SS8046 3.3V 2A Low-Dropout Regulator with Disable Features General Description Dropout-voltage 0.5V @ I O = 2A Output current in excess of 2A Output voltage accuracy ±2.5% Quiescent current typically 5mA Internal short-circuit current limit Internal over-temperature protection TO-220 4pin Full-Mold package ON/OFF control The SS8046 positive 3.3V voltage regulator features the ability to source 2A of output current. The dropout voltage is 0.5V at 2A output current. The typical quiescent current is 5mA. Furthermore, the quiescent current is smaller when the regulator is in the dropout mode (V IN < 3.3V). Familiar regulator features such as over-temperature and over-current protection circuits are provided to prevent the device from being damaged by abnormal operating conditions. A Vdis pin is provided to disable the output when needed. Ordering Information SS8046XX1TB Packing type TB: Tubes Package Type TF : TO 220F-4L (short lead) TH : TO 220F-4L (long lead) Example: SS8046TF1TB à SS8046 in TO 220F-4L (short lead) shipped in tubes Typical Application Pin Configuration ON/OFF TO 220F-4 IO V IN SS8046 C1 4.7µF IQ V OUT C OUT 47µF Top View 1 2 3 4 V IN V O GND V dis Rev.2.01 6/06/2003 www.SiliconStandard.com 1 of 7 SS8046 Block Diagram VIN 1 2 VO THERMAL SHUTDOWN BANDGAP REFERENCE SHORT-CIRCUIT PROTECTION 1.25V _ + R1 OUTPUT ON/OFF HIGH / LOW Vdis 4 R2 TTL COMPATIBLE BUFFER 3 GND Absolute Maximum Ratings (Note 1) Input Voltage……………………….…….……………………………………………..…..8V Vdis Voltage……………………………..……………………………………………...……8V Power Dissipation Internally Limited (Note 2) Maximum Junction Temperature.…..…….………………………………………….…..150°C Storage Temperature Range………………………………………………....................-65°C ≤ TJ ≤+150°C Lead Temperature, Time for Wave Soldering TO 220 Package…………….….……….………………………………………….……..260°C, 10s Continuous Power Dissipation (TA = +25°C) TO 220 No heatsink…………….…………….……………………………………....…..1.5W TO 220 with infinite heatsink…………………..………………………………………….15W Operating Conditions (Note 1) Input Voltage………………………………………………………………………….…..3.6V~7V Temperature Range…………………………………………………….….…..….........-20°C ≤ TA ≤85°C Rev.2.01 6/06/2003 www.SiliconStandard.com 2 of 7 SS8046 Electrical Characteristics VIN =5V, IO = 0.5A, CIN = 4.7µF, COUT =47µF, TA = TJ = 25°C unless otherwise specified [Note 3] PARAMETER SYMBOL CONDITIONS MIN TYP MAX 3.22 3.3 3.38 V 4V < V IN < 7V, IO = 10mA 0.5 2 % Load Regulation 50mA < IO < 2A 0.5 2 % Quiescent Current V IN = 5V 5 10 mA Ripple Rejection fi = 120Hz, 1VP-P, IO = 100mA 45 Dropout Voltage IO = 2A Output Voltage IO =0.5A Line Regulation UNITS dB 0.5 V Short Circuit Current 3.8 A Over Temperature 150 °C Disable Voltage High V disH Output Active Disable Voltage Low V disL Output Disabled 2.0 0.8 V V Disable Bias Current High IdisH V dis = 2.7V 20 µA Disable Bias Current Low IdisL V dis = 0.4V 20 µA Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics. Note 2: The maximum power dissipation is a function of the maximum junction temperature, TJmax , total thermal resistance, θJA, and ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is Tjmax-TA / θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and the device will go into thermal shutdown. For the TO 220 package, θ JA is 60°C/W (No heat sink). Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible. Note4: The output capacitor should be a tantalum or aluminum type. Definitions Dropout Voltage The input/output voltage differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 2% below its nominal value, dropout voltage is affected by junction temperature, load current and minimum input supply requirements. Line Regulation The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly affected. Rev.2.01 6/06/2003 Load Regulation The change in output voltage for a change in load current at constant chip temperature. The measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly affected. Maximum Power Dissipation The maximum total device dissipation for which the regulator will operate within specifications. Quiescent Bias Current Current which is used to operate the regulator chip and is not delivered to the load. www.SiliconStandard.com 3 of 7 SS8046 Typical Performance Characteristics (V IN=5V, CIN=10µF, COUT =47µF, TA=25°C, unless otherwise noted.) Line Transient Response Load Transient Response Short Circuit-Current Output Noise Ripple Rejection Disable- ON 60 IL=100mA Ripple Rejection (dB) 50 40 30 IL=2A IL=1A 20 10 COUT=47µF 0 10 100 1000 10000 100000 1000000 Frequency (Hz) Rev.2.01 6/06/2003 www.SiliconStandard.com 4 of 7 SS8046 Typical Performance Characteristics (continued) Dropout Voltage vs. Temperature Load Regulation 0.5 0 -0.1 IL=2A IL=100mA~1A 4V -0.2 Load Regulation (%) Dropout Voltage (V) 0.4 0.3 0.2 0.1 7V -0.3 -0.4 -0.5 -0.6 -0.7 -0.8 -0.9 0 -1 -40 -20 0 20 40 60 80 100 -40 -20 0 Temperature (°C) Output Voltage vs. Temperature 40 60 80 100 Quiescent Current vs. Temperature 3.5 5 3.45 IL=1A VIN=4V 4.5 VIN=5V VIN=5V 4 Quiescent current (mA) VIN=7V 3.4 3.35 Vout 20 Temperature (°C) 3.3 3.25 3.2 VIN=6V 3.5 3 2.5 2 1.5 1 3.15 0.5 3.1 -40 -20 0 20 40 Temperature (°C) Rev.2.01 6/06/2003 60 80 100 0 -40 -20 0 20 40 60 80 100 Temperature (°C) www.SiliconStandard.com 5 of 7 SS8046 Package Outlines E1 2.8 ± 0.15 4.8 3.75 b D φ3 .20 e E θ A C A2 A1 TO 220F-4 Package (short lead) Note: 1. Lead frame material: TAMAC-4 2. Solder plating thickness: 10±5µm 3. Package body size include mold flash and gate burr 4. Tolerance±0.1mm unless otherwise specified 5. End flash Max. 0.05mm 6. Mismatch Max. 0.05mm 7. Misalignment Max. 0.05mm 8. Epoxy molding compound: SUMITOMO 6300H or equivalent 9. Matte finish Ra: 0.2µm~0.8µm top and bottom surface SYMBOL A A1 A2 D E E1 C e b ? Rev.2.01 6/06/2003 MIN. DIMENSION IN MM NOM. MAX. MIN. DIMENSION IN INCH NOM. MAX. 4.42 2.69 1.68 10.00 6.25 8.54 ------------4° 4.57 2.79 1.78 10.10 6.35 8.64 0.48 2.54(TYP) 0.635(TYP) 7° 4.72 2.89 1.88 10.20 6.45 8.74 ------------11° 0.174 0.106 0.066 0.400 0.246 0.336 ------------4° 0.180 0.110 0.070 0.404 0.250 0.340 0.019 0.1(TYP) 0.025(TYP) 7° 0.186 0.114 0.074 0.408 0.254 0.344 ------------11° www.SiliconStandard.com 6 of 7 SS8046 E1 2.8 ± 0.15 L b D φ3 .20 e E θ A C A2 A1 TO 220F-4 Package (long lead) Note: 1. Lead frame material: TAMAC-4 2. Solder plating thickness: 10±5µm 3. Package body size include mold flash and gate burr 4. Tolerance±0.1mm unless otherwise specified 5. End flash Max. 0.05mm 6. Mismatch Max. 0.05mm 7. Misalignment Max. 0.05mm 8. Epoxy molding compound: SUMITOMO 6300H or equivalent 9. Matte finish Ra: 0.2µm~0.8µm top and bottom surface SYMBOL A A1 A2 D E E1 L C e b ? MIN. DIMENSION IN MM NOM. MAX. 4.42 2.69 1.68 10.00 6.25 8.54 13.70 ------------4° 4.57 2.79 1.78 10.10 6.35 8.64 13.90 0.48 2.54(TYP) 0.635(TYP) 7° 4.72 2.89 1.88 10.20 6.45 8.74 14.10 ------------11° MIN. DIMENSION IN INCH NOM. MAX. 0.174 0.106 0.066 0.400 0.246 0.336 0.539 ------------4° 0.180 0.110 0.070 0.404 0.250 0.340 0.547 0.019 0.1(TYP) 0.025(TYP) 7° 0.186 0.114 0.074 0.408 0.254 0.344 0.555 ------------11° Information furnished by Silicon Standard Corporation is believed to be accurate and reliable. However, Silicon Standard Corporation makes no guarantee or warranty, express or implied, as to the reliability, accuracy, timeliness or completeness of such information and assumes no responsibility for its use, or for infringement of any patent or other intellectual property rights of third parties that may result from its use. Silicon Standard reserves the right to make changes as it deems necessary to any products described herein for any reason, including without limitation enhancement in reliability, functionality or design. No license is granted, whether expressly or by implication, in relation to the use of any products described herein or to the use of any information provided herein, under any patent or other intellectual property rights of Silicon Standard Corporation or any third parties. Rev.2.01 6/06/2003 www.SiliconStandard.com 7 of 7