SEOUL SWT821-S

Z-Power LED
X10490
Technical
Data
Sheet
Specification
SWT821-S
SSC
Drawn
CUSTOMER
Approval
Approval
1
Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
CONTENTS
1.
Feature & Application
2.
Absolute Maximum Ratings
3.
Electro Characteristics
4.
Optical characteristics
5.
Rank of SWT821-S
6.
Color & Binning
7.
Outline Dimension
8.
Packing
9.
Soldering
10. Precaution for use
11. Handling of Silicone Resin LEDs
12. Reliability Test Item and Condition
2
Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
SWT821-S
SWT821-S
Features
Description
This surface-mount LED
comes in PLCC standard
package dimension. It has a
substrate made up of a
molded plastic reflector
sitting on top of a bent lead
frame. The die is attached
within the reflector cavity
and the cavity is
encapsulated by epoxy or
silicone.
The package design coupled
with careful selection of
component materials allow
these products to perform
with high reliability in a
larger temperature range 40℃ to 100℃. The high
reliability feature is crucial to
Automotive interior and
Indoor ESS.
사진
•
White colored SMT
package.
• Material : InGaN/SiC
• Encapsulating Resin :
Silicon Resin
• High Reliability
• Suitable for all SMT
assembly methods ;
Suitable for all
soldering methods
• RoHS Compliant
Applications
• Interior automotive
• Electronic Signs and
Signals
• Office Automation,
Electrical Appliances,
Industrial Equipment
Rev. 03
3
May 2008
www.ZLED.com
Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
2. Absolute maximum ratings
Parameter
Symbol
Value
Unit
Power Dissipation
Pd
342
mW
Forward Current
IF
90
mA
100
mA
IFM
Peak Forward Current
*2
Reverse Voltage (per die)
VR
5
V
Operating Temperature
Topr
-40 ~ +85
ºC
Storage Temperature
Tstg
-40 ~ +100
ºC
*1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product.
*2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio.
3. Electric characteristics
Parameter
Symbol
Condition
Min
Typ
Max
Unit
Forward Voltage (per die)
VF
IF =60 mA
2.8
3.2
3.8
V
Reverse Current (per die)
IR
VR=5V
-
-
10
µA
IV
IF =60 mA
4000
5500
6500
mcd
Luminance Flux
ΦV
IF =60 mA
11
13.5
16
lm
Color Temperature
CCT
IF =60 mA
12000
-
4800
K
*2
2θ½
IF =60 mA
-
120
-
deg
Optical Efficiency
ηop
IF =60 mA
-
70
-
lm/W
Thermal Resistance
Rthja
IF =60 mA
-
65
-
K/W
Luminance Intensity
Viewing Angle
*1.
the
*2.
*3.
*1
The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with
mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10%
2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity.
Rthja results from mounting on PCB FR4(pad size≥16mm2 per pad, thickness≒ 0.6mm)
4
Document No. : SSC-QP-7-07-24 (Rev.00)
Forward Current vs. Forward Voltage (per die)
(Ta=25 OC )
10
1
2.0
2.5
3.0
3.5
4.0
Forward Voltage[V]
Relative Luminous Intensity vs Forward Current
(Ta=25 OC )
2.0
1.8
1.6
Relative Luminosity(a.u.)
Forward Current [mA]
Z-Power LED
X10490
Technical
Data
Sheet
4. Optical characteristics
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0
15
30
45
60
75
90
105
120
Forward Current IF[mA]
5
Document No. : SSC-QP-7-07-24 (Rev.00)
Ambient Temperature vs. Allowable Forward Current (per die)
35
30
Forward current IF (mA)
Z-Power LED
X10490
Technical
Data
Sheet
4. Optical characteristics
25
20
15
10
5
0
-25
0
25
50
75
100
O
Ambient temperature Ta( C)
Radiation Diagram
(Ta=25 OC )
0
30
-30
60
-60
90
-90
6
Document No. : SSC-QP-7-07-24 (Rev.00)
Spectrum
(TA=25℃, IF=60mA)
1.0
Normalized Intensity[a.u.]
Z-Power LED
X10490
Technical
Data
Sheet
4. Optical characteristics
0.8
0.6
0.4
0.2
0.0
300
400
500
600
700
800
Wavelength[nm]
7
Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
5. Rank of SWT821-S
§.Rank Name
X1
X2
X3
VF
IV
CIE
§.Forward Voltage[V]
rank
name
min
max
Unit
Z1
3.0
3.1
V
Z2
3.1
3.2
Z3
3.2
3.3
A1
3.3
3.4
A2
3.4
3.5
§.Luminous Intensity [IV]
rank
name
min
max
Unit
M
4000
5000
mcd
N
5000
6500
[Note] All measurements were made under the standardized environment of SSC.
8
Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
6. Color & Binning
0.8
0.7
0.6
Y
0.5
0.4
0.3
CCT
0.2
0.1
0.0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
X
9
Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
0.38
5600K
0.36
f2
7000K
0.34
d2
Y
0.32
0.30
c2
10000K
b2
a2
0.28
0.26
f1
e1
4800K
d1
c1
6200K
b1
a1
8200K
12000K
0.26
0.28
0.30
0.32
0.34
0.36
X
● COLOR RANK
a1
e2
a2
b1
X
Y
X
Y
X
0.285
0.259
0.278
0.271
0.292
0.292
0.27
0.286
0.282
0.3
0.286
0.282
0.279
0.297
0.295
0.278
0.271
0.271
0.284
0.286
c1
c2
d1
X
Y
X
Y
X
0.3
0.281
0.295
0.295
0.31
0.31
0.2935
0.3065
0.3104
0.32
0.3065
0.3104
0.303
0.329
0.318
0.295
0.295
0.289
0.312
0.3065
e1
e2
f1
X
Y
X
Y
X
0.32
0.306
0.318
0.325
0.33
0.33
0.318
0.33
0.338
0.344
0.33
0.338
0.33
0.358
0.345
* Measurement Uncertainty of the Color Coordinates : ± 0.01
0.318
0.325
0.316
0.343
0.33
<IF=60mA, Ta=25℃>
b2
Y
X
Y
0.27
0.286
0.282
0.281
0.295
0.295
0.295
0.289
0.312
0.282
0.279
0.297
d2
Y
X
Y
0.2935
0.3065
0.3104
0.306
0.318
0.325
0.325
0.316
0.343
0.3104
0.303
0.329
f2
Y
X
Y
0.318
0.33
0.338
0.335
0.345
0.353
0.353
0.346
0.374
0.338
0.33
0.358
10
Document No. : SSC-QP-7-07-24 (Rev.00)
2.80
1.9
0.75
3
Anode
1
0.80
4
0.85
1.50
3.20
2.40
4
2
3
Cathode Cathode Cathode
1
<Circuit diagram>
0.50
2
0.15
( Tolerance: ±0.2,
mm )
ATTENTION
MARKING
LED IS COMMON ANODE(+)
Packing
Mark ON
(Anode)
Unit:
8. packing
1.75±0.1
1 .5 5 ± 0 .0 5
4 .0 ±0 .1
2 .0 ±0 .0 5
0 .2 2 ±0 .0 5
3.83±0.1
5°
3.5±0.1
8±0.1
1 .0 ±0 .1
8°
3 .1 ±0 .1
2 .2 2 ±0 .1
11.4 ± 0.1
180 +0
-3
9.0 ± 0.3
LABLE
2.0 ± 0.2
13
30°
±0.2
60
Z-Power LED
X10490
Technical
Data
Sheet
7.outline dimension
10
22
(1) Quantity : 2000pcs/Reel
(2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm
(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is
turned off from the carrier tape at the angle of 10º to the carrier tape
(4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof
Package
11
Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
● Reel Packing Structure
Reel
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
HUMIDITY INDICATOR
DESI PAK
Aluminum Vinyl Bag
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
Outer Box Structure
Material : Paper(SW3B(B))
TYPE
7inch
SIZE (mm)
a
c
b
245 220 102
245 220 142
1 SIDE
c
TUV
MADE IN KOREA
Acriche
QUANTITY : XXXX
1
Semiconductor EcoLight
LOT NUMBER : XXXXXXXXXX
b
RoHS
PART NUMBER :
a
SEOUL SEMICONDUCTOR CO., LTD.
12
Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
9. soldering
(1) Lead Solder
Lead Solder
Lead Solder
2.5~5 o C / sec.
Pre-heat
120~150℃
Pre-heat time
120 sec.
Max.
Peak-Temperature
240℃ Max.
Soldering time
Condition
2.5~5 C / sec.
Pre-heating
120~150 oC
240 oC Max.
10 sec. Max.
60sec. Max.
Above 200 oC
120sec. Max.
10 sec. Max.
(2) Lead-Free Solder
Lead-frame Solder
1~5 oC / sec.
Lead Free Solder
Pre-heat
150~200℃
Pre-heat time
120 sec.
Max.
Peak-Temperature
260℃ Max.
Soldering time
Condition
1~5 oC / sec.
Pre-heating
150~200 o C
260 oC Max.
10 sec. Max.
60sec. Max.
Above 220 oC
120sec. Max.
10 sec. Max.
(3) Hand Soldering conditions
Do not exceed 4 seconds at maximum 315ºC under soldering iron.
(4) The encapsulated material of the LEDs is silicone.
Precautions should be taken to avoid the strong pressure on the
encapsulated part.
So when using the chip mounter, the picking up nozzle that does not
affect the silicone resign should be used.
Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.
13
Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
10. precaution for use
(1) Storage
In order to avoid the absorption of moisture, it is recommended to store in a dry box
(or a desicator) with a desiccant. Otherwise, to store them in the following
environment is recommended.
Temperature : 5ºC ~30ºC Humidity : maximum 70%RH
(2) Attention after open.
LED is correspond to SMD, when LED be soldered dip, interfacial separation may
affect the light transmission efficiency, causing the light intensity to drop. Attention
in followed; Keeping of a fraction
Temperature : 5 ~ 40ºC Humidity : less than 10%
(3) In the case of more than 1 week passed after opening or change color of
indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC.
(4) Any mechanical force or any excess vibration shall not be accepted to apply
during cooling process to normal temperature after soldering.
(5) Quick cooling shall be avoided.
(6) Components shall not be mounted on warped direction of PCB.
(7) Anti radioactive ray design is not considered for the products.
(8) This device should not be used in any type of fluid such as water, oil, organic
solvent etc. When washing is required, IPA should be used.
(9) When the LEDs are illuminating, operating current should be decided after
considering the ambient maximum temperature.
(10) The LEDs must be soldered within seven days after opening the moisture-proof
packing.
(11) Repack unused products with anti-moisture packing, fold to close any opening
and then store in a dry place.
(12) The appearance and specifications of the product may be modified for
improvement without notice.
14
Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
11. Handling of Silicone Resin LEDs
(1) During processing, mechanical stress on the surface should be minimized as much as
possible. Sharp objects of all types should not be used to pierce the sealing compound.
(2) In general, LEDs should only be handled from the side. By the way, this also applies
to LEDs without a silicone sealant, since the surface can also become scratched.
(3) When populating boards in SMT production, there are basically no restrictions
regarding the form of the pick and place nozzle, except that mechanical pressure on the
surface of the resin must be prevented.
This is assured by choosing a pick and place nozzle which is larger than the LED’s
reflector area.
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs.
These conditions must be considered during the handling of such devices. Compared to
standard encapsulants, silicone is generally softer, and the surface is more likely to
attract dust.
As mentioned previously, the increased sensitivity to dust requires special care
during processing. In cases where a minimal level of dirt and dust particles cannot be
guaranteed, a suitable cleaning solution must be applied to the surface after the
soldering of components.
(5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it
must be assured that these solvents do not dissolve the package or resin.
Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the
LED.
15
Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
12. Reliability Test Item and Condition
Item
Reference
Test Condition
Duration
/ Cycle
Number
of
Damage
Thermal Shock
EIAJ ED4701
Ta =-40oC (30MIN) ~ 100oC
(30MIN)
100
Cycle
0/22
Temperature
Cycle
EIAJ ED4701
Ta =-40oC (30MIN) ~ 25oC (5MIN)
~ 100oC (30MIN) ~ 25oC (5MIN)
100
Cycle
0/22
High
Temperature
Storage
EIAJ ED4701
Ta =100oC
1000
Hours
0/22
High
Temperature
High Humidity
Storage
EIAJ ED4701
Ta =85oC, RH=85%
1000
Hours
0/22
Low
Temperature
Storage
EIAJ ED4701
Ta =-40oC
1000
Hours
0/22
Operating
Endurance Test
Internal
Reference
Ta =25oC, IF =20mA
1000
Hours
0/22
High
Temperature
High Humidity
Life Test
Internal
Reference
Ta =85oC, RH=85%, IF =15mA
300
Hours
0/22
High
Temperature
Life Test
Internal
Reference
Ta =85oC, IF =20mA
500
Hours
0/22
Low
Temperature
Life Test
Internal
Reference
Ta =-40oC, IF =20mA
1000
Hours
0/22
ESD(HBM)
MIL-STD883D
1KV at 1.5kΩ; 100pF
3 Time
0/22
Criteria for Judging the Damage
Item
Symbol
Condition
Forward Voltage
VF
Reverse Current
Luminous
Intensity
Criteria for Judgement
MIN
MAX
IF =20mA
-
USL*1 × 1.2
IR
VR=5V
-
USL*1 × 2.0
IV
IF =20mA
LSL*2 × 0.5
-
Note : *1 USL : Upper Standard Level
*2 LSL : Lower Standard Level
16
Document No. : SSC-QP-7-07-24 (Rev.00)