B WFU2N60 WFU2N60B Silicon N-Channel MOSFET Features � 2A,600V,RDS(on)(Max 5.0Ω)@VGS=10V � Ultra-low Gate Charge(Typical 9nC) � Fast Switching Capability � 100%Avalanche Tested � Maximum Junction Temperature Range(150℃) General Description This Power MOSFET is produced using Winsemi's advanced planar stripe,VDMOS technology. This latest technology has been especially designed to minimize on -state resistance,have a high rugged avalanche characteristics. This devices is specially well suited for high efficiency switch mode power supply . Absolute Maximum Ratings Symbol VDSS Value Units Drain Source Voltage Parameter 600 V Continuous Drain Current(@Tc=25℃) 2.0 A Continuous Drain Current(@Tc=100℃) 1.3 A 8 A ±30 V ID IDM Drain Current Pulsed (Note1) VGS Gate to Source Voltage EAS Single Pulsed Avalanche Energy (Note2) 140 mJ EAR Repetitive Avalanche Energy (Note1) 6.4 mJ dv/dt Peak Diode Recovery dv /dt (Note3) 5.5 V/ ns 46 W 0.35 W/℃ -55~150 ℃ 300 ℃ Total Power Dissipation(@Tc=25℃) PD Derating Factor above 25℃ TJ,Tstg TL Junction and Storage Temperature Channel Temperature Thermal Characteristics Symbol Parameter RQJC Thermal Resistance , Junction -to -Case RQCS Thermal Resistance , Case-to-Sink RQJA Thermal Resistance , Junction-to -Ambient Value Units Min Typ Max - - 2.7 ℃/W 0.5 - - ℃/W - - 62.5 ℃/W Rev.A Nov.2010 Copyright@Winsemi Microelectronics Co., Ltd., All right reserved. B WFU2N60 WFU2N60B Electrical Characteristics(Tc=25℃) Characteristics Gate leakage current Gate-source breakdown voltage Drain cut -off current Drain -source breakdown voltage Symbol Test Condition Min Type Max Unit IGSS VGS=±30V,VDS=0V - - ±100 nA V(BR)GSS IG=±10 µA,VDS=0V ±30 - - V VDS=600V,V GS=0V - - 10 µA VDS=480V,Tc=125℃ - 100 µA IDSS V(BR)DSS ID=250 µA,VGS=0V 600 - - V Gate threshold voltage VGS(th) VDS=10V,ID=250 µA 2 - 4 V Drain -source ON resistance RDS(ON) VGS=10V,ID=1A - 4.5 5.0 Ω Forward Transconductance gfs VDS=50V,ID=1A - 2.25 - S Input capacitance Ciss VDS=25V, - 280 330 Reverse transfer capacitance Crss VGS=0V, - 6 8 Output capacitance Coss f=1MHz - 45 55 VDD=300V, - 10 28 ID=2A, - 25 55 RG=25Ω, - 20 60 - 25 60 - 9.0 12 - 1.7 - - 4.5 - Rise time Turn-on time tr ton Switching time pF ns Fall time Turn-off time tf (Note4,5) toff Total gate charge(gate-source VDD=320V, Qg plus gate-drain) VGS=10V, nC Gate-source charge Qgs Gate-drain("miller") Charge Qgd ID=2A (Note4,5) Source-Drain Ratings and Characteristics(Ta=25℃) Characteristics Symbol Test Condition Min Type Max Unit Continuous drain reverse current IDR - - - 2.0 A Pulse drain reverse current IDRP - - - 8.0 A Forward voltage(diode) VDSF IDR=2.0A,VGS=0V - - 1.4 V Reverse recovery time trr IDR=2.A,VGS=0V, - 180 - ns Reverse recovery charge Qrr dIDR / dt =100 A / µs - 0.72 - µC Note 1.Repeativity rating :pulse width limited by junction temperature 2.L=18.5mH IAS=2A,VDD=50V,RG=0Ω ,Starting TJ=25℃ 3.ISD≤2A,di/dt≤200A/us,VDD<BVDSS,STARTING TJ=25℃ 4.Pulse Test:Pulse Width≤300us,Duty Cycle≤2% 5. Essentially independent of operating temperature. This transistor is an electrostatic sensitive device Please handle with caution 2/7 Steady, keep you advance B WFU2N60 WFU2N60B Fig.1 On-State Characteristics Fig.2 Transfer Current characteristics Fig.3 On Resistance variation Fig.4 Body Diode Forward Voltage vsDrain Current Variation With Source Current And temperature Fig.5 On-Resistance Variation vs Fig.6 Gate Charge Characteristics Junction Temperature 3/7 Steady, keep you advance B WFU2N60 WFU2N60B Fig.7 Maximum Safe Operation Area Fig.8 Maximum Drain Current vs Case Temperature Fig.9 Transient Thermal Response curve 4/7 Steady, keep you advance B WFU2N60 WFU2N60B Fig.10 Gate Test circuit & Waveform Fig.11 Resistive Switching Test Circuit & Waveform Fig.12 Uncamped Inductive Switching Test Circuit & Waveform 5/7 Steady, keep you advance B WFU2N60 WFU2N60B Fig.13 Peak Diode Recovery dv/dt Test Circuit & Waveform 6/7 Steady, keep you advance B WFU2N60 WFU2N60B TO251 Package Dimension Unit:mm 7/7 Steady, keep you advance