SUPERWORLD SDM109N

MOLDING TYPE DIP INDUCTORS
SDM109N SERIES
1. PART NO. EXPRESSION :
SDM109N-R25MF
(a)
(b)
(c)
(d)(e)
(a) Series code
(d) Tolerance code : M = ±20%
(b) Dimension code
(e) F : Lead Free
(c) Inductance code : R25 = 0.25uH
2. CONFIGURATION & DIMENSIONS :
A
L
P
11.5
E
B
M
ØN
C
R50
O
D
11.5
PCB Pattern
ØW
F
A
10.5 Max.
B
C
10.5 Max. 10.0 Max.
Unit:m/m
D
E
F
3.4±0.5
5.3±1.0
5.3±1.0
W
L
M
ØN
O
P
1.3±0.1
7.5±0.5
7.5 Typ.
1.6 Typ.
5.3±0.15
5.3±0.15
3. SCHEMATIC :
4. MATERIALS :
(a) Core : M-Iron Core
(b) Wire : Enamelled Copper Wire
(c) Adhesive : Epoxy
5. FEATURES :
a) Shielded construction
b) Frequency up to 1MHz
NOTE : Specifications subject to change without notice. Please check our website for latest information.
18.04.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 1
MOLDING TYPE DIP INDUCTORS
SDM109N SERIES
6. GENERAL SPECIFICATION :
a) Test Frequency : 100KHz/1.0Vdc
b) Operating temp. : -25°C to +125°C
c) Ambient temp. : 25°C
d) Irms (A) : Will cause an approximately temp. rise < 40°C typ.
e) Isat (A) : Will cause L0 to drop approximately 20% typ.
f) Part temperature (ambient + temp. rise) : Should not exceed 125°C under worst case operating conditions.
7. ELECTRICAL CHARACTERISTICS :
Part No.
Inductance L0 ( uH )
±20% @ 0Adc
Q
Min.
Irms
(A)
Typ.
Isat
(A)
Max.
DCR
( mȍ )
Max.
SDM109N-R25MF
0.25
20
35
40
0.8
SDM109N-R50MF
0.50
20
32
38
1.0
SDM109N-R56MF
0.56
20
30
35
1.0
SDM109N-R68MF
0.68
15
30
35
1.3
SDM109N-R80MF
0.80
15
10
20
1.3
8. CHARACTERISTICS CURVES :
Inductance vs. Frequency
SDM109N
SERIES
D MP I109
N
I N DU CT AN CE (u H
˄
˥˅ˈ
˃ˁˋ
˥ˈ˃
˃ˁˉ
˥ˈˉ
˃ˁˇ
˥ˉˋ
˃ˁ˅
˃
˃ ˁ˃ ˃ ˄
˥ˋ˃
˃ˁ˃ ˄
˃ˁ˄
˄
FR EQ UE NC Y( M Hz)
˄˃
˄ ˃˃
NOTE : Specifications subject to change without notice. Please check our website for latest information.
18.04.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 2
MOLDING TYPE DIP INDUCTORS
SDM109N SERIES
8. CHARACTERISTICS CURVES :
DC Current vs. Inductance & Temperature Rise
SDM109N-R50MF
DMPI109N-R50
SDM109N-R25MF
DMPI109N-R25
100
1
100
90
90
60
0.3
50
0.2
40
30
0.1
INDUCTANCE (uH)
70
TEMP. RISE(oC)
INDUCTANCE (uH)
80
80
0.4
20
0.75
70
60
50
0.5
40
30
0.25
20
10
0
0
10
20
30
40
50
10
0
0
60
0
DC CURRENT(A)
9
18
27
36
0
45
DC CURRENT(A)
SDM109N-R68MF
DMPI109N-R68
SDM109N-R56MF
DMPI109N-R56
1
TEMP. RISE(oC)
0.5
1
100
100
0.5
40
0.25
80
0.75
70
60
0.5
50
40
30
0.25
TEMP. RISE(o C)
60
INDUCTANCE (uH)
80
0.75
TEMP. RISE(oC)
INDUCTANCE (uH)
90
20
20
10
0
0
10
20
DC CURRENT(A)
0
30
40
SDM109N-R80MF
DMPI109N-R80
1
0
0
9
18
27
DC CURRENT(A)
36
0
45
50
45
40
35
0.6
30
25
0.4
20
15
0.2
TEMP. RIS E(oC)
INDUCTANCE(uH)
0.8
10
5
0
0
5
10
15
DC CURRENT(A)
20
0
25
NOTE : Specifications subject to change without notice. Please check our website for latest information.
18.04.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 3
MOLDING TYPE DIP INDUCTORS
SDM109N SERIES
9. RELIABILITY AND TEST CONDITION :
ITEM
PERFORMANCE
TEST CONDITION
Electrical Characteristics Test
Inductance
Refer to standard electrical characteristics list
HP-4192A, HP4284A, CH1320
DCR
Agilent 33420A
Heat Rated Current (Irms)
Irms(A) will cause an temp rise < 40°C typ.
Saturation Current (Isat)
Isat(A) will cause Lo to drop approximately 25%
Mechanical Performance Test
Solderability Test
More than 90% of the terminal electrode
should be covered with solder.
Preheating Dipping
245°C
150°C
60
seconds
Natural
cooling
4±1
seconds
After fluxing, component shall be dipped in a melted
solder bath at 245±5°C for 5 seconds
Solder Heat Resistance
1. Appearance : No significant abnormality
2. Inductance change : Within ±3%
Preheat : 150°C, 60sec.
Solder : Sn99.95-Cu0.05
Solder Temperature : 260±5°C
Flux : rosin
260°C
Dip Time : 10±0.5sec.
150°C
Preheating
Dipping
60
seconds
Natural
cooling
10±0.5
seconds
Reliability Test
High Temperature
Life Test
Low Temperature
Life Test
Temperature : 85±5°C
Time : 500±12 hours
Recovery: 4 to 24hrs of recovery under the standard
condition after the removal from test chamber
1. Appearance : No damage
2. Inductance : Within ±3% of initial value.
Thermal Shock
No disconnection or short circuit.
Temperature : -40±5°C
Time : 500±12 hours
Recovery: 4 to 24hrs of recovery under the standard
condition after the removal from test chamber
Conditions of 1 cycle.
Step
Temperature (°C)
1
-25±3
30±3
2
Room Temperature
Within 3
Times (min.)
3
85±3
30±3
4
Room Temperature
Within 3
Total : 5 cycles
Recovery: 4 to 24hrs of recovery under the standard
condition after the removal from test chamber
Humidity Resistance
1. Appearance : No damage
2. Inductance : Within ±5% of initial value.
No disconnection or short circuit.
Temperature : 40±5°C
Humidity : 90% to 95%
Applied Current : Rated Curent
Time : 500±12 hours
Recovery: 4 to 24hrs of recovery under the standard
condition after the removal from test chamber
NOTE : Specifications subject to change without notice. Please check our website for latest information.
18.04.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
MOLDING TYPE DIP INDUCTORS
SDM109N SERIES
10. SOLDERIND AND MOUNTING :
10-1. Recommended PC Board Pattern
Ty
p.
5
7.
p.
Ty
11.5
.6
5.3±0.15
Ø1
5.3±0.15
11.5
10-2. Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all
wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot
air soldering tools.
10-2.1 Solder Re-flow :
Recommended temperature profiles for re-flow soldering in Figure 1.
10-2.2 Soldering Iron (Figure 2) :
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
Note :
a) Preheat circuit and products to 150°C.
b) 280°C tip temperature (max)
c) Never contact the ceramic with the iron tip
d) 1.0mm tip diameter (max)
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
f) Limit soldering time to 3 secs.
Soldering
10s max.
Natural
cooling
250~260
230
180
150
60~120s
30~60s
Preheating
TEMPERATURE °C
TEMPERATURE °C
Preheating
350
Soldering
Natural
cooling
300
150
Over 1min.
Gradual
Cooling
Within 3secs.
Figure 1. Re-flow Soldering
Figure 2. Iron Soldering
NOTE : Specifications subject to change without notice. Please check our website for latest information.
18.04.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5
MOLDING TYPE DIP INDUCTORS
SDM109N SERIES
11. PACKING AND QUANTITY :
Size
SDM109N
Styrofoam
100
Inner Box
1000
Carton
2000
Application Notice
1. Storage Conditions :
To maintain the solderabililty of terminal electrodes :
a) Temperature and humidity conditions : Less than 30°C and 70% RH.
b) Recommended products should be used within 6 months from the time of delivery.
c) The packaging material should be kept where no chlorine or sulfur exists in the air.
2. Transportation :
a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
b) The use of tweezers or vacuum pick up is strongly recommended for individual components.
c) Bulk handling should ensure that abrasion and mechanical shock are minimized.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
18.04.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 6