Z-Power LED X10490 Technical Data Sheet Specification SWT821-S SSC Drawn CUSTOMER Approval Approval 1 Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet CONTENTS 1. Feature & Application 2. Absolute Maximum Ratings 3. Electro Characteristics 4. Optical characteristics 5. Rank of SWT821-S 6. Color & Binning 7. Outline Dimension 8. Packing 9. Soldering 10. Precaution for use 11. Handling of Silicone Resin LEDs 12. Reliability Test Item and Condition 2 Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet SWT821-S SWT821-S Features Description This surface-mount LED comes in PLCC standard package dimension. It has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame. The die is attached within the reflector cavity and the cavity is encapsulated by epoxy or silicone. The package design coupled with careful selection of component materials allow these products to perform with high reliability in a larger temperature range 40℃ to 100℃. The high reliability feature is crucial to Automotive interior and Indoor ESS. 사진 • White colored SMT package. • Material : InGaN/SiC • Encapsulating Resin : Silicon Resin • High Reliability • Suitable for all SMT assembly methods ; Suitable for all soldering methods • RoHS Compliant Applications • Interior automotive • Electronic Signs and Signals • Office Automation, Electrical Appliances, Industrial Equipment Rev. 03 3 May 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 2. Absolute maximum ratings Parameter Symbol Value Unit Power Dissipation Pd 342 mW Forward Current IF 90 mA 100 mA IFM Peak Forward Current *2 Reverse Voltage (per die) VR 5 V Operating Temperature Topr -40 ~ +85 ºC Storage Temperature Tstg -40 ~ +100 ºC *1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. *2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio. 3. Electric characteristics Parameter Symbol Condition Min Typ Max Unit Forward Voltage (per die) VF IF =60 mA 2.8 3.2 3.8 V Reverse Current (per die) IR VR=5V - - 10 µA IV IF =60 mA 4000 5500 6500 mcd Luminance Flux ΦV IF =60 mA 11 13.5 16 lm Color Temperature CCT IF =60 mA 12000 - 4800 K *2 2θ½ IF =60 mA - 120 - deg Optical Efficiency ηop IF =60 mA - 70 - lm/W Thermal Resistance Rthja IF =60 mA - 65 - K/W Luminance Intensity Viewing Angle *1. the *2. *3. *1 The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10% 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity. Rthja results from mounting on PCB FR4(pad size≥16mm2 per pad, thickness≒ 0.6mm) 4 Document No. : SSC-QP-7-07-24 (Rev.00) Forward Current vs. Forward Voltage (per die) (Ta=25 OC ) 10 1 2.0 2.5 3.0 3.5 4.0 Forward Voltage[V] Relative Luminous Intensity vs Forward Current (Ta=25 OC ) 2.0 1.8 1.6 Relative Luminosity(a.u.) Forward Current [mA] Z-Power LED X10490 Technical Data Sheet 4. Optical characteristics 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 15 30 45 60 75 90 105 120 Forward Current IF[mA] 5 Document No. : SSC-QP-7-07-24 (Rev.00) Ambient Temperature vs. Allowable Forward Current (per die) 35 30 Forward current IF (mA) Z-Power LED X10490 Technical Data Sheet 4. Optical characteristics 25 20 15 10 5 0 -25 0 25 50 75 100 O Ambient temperature Ta( C) Radiation Diagram (Ta=25 OC ) 0 30 -30 60 -60 90 -90 6 Document No. : SSC-QP-7-07-24 (Rev.00) Spectrum (TA=25℃, IF=60mA) 1.0 Normalized Intensity[a.u.] Z-Power LED X10490 Technical Data Sheet 4. Optical characteristics 0.8 0.6 0.4 0.2 0.0 300 400 500 600 700 800 Wavelength[nm] 7 Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 5. Rank of SWT821-S §.Rank Name X1 X2 X3 VF IV CIE §.Forward Voltage[V] rank name min max Unit Z1 3.0 3.1 V Z2 3.1 3.2 Z3 3.2 3.3 A1 3.3 3.4 A2 3.4 3.5 §.Luminous Intensity [IV] rank name min max Unit M 4000 5000 mcd N 5000 6500 [Note] All measurements were made under the standardized environment of SSC. 8 Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 6. Color & Binning 0.8 0.7 0.6 Y 0.5 0.4 0.3 CCT 0.2 0.1 0.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 X 9 Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 0.38 5600K 0.36 f2 7000K 0.34 d2 Y 0.32 0.30 c2 10000K b2 a2 0.28 0.26 f1 e1 4800K d1 c1 6200K b1 a1 8200K 12000K 0.26 0.28 0.30 0.32 0.34 0.36 X ● COLOR RANK a1 e2 a2 b1 X Y X Y X 0.285 0.259 0.278 0.271 0.292 0.292 0.27 0.286 0.282 0.3 0.286 0.282 0.279 0.297 0.295 0.278 0.271 0.271 0.284 0.286 c1 c2 d1 X Y X Y X 0.3 0.281 0.295 0.295 0.31 0.31 0.2935 0.3065 0.3104 0.32 0.3065 0.3104 0.303 0.329 0.318 0.295 0.295 0.289 0.312 0.3065 e1 e2 f1 X Y X Y X 0.32 0.306 0.318 0.325 0.33 0.33 0.318 0.33 0.338 0.344 0.33 0.338 0.33 0.358 0.345 * Measurement Uncertainty of the Color Coordinates : ± 0.01 0.318 0.325 0.316 0.343 0.33 <IF=60mA, Ta=25℃> b2 Y X Y 0.27 0.286 0.282 0.281 0.295 0.295 0.295 0.289 0.312 0.282 0.279 0.297 d2 Y X Y 0.2935 0.3065 0.3104 0.306 0.318 0.325 0.325 0.316 0.343 0.3104 0.303 0.329 f2 Y X Y 0.318 0.33 0.338 0.335 0.345 0.353 0.353 0.346 0.374 0.338 0.33 0.358 10 Document No. : SSC-QP-7-07-24 (Rev.00) 2.80 1.9 0.75 3 Anode 1 0.80 4 0.85 1.50 3.20 2.40 4 2 3 Cathode Cathode Cathode 1 <Circuit diagram> 0.50 2 0.15 ( Tolerance: ±0.2, mm ) ATTENTION MARKING LED IS COMMON ANODE(+) Packing Mark ON (Anode) Unit: 8. packing 1.75±0.1 1 .5 5 ± 0 .0 5 4 .0 ±0 .1 2 .0 ±0 .0 5 0 .2 2 ±0 .0 5 3.83±0.1 5° 3.5±0.1 8±0.1 1 .0 ±0 .1 8° 3 .1 ±0 .1 2 .2 2 ±0 .1 11.4 ± 0.1 180 +0 -3 9.0 ± 0.3 LABLE 2.0 ± 0.2 13 30° ±0.2 60 Z-Power LED X10490 Technical Data Sheet 7.outline dimension 10 22 (1) Quantity : 2000pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package 11 Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet ● Reel Packing Structure Reel QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. HUMIDITY INDICATOR DESI PAK Aluminum Vinyl Bag QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. Outer Box Structure Material : Paper(SW3B(B)) TYPE 7inch SIZE (mm) a c b 245 220 102 245 220 142 1 SIDE c TUV MADE IN KOREA Acriche QUANTITY : XXXX 1 Semiconductor EcoLight LOT NUMBER : XXXXXXXXXX b RoHS PART NUMBER : a SEOUL SEMICONDUCTOR CO., LTD. 12 Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 9. soldering (1) Lead Solder Lead Solder Lead Solder 2.5~5 o C / sec. Pre-heat 120~150℃ Pre-heat time 120 sec. Max. Peak-Temperature 240℃ Max. Soldering time Condition 2.5~5 C / sec. Pre-heating 120~150 oC 240 oC Max. 10 sec. Max. 60sec. Max. Above 200 oC 120sec. Max. 10 sec. Max. (2) Lead-Free Solder Lead-frame Solder 1~5 oC / sec. Lead Free Solder Pre-heat 150~200℃ Pre-heat time 120 sec. Max. Peak-Temperature 260℃ Max. Soldering time Condition 1~5 oC / sec. Pre-heating 150~200 o C 260 oC Max. 10 sec. Max. 60sec. Max. Above 220 oC 120sec. Max. 10 sec. Max. (3) Hand Soldering conditions Do not exceed 4 seconds at maximum 315ºC under soldering iron. (4) The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products. 13 Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 10. precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desicator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 70%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 10% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC. (4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ray design is not considered for the products. (8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (10) The LEDs must be soldered within seven days after opening the moisture-proof packing. (11) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (12) The appearance and specifications of the product may be modified for improvement without notice. 14 Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 11. Handling of Silicone Resin LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. 15 Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 12. Reliability Test Item and Condition Item Reference Test Condition Duration / Cycle Number of Damage Thermal Shock EIAJ ED4701 Ta =-40oC (30MIN) ~ 100oC (30MIN) 100 Cycle 0/22 Temperature Cycle EIAJ ED4701 Ta =-40oC (30MIN) ~ 25oC (5MIN) ~ 100oC (30MIN) ~ 25oC (5MIN) 100 Cycle 0/22 High Temperature Storage EIAJ ED4701 Ta =100oC 1000 Hours 0/22 High Temperature High Humidity Storage EIAJ ED4701 Ta =85oC, RH=85% 1000 Hours 0/22 Low Temperature Storage EIAJ ED4701 Ta =-40oC 1000 Hours 0/22 Operating Endurance Test Internal Reference Ta =25oC, IF =20mA 1000 Hours 0/22 High Temperature High Humidity Life Test Internal Reference Ta =85oC, RH=85%, IF =15mA 300 Hours 0/22 High Temperature Life Test Internal Reference Ta =85oC, IF =20mA 500 Hours 0/22 Low Temperature Life Test Internal Reference Ta =-40oC, IF =20mA 1000 Hours 0/22 ESD(HBM) MIL-STD883D 1KV at 1.5kΩ; 100pF 3 Time 0/22 Criteria for Judging the Damage Item Symbol Condition Forward Voltage VF Reverse Current Luminous Intensity Criteria for Judgement MIN MAX IF =20mA - USL*1 × 1.2 IR VR=5V - USL*1 × 2.0 IV IF =20mA LSL*2 × 0.5 - Note : *1 USL : Upper Standard Level *2 LSL : Lower Standard Level 16 Document No. : SSC-QP-7-07-24 (Rev.00)