Threshold Voltage
VBD(OVP)
5–2
2.2
2.6
3.0
V
Overload Protection (OLP) Threshold
Voltage-1
VFB(OLP)1
6–2
5.0
5.5
6.0
V
Overload Protection (OLP) Threshold
Voltage-2
VFB(OLP)2
6–2
4.1
4.5
4.9
V
OVP Pin OVP Threshold Voltage
VOVP(OVP)
7–2
1.6
2.0
2.4
V
VCC Pin OVP Threshold Voltage
VCC(OVP)
4–2
28.5
31.5
34.0
V
TJ(TSD)
–
135
–
–
°C
Normal Operation
PWM Operation Frequency
Protection Operation
Thermal Shutdown Activating
Temperature
*VCC(BIAS)1 > VCC(OFF) always.
LC5523F-DS
SANKEN ELECTRIC CO., LTD.
3
November 26, 2012
Single-Stage Power Factor Corrected
Off-Line Switching Regulator IC
LC5523F
ELECTRICAL CHARACTERISTICS of MOSFET TA = 25°C, unless otherwise specified
Characteristic
Drain-to-Source Breakdown Voltage
Drain Leakage Current
On Resistance
Switching Time
Thermal Resistance
LC5523F-DS
Symbol
Pins
Min.
Typ.
Max.
Unit
VDSS
Test Conditions
1–2
650
―
―
V
IDSS
1–2
―
―
300
μA
RDS(on)
1–2
―
―
1.9
Ω
tf
Rθch-F
Between channel and internal frame
SANKEN ELECTRIC CO., LTD.
1–2
―
―
400
ns
―
―
―
3.1
°C/W
4
November 26, 2012
Single-Stage Power Factor Corrected
Off-Line Switching Regulator IC
LC5523F
Characteristic Performance
MOSFET Safe Operating Area Curve
10
0.1 ms
100
Drain current limited
by on-resistance
80
60
40
20
0
1
Drain Current, ID (A)
Safe Operating Area
Temperature Derating Coefficient (%)
S. O. A. Temperature Derating Coefficient Curve
0
25
50
75
100
125
1 ms
TA = 25°C, single pulse
0.1
150
To use this graph, apply the S.O.A
temperature derating coefficient
taken from the graph at the left
Channel Temperature, Tch (°C)
0.01
10
100
1000
Drain-to-Source Voltage, VDS (V)
100
MOSFET Temperature versus Power Dissipation Curve
Allowable Power Dissipation, PD1 (W)
EAS
Temperature Derating Coefficient (%)
MOSFET Avalanche Energy Derating Coefficient Curve
80
60
40
20
0
25
50
75
100
125
150
30
25
20.2
20
With infinite heatsink
15
10
5
0
25
Transient Thermal Resistance, Rθch-c (°C/W)
Channel Temperature, Tch (°C)
10
Without heatsink
1.8
0
50
75
100
115
125
150
Ambient Temperature, TA (°C)
Transient Thermal Resistance Curve
1
0.1
0.01
0.001
10-6
10-5
10-4
10-3
10-2
10-1
Time (s)
LC5523F-DS
SANKEN ELECTRIC CO., LTD.
5
November 26, 2012
Single-Stage Power Factor Corrected
Off-Line Switching Regulator IC
LC5523F
Functional Block Diagram
VCC
④
Control Part
① D/ST
STARTUP
TSD
UVLO
Reg
Drv
Bias
OVP
OVP ⑦
② S/GND
S
RQ
OCP ⑤
Bottom
Detection
NC
3
OCP
OLP
OSC
LEB
Feedback
Control
⑥ FB
Reg
Pin-out Diagrams
D/ST
1
LC5523F Pin List Table
S/GND
2
NC
3
VCC
4
OCP
FB
(LF 3051)
5
6
OVP
7
D/ST
1
S/GND
2
NC
VCC
3
OCP
FB
OVP
LC5523F-DS
(LF 3052)
4
Number
Name
Function
1
D/ST
MOSFET drain pin and input of the startup current
2
S/GND
MOSFET source and GND pin for the Control Part
3
NC
4
VCC
No connection
Supply voltage input and Overvoltage protection (OVP) signal input
5
OCP
Overcurrent Protection, quasi-resonant signal input pin, and
Overvoltage Protection (OVP) signal input
6
FB
7
OVP
Feedback signal input and Overload Protection (OLP) signal input
Overvoltage Protection (OVP) signal input
5
6
7
1
D/ST
2
S/GND
3
NC
4
VCC
5
OCP
6
FB
7
OVP
(LF 3054)
SANKEN ELECTRIC CO., LTD.
6
November 26, 2012
Single-Stage Power Factor Corrected
Off-Line Switching Regulator IC
LC5523F
Package Outline Drawing, TO-220F Leadform 3051
2.6 ±0.2
15 ±0.3
（5.6）
Gate burr
Ø3.2 ±0.2
4.2 ±0.2
2.8 +0.2
10 ±0.2
LC
（1.1）
a
2.6 ±0.1
（At base of pin）
10.4 ±0.5
7-0.62 ±0.15
+0.2
7-0.55 -0.1
R-end
R-end
+0.2
0.45 -0.1
5×P1.17±0.15
＝5.85±0.15
2 ±0.15
5±0.5
5±0.5
b
（At base of pin）
5.08±0.6
2.54±0.6
（At tip of pin）
（At tip of pin）
2
1
4
3
6
5
7
0.5
0.5
Front view
Unit: mm
Package: TO-220F-7L
"Gate Burr" shows area
where 0.3 mm (max) gate
burr may be present
0.5
0.5
Side view
a: Part # 5523F
b: Lot number
st
1 letter: Last digit of year
nd
2 letter: Month
Jan to September: Numeric
October: O
November: N
December: D
rd
th
3 and 4 letter: Date
01 to 31: Numeric
th
5 letter: Sanken control number
Pin treatment Pb-free. Device composition
compliant with the RoHS directive.
LC5523F-DS
SANKEN ELECTRIC CO., LTD.
7
November 26, 2012
Single-Stage Power Factor Corrected
Off-Line Switching Regulator IC
LC5523F
Package Outline Drawing, TO-220F Leadform 3052
2.6 ±0.2
LC
15 ±0.3
（5.6）
Gate burr
Ø3.2 ±0.2
4.2 ±0.2
2.8 +0.2
10 ±0.2
a
（1.1）
2.6 ±0.1
（At base of pin）
5±0.5
b
10.4 ±0.5
7-0.62 ±0.15
+0.2
7-0.55 -0.1
0.45 +0.2
-0.1
5×P1.17±0.15
＝5.85±0.15
2 ±0.15
R-end
5.08±0.6
（At base of pin）
（At tip of pin）
0.5
0.5
Front View
1
0.5
Side View
2 3 4 5 6 7
Unit: mm
Package: TO-220F-7L
"Gate Burr" shows area
where 0.3 mm (max) gate
burr may be present
Pin treatment Pb-free. Device composition
compliant with the RoHS directive.
LC5523F-DS
0.5
a: Part # 5523F
b: Lot number
st
1 letter: Last digit of year
nd
2 letter: Month
Jan to September: Numeric
October: O
November: N
December: D
rd
th
3 and 4 letter: Date
01 to 31: Numeric
th
5 letter: Sanken control number
SANKEN ELECTRIC CO., LTD.
8
November 26, 2012
Single-Stage Power Factor Corrected
Off-Line Switching Regulator IC
LC5523F
2.8 ±0.2
Package Outline Drawing, TO-220F Leadform 3054
2.6 ±0.2
a
b
2.8 ±0.5
（At tip of pin）
2.5 ±0.5
LC
15 ±0.3
(5.6)
Gate burr
4.2±0.2
Ø3.2 ±0.2
10 ±0.2
(1.1)
3-( R1)
2.6 ±0.1
（At base of pin）
（At base of pin）
0.5
（At tip of pin）
5×P 1.17 ±0.15
= 5.85 ±0.15
2 ±0.15
+0.2
0.45 -0.1
7-0.55 +0.2
-0.1
5 ±0.5
7-0.62 ±0.15
3.8±0.5
0.5
Plan View
1
0.5
0.5
Side View
2 3 4 5 6 7
Unit: mm
Package: TO-220F-7L
"Gate Burr" shows area
where 0.3 mm (max) gate
burr may be present
a: Part # 5523F
b: Lot number
st
1 letter: Last digit of year
nd
2 letter: Month
Jan to September: Numeric
October: O
November: N
December: D
rd
th
3 and 4 letter: Date
01 to 31: Numeric
th
5 letter: Sanken control number
Pin treatment Pb-free. Device composition
compliant with the RoHS directive.
LC5523F-DS
SANKEN ELECTRIC CO., LTD.
9
November 26, 2012
Single-Stage Power Factor Corrected
Off-Line Switching Regulator IC
LC5523F
Because reliability can be affected adversely by improper storage
environments and handling methods, please observe the following
cautions.
Cautions for Storage
•
Ensure that storage conditions comply with the standard
temperature (5°C to 35°C) and the standard relative humidity
(around 40% to 75%); avoid storage locations that experience
extreme changes in temperature or humidity.
•
Avoid locations where dust or harmful gases are present and
avoid direct sunlight.
•
Reinspect for rust on leads and solderability of the products that
have been stored for a long time.
Cautions for Testing and Handling
When tests are carried out during inspection testing and other
standard test periods, protect the products from power surges
from the testing device, shorts between the product pins, and
wrong connections. Ensure all test parameters are within the
ratings specified by Sanken for the products.
Remarks About Using Silicone Grease with a Heatsink
• When silicone grease is used in mounting the products on a
heatsink, it shall be applied evenly and thinly. If more silicone
grease than required is applied, it may produce excess stress.
• Volatile-type silicone greases may crack after long periods of
time, resulting in reduced heat radiation effect. Silicone greases
with low consistency (hard grease) may cause cracks in the mold
resin when screwing the products to a heatsink.
Our recommended silicone greases for heat radiation purposes,
which will not cause any adverse effect on the product life, are
indicated below:
Type
Suppliers
G746
Shin-Etsu Chemical Co., Ltd.
YG6260
Momentive Performance Materials Inc.
SC102
Dow Corning Toray Co., Ltd.
Cautions for Mounting to a Heatsink
• When the flatness around the screw hole is insufficient, such as when
mounting the products to a heatsink that has an extruded (burred)
screw hole, the products can be damaged, even with a lower than
LC5523F-DS
recommended screw torque. For mounting the products, the mounting
surface flatness should be 0.05 mm or less.
• Please select suitable screws for the product shape. Do not use
a flat-head machine screw because of the stress to the products.
Self-tapping screws are not recommended. When using self-tapping
screws, the screw may enter the hole diagonally, not vertically,
depending on the conditions of hole before threading or the work
situation. That may stress the products and may cause failures.
• Recommended screw torque: 0.588 to 0.785 N●m (6 to 8 kgf●cm).
• For tightening screws, if a tightening tool (such as a driver) hits the
products, the package may crack, and internal stress fractures may
occur, which shorten the lifetime of the electrical elements and can
cause catastrophic failure. Tightening with an air driver makes a
substantial impact. In addition, a screw torque higher than the set
torque can be applied and the package may be damaged. Therefore,
an electric driver is recommended.
When the package is tightened at two or more places, first pre-tighten
with a lower torque at all places, then tighten with the specified torque.
When using a power driver, torque control is mandatory.
Soldering
•
When soldering the products, please be sure to minimize the
working time, within the following limits:
260±5°C 10±1 s
(Flow, 2 times)
380±10°C 3.5±0.5 s (Soldering iron, 1 time)
• Soldering should be at a distance of at least 2.0 mm from the
body of the products.
Electrostatic Discharge
•
When handling the products, the operator must be grounded.
Grounded wrist straps worn should have at least 1 MΩ of
resistance from the operator to ground to prevent shock hazard,
and it should be placed near the operator.
•
Workbenches where the products are handled should be
grounded and be provided with conductive table and floor mats.
•
When using measuring equipment such as a curve tracer, the
equipment should be grounded.
•
When soldering the products, the head of soldering irons or the
solder bath must be grounded in order to prevent leak voltages
generated by them from being applied to the products.
•
The products should always be stored and transported in Sanken
shipping containers or conductive containers, or be wrapped in
aluminum foil.
SANKEN ELECTRIC CO., LTD.
10
November 26, 2012
LC5523F
Single-Stage Power Factor Corrected
Off-Line Switching Regulator IC
• The contents in this document are subject to changes, for improvement and other purposes, without notice. Make sure that this is the
latest revision of the document before use.
• Application and operation examples described in this document are quoted for the sole purpose of reference for the use of the products herein and Sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights or
any other rights of Sanken or any third party which may result from its use.
• Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures
including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device
failure or malfunction.
• Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.).
When considering the use of Sanken products in the applications where higher reliability is required (transportation equipment and
its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever
long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest Sanken sales
representative to discuss, prior to the use of the products herein.
The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is required
(aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited.
• In the case that you use Sanken products or design your products by using Sanken products, the reliability largely depends on the
degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation range is set by derating the
load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. In general,
derating factors include electric stresses such as electric voltage, electric current, electric power etc., environmental stresses such
as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor products. For these stresses,
instantaneous values, maximum values and minimum values must be taken into consideration.
In addition, it should be noted that since power devices or IC's including power devices have large self-heating value, the degree of
derating of junction temperature affects the reliability significantly.
• When using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically
or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance
and proceed therewith at your own responsibility.
• Anti radioactive ray design is not considered for the products listed herein.
• Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of Sanken's distribution network.
• The contents in this document must not be transcribed or copied without Sanken's written consent.
LC5523F-DS
SANKEN ELECTRIC CO., LTD.
11
November 26, 2012