HIGH CURRENT POWER INDUCTORS SDL1108N SERIES 1. PART NO. EXPRESSION : SDL1108N-R47MF (a) (b) (c) (d) (e) (f) (a) Series code (d) Inductance code : R47 = 0.47uH (b) Dimension code (e) Tolerance code : M = ±20% (c) Material code (f) F : RoHS Compliant B F 2. CONFIGURATION & DIMENSIONS : A D C R80 ØO E Unit : mm Part No. A B C D E F ØO SDL1108N-R30MF 11.7 Max. 11.7 Max. 8.5 Max. 3.5±0.5 6.3±0.5 5.7±0.5 1.5±0.1 SDL1108N-R47MF 11.7 Max. 11.7 Max. 8.5 Max. 3.5±0.5 6.3±0.5 5.7±0.5 1.5±0.1 SDL1108N-R56MF 11.7 Max. 11.7 Max. 8.5 Max. 3.5±0.5 6.3±0.5 5.7±0.5 1.5±0.1 SDL1108N-R60MF 11.7 Max. 11.7 Max. 8.5 Max. 3.5±0.5 6.3±0.5 5.7±0.5 1.5±0.1 SDL1108N-R80LF 11.7 Max. 11.7 Max. 8.5 Max. 3.5±0.5 6.3±0.5 6.4±0.5 1.3±0.1 SDL1108N-1R0MF 11.7 Max. 11.7 Max. 8.5 Max. 3.5±0.5 6.3±0.5 5.7±0.5 1.1±0.1 SDL1108N-R47MF 11.7 Max. 11.7 Max. 8.5 Max. 3.5±0.5 6.7±0.5 6.4±0.5 1.1±0.1 SDL1108N-R56MF 11.7 Max. 11.7 Max. 8.5 Max. 3.5±0.5 6.4±0.5 6.3±0.5 1.2±0.1 SDL1108N-R60MF 12.5 Max. 11.7 Max. 8.5 Max. 3.5±0.3 6.6±0.5 6.6±0.5 1.0±0.1 SDL1108N-R80LF 11.7 Max. 11.7 Max. 8.5 Max. 3.5±0.5 6.6±0.5 6.6±0.5 1.0±0.1 SDL1108N-1R0MF 11.7 Max. 11.7 Max. 8.5 Max. 3.5±0.3 5.7±0.5 7.9±0.5 0.8±0.1 3. SCHEMATIC : NOTE : Specifications subject to change without notice. Please check our website for latest information. 01.07.2009 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 HIGH CURRENT POWER INDUCTORS SDL1108N SERIES 4. MATERIALS : b (a) Core : Iron Core (b) Wire : Enamelled Copper Wire a 5. GENERAL SPECIFICATION : a) Operating temp. : -40°C to +125°C b) Storage temp. : -40°C to +125°C c) Ambient temp. : 20°C d) Irms (A) : Will cause the coil temperature rise approximately ǻT=40°C without core loss e) Isat (A) : Will cause L0 to drop approximately 20% typical f) Part temperature (ambient + temp. rise) : Should not exceed 125°C under worst case operating conditions 6. ELECTRICAL CHARACTERISTICS : Part No. Inductance L 0 ( µH ) Test Frequency ( Hz ) DCR ( mȍ ) ±8% Irms (A) Typ. Isat (A) Typ. SDL1108N-R30MF 0.30±20% 1V / 100K 0.8 38 50 SDL1108N-R47MF 0.47±20% 1V / 100K 0.8 38 50 SDL1108N-R56MF 0.56±20% 1V / 100K 1.3 32 40 SDL1108N-R60MF 0.60±20% 1V / 100K 0.8 38 50 SDL1108N-R80LF 0.80±15% 1V / 100K 1.3 31 45 SDL1108N-1R0MF 1.0±20% 1V / 100K 2.2 29 40 SDL1108N-1R2MF 1.2±20% 1V / 100K 2.2 20 30 SDL1108N-1R5MF 1.5±20% 1V / 100K 1.8 25 31 SDL1108N-2R0MF 2.0±20% 1V / 100K 3.3 21 30 SDL1108N-2R2MF 2.2±20% 1V / 100K 4.0 15 25 SDL1108N-3R3MF 3.3±20% 1V / 100K 6.0 12 15 NOTE : Specifications subject to change without notice. Please check our website for latest information. 01.07.2009 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 HIGH CURRENT POWER INDUCTORS SDL1108N SERIES 7. CHARACTERISTICS CURVES : SDL1108N-R30MF ˗˟ˣ˜˄˄˃ˋˡˀ˥ˆ˃ˠˀ˞˃˄ SDL1108N-R30MF DLPI1108N-R30M-K01 ˇ˃ ˧˸̀̃ˁʳ˥˼̆˸ʻ˷˸˺̅˸˸кʼ ˜ˡ˗˨˖˧˔ˡ˖˘ʻ̈˛ʼ ˄ˁ˃˃ ˃ˁˊˈ ˃ˁˈ˃ ˃ˁ˅ˈ ˃ˁ˃˃ ˃ ˄˃ ˅˃ ˆ˃ ˇ˃ ˆ˃ ˅˃ ˄˃ ˃ ˈ˃ ˃ DC CURRENT (A) ˌˁˈ ˄ˌ SDL1108N-R47MF ˆˋ ˅ˋ ˁˈ ˆˋˁ˃ ˅ˇ ˆ˅ ˅ˋˁˈ ˆˋ SDL1108N-R47MF ˇ˃ ˧˸̀̃ ˁʳ˥˼̆˸ʻ˷˸˺̅˸˸кʼ 0.45 ˜ ˡ˗˨˖ ˧˔ˡ˖ ˘ʻ̈ ˛ ˅ˋˁˈ ˗˖ʳ˖˨˥˥˘ˡ˧ʻ˔ʼ 0.36 0.27 0.18 0.09 0 ˃ ˄˃ ˅˃ ˆ˃ ˇ˃ DC CU RRENT (A) ˆ˃ ˅˃ ˄˃ ˃ ˈ˃ ˃ˁ˃ ˌˁ ˈ ˄ˌˁ˃ ˗˖ ʳ˖˨˥˥˘ ˡ˧ʻ ˔ʼ ˗˟ˣ˜˄˄˃ˋˡˀ˥ˈˉˠˀ˞˃˄ SDL1108N-R56MF SDL1108N-R56MF ˗˟ˣ˜˄˄˃ˋˡˀ˥ˈˉˠˀ˞˃˄ ˇ˃ ˧˸̀̃ˁʳ˥˼̆˸ʻ˷˸˺̅˸˸кʼ ˜ˡ˗˨˖˧˔ˡ˖˘ʻ̈˛ʼ ˄ˁ˃˃ ˃ˁˊˈ ˃ˁˈ˃ ˃ˁ˅ˈ ˃ˁ˃˃ ˃ ˄˃ ˅˃ ˆ˃ ˆ˃ ˅˃ ˄˃ ˃ ˇ˃ ˃ ˗˖ʳ˖˨˥˥˘ˡ˧ʻ˔ʼ ˄ˉ ˗˖ʳ˖˨˥˥˘ˡ˧ʻ˔ʼ SDL1108N-R60MF ˗˟ˣ˜˄˄˃ˋˡˀ˥ˉ˃ˠˀ˞˃˄ SDL1108N-R60MF DLPI1108N-R60M-K01 ˇ˃ ˧˸̀̃ˁʳ˥˼̆˸ʻ˷˸˺̅˸˸кʼ 2.00 ˜ˡ˗˨˖˧˔ˡ˖˘ʻ̈˛ʼ ˋ 1.50 1.00 0.50 0.00 ˃ ˄˃ ˅˃ ˆ˃ DC CURRENT(A) ˇ˃ ˈ˃ ˆ˃ ˅˃ ˄˃ ˃ ˃ ˌˁˈ ˄ˌ ˗˖ʳ˖˨˥˥˘ˡ˧ʻ˔ʼ NOTE : Specifications subject to change without notice. Please check our website for latest information. 01.07.2009 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 HIGH CURRENT POWER INDUCTORS SDL1108N SERIES 7. CHARACTERISTICS CURVES : SDL1108N-R80LF DLPI1108N-R80L SDL1108N-R80LF DLPI1108N-R80L ˇ˃ ˧˸̀̃ˁʳ˥˼̆˸ʻ˷˸˺̅˸˸кʼ ˜ˡ˗˨˖˧˔ˡ˖˘ʻ̈˛ʼ 1.0 0.8 0.6 0.4 0.2 ˆ˃ ˅˃ ˄˃ ˃ ˃ 0.0 ˃ ˈ ˄˃ ˄ˈ ˅˃ ˅ˈ ˆ˃ ˆˈ ˇ˃ ˊˁˊˈ ˄ˈˁˈ ˅ˆˁ˅ˈ ˆ˄ ˇˈ D C CU RRENT(A) DC CURRENT(A) ˗˟ˣ SDL1108N-1R0MF ˜˄˄ ˃ˋ ˡˀ˄˥ ˃ ˠˀ˞˃ ˄ SDL1108N-1R0MF DLPI11 08N-1R0M-K01 ˇ˃ ˧˸̀ ̃ˁ ʳ˥ ˼̆˸ʻ˷ ˸˺ ̅˸˸к ˜ˡ˗˨˖˧˔ˡ˖˘ʻ̈˛ʼ 2.0 1.5 1.0 0.5 0.0 ˆ˃ ˅˃ ˄˃ ˃ ˃ ˄˃ ˅˃ ˆ˃ ˇ˃ ˃ ˊ ˁ˅ˈ ˄ ˇˁˈ DC CURRENT(A) ˅ ˄ˁ ˋ ˅ˌ ˁ˃ ˇ˃ ˧˸̀̃ˁʳ˥˼̆˸ʻ˷˸˺̅˸˸кʼ ˜ˡ˗˨˖˧˔ˡ˖˘ʻ̈˛ʼ ˅ˌ S DL1108N-1R2M F DLPI1108N-1R2M S DL1108N-1R2M DL P I11 08 N -1R 2 MF 2.0 1.6 1.2 0.8 0.4 0.0 ˆ˃ ˅˃ ˄˃ ˃ ˃ ˈ ˄˃ ˄ˈ ˅˃ ˅ˈ ˆ˃ ˃ ˁ˃ ˊ ˁˆ ˄ ˇ ˁˈ DC CU R RE NT (A ) ˗ ˖ ʳ˖ ˨˥ ˥ ˘ ˡ ˧ ʻ˔ ʼ SDL1108N-1R5MF ˗ ˟ˣ ˜˄˄˃ˋ ˡˀ˄˥ˈˠ ˀ˞ ˃˄ SDL1108N-1R5MF DLPI1108N-1R5M-K01 ˇ˃ ˧ ˸ ̀ ̃ˁʳ ˥ ˼̆˸ ʻ˷˸ ˺̅˸ ˸ к 4 ˜ˡ˗˨˖˧˔ˡ˖˘ʻ̈˛ʼ ˅˄ ˁˊˈ ˗˖ ʳ˖ ˨˥ ˥ ˘ˡ˧ʻ˔ʼ 3 2 1 0 ˃ ˊˁˊˈ ˄ˈˁˈ DC CURRENT (A) ˅ˆˁ˅ˈ ˆ˄ ˆ˃ ˅˃ ˄˃ ˃ ˃ ˈ ˄˃ ˄ˈ ˅˃ ˅ˈ ˗˖ ʳ˖ ˨˥ ˥˘ ˡ˧ ʻ˔ ʼ NOTE : Specifications subject to change without notice. Please check our website for latest information. 01.07.2009 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 HIGH CURRENT POWER INDUCTORS SDL1108N SERIES 7. CHARACTERISTICS CURVES : SDL1108N-2R0MF DLPI1108N-2R0 3 100 SDL1108N-2R2MF ˗˟ˣ˜˄˄˃ˋˡˀ˅˥˅ˠˀ˞˃˄ 80 1.8 60 1.2 40 0.6 20 ˜ˡ˗˨˖˧˔ˡ˖˘ʻ̈˛ʼ 2.4 TEMP. RISE(oC) INDUCTANCE (uH) ˇˁ˃˃ ˆˁ˃˃ ˅ˁ˃˃ ˄ˁ˃˃ ˃ˁ˃˃ ˃ 0 ˈ 0 0 6 12 18 24 ˄˃ ˄ˈ ˅˃ ˅ˈ ˗˖ʳ˖˨˥˥˘ˡ˧ʻ˔ʼ 30 DC CURRENT(A) D L PI1 10 8N -3R 3 M -K0 1 SDL1108N-3R3MF 5.0 ˆ˃ 4.0 ˜ˡ˗˨˖ ˧˔ˡ˖ ˘ʻ̈˛ ˧˸̀̃ˁʳ˥˼̆˸ʻ˷˸˺̅˸˸кʼ ˗˟ˣ˜˄˄˃ˋˡˀ˅˥˅ˠˀ˞˃˄ SDL1108N-2R2MF ˇ˃ ˅˃ ˄˃ 3.0 2.0 1.0 0.0 ˃ ˃ ˆ ˉ ˌ ˄˅ ˄ˈ ˃ ˆ ˉ ˌ ˄˅ ˄ˈ D C CU RR E N T (A ) ˗˖ʳ˖˨˥˥˘ˡ˧ʻ˔ʼ SDL1108N-3R3MF ˗˟ˣ˜˄˄˃ˋˡˀˆ˥ˆˠˀ˞˃˄ ˧˸̀̃ˁʳ˥˼̆˸ʻ˷˸˺̅˸˸кʼ ˇ˃ ˆ˃ ˅˃ ˄˃ ˃ ˃ ˆ ˉ ˌ ˄˅ ˗˖ʳ˖˨˥˥˘ˡ˧ʻ˔ʼ NOTE : Specifications subject to change without notice. Please check our website for latest information. 01.07.2009 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 HIGH CURRENT POWER INDUCTORS SDL1108N SERIES 8. RELIABILITY AND TEST CONDITION : ITEM PERFORMANCE TEST CONDITION Electrical Characteristics Test Inductance Refer to standard electrical characteristics list HP4284A, CH3252A, CH1320, CH1320S LCR meter. DCR CH1320, Micro-Ohm Meter. Heat Rated Current (Irms) Irms(A) will cause the coil temperature rise approximately ǻT=40°C without core loss 1. Applied the allowed DC current 2. Temperature measured by digital surface thermometer Saturation Current (Isat) Isat(A) will cause Lo to drop approximately 20%. Mechanical Performance Test Solderability Test More than 90% of the terminal electrode should be covered with solder. Preheat : 150°C, 60sec. Solder : lead free Solder Temperature : 245±5°C Flux for lead free : rosin Dip Time : 4±1sec. Preheating Dipping 245°C 150°C Solder Heat Resistance 1. Components should have no evidence of electrical & mechanical damage. 2. Inductance : Within ±20% of initial value. 60 seconds Natural cooling 4±1 seconds Preheat : 150°C, 60sec. Solder : lead free Solder Temperature : 260±5°C Flux for lead free : rosin Dip Time : 10±0.5sec. Preheating Dipping 260°C 150°C 60 seconds Natural cooling 10±0.5 seconds Reliability Test High Temperature Life Test Low Temperature Life Test Temperature : 125±5°C Time : 500±12 hours Measure at room temperature after placing for 2 to 3 hrs. 1. Appearance : No damage 2. Inductance : Within ±20% of initial value. No disconnection or short circuit. Thermal Shock Temperature : -55±5°C Time : 500±12 hours Measure at room temperature after placing for 2 to 3 hrs. Conditions of 1 cycle. Step Temperature (°C) 1 -40±3 30±3 2 Room Temperature Within 3 Times (min.) 3 125±3 30±3 4 Room Temperature Within 3 Total : 5 cycles Measure at room temperature after placing for 2 to 3 hrs. Humidity Resistance 1. Appearance : No damage 2. Inductance : Within ±20% of initial value. No disconnection or short circuit. Temperature : 40±5°C Humidity : 90% to 95% Applied Current : Rated Current Time : 500±12 hours Measure at room temperature after placing for 2 to 3 hrs. NOTE : Specifications subject to change without notice. Please check our website for latest information. 01.07.2009 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6 HIGH CURRENT POWER INDUCTORS SDL1108N SERIES 9. SOLDERING AND MOUNTING : H H I J 6.4±0.5 6.3±0.5 1.8 Ref. 9.0±0.5 G G ØI J 9-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 9-2.1 Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 9-2.2 Soldering Iron (Figure 2) : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : a) Preheat circuit and products to 150°C. d) 1.0mm tip diameter (max) e) Use a 20 watt soldering iron with tip diameter of 1.0mm b) 280°C tip temperature (max) c) Never contact the ceramic with the iron tip f) Limit soldering time to 3 secs. Soldering 10s max. Natural cooling 250~260 230 180 150 60~120s Preheating TEMPERATURE °C TEMPERATURE °C Preheating Soldering 350 Natural cooling 300 150 Over 1min. 30~60s Gradual Cooling Within 3secs. Figure 1. Re-flow Soldering Figure 2. Iron Soldering NOTE : Specifications subject to change without notice. Please check our website for latest information. 01.07.2009 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 7 HIGH CURRENT POWER INDUCTORS SDL1108N SERIES 10. PACKING AND QUANTITY : Size SDL1108N Styrofoam 108 Inner box 756 Carton 1512 Application Notice 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : Less than 30°C and 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. NOTE : Specifications subject to change without notice. Please check our website for latest information. 01.07.2009 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 8