Z-Power LED X10490 Technical Data Sheet Specification STW7T16A SSC Drawn Approval CUSTOMER Approval Rev.04 December 2011 www.seoulsemicon.com SSC- QP- 7- 07- 24 (Rev.00) Z-Power LED X10490 Technical Data Sheet CONTENTS 1. Description 2. Absolute Maximum Ratings 3. Electro-Optical Characteristics 4. Optical characteristics 5. Reliability Test 6. Color & Binning 7. Bin Code Description 8. Outline Dimension 9. Reel Structure 10. Packing 11. Soldering 12. Precaution for use 13. Handling of Silicone Resin LEDs Rev.04 December 2011 www.seoulsemicon.com SSC- QP- 7- 07- 24 (Rev.00) Z-Power LED X10490 Technical Data Sheet STW7T16A 1. Description STW7T16A Features • This surface-mount LED comes in standard package dimension. It has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame. The die is attached within the reflector cavity and the cavity is encapsulated by silicone. White colored SMT package. • Pb-free Reflow Soldering Application • Suitable for all SMT assembly methods ; Suitable for all soldering methods • RoHS Compliant The package design coupled with careful selection of component materials allow these products to perform with high reliability. Applications • Interior lighting • General lighting • Indoor and out door displays • Architectural / Decorative lighting Rev.04 December 2011 www.seoulsemicon.com SSC- QP- 7- 07- 24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 2. Absolute maximum ratings Parameter [1] Symbol Value Unit Power Dissipation Pd 315 mW Forward Current IF 90 mA Operating Temperature Topr -40~+85 ℃ Storage Temperature Tstg -40~+100 Junction Temperature Tj 125 ℃ ℃ [1] Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. * LED’s properties might be different from suggested values like above and below tables if operation condition will be exceeded our parameter range. 3. Electro-Optical characteristics Parameter Forward Voltage Reverse Voltage Symbol Condition Min. Typ. Max. Unit VF IF=60mA 2.9 3.1 3.4 V VR IR=5mA - 0.9 1.2 V Iv IF=60mA - 7.0 - Cd CCT IF=60mA 4,700 - 7,000 K 2Θ1/2 IF=60mA - 120 - deg. Ra IF=60mA 75 - 85 - 1.5kΩ;100pF 5 - - KV IF=60mA - 22 - ºC/W [1] Luminous Intensity* (4,700~7,000 K) Color Correlated Temperature Viewing Angle [2] Color Rendering Index* ESD (HBM) Thermal resistance [3] RthJS [1] The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. [2] 2Θ1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity. [3] Thermal resistance: RthJS (Junction / solder) * Tolerance : VF :± 0.1V, IV :± 10%, Ra :± 3, x,y :± 0.01 [Note] All measurements were made under the standardized environment of SSC. Rev.04 December 2011 www.seoulsemicon.com SSC- QP- 7- 07- 24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 4. Optical characteristics Forward Voltage vs. Forward Current Ta=25 Forward Current vs. Relative Luminous Intensity ℃ Ta=25 ℃ 80 1.4 70 1.2 Relative Luminous Intensity Forward Current IF [mA] 90 60 50 40 30 20 1.0 0.8 0.6 0.4 0.2 10 0 2.3 0.0 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 0 10 20 Forward Voltage VF [V] 30 40 50 60 70 80 90 Forward Current IF [mA] Directivity Ambient Temperature vs. Maximum Forward Current Ta=25 ℃ Forward Current IF[mA] 90 RthJ-A : 200 ℃/W 0 60 -30 -60 30 0 -2 5 0 25 50 75 100 30 60 -90 90 O A m b ie n t te m p e r a tu re T a ( C ) Rev.04 December 2011 www.seoulsemicon.com SSC- QP- 7- 07- 24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 4. Optical characteristics Relative Light Output vs. Junction Temperature Forward Voltage Shift vs. Junction Temperature IF=60mA 1.0 1.0 0.8 0.8 Relative Light Output Relative Forward Voltage IF=60mA 0.6 0.4 0.6 0.4 0.2 0.2 0.0 0.0 30 45 60 75 90 105 120 O 30 45 60 75 90 105 120 O Ju n ctio n te m p e ra tu re T j( C ) Junction tem perature Tj( C) Spectrum Ta=25 ℃, I =60mA F Relative Emission Intensity 1.0 0.5 0.0 300 400 500 600 700 800 Wavelength [nm] Rev.04 December 2011 www.seoulsemicon.com SSC- QP- 7- 07- 24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 5. Reliability Test Item Reference Test Conditions Duration / Cycle Number of Damaged Thermal Shock EIAJ ED-4701 Ta =-40oC(30min) ~ 100oC(30min) 100 Cycle 0/22 High Temperature Storage EIAJ ED-4701 Ta =100oC 1000 Hours 0/22 High Temp. High Humidity Storage EIAJ ED-4701 Ta =60oC, RH=90% 1000 Hours 0/22 Low Temperature Storage EIAJ ED-4701 Ta =-40oC 1000 Hours 0/22 Operating Endurance Test Internal Reference Ta =25oC, IF =60mA 1000 Hours 0/22 High Temperature High Humidity Life Test Internal Reference Ta =60oC, RH=90%, IF =60mA 500 Hours 0/22 High Temperature Life Test Internal Reference Ta =85oC, IF =60mA 500 Hours 0/22 Low Temperature Life Test Internal Reference Ta =-40oC, IF =60mA 1000 Hours 0/22 ESD(HBM) MIL-STD883D 5KV at 1.5k ; 100pF 3 Time 0/22 Reflow Tsol ℃< 10sec. Reflow 3 Time 0/22 Ω 260 Soldering □ CRITERIA FOR JUDGING THE DAMAGE Criteria for Judgment Item Symbol Condition Forward Voltage VF Luminous Intensity IV MIN MAX IF =60mA - USL [1] × 1.2 IF =60mA LSL [2] × 0.7 - Note : [1] USL : Upper Standard Level [2] LSL : Lower Standard Level Rev.04 December 2011 www.seoulsemicon.com SSC- QP- 7- 07- 24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 6. Color & Binning 0.39 0.38 Energy Star Rank 4700K 5000K 0.37 C1 5300K CIE Y 0.36 C0 C3 B1 C2 C5 B0 B3 C4 B2 B5 5600K 6000K 0.35 6500K 0.34 A1 7000K 0.33 A0 A2 0.32 A3 B4 A5 A4 0.31 0.30 0.29 0.30 0.31 0.32 0.33 0.34 0.35 0.36 0.37 CIE X Rev.04 December 2011 www.seoulsemicon.com SSC- QP- 7- 07- 24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 6. Color & Binning ● COLOR RANK <IF=60mA, Ta=25 ℃> 6500~7000K A0 A2 A4 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3028 0.3304 0.3041 0.324 0.3055 0.3177 0.3041 0.324 0.3055 0.3177 0.3068 0.3113 0.3126 0.3324 0.3136 0.3256 0.3146 0.3187 0.3115 0.3393 0.3126 0.3324 0.3136 0.3256 6000~6500K A1 A3 A5 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3115 0.3393 0.3126 0.3324 0.3136 0.3256 0.3126 0.3324 0.3136 0.3256 0.3146 0.3187 0.321 0.3408 0.3216 0.3334 0.3221 0.3261 0.3205 0.3481 0.321 0.3408 0.3216 0.3334 5600~6000K B0 B2 B4 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3207 0.3462 0.3212 0.3389 0.3217 0.3316 0.3212 0.3389 0.3217 0.3316 0.3222 0.3243 0.3293 0.3461 0.3293 0.3384 0.3294 0.3306 0.3292 0.3539 0.3293 0.3461 0.3293 0.3384 5300~5600K B1 B3 B5 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3292 0.3539 0.3293 0.3461 0.3293 0.3384 0.3293 0.3461 0.3293 0.3384 0.3294 0.3306 0.3373 0.3534 0.3369 0.3451 0.3366 0.3369 0.3376 0.3616 0.3373 0.3534 0.3369 0.3451 Rev.04 December 2011 * Measurement Uncertainty of the Color Coordinates : ± 0.01 www.seoulsemicon.com SSC- QP- 7- 07- 24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 6. Color & Binning ● COLOR RANK <IF=60mA, Ta=25 ℃> 5000~5300K C0 C2 C4 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3376 0.3616 0.3373 0.3534 0.3369 0.3451 0.3373 0.3534 0.3369 0.3451 0.3366 0.3369 0.3456 0.3601 0.3448 0.3514 0.344 0.3428 0.3463 0.3687 0.3456 0.3601 0.3448 0.3514 4700~5000K C1 C3 C5 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3463 0.3687 0.3456 0.3601 0.3448 0.3514 0.3456 0.3601 0.3448 0.3514 0.344 0.3428 0.3539 0.3669 0.3526 0.3578 0.3514 0.3487 0.3552 0.376 0.3539 0.3669 0.3526 0.3578 Rev.04 December 2011 * Measurement Uncertainty of the Color Coordinates : ± 0.01 www.seoulsemicon.com SSC- QP- 7- 07- 24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 7. Bin Code Description Bin Code Luminous Intensity Color Rank Forward Voltage Q0 A1 Z2 4,700K ~ 7,000K Luminous Intensity [mcd] *[1] @ IF = 60mA Color Rank @ IF = 60mA Flux *[2] [lm] RANK Min. Max. Typ. P5 6,500 7,000 19.7 Q0 7,000 7,500 21.2 Q5 7,500 8,000 22.6 R0 8,000 8,500 23.9 A0 A1 A2 A3 A4 A5 B0 B1 B2 B3 B4 B5 C0 C1 C2 C3 C4 C5 Forward Voltage [V] @ IF = 60mA RANK Min. Max. Y3 2.9 3.0 Z1 3.0 3.1 Z2 3.1 3.2 Z3 3.2 3.3 A1 3.3 3.4 Available ranks Not yet available ranks CCT IV Rank 6,000~7,000 K P5 Q0 Q5 R0 5,300~6,000 K P5 Q0 Q5 R0 4,700~5,300 K P5 Q0 Q5 R0 [Note] All measurements were made under the standardized environment of SSC. In order to ensure availability, single color rank & IV rank & VF rank will not be orderable. [1] Classification criteria : Luminous intensity IV [2] Please use for only reference. Rev.04 December 2011 www.seoulsemicon.com SSC- QP- 7- 07- 24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 8.Outline Dimension Package Outlines Package Marking (Cathode) 6 5 4 1 2 3 Front View Right View Rear View ( Tolerance: Circuit Diagram ±0.2, Unit: mm ) R ecom m ended S o ld e r P a d Anode 6, 5, 4 ESD Protection Device 1, 2, 3 Cathode Rev.04 December 2011 www.seoulsemicon.com SSC- QP- 7- 07- 24 (Rev.00) 1.75± 0.1 .5 ?1 +0 4± 0.1 . 1, 2± 0.05 5.3 8± 0.1 5.7± 0.1 (4.75) 12.0± 0.2 0.3- 0.05 5.5± 0.05 -0 2.1± 0.1 Package Marking 15.4± 1.0 180 13± 0.3 2 60 Z-Power LED X10490 Technical Data Sheet 9. Reel Structure 22 13 ( Tolerance: ±0.2, Unit: mm ) 1)Quantity : 1,200pcs/Reel 2)Cumulative Tolerance : Cumulative Tolerance/10 pitches to be 0.2mm 3)Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10 to the carrier tape 4)Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package ± Rev.04 December 2011 www.seoulsemicon.com SSC- QP- 7- 07- 24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 10. Packing Reel QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. HUMIDITY INDICATOR DESI PAK Aluminum Vinyl Bag QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. Outer Box Structure Material : Paper(SW3B(B)) SIZE (mm) a c b 245 220 102 7inch 245 220 142 TYPE 1 SIDE c TUV QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. MADE IN KOREA Acriche 1 Semiconductor EcoLight b RoHS a Rev.04 December 2011 www.seoulsemicon.com SSC- QP- 7- 07- 24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 11. Soldering (1) Lead Solder Lead Solder Lead Solder ℃ Pre-heat 120~150 Pre-heat time 120 sec. Max. Peak-Temperature 240 Soldering time Condition 10 sec. Max. ℃ Max. 2.5~5 o C / sec. 2.5~5 C / sec. Pre-heating 120~150 oC 240 oC Max. 10 sec. Max. 60sec. Max. Above 200 oC 120sec. Max. (2) Lead-Free Solder Lead-free Solder Lead Free Solder 1~5 oC / sec. ℃ Pre-heat 150~200 Pre-heat time 120 sec. Max. ℃ Max. Peak-Temperature 260 Soldering time Condition 10 sec. Max. 1~5 oC / sec. Pre-heating 150~200 o C 260 oC Max. 10 sec. Max. 60sec. Max. Above 220 oC 120sec. Max. (3) Hand Soldering conditions Do not exceed 4 seconds at maximum 315ºC under soldering iron. (4) The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used. (5) It is recommended that the customer use the nitrogen reflow method. (6) Repairing should not be done after the LEDs have been soldered. (7) Reflow soldering should not be done more than two times. In the case of more than 24 hours passed soldering after first, LEDs will be damaged. (8) We recommend using solder paste composed of AgCuSn, because pastes that contain Bi or B might cause color change of Ag during surface mount technology. [Note] In case that the soldered products are reused in soldering process, we don’t guarantee theRev.04 products. December 2011 www.seoulsemicon.com SSC- QP- 7- 07- 24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 12. Precaution for use 1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 70%RH 2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; a. After opened and mounted the soldering shall be quickly. b. Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 30% 3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60± 5ºC. 4) Silver plating might be tarnished in the environment that contains corrosive gases and materials. Also any product that has tarnished lead might be decreased the solder-ability and optical-electrical properties compare to normal ones. Please do not expose the product in the corrosive environment during the storage. 5) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. 6) Quick cooling shall be avoided. 7) Components shall not be mounted on warped direction of PCB. 8) Anti radioactive ray design is not considered for the products. 9) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. 10) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. 11) The LEDs must be soldered within seven days after opening the moisture-proof packing. 12) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. 13) The appearance and specifications of the product may be modified for improvement without notice. 14) Please note the information contained herein is subject to change. SSC reserves the right to modify or change the design of LED package inside structure without prior notice unless optical performance changes. Rev.04 December 2011 www.seoulsemicon.com SSC- QP- 7- 07- 24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 13. Handling of Silicone Resin LEDs 1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. 2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. 3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. 4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. 5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. 6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this product with acid or sulfur material in sealed space. Rev.04 December 2011 www.seoulsemicon.com SSC- QP- 7- 07- 24 (Rev.00)