SS8117G 1A Adjustable Low-Dropout Regulator FEATURES DESCRIPTION Dropout voltage typically 1.2V @ I O = 800mA Output current in excess of 1A Adjustable output voltage Space-saving SOT-223 package Internal short circuit current limit Internal over temperature protection The SS8117G is a low dropout linear regulator with a max. dropout voltage of 1.4V at a load current of 1A. Available only in adjustable form, the output voltage can be set from 1.25V to 5V with only two external resistors. The SS8117G provides over-temperature and overcurrent protection circuits to prevent it from being damaged by abnormal operating conditions. APPLICATIONS Post-regulation for switching DC/DC converters. High-efficiency linear regulator Battery charger Battery-powered instrumentation Motherboards The SS8117G is available in a SOT-223 package. A tantalum electrolytic capacitor of at least 10µF is required at the output to improve the transient response and stability. ORDERING INFORMATION SS8117GT63XX Packing Pin Option Package Type PACKAGE TYPE PIN OPTION GT6 : SOT-223 Pb-free 1 3 : GND/ADJ 2 Vout PACKING 3 Vin TR : Tape & Reel TB: Tubes Pb-free, RoHS compliant TYPICAL APPLICATION IO SS8117G VOUT VIN VIN PIN CONFIGURATION VOUT Top View GND/ADJ C1 1 µF R1 COUT 10µF R2 1 2 3 SOT 223 5/26/2005 Rev.2.2 www.SiliconStandard.com 1 of 6 SS8117G ABSOLUTE MAXIMUM RATINGS (Note 1) Input Voltage………………………………………………………………………………………….…7V Power Dissipation Internally Limited (Note 2) Maximum Junction Temperature…...…………………………………………………………….…..150°C Storage Temperature Range…..……………………………………….................…………..-65°C ≤ TJ ≤+150°C Reflow Temperature (soldering, 10secs) SOT 223 Pac kage…….……………………………………………………….....…..…………....260°C Continuous Power Dissipation (TA = +25°C) SOT 223(1) ……………………...……………………………………………………………………..0.8W Note (1): See Recommended Minimum Footprint OPERATING CONDITIONS (Note 1) (V IN-VADJ) Voltage………..……………………………………………….......……………….……2.5V~6.5V Temperature Range…………………………………………………………...............….……..-40°C ≤ T J ≤85°C ELECTRICAL CHARACTERISTICS Operating Conditions: V IN ≤ 6.5V, TJ = 25°C unless otherwise specified. [Note3] PARAMETER CONDITIONS MIN TYP MAX UNITS 1.225 1.250 1.275 V Reference Voltage V IN - V OUT = 2V, IOUT = 10mA Line Regulation (V OUT + 1.5V) < V IN < 6.5V, IOUT = 10mA 1.32 Load Regulation (V IN - V OUT ) = 2V, 10mA < IOUT < 800mA 0.04 Dropout Voltage ∆V OUT = 2%, IOUT = 800mA 1.2 1.3 ∆V OUT = 2%, IOUT = 1A 1.3 1.4 Current Limit (V IN - V OUT ) = 2V Adjust Pin Current Change V IN - V OUT = 2V, 10mA < IOUT < 1mA Minimum Load Current 1.5V < (V IN - V OUT ) < 5.25V Quiescent Current V IN - V OUT = 2V 80 µA Ripple Rejection f = 120Hz, COUT = 10µF Tantalum, (V IN - V OUT ) = 3V, IOUT = 800mA 50 dB Thermal Regulation TA = 25°C, 30ms pulse Temperature Stability V IN = 4V, IO =10mA RMS Output Noise (% of V OUT ) TA = 25°C, 10Hz < f < 10kHz, ILOAD = 10mA 1000 % % V V 1200 mA 0.15 µA 10 mA 0.004 0.02 %/W 0.3 % 0.007 % Thermal Resistance,Junction-to-Ambient SOT-223; Recommended Minimum Footprint (No heat sink; No air flow) 156 °C/W Thermal Shutdown 150 °C 10 °C Junction Temperature Thermal Shutdown Hysteresis Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics. Note 2: The maximum power dissipation is a function of the maximum junction temperature, TJmax , total thermal resis tance, θJA, and ambient temperature TA. The maximum allowable power dissipation at any ambient te mperature is Tjmax-TA / θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and the IC will go into thermal shutdown. For the SS8117G in SOT 223 package, θ JA is 156°C/W (See recommended minimum footprint). For safe operation in SOT 223 package, see “Typical Performance Characte ristics” (Safe Operating Area). Note3: Low duty cycle pulse techniques are used during test to maintain junction te mperature as close to ambient temperature as possible. Note4: The output capacitor should be tantalum or aluminum . 5/26/2005 Rev.2.2 www.SiliconStandard.com 2 of 6 SS8117G DEFINITIONS Output Voltage The SS8117G provides an adjustable output voltage from 1.25V to 5V with two external resistors. It can be calculated from: VOUT = 1.25V x (1+ R2 R1 ) + IADJ x R2 IADJ = 80µA (typ.) Dropout Voltage The input/output voltage differential at which the regulator output no longer maintains regulation against further reductions in input voltage. It is measured when the output drops 20% below its nominal value. Dropout voltage is affected by junction temperature, load current and minimum input supply requirements. voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not significantly affected. Load Regulation The change in output voltage for a change in load current at constant chip temperature. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not significantly affected. Maximum Power Dissipation The maximum total device dissipation with which the regulator will still operate within specifications. Quiescent Bias Current Current which is used to operate the regulator chip and is not delivered to the load. Line Regulation The change in output voltage for a change in input volt- Recommended Minimum Footprint 5/26/2005 Rev.2.2 www.SiliconStandard.com 3 of 6 SS8117G TYPICAL PERFORMANCE CHARACTERISTICS (V IN= 4V, CIN=10µF, COUT=10µF, TA=25°C, unless otherwise noted. Line transient Load Transient Dropout Voltage vs. Load Current I ADJ Current vs. Load Current 1.06 94 85°C 91 1.02 85°C 1 IADJ Current(mA) Dropout Voutput (V) 1.04 25°C 0.98 0.96 -45°C 0.94 88 25°C 85 82 79 -45°C 76 0.92 73 0.9 70 0 200 400 600 800 Output Current (mA) 1000 0 Ripple Rejection 100 200 300 400 500 600 700 800 Load Current(mA) Temperature Stability 1 60 Ripple Rejection (dB) 50 (VIN - V OUT) > 3V 40 I OUT = 800mA 30 20 COUT = 10µF IOUT = 0.1A~0.8A 10 0 10 5/26/2005 Rev.2.2 100 1000 10000 Frequency (Hz) 100000 Output Voltage Change IOUT = 100mA 0.5 0 -0.5 -1 -40 -20 0 www.SiliconStandard.com 20 40 60 Temperature 80 100 4 of 6 SS8117G TYPICAL PERFORMANCE CHARACTERISTICS (continued) Output Noise Short-Circuit Current 1.60 1.50 Short-Circuit current (A) VIN = 4.5V IOUT = 10mA 115°C 1.40 1.30 25°C 1.20 -45°C 1.10 1.00 0.90 0.80 1.25 1.75 2.25 2.75 3.25 3.75 4.25 4.75 5.25 (VIN-V OUT ) Diffrential (V) Load Regulation Overcurrent Protection Characteristics Output Voltage Deviation (%) 0.15 0.1 0.05 0 -0.05 -0.1 -40 -25 -10 5 20 35 50 65 80 95 110 Temperature Max. Power Dissipationj vs. Ambient Temperature Max. Power Dissipation vs. PCB Top Copper Area 2.5 2.5 2 1.5 1 0.5 A=0.2 still air; Different PCB Top Copper Area A=0.3 2.1 A=0.4 1.9 A=0.5 1.7 A=1.0 A=1.5 1.5 A=2.0 1.3 A=2.5 1.1 A=3.0 A=3.5 0.9 A=4.0 0.7 0 5/26/2005 Rev.2.2 A=4.5 A=5.0 0.5 0 1 2 3 4 PCB Top Copper Area (in2) 5 2 A=0.1 2.3 Max. Dissipation Power (W) Max. Dissipation Power (W) TAMB = 25°C ; Still Air Unit : in 25 35 www.SiliconStandard.com 45 55 TAMB 65 (°C) 75 85 5 of 6 SS8117G A D α B1 C 1 3°(4X ) H E L L2 e e1 13° (4X) Feed Direction SOT 223 Package Orientation A1 B SOT-223 (GT6) Package SYMBOLS MILLIMETERS INCHES MIN MAX MIN MAX A 1.55 1.80 0.061 0.071 A1 0.02 0.12 0.0008 0.0047 B 0.60 0.80 0.024 0.031 B1 2.90 3.10 0.114 0.122 C 0.24 0.32 0.009 0.013 D 6.30 6.70 0.248 0.264 E 3.30 3.70 0.130 0.146 e 2.30 BSC e1 4.60 BSC H 6.70 0.090 BSC 0.181 BSC 7.30 0.264 0.287 L 0.90 MIN 0.036 MIN L2 0.06 BSC 0.0024 BSC a 0º 10º 0º 10º Information furnished by Silicon Standard Corporation is believed to be accurate and reliable. However, Silicon Standard Corporation makes no guarantee or warranty, express or implied, as to the reliability, accuracy, timeliness or completeness of such information and assumes no responsibility for its use, or for infringement of any patent or other intellectual property rights of third parties that may result from its use. Silicon Standard reserves the right to make changes as it deems necessary to any products described herein for any reason, including without limitation enhancement in reliability, functionality or design. No license is granted, whether expressly or by implication, in relation to the use of any products described herein or to the use of any information provided herein, under any patent or other intellectual property rights of Silicon Standard Corporation or any third parties. 5/26/2005 Rev.2.2 www.SiliconStandard.com 6 of 6