Z-Power LED X10490 Technical Data Sheet Specification UPGT801-S SSC Drawn Approval CUSTOMER Approval Rev. 00 September 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet UPGT801-S 1. Features 2. Absolute Maximum Ratings 3. Electro Characteristics 4. Optical characteristics 5. Color & Binning 6. Outline Dimension 7. Packing 8. Soldering 9. Precaution for use 10. Handling of Silicone resin LEDs Rev. 00 September 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet UPGT801-S Description This surface-mount LED comes in PLCC standard package dimension. It has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame. The die is attached within the reflector cavity and the cavity is encapsulated by epoxy or silicone The package design coupled with careful selection of component materials allow these products to perform with high reliability in a larger temperature range -40℃ to 100℃. The high reliability feature is crucial to Automotive interior and Indoor ESS. UPGT801-S Features 사진 • Industry Standard PLCC SMT package • High brightness using AlInGaP and InGaN dice technologies • Available in multiple colors • High volume, high reliability Applications • Interior automotive • Electronic Signs and Signals • Office Automation, Electrical Appliances, Industrial Equipment Rev. 00 September 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 1. Features • Green colored SMT package • Material AlInGaP • Suitable for all SMT assembly methods Suitable for all soldering methods • RoHS Compliant Rev. 00 September 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 2. Absolute maximum ratings Parameter Symbol Value Unit Power Dissipation Pd 123 mW Forward Current IF 30 mA Peak Forward Current IFM *2 90 mA Reverse Voltage VR 5 V Operating Temperature Topr -40 ~ +100 oC Storage Temperature Tstg -40 ~ +100 oC [1] Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. [2] IFM was measured at Tw≤1 msec of pulse width and D≤1/10 of duty ratio. [3] LED’s properties might be different from suggested values like above and below tables if operation condition will be exceeded our parameter range. 3. Electric characteristics Parameter Symbol Condition Min Typ Max Unit Forward Voltage VF IF =20mA 1.7 2.2 2.7 V Reverse Current IR VR=5V - - 10 μA Luminance Intensity *1 IV IF =20mA 12 17 36 mcd Peak Wavelength λP IF =20mA - 557 - nm Dominant Wavelength λd IF =20mA 554 562 567 nm Spectral Bandwidth 50% Δλ IF =20mA - 30 - nm IF =20mA - 120 - deg. Viewing Angle *2 2θ ½ *1. The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10% *2. 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity. Rev. 00 September 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 (Rev.00) Relative Luminous Intensity vs Forward Current Forward Current vs. Forward Voltage (Ta=25 OC ) 2 (Ta=25 OC ) 1 .6 Relative Luminous Intensity Iv/Iv [Rel] 10 1 .4 1 .2 Forward Current IF [mA] Z-Power LED X10490 Technical Data Sheet 4. Optical characteristics 1 .0 10 1 0 .8 0 .6 0 .4 10 0 0 .2 0 .0 1 .7 1 .8 1 .9 2 .0 2 .1 2 .2 2 .3 0 2 .4 5 Current 15 20 25 30 Forward Current IF [mA] Forward Voltage VF (V) Forward Curve 10 Derating Radiation Diagram (Ta=25 OC ) 40 Forward Current IF [mA] 0 -30 30 20 -60 30 60 10 -90 90 0 -40 -20 0 20 40 60 80 100 120 Ambient Temperature TA [OC] Rev. 00 September 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 5. Color & Binning ● UPGT801-S BINNING RANK NAME VF [V] IV [mcd] A Wd [nm] 554 ~ 556 B 12 ~ 20 556 ~ 558 C 558 ~ 560 D 560 ~ 562 E 12 ~ 17 F G 20 ~ 28 1.7 ~ 2.7 J K L 564 ~ 567 554 ~ 556 H I 562 ~ 564 556 ~ 558 558 ~ 560 560 ~ 561 17 ~ 28 561 ~ 564 564 ~ 567 M 554 ~ 556 N 556 ~ 558 O P 28 ~ 36 558 ~ 560 560 ~ 562 Q 562 ~ 564 R 564 ~ 567 [Note] All measurements were made under the standardized environment of SSC. Rev. 00 September 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 (Rev.00) Recommended Solder Pattern 1.9 2.8 0.15 1.8 0.8 2.2 1.6 0.8 Anode 1.8 3.2 2.4 1.6 Cathode Cathode Mark 2.2 ( Tolerance: ±0.2, Unit: mm ) 7. packing 1 .5 5 ± 0 .0 5 4 .0 ±0 .1 1.75±0.1 2 .0 ±0 .0 5 0 .2 2 ±0 .0 5 3.83±0.1 5° 3.5±0.1 8±0.1 1 .0 ±0 .1 8° 3 .1 ±0 .1 2 .2 2 ±0 .1 11.4 ± 0.1 180 +0 -3 9.0 ± 0.3 LABLE 2.0 ± 0.2 13 30° 10 ±0.2 60 Z-Power LED X10490 Technical Data Sheet 6.outline dimension 22 (1) Quantity : 2000pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package Rev. 00 September 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet ● Reel Packing Structure Reel QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. HUMIDITY INDICATOR DESI PAK Aluminum Vinyl Bag QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. Outer Box Structure Material : Paper(SW3B(B)) SIZE (mm) TYPE a c b 7inch 245 220 142 1 SIDE c 1 QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX RoHS PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. b a Rev. 00 September 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 8. soldering (1) Lead Solder Lead Solder Lead Solder 2.5~5 o C / sec. Pre-heat 120~150℃ Pre-heat time 120 sec. Max. Peak-Temperature 240℃ Max. Soldering time Condition 10 sec. Max. 2.5~5 C / sec. Pre-heating 120~150 oC 240 oC Max. 10 sec. Max. 60sec. Max. Above 200 oC 120sec. Max. (2) Lead-Free Solder Lead-free Solder 1~5 oC / sec. Lead Free Solder Pre-heat 150~200℃ Pre-heat time 120 sec. Max. Peak-Temperature 260℃ Max. Soldering time Condition 10 sec. Max. 1~5 oC / sec. Pre-heating 150~200 oC 260 oC Max. 10 sec. Max. 60sec. Max. Above 220oC 120sec. Max. (3) Hand Soldering conditions Do not exceed 4 seconds at maximum 315ºC under soldering iron. (4) The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used. (5) It is recommended that the customer use the nitrogen reflow method. (6) Repairing should not be done after the LEDs have been soldered. (7) Reflow soldering should not be done more than two times. In the case of more than 24 hours passed soldering after first, LEDs will be damaged. Rev. 00 September 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 9. precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desicator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 70%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 10% (3) In the case of more than 4 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC. (4) Silver plating might be tarnished in the environment that contains corrosive gases and materials. Also any product that has tarnished lead might be decreased the solder-ability and optical-electrical properties compare to normal ones. Please do not expose the product in the corrosive environment during the storage. (5) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (6) Quick cooling shall be avoided. (7) Components shall not be mounted on warped direction of PCB. (8) Anti radioactive ray design is not considered for the products. (9) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (10) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (11) The LEDs must be soldered within seven days after opening the moisture-proof packing. (12) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (13) The appearance and specifications of the product may be modified for improvement without notice. Rev. 00 September 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 10. Handling of Silicone Resin LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. Rev. 00 September 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 (Rev.00)