SUPERWORLD L818HW

HIGH CURRENT MOLDED POWER INDUCTORS
L818HW SERIES
1. PART NO. EXPRESSION :
L818HW-1R0MF
(a)
(b)
(c)
(d)(e)
(a) Series code
(d) Tolerance code : M = ±20%
(b) Type code
(e) F : Lead Free
(c) Inductance code : 1R0 = 1.0uH
2. CONFIGURATION & DIMENSIONS :
A'
C'
A
C
D
L
E
B'
B
SWORLD
R47
H
G
PCB Pattern
Unit:m/m
A'
A
B'
B
13.7 Max. 12.9 Max. 13.7 Max. 12.9 Max.
C'
C
D
E
G
H
L
7.0 Max.
6.5 Typ.
2.5±0.5
3.0±0.5
8.1 Typ.
3.4 Typ.
13.8 Typ.
3. SCHEMATIC :
4. MATERIALS :
a
b
(a) Core
(b) Wire
(c) Terminal
c
5. FEATURES :
a) Shielded Construction
b) Frequency up to 5MHz
NOTE : Specifications subject to change without notice. Please check our website for latest information.
15.01.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 1
HIGH CURRENT MOLDED POWER INDUCTORS
L818HW SERIES
6. GENERAL SPECIFICATION :
a) Test Freq. : 100KHz/1.0VDC; Q : 100KHz/1.0VDC
b) Ambient Temp. : 20°C
c) Operating Temp. : -55°C to +125°C
d) Storage Temp. : -55°C to +125°C
e) Humidity Range : 50 ~ 60% RH
f) Heat Rated Current (Irms) : Will cause the coil temp. rise approximately ǻT=40°C without core loss.
g) Saturation Current (Isat) : Will cause L 0 to drop approximately 20% typ.
h) Part Temperature (Ambient+Temp. Rise) : Should not exceed 125°C under worst case operating conditions.
7. ELECTRICAL CHARACTERISTICS :
Part No.
Inductance L 0
( µH )
±20% @ 0 Adc
Irms
(A)
Typ.
Isat
(A)
Typ.
DCR
( mȍ )
Max.
Q
Min.
L818HW-R47MF
0.47
41
65
1.2
25
L818HW-R68MF
0.68
35
60
1.6
25
L818HW-1R0MF
1.00
32
50
2.1
25
L818HW-1R5MF
1.50
27
48
2.6
25
L818HW-2R2MF
2.20
22
40
4.2
25
L818HW-3R3MF
3.30
18
35
6.8
25
L818HW-4R7MF
4.70
15
30
11.2
25
L818HW-6R8MF
6.80
12
21
14
25
L818HW-100MF
10.0
10
16
16.8
25
NOTE : Specifications subject to change without notice. Please check our website for latest information.
15.01.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 2
HIGH CURRENT MOLDED POWER INDUCTORS
L818HW SERIES
8. CHARACTERISTICS CURVES :
INDUCTANCE VS. FREQUENCY
Q VS. FREQUENCY
INDUCTANCE VS. DC CURRENT
TEMP. RISE VS. DC CURRENT
NOTE : Specifications subject to change without notice. Please check our website for latest information.
15.01.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 3
HIGH CURRENT MOLDED POWER INDUCTORS
L818HW SERIES
8. CHARACTERISTICS CURVES :
L818HW-R68MF
SMPI1207HW-R68
L818HW-R47MF
SMPI1207HW-R47
1
100
100
90
90
0.8
70
0.4
60
0.3
50
40
0.2
30
INDUCTANCE (uH)
80
TEM P. RISE(oC)
20
0.1
80
70
0.6
60
50
0.4
40
30
0.2
20
10
0
10
0
13
26
39
52
65
0
0
10
20
DC CURRENT(A)
30
40
50
60
DC CURRENT(A)
SL818HW-1R5MF
MPI1207HW-1R5
L818HW-1R0MF
S MPI1207HW-1R0
1.2
2 .5
100
100
90
90
2
70
0.8
60
0.6
50
40
0.4
30
INDUCT ANCE (uH)
80
TEM P. RISE(oC)
INDUCTANCE (uH)
1
70
1 .5
60
50
1
40
30
0 .5
20
0.2
80
20
10
10
0
0
0
0
10
20
30
40
0
0
50
8
16
24
32
40
48
DC CURRENT(A)
DC CURRENT(A)
L818HW-3R3MF
S MPI1207HW-3R3
SL818HW-2R2MF
MPI1207HW-2R2
2.5
4
1 00
100
90
90
3.2
70
1.5
60
50
1
40
30
20
0.5
INDUCT ANCE (uH)
80
TEM P. RISE(oC)
INDUCTANCE (uH)
2
80
70
60
2.4
50
1.6
40
30
0.8
20
10
10
0
0
0
10
20
T EM P. RISE(oC)
0
0
30
40
T EM P. RISE(oC)
INDUCTANCE (uH)
0.5
TEM P. RISE(oC)
0.6
0
0
0
7
DC CURRENT(A)
14
21
28
35
DC CURRENT(A)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
15.01.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
HIGH CURRENT MOLDED POWER INDUCTORS
L818HW SERIES
8. CHARACTERISTICS CURVES :
S L818HW-4R7MF
MPI1207HW-4R7
L818HW-6R8MF
SMPI1207HW-6R8
100
12
100
90
90
80
70
4
60
3
50
40
2
30
INDUCTANCE (uH)
80
TEM P. RISE(oC)
INDUCTANCE (uH)
5
9
70
60
6
50
40
30
3
20
20
1
10
10
0
0
0
0
6
12
18
24
TEM P. RISE(oC)
6
0
30
0
4.2
8.4
12.6
16.8
21
DC CURRENT(A)
DC CURRENT(A)
L818HW-100MF
SMPI1207HW-100
15
100
90
INDUCTANCE (uH)
70
60
9
50
6
40
30
3
TEM P. RISE(oC)
80
12
20
10
0
0
0
4
8
12
16
DC CURRENT(A)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
15.01.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5
HIGH CURRENT MOLDED POWER INDUCTORS
L818HW SERIES
9. CORE LOSS :
100KHz and 500KHz
40000
material
gauss loss
K
W
/ m3
K
W
/m
3
30000
20000
500KHZ
10000
100KHZ
0
0
200
400
gauss
600
800
1000
gauss
100KHz
500KHz
100
-
266
200
-
1,234
300
351.7
2,932
400
665.9
5,195
500
1,039
8,336
600
1,471
12,025
700
1,923
15,715
800
2,537
20,444
900
3,148
25,429
1000
3,902
31,002
100KHz
4000
material
gauss loss
KKW
/3
m3
W
/m
3000
2000
1000
0
200
400
600
800
1000
gau ss
gauss
100KHz
300
351.7
400
665.9
500
1,039
600
1,471
700
1,923
800
2,537
900
3,148
1000
3,902
500KHz
40000
KW
W
/m
K
/m
3
3
30000
20000
10000
0
0
200
400
600
800
1000
g au ss
gauss
NOTE : Specifications subject to change without notice. Please check our website for latest information.
15.01.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 6
HIGH CURRENT MOLDED POWER INDUCTORS
L818HW SERIES
10. RELIABILITY AND TEST CONDITION :
ITEM
PERFORMANCE
TEST CONDITION
Electrical Characteristics Test
Refer to standard electrical characteristics list
Inductance
HP4284A, CH11025, CH3302, CH1320, CH1320S
LCR meter.
DCR
CH16502, Agilent33420A Micro-Ohm Meter.
Heat Rated Current (Irms)
Irms(A) will cause the coil temperature rise
approximately ǻT=40°C without core loss
1. Applied the allowed DC current
2. Temperature measured by digital surface thermometer
Saturation Current (Isat)
Isat(A) will cause Lo to drop approximately 20% typ.
Mechanical Performance Test
Solderability Test
More than 90% of the terminal electrode
should be covered with solder.
Preheating Dipping
245°C
150°C
Solder Heat Resistance
60
seconds
Natural
cooling
4±1
seconds
1. Appearance : No significant abnormality
2. Inductance change : Within ±20%
Preheating
260°C
150°C
60
seconds
Preheat : 150°C, 60sec.
Solder : Sn99.95-Cu0.05
Solder Temperature : 245±5°C
Flux for lead free : rosin
Dip Time : 4±1sec.
Dipping
Natural
cooling
Preheat : 150°C, 60sec.
Solder : Sn99.95-Cu0.05
Solder Temperature : 260±5°C
Flux for lead free : rosin
Dip Time : 10±0.5sec.
10±0.5
seconds
Reliability Test
High Temperature
Life Test
Temperature : 125±5°C
Time : 500±12 hours
Measure at room temperature after placing for 2 to 3 hrs.
Low Temperature
Life Test
1. Appearance : No damage
Thermal Shock
2. Inductance : Within ±20% of initial value.
No disconnection or short circuit.
Temperature : -55±5°C
Time : 500±12 hours
Measure at room temperature after placing for 2 to 3 hrs.
Conditions of 1 cycle.
Step
Temperature (°C)
1
-55±3
30±3
2
Room Temperature
Within 3
Times (min.)
3
+125±3
30±3
4
Room Temperature
Within 3
Total : 5 cycles
Measure at room temperature after placing for 2 to 3 hrs.
Humidity Resistance
1. Appearance : No damage
2. Inductance : Within ±20% of initial value.
No disconnection or short circuit.
Random Vibration Test
Appearance : Cracking, shipping and any other
defects harmful to the characteristics should not
be allowed.
Temperature : 40±5°C
Humidity : 90% to 95%
Applied Current : Rated Curent
Time : 500±12 hours
Measure at room temperature after placing for 2 to 3 hrs.
Frequency : 10-55-10Hz for 1 min.
Amplitude : 1.52mm
Directions & times : X, Y, Z directions for 2 hours.
A period of 2 hours in each of 3 mutually perpendicular
directions (Total 6 hours).
NOTE : Specifications subject to change without notice. Please check our website for latest information.
15.01.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 7
HIGH CURRENT MOLDED POWER INDUCTORS
L818HW SERIES
11. SOLDERIND AND MOUNTING :
11-1. Recommended PC Board Pattern
8.1
2.85
3.4
2.85
11-2. Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all
wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot
air soldering tools.
11-2.1 Solder Re-flow :
Recommended temperature profiles for re-flow soldering in Figure 1.
11-2.2 Soldering Iron (Figure 2) :
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
Note :
a) Preheat circuit and products to 150°C.
b) 280°C tip temperature (max)
c) Never contact the ceramic with the iron tip
d) 1.0mm tip diameter (max)
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
f) Limit soldering time to 3 secs.
Soldering
10s max.
Natural
cooling
250~260
230
180
150
60~120s
30~60s
Preheating
TEMPERATURE °C
TEMPERATURE °C
Preheating
350
Soldering
Natural
cooling
300
150
Over 1min.
Gradual
Cooling
Within 3secs.
Figure 1. Re-flow Soldering
Figure 2. Iron Soldering
NOTE : Specifications subject to change without notice. Please check our website for latest information.
15.01.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 8
HIGH CURRENT MOLDED POWER INDUCTORS
L818HW SERIES
12. PACKAGING INFORMATION :
12-1. Reel Dimension
COVER TAPE
ØC
B
D
2.0±0.5
A
EMBOSSED CARRIER
Type
A(mm)
B(mm)
C(mm)
D(mm)
13" x 24mm
24.0±0.5
100±2.0
13.5±0.5
330
t
P
0.15 MIN
Bo
Ø1.5+0.1
2.0±0.1
W
4.0±0.1
1.75±0.1
12-2 Tape Dimension
Ko
Ao
Series
Ao(mm)
Bo(mm)
Ko(mm)
P(mm)
W(mm)
t(mm)
L818HW
13.2±0.1
14.2±0.1
6.9±0.1
20.5±0.1
24.0±0.3
0.50±0.05
12-3. Packaging Quantity
Size
L818HW
Chip / Reel
400
Inner Box
800
Carton
3200
NOTE : Specifications subject to change without notice. Please check our website for latest information.
15.01.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 9
HIGH CURRENT MOLDED POWER INDUCTORS
L818HW SERIES
12-4. Tearing Off Force
The force for tearing off cover tape is 15 to 60 grams
in the arrow direction under the following conditions.
F
165° to 180°
Top cover tape
Room Temp.
(°C)
Room Humidity
(%)
Room atm
(hPa)
Tearing Speed
(mm/min)
5~35
45~85
860~1060
300
Base tape
Application Notice
1. Storage Conditions :
To maintain the solderabililty of terminal electrodes :
a) Temperature and humidity conditions : Less than 30°C and 70% RH.
b) Recommended products should be used within 6 months from the time of delivery.
c) The packaging material should be kept where no chlorine or sulfur exists in the air.
2. Transportation :
a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
b) The use of tweezers or vacuum pick up is strongly recommended for individual components.
c) Bulk handling should ensure that abrasion and mechanical shock are minimized.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
15.01.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 10