LC5545LD, LC5546LD, LC5548LD Datasheet

LC5540LD Series
Single-Stage Power Factor Corrected
Off-Line Switching Regulator ICs
Features and Benefits
Description
• Integrated on-time control circuit (it realizes high power
factor by average current control)
• Integrated startup circuit (no external startup
circuit necessary)
• Integrated soft-start circuit (reduces power stress during
start-up on the incorporated power MOSFET and
output rectifier)
• Integrated bias assist circuit (improves startup
performance, suppresses VCC voltage droop during
operation, and allows use of low-rated ceramic capacitor
on VCC pin)
• Integrated Leading Edge Blanking (LEB) circuit
• Integrated maximum on-time limit circuit
• Protection features:
▫ Overcurrent protection (OCP): pulse-by-pulse
▫ Overvoltage protection (OVP): latched shutdown
▫ Overload protection (OLP): latched shutdown
▫ Thermal shutdown (TSD): latched shutdown
The LC5540LD series is the power IC for the isolated type
LED driver which has an incorporated power MOSFET,
designed for input capacitorless applications, and making it
possible for systems to comply with the harmonics standard
(IEC61000-3-2 class C), even during light load condition.
The controller adapts the average current control method for
realizing high power factors, and the quasi-resonant topology contributes to high efficiency and low EMI noise. The
series is housed in DIP8 packages.
The rich set of protection features helps to realize low component counts, and high performance-to-cost power supply.
The incorporated MOSFET has a VDSS(min) rating from
650 V (LC5545LD and LC5546LD) to 800 V (LC5548LD).
The RDS(on)(max) is 1.9 Ω (LC5546LD) to 3.95 Ω
(LC5545LD). It is capable of a maximum output power of
20 W on 230 VAC supply to 16 W on universal input supply
(85 to 265 VAC) (LC5546LD) based on the thermal rating.
Note that the maximum output power can be up to 120% to
140% of this value. However, it may be limited in applications with low output voltage or short duty cycle.
Package: 8-pin DIP
Applications
• LED lighting fixtures
• LED light bulbs
Not to scale
Typical Application
F1
VAC
L1
C11
D1
D2
D3
D4
T1
L2
C1
C8
D8
R5
R8 R10
PC2
C2
C9
Q1
C10
D5
U1
LC554xLD
8
S/GND
5
NC
6
D/ST
OVP
R1
R9
PC1
R11
R12
C13
C4
DZ2
PC2
C3
Controller
Chip
C17
D6
R14
R17
R15
R18
-
DZ1
C12
R6
LED
R13
D9
U2
+
C14
C15
R16
C16
R19 R20
S/GND VCC OCP FB
1
2
3
4
R7
C5
ROCP
LC5540LD-DS
R3
C6
R21
C18 DZ3
R4
PC1
D7
C7
SANKEN ELECTRIC CO., LTD.
http://www.sanken-ele.co.jp/en/
January 28, 2013
Single-Stage Power Factor Corrected
Off-Line Switching Regulator ICs
LC5540LD Series
Selection Guide
MOSFET
VDSS(min)
(V)
Part
Number
LC5545LD
PWM Operation
Frequency, fOSC(typ)
(kHz)
On-Time
tON(MAX)(typ)
(μs)
230 VAC
85 to 265
VAC
3.95
72
9.3
13
10
1.9
60
11.2
20
16
3.5
72
9.3
13
10
650
LC5546LD
LC5548LD
POUT*
(W)
RDS(on)
(max)
(Ω)
800
*Based on the thermal rating; the allowable maximum output power can be up to 120% to 140% of
this value. However, maximum output power may be limited in such an application with low output
voltage or short duty cycle.
The polarity value for current specifies a sink as "+," and a source as “−,” referencing the IC.
Absolute Maximum Ratings Unless specifically noted, TA is 25°C
Characteristic
Symbol
Notes
Pins
LC5545LD
Drain
Current1
IDPeak
LC5546LD
Single pulse
8–1
LC5548LD
Single Pulse Avalanche Energy2
EAS
LC5545LD
ILPeak = 2.0 A, VDD = 99 V, L = 20 mH
LC5546LD
ILPeak = 2.7 A, VDD = 99 V, L = 20 mH
LC5548LD
ILPeak = 2.3 A, VDD = 99 V, L = 20 mH
8–1
Rating
Unit
2.5
A
4.0
A
2.6
A
47
mJ
86
mJ
56
mJ
Control Part Input Voltage
VCC
2–1
35
V
OCP Pin Voltage
VOCP
3–1
−2.0 to 5.0
V
FB Pin Voltage
VFB
4–1
−0.3 to 7.0
V
OVP Pin Voltage
VOVP
6–1
−0.3 to 5.0
V
Allowable Power Dissipation of
MOSFET3
PD1
8–1
0.97
W
Operating Ambient Temperature
TOP
―
−55 to 125
°C
Storage Temperature
Tstg
―
−55 to 125
°C
Channel Temperature
Tch
―
150
°C
Mounted on a 15 mm × 15 mm PCB
1Refer
to MOSFET Safe Operating Area Curve.
2Refer to MOSFET Avalanche Energy Derating Coefficient Curve.
3Refer to MOSFET Temperature versus Power Dissipation Curve.
LC5540LD-DS
SANKEN ELECTRIC CO., LTD.
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January 28, 2013
Single-Stage Power Factor Corrected
Off-Line Switching Regulator ICs
LC5540LD Series
Electrical Characteristics of Control Part TA = 25°C, VCC = 20 V, unless otherwise specified
Characteristic
Symbol
Test Conditions
Pins
Min.
Typ.
Max.
Unit
Power Supply Startup Operation
Operation Start Voltage
VCC(ON)
2–1
13.8
15.1
17.3
V
Operation Stop Voltage*
VCC(OFF)
2–1
8.4
9.4
10.7
V
ICC(ON)
2–1
–
–
4.7
mA
VSTARTUP
8–1
18
21
24
V
2–1
−8.5
−4.0
−1.5
mA
2–1
9.5
11.0
12.5
V
60
72
84
kHz
50
60
70
kHz
60
72
84
kHz
Circuit Current in Operation
Startup Circuit Operation Voltage
Startup Current
Startup Current Threshold Biasing
Voltage*
ICC(STARTUP)
VCC = 13 V
VCC(BIAS)
Normal Operation
LC5545LD
PWM Operation Frequency
fOSC
LC5546LD
8–1
LC5548LD
LC5545LD
8.0
9.3
11.2
μs
8–1
9.0
11.2
13.4
μs
8.0
9.3
11.2
μs
VFB(MIN)
4–1
0.50
0.85
1.20
V
Maximum Feedback Current
IFB(MAX)
4–1
–40
–25
–10
μA
Leading Edge Blanking Time
tON(LEB)
3–1
−
600
−
ns
Quasi-Resonant Operation Threshold
Voltage-1
VBD(TH1)
3–1
0.14
0.24
0.34
V
Quasi-Resonant Operation Threshold
Voltage-2
VBD(TH2)
3–1
0.11
0.16
0.21
V
OCP Pin Overcurrent Protection
(OCP) Threshold Voltage
VOCP
3–1
−0.66
−0.60
−0.54
V
OCP Pin Source Current
IOCP
3–1
−120
−40
−10
μA
OCP Pin Overvoltage Protection
(OVP) Operation Voltage
VBD(OVP)
3–1
2.2
2.6
3.0
V
Overload Protection (OLP) Threshold
Voltage
VFB(OLP)
4–1
4.1
4.5
4.9
V
OVP Pin OVP Threshold Voltage
VOVP(OVP)
6–1
1.6
2.0
2.4
V
VCC Pin OVP Threshold Voltage
VCC(OVP)
2–1
28.5
31.5
34.0
V
TJ(TSD)
–
135
–
–
°C
Maximum On-Time
tON(MAX)
FB Pin Control Minimum Voltage
LC5546LD
LC5548LD
Protection Operation
Thermal Shutdown Activating
Temperature
*VCC(BIAS) > VCC(OFF) always.
LC5540LD-DS
SANKEN ELECTRIC CO., LTD.
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January 28, 2013
Single-Stage Power Factor Corrected
Off-Line Switching Regulator ICs
LC5540LD Series
ELECTRICAL CHARACTERISTICS of MOSFET TA = 25°C, unless otherwise specified
Characteristic
Symbol
Test Conditions
Pins
LC5545LD
Drain-to-Source Breakdown Voltage
VDSS
LC5546LD
8–1
LC5548LD
Drain Leakage Current
IDSS
8–1
LC5545LD
On-Resistance
Switching Time
RDS(ON)
tr
LC5546LD
8–1
Unit
―
V
650
―
―
V
800
―
―
V
―
―
300
μA
―
―
3.95
Ω
Ω
―
1.9
―
―
3.5
Ω
LC5545LD
―
―
250
ns
LC5546LD
LC5546LD
LC5548LD
LC5540LD-DS
Max.
―
―
LC5545LD
Rθch-c
Typ.
650
LC5548LD
8–1
LC5548LD
Thermal Resistance
Min.
Between channel and case; case
temperature, TC , measured at the
center of the case top surface
SANKEN ELECTRIC CO., LTD.
―
―
―
400
ns
―
―
400
ns
―
―
42
°C/W
―
―
35.5
°C/W
―
―
40
°C/W
4
January 28, 2013
Single-Stage Power Factor Corrected
Off-Line Switching Regulator ICs
LC5540LD Series
Characteristic Performance
LC5545LD
MOSFET Safe Operating Area Curve
100
TA = 25°C, single pulse
100
10
80
Drain Current, ID (A)
Safe Operating Area
Temperature Derating Coefficient (%)
S. O. A. Temperature Derating Coefficient Curve
60
40
20
Drain current limited
by on-resistance
1
0.1 ms
1 ms
0.1
0
0
25
50
75
100
125
150
To use this graph, apply the S.O.A
temperature derating coefficient
taken from the graph at the left
Channel Temperature, Tch (°C)
0.01
1
10
100
1000
Drain-to-Source Voltage, VDS (V)
100
MOSFET Temperature versus Power Dissipation Curve
Allowable Power Dissipation, PD1 (W)
EAS
Temperature Derating Coefficient (%)
MOSFET Avalanche Energy Derating Coefficient Curve
80
60
40
20
0
25
50
75
100
125
150
1.2
1.0
0.8
0.6
0.4
0.2
0
0
Transient Thermal Resistance, Rθch-c (°C/W)
Channel Temperature, Tch (°C)
10
25
50
75
100
125
150
Ambient Temperature, TA (°C)
Transient Thermal Resistance Curve
1
0.1
0.01
10–6
10–5
10–4
10–3
10–2
10–1
Time (s)
LC5540LD-DS
SANKEN ELECTRIC CO., LTD.
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January 28, 2013
Single-Stage Power Factor Corrected
Off-Line Switching Regulator ICs
LC5540LD Series
Characteristic Performance
LC5546LD
MOSFET Safe Operating Area Curve
100
TA = 25°C, single pulse
100
Drain current limited
by on-resistance
10
80
Drain Current, ID (A)
Safe Operating Area
Temperature Derating Coefficient (%)
S. O. A. Temperature Derating Coefficient Curve
60
40
20
0.1 ms
1 ms
1
0.1
0
0
25
50
75
100
125
150
To use this graph, apply the S.O.A
temperature derating coefficient
taken from the graph at the left
Channel Temperature, Tch (°C)
0.01
1
10
100
1000
Drain-to-Source Voltage, VDS (V)
100
MOSFET Temperature versus Power Dissipation Curve
Allowable Power Dissipation, PD1 (W)
EAS
Temperature Derating Coefficient (%)
MOSFET Avalanche Energy Derating Coefficient Curve
80
60
40
20
0
25
50
75
100
125
150
1.2
1.0
0.8
0.6
0.4
0.2
0
0
Transient Thermal Resistance, Rθch-c (°C/W)
Channel Temperature, Tch (°C)
10
25
50
75
100
125
150
Ambient Temperature, TA (°C)
Transient Thermal Resistance Curve
1
0.1
0.01
10–6
10–5
10–4
10–3
10–2
10–1
Time (s)
LC5540LD-DS
SANKEN ELECTRIC CO., LTD.
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January 28, 2013
Single-Stage Power Factor Corrected
Off-Line Switching Regulator ICs
LC5540LD Series
Characteristic Performance
LC5548LD
MOSFET Safe Operating Area Curve
100
TA = 25°C, single pulse
100
Drain current limited
by on-resistance
10
80
Drain Current, ID (A)
Safe Operating Area
Temperature Derating Coefficient (%)
S. O. A. Temperature Derating Coefficient Curve
60
40
20
0.1 ms
1 ms
1
0.1
0
0
25
50
75
100
125
150
To use this graph, apply the S.O.A
temperature derating coefficient
taken from the graph at the left
Channel Temperature, Tch (°C)
0.01
1
10
100
1000
Drain-to-Source Voltage, VDS (V)
100
MOSFET Temperature versus Power Dissipation Curve
Allowable Power Dissipation, PD1 (W)
EAS
Temperature Derating Coefficient (%)
MOSFET Avalanche Energy Derating Coefficient Curve
80
60
40
20
0
25
50
75
100
125
150
1.2
1.0
0.8
0.6
0.4
0.2
0
0
Transient Thermal Resistance, Rθch-c (°C/W)
Channel Temperature, Tch (°C)
10
25
50
75
100
125
150
Ambient Temperature, TA (°C)
Transient Thermal Resistance Curve
1
0.1
0.01
10–6
10–5
10–4
10–3
10–2
10–1
Time (s)
LC5540LD-DS
SANKEN ELECTRIC CO., LTD.
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January 28, 2013
Single-Stage Power Factor Corrected
Off-Line Switching Regulator ICs
LC5540LD Series
Functional Block Diagram
VCC
②
Control Part
⑧ D/ST
START UP
TSD
UVLO
Reg
Drv
Bias
OVP
OVP ⑥
① S/GND
S
RQ
OCP ③
Bottom
Detection
NF ⑤
OCP
OSC
OLP
LEB
Feedback
Control
④ FB
Reg
Pin List Table
Pin-out Diagram
S/GND 1
8 D/ST
VCC 2
OCP 3
FB 4
LC5540LD-DS
6 OVP
5 NF
Number
Name
1
S/GND
2
VCC
Supply voltage input and Overvoltage Protection (OVP) signal input
3
OCP
Overcurrent Protection (OCP), quasi-resonant signal input, and
Overvoltage Protection (OVP) signal input
4
FB
Feedback signal input and Overload Protection (OLP) signal input
5
NF
No function; must be externally connected to S/GND pin with as
short a trace as possible, for stable operation of the IC
6
OVP
7
–
8
D/ST
Function
MOSFET source and GND pin for the Control Part
Overvoltage Protection (OVP) signal input
Pin removed
MOSFET drain pin and input of the startup current
SANKEN ELECTRIC CO., LTD.
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January 28, 2013
Single-Stage Power Factor Corrected
Off-Line Switching Regulator ICs
LC5540LD Series
Package Outline Drawing, DIP8
9.4 ±0.3
8
5
LC
6.5 ±0.2
a
b
c
1.0 +0.3
-0.05
4
1
+0.3
1.52
-0.05
3.3 ±0.2
7.5 ±0.5
4.2 ±0.3
3.4 ±0.1
(7.6 TYP)
0.2 5 + 0.
- 0.01
5
0~15° 0~15°
2.54 TYP
0.89 TYP
0.5 ±0.1
Unit: mm
a: Part #: 554x
b: Lot number 3 digits, plus L
st
1 letter: Last digit of year
nd
2 letter: Month
Jan to September: Numeric
October: O
November: N
December: D
rd
3 letter: Week
Date 1 to 10: 1
Date 11 to 20: 2
Date 21 to 31: 3
c: Sanken control number
Pb-free. Device composition compliant
with the RoHS directive.
LC5540LD-DS
SANKEN ELECTRIC CO., LTD.
9
January 28, 2013
Single-Stage Power Factor Corrected
Off-Line Switching Regulator ICs
LC5540LD Series
Because reliability can be affected adversely by improper storage
environments and handling methods, please observe the following
cautions.
Cautions for Storage
•
Ensure that storage conditions comply with the standard
temperature (5°C to 35°C) and the standard relative humidity
(around 40% to 75%); avoid storage locations that experience
extreme changes in temperature or humidity.
•
Avoid locations where dust or harmful gases are present and
avoid direct sunlight.
•
Reinspect for rust on leads and solderability of the products that
have been stored for a long time.
Cautions for Testing and Handling
When tests are carried out during inspection testing and other
standard test periods, protect the products from power surges
from the testing device, shorts between the product pins, and
wrong connections. Ensure all test parameters are within the
ratings specified by Sanken for the products.
Remarks About Using Silicone Grease with a Heatsink
• When silicone grease is used in mounting the products on a
heatsink, it shall be applied evenly and thinly. If more silicone
grease than required is applied, it may produce excess stress.
• Volatile-type silicone greases may crack after long periods of
time, resulting in reduced heat radiation effect. Silicone greases
with low consistency (hard grease) may cause cracks in the mold
resin when screwing the products to a heatsink.
Our recommended silicone greases for heat radiation purposes,
which will not cause any adverse effect on the product life, are
indicated below:
Type
Suppliers
G746
Shin-Etsu Chemical Co., Ltd.
YG6260
Momentive Performance Materials Inc.
SC102
Dow Corning Toray Co., Ltd.
LC5540LD-DS
Soldering
•
When soldering the products, please be sure to minimize the
working time, within the following limits:
260±5°C 10±1 s
(Flow, 2 times)
380±10°C 3.5±0.5 s (Soldering iron, 1 time)
• Soldering should be at a distance of at least 1.5 mm from the
body of the products.
Electrostatic Discharge
•
When handling the products, the operator must be grounded.
Grounded wrist straps worn should have at least 1 MΩ of
resistance from the operator to ground to prevent shock hazard,
and it should be placed near the operator.
•
Workbenches where the products are handled should be
grounded and be provided with conductive table and floor mats.
•
When using measuring equipment such as a curve tracer, the
equipment should be grounded.
•
When soldering the products, the head of soldering irons or the
solder bath must be grounded in order to prevent leak voltages
generated by them from being applied to the products.
•
The products should always be stored and transported in Sanken
shipping containers or conductive containers, or be wrapped in
aluminum foil.
SANKEN ELECTRIC CO., LTD.
10
January 28, 2013
LC5540LD Series
Single-Stage Power Factor Corrected
Off-Line Switching Regulator ICs
• The contents in this document are subject to changes, for improvement and other purposes, without notice. Make sure that this is the
latest revision of the document before use.
• Application and operation examples described in this document are quoted for the sole purpose of reference for the use of the products herein and Sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights or
any other rights of Sanken or any third party which may result from its use. Unless otherwise agreed in writing by Sanken, Sanken
makes no warranties of any kind, whether express or implied, as to the products, including product merchantability, and fitness for a
particular purpose and special environment, and the information, including its accuracy, usefulness, and reliability, included in this
document.
• Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures
including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device
failure or malfunction.
• Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.).
When considering the use of Sanken products in the applications where higher reliability is required (transportation equipment and
its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever
long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest Sanken sales
representative to discuss, prior to the use of the products herein.
The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is required
(aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited.
• In the case that you use Sanken products or design your products by using Sanken products, the reliability largely depends on the
degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation range is set by derating the
load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. In general,
derating factors include electric stresses such as electric voltage, electric current, electric power etc., environmental stresses such
as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor products. For these stresses,
instantaneous values, maximum values and minimum values must be taken into consideration.
In addition, it should be noted that since power devices or IC's including power devices have large self-heating value, the degree of
derating of junction temperature affects the reliability significantly.
• When using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically
or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance
and proceed therewith at your own responsibility.
• Anti radioactive ray design is not considered for the products listed herein.
• Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of Sanken's distribution network.
• The contents in this document must not be transcribed or copied without Sanken's written consent.
LC5540LD-DS
SANKEN ELECTRIC CO., LTD.
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January 28, 2013