1-2-4 High-voltage 3-phase Motor Driver ICs SMA6843MP/SLA6848MP Support for 3-shunt ■Features ■Absolute Maximum Ratings • A package of 6 MOSFET units for 3-phase bridge and pre-drive (HVIC, LVIC) Parameter Symbol • High side drive of bootstrap method has been employed. Unit Conditions SMA6843MP SLA6848MP VDSS 500 500 V Vcc=15V,VIN=0V Control Supply Voltage Vcc 20 20 V Between V CC and COM Control Supply Voltage (bootstrap) Output Current (continuous) VBS Io 20 2.5 20 2.5 V A Between VB and HS (U, V, W) PW≤100µs, duty=1% MOSFET Output Withstand Voltage • Best for driving fan motors and pumps (Ta=25°C) Ratings Output Current (pulse) I op 5 5 A • Built-in undervoltage lock out (auto regression) Input Voltage VIN –0.5 to +7 –0.5 to +7 V • Built-in overheat detection circuit (no stopping) Power Dissipation PD 28 31 W Tc=25°C Thermal Resistance (Junction to Case) Thermal Resistance (Junction to Ambient Air) θ j-c θ j-a 4.5 28 4 31 °C/W °C/W When all elements operating When all elements operating Operating Case Temperature Top –20 to +100 –20 to +100 °C Junction Temperature (Power part) Tch +150 +150 °C Storage Temperature Tstg –40 to +150 –40 to +150 °C • Built-in fail signal output function (for when the overheat detection circuit and UVLO) • Support for 3-shunt current detection ■Recommended Operating Conditions Ratings Parameter Symbol SMA6843MP SLA6848MP Unit Conditions 400 16.5 V V Between V BB and LS Between VCC and COM µs min. typ. max. min. typ. max. – 13.5 280 – 400 16.5 – 13.5 280 – Main Supply Voltage Control Supply Voltage Vss Vcc Input Signal Dead Time tdead 1.5 – – 1.5 – – Minimum Input Pulse Width tw 0.5 – – 0.5 – – µs Junction Temperature Tj – – 125 – – 125 °C ■Electrical Characteristics Ratings Parameter Symbol min. SMA6843MP typ. max. min. SLA6848MP typ. max. Unit Conditions Between V CC and COM Control Supply Voltage Vcc 13.5 15 16.5 13.5 15 16.5 V Control Supply Current Icc – 4 6 – 4 6 mA V IH – 2 2.5 – 2 2.5 Input VoltageVIH Input Voltage Hysteresis Width Input Current VIL 1 1.5 – 1 1.5 – VH I IH – – 0.5 50 – 100 – – 0.5 50 – 100 IIL – – 2 – – 2 Undervoltage Lock Out (high side) UVHL 9.0 10.0 11.0 9.0 10.0 11.0 UVHH 9.5 10.5 11.5 9.5 10.5 11.5 Undervoltage Lock Out (low side) Uvhys UVHL – 10.0 0.5 11.0 – 12.0 – 10.0 0.5 11.0 – 12.0 UVHH 10.5 11.5 12.5 10.5 11.5 12.5 Uvhys – 0.5 – – 0.5 – V V µA V V Vcc=15V Vcc=15V, Output:ON Vcc=15V, Output:OFF Vcc=15V Vcc=15V, VIN=5V Vcc=15V, VIN=0V Between VB and U (V, W) Between V CC and COM VFOL 0 – 1.0 0 – 1.0 VFOH TDH 4.0 135 – 150 5.5 165 4.0 135 – 150 5.5 165 Overheat Detection Release Threshold TDL 105 120 135 105 120 135 °C Vcc=15V MOSFET Output Withstand Voltage V DSS 500 – – 500 – – V Vcc=15V, ID=100µA, VIN=0V IDSS – – 100 – – 100 µA Vcc=15V, VIN=0V RDS(ON) VSD – – 2.0 1.0 2.4 1.5 – – 2.0 1.0 2.4 1.5 Ω V Vcc=15V, VIN=0V Vcc=15V, VIN=0V ns di/dt=100A/µs – 420 – – 420 FO Pin Output Voltage Overheat Detection Threshold MOSFET Output Leakage Current MOSFET DC On Resistance Diode Forward Voltage Diode Reverse Recovery Time trr td(on) High Side Switching Time Low Side Switching Time 136 ICs 75 75 V Vcc=15V – tr – 60 – – 60 – td(off) tf – – 440 40 – – – – 440 40 – – td(on) – 420 – – 420 – tr – 70 – – 70 – td(off) – 380 – – 380 – tf – 30 – – 30 – ns VBB=280V, Vcc=15V, VIN=0⇔5V, ID=2.5A ns SMA6843MP/SLA6848MP ■Typical Connection Diagram 5 2 3 4 VB1 VB2 VB3 VCC1 11 10 HO1 1 HS1 The input pulldown resistor is built in IC (about 100 kΩ). However, if the input is expected to be unstable or very fluctuant, it needs to be reinforced with external resistor. HO2 13 HS2 9 M HIN1 8 HIN2 HIN3 7 6 COM1 12 HS3 HVIC 23 The overheat detection threshold can be variable by externally attaching R1 and R2. HO3 14 Attach capacitors near IC. Attach a ceramic capacitor in parallel with the electrolytic capacitor if too much noise is generated. VCC2 20 LIN1 LO1 19 LIN2 18 24 MCU LIN3 LO2 17 5V R1 LO3 16 TADJ 15 R2 22 FO 21 COM2 LVIC 15V ■External Dimensions (ZIP24 [SMA24Pin]/ZIP24 with Fin [SLA24Pin]) SMA6843MP SLA6848MP 31±0.2 4.8±0.2 24.4±0.2 4±0.2 31±0.2 16.4±0.2 Gate burr Gate burr 1.7±0.1 φ 3.2±0.15 X 3.8 0.6 +0.15 –0.05 3 5 4 7 6 9 8 11 10 13 12 15 14 17 16 19 18 9.5 +0.7 –0.5 0.5 +0.15 –0.05 4.5±0.7 (Measured at the tip) 5±0.5 31.3±0.2 (Including the resin burr) 21 20 R-end (4.5) 4.5±0.5 (Measured at the tip) 31.3±0.2 (Including the resin burr) 2 16±0.2 9.9±0.2 0.5 +0.15 –0.05 23 X P1.27±0.7=29.21±1 1 2.45±0.2 (Measured at the root) 4-(R1) (10.5) (4.5) (4 -R 1 23 X P1.27±0.5=29.21±0.6 (Measured at the tip) Lot No. ) R-end 0.6 +0.15 –0.05 JAPAN Part No. 12.9±0.2 1.2±0.1 (Measured at the root) 9.5 +0.7 –0.05 Part No. 5±0.5 10.2±0.2 φ 3.2±0.15 Lot No. JAPAN 2 23 22 24 Forming No. 2452 Product Mass: Approx. 3.9 g 1 4 3 6 5 8 7 10 9 12 11 14 13 16 15 18 17 20 19 22 21 24 23 Forming No. 2171 Product Mass: Approx. 6.2 g ICs 137