1-3-2 Household HID Lamp Driver ICs SLA2601M/SLA2602M H Bridge, Enable Pin, Built-in Thermal Shutdown Circuit ■Features • Full-bridge MOSFETs and a pre-drive IC are integrated into a single package • Supports CMOS (3.3 and 5 V) input levels • Built-in undervoltage lock out (UVLO) circuit (auto regression) • Built-in thermal shutdown (TSD) circuit • Built-in dead time function • SIP power package ■Absolute Maximum Ratings Parameter Symbol MOSFET Breakdown Voltage Control Supply Voltage Control Supply Voltage Output Current (continuous) Output Current (pulse) FO Output Current Input Voltage Power Dissipation Thermal Resistance (Junction to Ambient Air) Operating Case Temperature Junction Temperature (Power part) Storage Temperature VDSS Vcc VBS Io IOP IFO VIN PD θj-c TOP Tj Tstg （T (Taa＝25℃） =25℃) Ratings SLA2601M Unit SLA2602M 250 20 20 14 21 V V V A A mA V W ℃/W ℃ ℃ ℃ 7 10.5 8 –0.5 to +7 41.6 3.0 –20 to +100 150 –40 to +150 Conditions ID=100uA Between VCC and COM Between VB and VM1, VM2 Tc=25℃ PW≤100µs, duty=1% EN, IN, FO TC=25℃, all elements operating All elements operating ■Recommended Operating Conditions Ratings Parameter Main Supply Voltage Control Supply Voltage Boot Strap Capacitor Capacity FO Pull-up Resistance FO Capacitor Capacity IN Pin Frequency Junction Temperature Symbol SLA2601M min. − 13.5 10 0.68 0.001 − − VBB Vcc Cboot RFO CFO FIN Tj SLA2602M max. 200 17.5 − 10 0.01 150 125 min. − 13.5 10 0.68 0.001 − − Unit max. 200 17.5 − 10 0.01 150 125 V V uF kΩ uF kHz ℃ Conditions Between VBB and LS/COM Between VCC and COM ■Electrical Characteristics (Ta=25℃) Ratings Parameter min. − − − 1 − 9 9.5 10 10.5 0 3.6 135 105 − 250 − SLA2601M typ. 2 135 2 1.5 230 − − − − − − 150 120 430 − − max. − − 2.5 − 500 11 11.5 12 12.5 1 5 165 135 − − 100 min. − − − 1 − 9 9.5 10 10.5 0 3.6 135 105 − 250 − SLA2602M typ. 2 135 2 1.5 230 − − − − − − 150 120 430 − − max. − − 2.5 − 500 11 11.5 12 12.5 1 5 165 135 − − 100 MOSFET DC ON Resistance RDS(on) − 0.11 0.14 − 0.14 0.185 Ω MOSFET Diode Forward Voltage − − − − − − − − − 1 1290 100 900 30 1270 80 880 30 1.5 − − − − − − − − − − − − − − − − − 1 1260 40 850 15 1240 40 830 25 1.5 − − − − − − − − V Control Supply Current Boot Supply Current Input Voltage (EN, IN, FO) Input Current (EN, IN) Undervoltage Lock Out (VB) Undervoltage Lock Out (VCC) FO Pin Output Voltage Thermal Protection and Release Threshold Internal Dead Time MOSFET Output Breakdown Voltage MOSFET Output Leakage Current High Side Switching Time Low Side Switching Time 132 ICs Symbol Icc IB VIH VIL IIH VUVHL VUVHH VUVLL VUVLH VFO(L) VFO(H) TDH TDL Tdead VDSS IDSS VSD td(on) tr td(off) tf td(on) tr td(off) tf Unit mA uA Conditions uA Vcc=15V, FO=OPEN VB=15V Vcc=15V Vcc=15V Vcc=15V, EN,IN=5V V Between VB and VM1, VM2 V Between VCC and COM V Vcc=15V, FO=OPEN V ℃ Vcc=15V ns V uA Vcc=15V ID=100uA VDS=250V VCC=15V, ID=7A (3.5A for the SLA2602M),EN=5V ISD=7A (3.5A for the SLA2602M) ns ns VBB=200V, VCC=15V, ID=7A (3.5A for the SLA2602M), EN=5V, R load VBB=200V, VCC=15V, ID=7A (3.5A for the SLA2602M), EN=5V, R load SLA2601M/SLA2602M ■Typical Connection Diagram The input pull-down resistor is built in IC (about 22 kΩ). However, if the input is expected to be unstable or to fluctuate greatly, it needs to be reinforced using an external resistor. Attach capacitors near the IC. Attach a ceramic capacitor in parallel with the electrolytic capacitor if too much noise is generated. When inserting a current sense resistor between LS1/LS2 and COM, make sure to specify the resistance so that the voltage between LS1/LS2 and COM is 1 V or less. ■Pin Assignment Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 Symbol LSI VM1 VM1 (LG1) (LG1) VBB1 VB1 (LG1) (LG1) EN IN COM COM VCC FO (LG2) (LG2) VB2 VBB2 (LG2) (LG2) VM2 VM2 LS2 ■Truth Table Function MOSFET L1 source pin/MOSFET L2 source pin MOSFET H1 source pin/MOSFET L1 drain pin Same as above Cut pin (MOSFET L1 gate pin) Same as above MOSFET H1 drain pin/MOSFET H2 drain pin High side floating power supply pin 1 Cut pin (MOSFET L1 gate pin) Same as above Input pin for enabling output Input pin for switching output Pre-drive IC ground pin Same as above Pre-drive IC power supply pin Fo signal output pin Cut pin (MOSFET L2 gate drive pin) Same as above High side floating power supply pin 2 MOSFET H1 drain pin/MOSFET H2 drain pin Cut pin (L2 gate drive pin) Same as above MOSFET H2 source pin/MOSFET L2 drain pin Same as above MOSFET L1 source pin/MOSFET L2 source pin EN IN FO H1 H2 L1 L2 L X H H X X H L X H L L OFF OFF ON OFF OFF OFF OFF ON OFF OFF OFF ON OFF OFF ON OFF ■External Dimensions (ZIP24 with Fin [SLA24Pin]) (Unit : mm) 31±0.2 31±0.2 24.4±0.2 16.4±0.2 Gate burr 4.8±0.2 24.4±0.2 1.7±0.1 16.4±0.2 Gate burr φ3.2±0.15 X 3.8 1.7±0.1 23 X P1.27±0.7=29.21±1 (Measured at the tip) 31.3±0.2 (Including the resin burr) 0.6 +0.15 -0.05 0.5 +0.15 -0.05 23 X P1.27±0.7=29.21±1 (Measured at the tip) 4.5±0.7 (Measured at the tip) 31.3±0.2 (Including the resin burr) Pins 4, 5, 8, 9, 16, 17, 20, and 21 are cut pins. 4 3 6 5 8 7 10 9 12 11 14 13 16 15 18 17 20 19 22 21 (10.4) 2-(R1) 0.5 +0.15 -0.05 (6.3) 16±0.2 Pins 4, 5, 8, 9, 16, 17, 20, and 21 are cut pins. Forming No. 2179 24 23 R-end 2.45±0.2 (Measured at the root) 2.5±0.6 (Measured at the tip) Forming No. 2176 2 1 12.9±0.2 B 3±0.5 0.6 +0.15 -0.05 (4.5) R-end A 9.3±0.5 4-(R1) 9.9±0.2 JAPAN 2.45±0.2 (Measured at the root) 2MAX B 9.5 +0.7 -0.5 MAX A 5±0.5 9.9±0.2 JAPAN 16±0.2 φ3.2±0.15 12.9±0.2 φ3.2±0.15 4.8±0.2 φ3.2±0.15 X 3.8 2 1 4 3 6 5 8 7 10 9 12 11 14 13 16 15 18 17 20 19 22 21 24 23 Product Mass: Approx. 6.2 g ICs 133