SILAN SC16315S

SC16315S
VFD CONTROLLER/DRIVER
DESCRIPTION
SC16315S is a Vacuum Fluorescent Display (VFD) Controller
driven on a 1/4 to 1/8 duty factor. It has eight segment output lines, 4
grid output lines, 4 segment/grid output drive lines, one display
memory, control circuit, key scan circuit, those above are all
incorporated into a single chip to build a highly reliable peripheral
device for a single chip micro computer.
Serial data is fed to
SC16315S via a three-line serial interface. It is housed in a 28-pin,
SOP-28-375-1.27
SOP Package.
FEATURES
* CMOS Technology
* Low Power Consumption
* Key Scanning (8 x 2 matrix)
* Multiple Display Modes: (8 Segments, 8 Digits to 12 Segments,
ORDERING INFORMATIONS
Device
Package
SC16315S
SOP-28-375-1.27
4 Digits)
* 8-Step Dimming Circuitry
APPLICATIONS
* Serial Interface for Clock, Data Input, Data Output, Strobe Pins
* No External Resistors Needed for Driver Outputs
* Microcomputer peripheral device
* Available in 28-pin, SOP Package
BLOCK DIAGRAM
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Page 1 of 13
SC16315S
ABSOLUTE MAXIMUM RATING (unless otherwise stated, Tamb=25°C, GND=0V)
Characteristic
Symbol
Value
Unit
Logic Supply Voltage
VDD
-0.5 ~ +7
V
Driver Supply Voltage
VEE
VDD + 0.5 ~ VDD - 40
V
Logic Input Voltage
VI
-0.5 ~ VDD + 0.5
V
VFD Driver Output Voltage
Vo
VEE - 0.5 ~ VDD + 0.5
V
VFD Driver Output Current
IOVFD
-40(Grid)
mA
-15(Segment)
RECOMMENDED OPERATING RANGE (Unless otherwise stated, Tamb=-20 ~ 70 °C, GND=0V)
Characteristic
Symbol
Min.
Typ.
Max.
Unit
Logic Supply Voltage
VDD
4.5
5
5.5
V
High-Level Input Voltage
VIH
0.7 VDD
--
VDD
V
Low-Level Input Voltage
VIL
0
--
0.3VDD
V
Driver Supply Voltage
VEE
VDD-35
--
0
V
ELECTRICAL CHARACTERISTICS
(Unless otherwise stated, Tamb=25 °C, VDD =5V, GND=0V, VEE=VDD-35V)
Characteristic
Low -Level Output Voltage
Symbol
Test conditions
VOLDOUT DOUT, IOLDOUT =4mA
High-Level Output Current
IOHGR
High-Level Output Current
IOHSG
VO=VDD-2V, GR1 to GR4,
SG9/GR8 to SG12/GR5
VO=VDD-2V, SG1/KS1 to
SG8/KS8
Min.
Typ.
Max.
Unit
--
--
0.4
V
-15
--
--
mA
-3
--
--
mA
High-Level Input Voltage
VIH
--
0.7VDD
--
--
V
Low-Level Input Voltage
VIL
--
--
--
0.3VDD
V
Oscillation Frequency
fosc
R=100KΩ
350
500
650
kHz
VI=VDD or VSS
--
--
±1
µA
Under no load, display off
--
--
5
mA
Min.
Typ.
Max.
Unit
--
--
0.4
V
-6
--
--
mA
-1.5
--
--
mA
Input Current
Dynamic Current Consumption
II
IDDdyn
ELECTRICAL CHARACTERISTICS
(Unless otherwise stated, Tamb=25 °C, VDD =3.3V, GND=0V, VEE=VDD-35V)
Characteristic
Symbol
Low -Level Output Voltage
VOLDOUT
High-Level Output Current
IOHGR
High-Level Output Current
IOHSG
Test conditions
DOUT, IOLDOUT =4mA
VO=VDD-2V, GR1 to GR4,
SG9/GR8 to SG12/GR5
VO=VDD-2V, SG1/KS1 to
SG8/KS8
(To be continued)
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SC16315S
(Continued)
Characteristic
High-Level Input Voltage
Symbol
Test conditions
Min.
0.7
Typ.
Max.
Unit
--
VDD
V
VIH
--
Low-Level Input Voltage
VIL
--
VSS
--
0.3VDD
V
Oscillation Frequency
fosc
R=100KΩ
350
500
650
kHz
VI=VDD or VSS
--
--
±1
µA
Under no load, display off
--
--
3
mA
Input Current
II
Dynamic Current Consumption
IDDdyn
VDD
PIN DESCRIPTION
Pin No.
Pin Name
Description
Clock input pin. This pin reads serial data at the rising edge and outputs
1
CLK
2
STB
3, 4
K1 to K2
5, 25
VSS
Logic ground pin
6, 24
VDD
Logic power supply
7~14
15
16~19
SG1/KS1 to
SG8/KS8
VEE
SG9/GR8 to
SG12/GR5
20~23
GR4 to GR1
26
OSC
27
DOUT
28
DIN
data at the falling edge.
Serial interface strobe pin. The data input after the STB has fallen is
processed as a command. When this pin is”HIGH”, CLK is ignored.
Key data input pins. At the end of the display cycle, the data sent to these
pins are latched.
High voltage segment output pins also acts as the key source.
Pull down level.
High voltage segment/Grid output pins.
High voltage Gird output pins
Oscillator input pin. Determining the oscillation frequency by a resistor
which is connected to this pin and GND (VSS).
Data output pin (N-channel, open drain) this pin outputs serial data at the
falling edge of the shift clock (starting from the lower bit).
Data input pin. This pin inputs serial data at the rising edge of the shift
clock (starting from the lower bits).
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SC16315S
FUNCTIONAL DESCRIPTION
Commands
Commands determine the display mode and status of SC16315S. A command is the first byte (b0 to b7)
inputted to SC16315S via the DIN Pin after STB Pin has changed from “HIGH”to “LOW”State. For some reason,
if STB Pin is set to “HIGH”while data or commands are being transmitted, the serial communication is initialized,
and the data/commands being transmitted are considered invalid.
COMMAND1: Display mode setting commands
SC16315S provides 4 display mode settings as shown in the diagram below: As stated earlier a command is
the first one byte (b0 to b7) transmitted to SC16315S via the DIN Pin when STB is “LOW”. However, for these
commands, the bits 5 to 6 (b4 to b5) are ignored, bits 7 & 8 (b6 to b7) are given a value of “0”.
The Display Mode Setting Commands determine the number of segments and grids to be used (1/4 to 1/8 duty,
12 to 8 segments). The display will be forcibly turned off and the key scanning will stop when these commands
are executed. In order to resume display, a display command “ON”must be executed. If the same mode setting
is selected, no command execution is take place, therefore, nothing happens.
When Power is turned “ON”, the 8-digit, 8-segment mode is selected.
Figure 3: display mode settings
MSB
LSB
0
0
b3
b2
b1
b0
Display mode settings
Don't
relevant
0000: 4 digits, 12 segments
0011: 5 digits, 11 segments
0100: 6 digits, 10 segments
0101: 7 digits, 9 segments
0110: 8 digits, 8 segments
COMMAND 2: Data setting commands
The Data Setting Commands executes the Data Write or Data Read Modes for SC16315S. The Data Setting
Command, the bits 5 and 6 (b4, b5) are ignored, bit 7 (b6) is given the value of “1”while bit 8 (b7) is given the
value of “0”. Please refer to the diagram below.
When power is turned ON, the bit 4 to bit 1 (b3 to b0) are given the value of “0”.
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SC16315S
Figure 4: data settings
MSB
0
LSB
1
b3
b2
b0
b1
Data write & read mode settings:
00: Write data to display mode
01: Irrelevant
10: Read key data
11: Irrelevant
Don't
relevant
Address increment mode settings(display mode):
0: Increments address after data has been written
1: Fixes address
Mode settings:
0: Normal operation mode
1: Test mode
COMMAND 3: Address setting commands
Address Setting Commands are used to set the address of the display memory. The address is considered
valid if it has a value of “00H”to “1DH”. The data is ignored until a valid address is set if the address is set to 1EH
or higher. When power is turned ON, the address is set at “00H”.
Please refer to the diagram below.
Figure 5: address settings
MSB
LSB
1
1
0
b4
b3
b2
b1
b0
Address: 00H to 1DH
COMMAND 4: Display control commands
The Display Control Commands are used to turn ON or OFF a display. It also used to set the pulse width.
Please refer to the diagram below. When the power is turned ON, a 1/16 pulse width is selected and the
displayed is turned OFF (the key scanning is stopped).
Figure 6: display control settings
MSB
1
LSB
b3
0
b2
b1
b0
Dimming quantity settings:
Don't
relevant
000: Set pulse width to 1/16
001: Set pulse width to 2/16
010: Set pulse width to 4/16
011: Set pulse width to 10/16
100: Set pulse width to 11/16
101: Set pulse width to 12/16
110: Set pulse width to 13/16
111: Set pulse width to 14/16
Display settings:
0: Display off(key scan continues)
1: Display on
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SC16315S
Display mode and RAM address
Data transmitted from an external device to SC16315S via the serial interface are stored in the Display RAM
and are assigned addresses. The RAM Addresses of SC16315S are given below in 8 bits unit.
Figure 7:SC16315S RAM address
SG1
SG4 SG5
SG8 SG9
SG12
00H
01H
02H
DGT1
03H
04H
05H
DGT2
06H
07H
08H
DGT3
09H
0AH
0BH
DGT4
12H
13H
14H
DGT5
15H
16H
17H
DGT6
18H
19H
1AH
DGT7
1BH
1CH
1DH
DGT8
Figure 8: SC16315S written RAM data bytes
Note: X=don’
t care
Key matrix & Key-input data storage ram
The key matrix is made up of 8x 2 arrays as shown below:
Figure 9: SC16315S key matrix
K1
SG8/KS8
SG7/KS7
SG6/KS6
SG5/KS5
SG4/KS4
SG3/KS3
SG2/KS2
SG1/KS1
K2
Each data entered by each key is stored as follows. They are read by a READ Command, starting from the last
significant bit. When the most significant bit of the data (SG1, b0) has been read, the least significant bit of the
next data (SG8, b7) is read.
Figure 10: SC16315S key input data storage
K1… … … K2
K1… … … . K2 K1… … … … .K2
K1… … … … ..K2
SG1/KS1
SG2/KS2
SG3/KS3
SG4/KS4
*
*
*
*
SG5/KS5
SG6/KS6
SG7/KS7
SG8/KS8
b0 ------- b1
b2 ------- b3
b4-------- b5
b6 -------- b7
Reading sequence
Note: *=These sections are not relevant but are needed to read the transmission clock.
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SC16315S
KEY SCANNING AND DISPLAY TIMING
The Key Scanning and display timing diagram is given below. One cycle of key scanning consists of 2 frames.
The data of the 8 x 2 matrix is stored in the RAM.
Figure 11: SC16315S scanning & display timing diagram
SERIAL COMMUNICATION FORMAT
The following diagram shows the SC16315S serial communication format. The DOUT Pin is an N- channel,
open-drain output pin; therefore, it is highly recommended that an external pull-up resistor (1 KΩ to 10 KΩ) must
be connected to DOUT.
Figure 12: SC16315S serial communication format
Reception (command/data write)
If data continues
STB
DIN
b0
CLK
b1
1
b2
2
b6
b7
7
3
8
Transmission (data read)
STB
DIN
CLK
b0
1
b1
2
b2
3
b3
4
b4
5
b5
6
b6
7
b7
8
1
2
3
4
5
6
tWAIT
DOUT
b0
Data read command is set.
b1
b2
b3
b4
b5
Data reading starts
Where: twait (waiting time) ≥ 1µs.
It must be noted that when the data is read, the waiting time (twait) between the rising of the eighth clock that
has set the command and the falling of the first clock that has read the data is greater or equal to 1µs.
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SC16315S
SWITCHING CHARACTERISTIC WAVEFORM
SC16315S switching characteristics waveform is given below.
Figure 13: SC16315S switching characteristic waveform
fOSC
OSC
50%
PWSTB
STB
PWCLK
PWCLK
tCLK-STB
CLK
tSETUP
tHOLD
DIN
tPZL
tPZL
DOUT
tTHZ
Sn/Gn
tTZH
90%
10%
Where: PW CLK(clock pulse width)≥400ns
t setup(data setup time) ≥100ns
PW STB(strobe pulse width) ≥1µs
thold (data hold time) ≥100ns
tCLK-STB (clock-strobe time) ≥1µs
tTHZ (fall time)≤150µs
tTZH2 (grid rise time) ≤0.5µs(at VDD=5V)
tPZL (propagation delay time)≤100ns
tTZH2 (grid rise time) ≤1.0µs(at VDD=3.3V)
tPLZ (propagation delay time) ≤400ns
tTZH1 (segment rise time) ≤2.0µs(at VDD=5V)
fosc=oscillation frequency
tTZH1 (segment rise time) ≤3.0µs(at VDD=3.3V)
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SC16315S
APPLICATIONS
Display memory is updated by incrementing addresses. Please refer to the following diagram.
Figure 14: display memory updated by address increments
STB
CLK
DIN
Command 2
Command 3
Data 1
Data n
Command 1
Command 4
where : Command1: display mode setting command
Command2: data setting command
Command3: address setting command
Data 1 to n: transfers display data (24 bytes max.)
Command4: display control command
The following diagram shows the waveforms when updating specific addresses.
Figure 15: address update.
STB
CLK
DIN
Command 2
Command 3
Data
Command 3
Data
Where: Command 2— data setting command
Command 3— address setting command
Data— display data
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SC16315S
RECOMMENDED SOFTWARE FLOWCHART
Figure 17: recommended software flowchart
Note: 1. Command 1: Display Mode Commands
2. Command 2: Data Setting Commands
3. Command 3: Address Setting Commands
4. Command 4: Display Control Commands
5. When IC power is applied for the first time, the contents of the Display RAM are not defined; thus, it is
strongly suggested that the contents of the Display RAM must be cleared during the initial setting.
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SC16315S
TYPICAL APPLICATION CIRCUIT
V DD
10K
MCU
1 CLK
DIN 28
2 STB
DOUT 27
3 K1
V DD
OSC 26
4 K2
V SS 25
5 V SS
V DD 24
6 V DD
GR1 23
82K
0.1µF
V DD
8 SG2/KS2
SC16315S
7 SG1/KS1
GR2 22
GR3 21
9 SG3/KS3
GR4 20
10 SG4/KS4
SG12/GR5 19
11 SG5/KS5
SG11/GR6 18
12 SG6/KS6
SG10/GR7 17
13 SG7/KS7
SG9/GR8 16
14 SG8/KS8
V EE 15
10K
G8 G7
G6 G5
G4 G3
G2 G1
8-GRID X 8- SEGMENT VFD
S8
S7
S6
S5
S4
S3
S2
S1
V EE
1N4148 X 8
10K
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SC16315S
PACKAGE OUTLINE
2.8 MAX
9.525
7.6±0.3
UNIT: mm
10.2±0.4
SOP-28-375-1.27
HANDLING MOS DEVICES:
Electrostatic charges can exist in many things. All of our MOS devices are internally protected against
electrostatic discharge but they can be damaged if the following precautions are not taken:
• Persons at a work bench should be earthed via a wrist strap.
• Equipment cases should be earthed.
• All tools used during assembly, including soldering tools and solder baths, must be earthed.
• MOS devices should be packed for dispatch in antistatic/conductive containers.
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