WINSEMI SFP12N65

SFP12N65
nnel MOSFET
Silicon N-Cha
N-Chan
Features
■ 12A,650V,RDS(on)(Max0.78Ω)@VGS=10V
■ Ultra-low Gate Charge(Typical 30nC)
■ Fast Switching Capability
■ 100% Avalanche Tested
■ Maximum Junction Temperature Range(150℃)
General Description
This Power MOSFET is produced using Winsemi’s advanced
planar stripe, VDMOS technology. This latest technology has
been especially designed to minimize on-state resistance, have a
high rugged avalanche characteristics. This devices is specially
well suited for AC-DC switching power supplies, DC-DC power
converters, high voltage H-bridge motor drive PMW
Absolute Maximum Ratings
Symbol
VDSS
Value
Units
Drain Source Voltage
Parameter
650
V
Continuous Drain Current(@Tc=25℃)
12
A
ID
Continuous Drain Current(@Tc=100℃)
IDM
Drain Current Pulsed
VGS
Gate to Source Voltage
±30
V
EAS
Single Pulsed Avalanche Energy
(Note 2)
990
mJ
EAR
Repetitive Avalanche Energy
(Note 1)
22
mJ
dv/dt
Peak Diode Recovery dv/dt
(Note 3)
PD
TJ, Tstg
TL
A
(Note1)
A
4.5
V/ns
Total Power Dissipation(@Tc=25℃)
178
W
Derating Factor above 25℃
1.43
W/℃
-55~150
℃
300
℃
Junction and Storage Temperature
Channel Temperature
Thermal Characteristics
Symbol
Parameter
Min
Value
Typ
Max
Units
RQJC
Thermal Resistance, Junction-to-Case
-
-
0.70
℃
RQCS
Thermal Resistance, Case-to-Sink
-
-
-
/
℃
RQJA
Thermal Resistance, Junction-to-Ambient
-
-
62.5
W
/
℃
W
/
W
Rev, A Nov.2008
Copyright@Winsemi Microelectronics Co., Ltd., All right reserved.
SFP12N65
Electrical Characteristics (Tc = 25°C)
Characteristics
Gate leakage current
Gate−source breakdown voltage
Symbol
Min
Type
Max Unit
IGSS
VGS = ±30 V, VDS = 0 V
-
-
±100
nA
V(BR)GSS
IG = ±10 μA, VDS = 0 V
±30
-
-
V
VDS = 650 V, VGS = 0 V
-
-
10
μA
VDS = 480 V, Tc = 125°°C
-
-
100
μA
IDSS
Drain cut−off current
Test Condition
V(BR)DSS
ID = 250 μA, VGS = 0 V
650
-
-
V
Gate threshold voltage
VGS(th)
VDS = 10 V, ID =250 μA
3
-
4.5
V
Drain−source ON resistance
RDS(ON)
VGS = 10 V, ID = 6A
-
0.64
Forward Transconductance
gfs
VDS = 50 V, ID =6A
-
6.4
-
Input capacitance
Ciss
VDS = 25 V,
-
1830
-
Reverse transfer capacitance
Crss
VGS = 0 V,
-
155
-
Output capacitance
Coss
f = 1 MHz
-
2.0
-
VDD =325V,
-
50
-
ID = 12A
-
49
-
-
310
-
-
54
-
-
51.7
-
-
9.6
-
-
18.6
-
Drain−source breakdown voltage
Rise time
Turn−on time
tr
ton
Switching time
Fall time
Turn−off time
tf
0.78
Ω
S
pF
ns
RG=25Ω
(Note4,5)
toff
Total gate charge (gate−source
plus gate−drain)
Qg
Gate−source charge
Qgs
Gate−drain (“miller”) Charge
Qgd
VDD =520 V,
VGS = 10 V,
ID = 12A
(Note4,5)
nC
Source−Drain Ratings and Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
Min
Type
IDR
-
-
-
12
A
Pulse drain reverse current
IDRP
-
-
-
48
A
Forward voltage (diode)
VDSF
IDR = 10A, VGS = 0 V
-
-
1.4
V
Continuous drain reverse current
Max Unit
Reverse recovery time
trr
IDR = 10 A, VGS = 0 V,
-
450
-
ns
Reverse recovery charge
Qrr
dIDR / dt = 100 A / μs
-
5.0
-
μC
Note 1.Repeativity rating :pulse width limited by junction temperature
2.L=14mH,IAS=12A,VDD=95V,RG=25Ω,Starting TJ=25℃
3.ISD≤10A,di/dt≤200A/us, VDD<BVDSS,STARTING TJ=25℃
4.Pulse Test: Pulse Width≤300us,Duty Cycle≤2%
5.Essentially independent of operating temperature.
This transistor is an electrostatic sensitive device
Please handle with caution
2/7
Steady, keep you advance
SFP12N65
Fig. 1 On-State Characteristics
Fig.3 On-Resistance Variation vs Drain
Current
Fig.5 On-Resistance Variation vs Junction
Temperature
Fig.2 Transfer Current Characteristics
ward Voltage
Fig.4 Body Diode For
Forw
Variation with Source Current
And Temperature
Fig.6 Gate Charge Characteristics
3 /7
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SFP12N65
Fig.7 Maximum Safe Operation Area
Fig.8 Maximum Drain Cu
Currrent vs
re
Case Temperatu
mperature
nt Thermal Response Curve
Fig.9 Transie
nsient
4 /7
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SFP12N65
Fig.10 Gate Test circuit & Waveform
Fig.11 Resistive Switching Test Circuit & Waveform
Fig.12 Uncamped Inductive Switching Test Circuit & Waveform
5 /7
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SFP12N65
Fig.13 Peak Diode Recovery dv/dt Test Circuit & Waveform
6 /7
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SFP12N65
TO-220 Package Dimension
Unit:mm
7 /7
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