AMSCO AS1116-BQFT

AS1116
D a ta s h e e t
6 4 L E D D r i v e r w i t h D e ta i l e d E r r o r D e t e c t i o n
1 General Description
2 Key Features
!
The AS1116 is a compact LED driver for 64 single LEDs
or 8 digits of 7-segments. The devices can be programmed via an SPI compatible 3-wire interface.
!
!
Every segment can be individually addressed and
updated separately. Only one external resistor (RSET) is
required to set the current. LED brightness can be controlled by analog or digital means.
!
!
!
The devices include an integrated BCD code-B/HEX
decoder, multiplex scan circuitry, segment and display
drivers, and a 64-bit memory. Internal memory stores
the shift register settings, eliminating the need for continuous device reprogramming.
!
!
!
!
!
Additionally the AS1116 offers a diagnostic mode for
easy and fast production testing and allows the use of
the AS1116 for critical applications. The diagnostic
allows to detect individual open or shorted LEDs.
!
10MHz SPI-Compatible Interface
Open and Shorted LED Error Detection
- Global or Individual Error Detection
Hexadecimal- or BCD-Code for 7-Segment Displays
200nA Low-Power Shutdown Current (typ; data
retained)
Individual Digit Brightness Control
Digital and Analog Brightness Control
Display Blanked on Power-Up
Drive Common-Cathode LED Displays
Supply Voltage Range: 2.7 to 5.5V
Software Reset
Optional External Clock
Package:
- QSOP-24 and TQFN(4x4)-24
3 Applications
The AS1116 features a low shutdown current of typically
200nA, and an operational current of typically 350µA.
The number of digits can be programmed, the devices
can be reset by software, and an external clock is also
supported.
The AS1116 is ideal for seven-segment or dot matrix displays in public information displays at subway, train or
bus stations, at airports and also at displays in public
,
transportation like buses or trains mobile
phones, personal electronic and toys.
The device is available in a QSOP-24 and TQFN(4x4)24 package.
Figure 1. Typical Application Diagram
8
DIG0 to
DIG7
SEGA-DP
VDD
2.7V to 5.5V
8
9.53kΩ
AS1116
SDO SDI
SDI
SCL
µP
8
GND
ISET
I/O
8
8
LD
AS1116
SDO
LD
SCL
SDI
SCL
AS1116
SDO
LD
I/O
I/O
I/O
Diagnostic readback: open & shorted LEDs
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Revision 1.04
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AS1116
Datasheet - P i n o u t
4 Pinout
Pin Assignments
SEGDP
DIG3 2
17 SEGC
16 VDD
AS1116
15 SEGG
9
10 11 12
SCL
8
SEGA
7
ISET
13 SEGF
LD
14 SEGB
N/C 6
DIG7
DIG5 5
DIG6
N/C 12
LD 11
DIG7 10
SEGD
18 SEG E
DIG4 4
DIG6 9
DIG5 8
DIG4 7
GND 6
DIG3 5
DIG2 4
DIG1 3
DIG0 2
SDI 1
SDI
24 23 22 21 20 19
DIG2 1
GND 3
AS1116
SDO
DIG0
DIG1
13 ISET
14 SCL
15 SEGA
16 SEGF
17 SEGB
18 SEGG
19 VDD
20 SEGC
21 SEG E
22 SEGDP
23 SEGD
24 SDO
Figure 2. Pin Assignments (Top View)
Pin Descriptions
Table 1. Pin Descriptions
Pin
Name
QSOP-24
TQFN(4x4)-24
SDI
1
22
DIG0:DIG7
2-5, 7-10
1, 2, 4, 5, 7, 8,
23, 24
GND
6
3
LD
11
9
N/C
12
6
ISET
13
10
SCL
14
11
SEGA:SEG
G, SEGDP
VDD
15-18,
20-23
19
12-15,
17-20
16
SDO
24
21
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Description
Serial-Data Input. Data is loaded into the internal 16-bit shift register
on the rising edge of pin SCL.
Digit Drive Lines. Eight digit drive lines that sink current from the
display cathode.
Ground.
Load. Serial Data is loaded into the shift register while this pin is low.
The last 16 bits of serial data are latched on the rising edge of this pin.
Not Connected.
Set Segment Current. Connect to VDD or a reference voltage through
RSET to set the peak segment current (see Selecting RSET Resistor
Value and Using External Drivers on page 15).
Serial-Clock Input. 10MHz maximum rate. Data is shifted into the
internal shift register on the rising edge of this pin. Data is clocked out of
pin SDO on the rising edge of this pin.
Seven Segment and Decimal Point Drive Lines. 8 seven-segment
drives and decimal point drive that source current to the display.
Positive Supply Voltage. Connect to +2.7 to +5.5V supply.
Serial-Data Output. The data into pin SDI is valid at pin SDO 16 clock
cycles later. This pin is used to daisy-chain several devices and is never
high-impedance.
Revision 1.04
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AS1116
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical
Characteristics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Input Voltage Range
Current
Min
Max
Units
VDD to GND
-0.3
7
V
All other pins to GND
-0.3
7 or
VDD + 0.3
V
DIG0:DIG7 Sink Current
500
mA
SEGA:SEGG, SEGDP
100
mA
85
%
Digital outputs
1000
V
All other pins
1000
V
Humidity
Electrostatic Discharge
5
Latch-Up Immunity
±100
Thermal Resistance ΘJA
Norm: MIL 833 E method 3015
EIA/JESD78
88
ºC/W
on PCB, QSOP-24 package
30.5
ºC/W
on PCB, TQFN(4x4)-24 package
-40
+85
ºC
Storage Temperature
-55
150
ºC
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Non-condensing
mA
Ambient Temperature
Package Body Temperature
Notes
+260
Revision 1.04
ºC
The reflow peak soldering
temperature (body temperature)
specified is in accordance with IPC/
JEDEC J-STD-020D “Moisture/
Reflow Sensitivity Classification for
Non-Hermetic Solid State Surface
Mount Devices”.
The lead finish for Pb-free leaded
packages is matte tin (100% Sn).
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AS1116
Datasheet - E l e c t r i c a l C h a r a c t e r i s t i c s
6 Electrical Characteristics
VDD = 2.7 to 5.5V, RSET = 9.53kΩ, TAMB = -40 to +85°C, typ. values @ TAMB = +25ºC, VDD = 5.0V (unless otherwise
specified).
Table 3. Electrical Characteristics
Symbol
Parameter
VDD
Operating Supply Voltage
IDDSD
Shutdown Supply Current
IDD
Operating Supply Current
fOSC
Display Scan Rate
8 digits scanned
0.6
IDIGIT
Digit Drive Sink Current
VOUT = 0.65V
320
ISEG
Segment Drive Source Current
ΔISEG
Segment Drive Current Matching
ISEG
Conditions
Min
Typ
2.7
Max
Unit
5.5
V
µA
All digital inputs at VDD or
GND, TAMB = +25ºC
0.2
2
RSET = open circuit.
0.35
0.6
All segments and decimal
point on; ISEG = -40mA.
335
VDD = 5.0V, VOUT = (VDD -1V)
Segment Drive Source Current
-37
0.8
mA
1.2
kHz
mA
-42
-47
mA
47
mA
Max
1
Unit
µA
3
Average Current
%
Table 4. Logic Inputs/Outputs Characteristics
Symbol
IIH, IIL
VIH
VIL
VOH
Parameter
Input Current SDI, SCL, LD
Conditions
Logic High Input Voltage
Logic Low Input Voltage
Output High Voltage
VIN = 0V or VDD
Min
-1
4.5V < VDD < 5.5V
0.6 x VDD
2.7V < VDD < 4.5V
0.7 x VDD
Typ
V
V
VDD = 5.0V
0.8
VDD = 3.0V
0.6
SDO, ISOURCE = -1mA,
VDD = 5.0V
VDD - 1
SDO, ISOURCE = -1mA,
VDD = 3.0V
VDD - 0.5
VOL
Output Low Voltage
SDO, ISINK = 1mA
ΔVI
Hysteresis Voltage
SDI, SCL, LD
V
V
0.4
Open Detection Level Threshold
0.7x
VDD
Short Detection Level Threshold
0.05x VDD
1
0.75x 0.8x
VDD
VDD
0.1x 0.15x
VDD
VDD
V
V
V
V
Table 5. SPI Timing Characteristics
Symbol
tCP
tCH
tCL
tCSS
tCSH
tDS
tDH
tDO
tLDCK
tCSW
tDSPD
Parameter
SCL Clock Period
SCL Pulse Width High
SCL Pulse Width Low
LD to SCL Rise Setup Time
SCL Rise to LD Rise Hold Time
SDI Setup Time
SDI Hold Time
Output Data Propagation Delay
LD Rising Edge to SCL Rising Edge
Minimum LD Pulse High
Data-to-Segment Delay
Conditions
Min
100
20
20
25
10
0
5
CLOAD = 50pF
Typ
Max
25
20
20
2.25
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ms
See Figure 18 on page 8 for more information.
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Revision 1.04
4 - 20
AS1116
Datasheet - Ty p i c a l O p e r a t i n g C h a r a c t e r i s t i c s
7 Typical Operating Characteristics
RSET = 9.53kΩ, VRset = VDD;
Figure 4. Display Scan Rate vs. Temperature;
980
980
960
960
940
940
fosc (Hz) .
fosc (Hz) .
Figure 3. Display Scan Rate vs. Supply Voltage;
920
900
880
920
900
880
Vdd = 2.7V
Tamb = - 40°C
860
Vdd = 4V
Tamb = + 25°C
Vdd = 5V
Vdd = 5.5V
860
Tamb = + 85°C
840
2.7
3.1
3.5
3.9
4.3
4.7
5.1
840
-40
5.5
-15
10
Vdd (V)
Figure 5. Segment Current vs. Temperature;
Vseg
Vseg
Vseg
Vseg
40
40
Iseg (mA) .
Iseg (mA) .
85
50
50
30
20
Vseg
Vseg
Vseg
Vseg
10
= 1.7V; Vdd = 2.7V
= 1.7V; Vdd = 5V
= 3V; Vdd = 5V
= 4V; Vdd = 5V
= 4V; Vdd = 5V
= 3V; Vdd = 5V
= 2V; Vdd = 5V
= 1.7V; Vdd = 2.7V
30
20
10
0
-15
10
35
60
0
85
10
20
Tamb (°C)
30
40
50
60
70
80
90
Rset (kOhm)
Figure 7. Segment Current vs. Supply Voltage;
Figure 8. Segment Current vs. VDD; VRset = 2.8V
50
60
Vseg
Vseg
Vseg
Vseg
45
50
40
= 1.7V
= 2V
= 2.3V
= 3.1V
35
40
Iseg (mA) .
Iseg (mA) .
60
Figure 6. Segment Current vs. RSET;
60
0
-40
35
Tamb (°C)
30
20
25
20
15
Vseg = 1.7V
10
Vseg = 3V
10
30
Vseg = 4V
5
0
0
2.7
3.1
3.5
3.9
4.3
4.7
5.1
5.5
2.7
Vdd (V)
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3
3.3
3.6
3.9
4.2
Vdd (V)
Revision 1.04
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AS1116
Datasheet - Ty p i c a l O p e r a t i n g C h a r a c t e r i s t i c s
Figure 9. VDIGIT vs. IDIGIT
Figure 10. Input High Level vs. Supply Voltage
0.4
3.5
3
2.5
Vih (V) .
Vdig (V) .
0.3
0.2
Vdd
Vdd
Vdd
Vdd
Vdd
0.1
2
1.5
1
= 2.7V
= 3.3V
= 4V
= 5V
= 5.5V
0.5
0
0
0
0.05
0.1
0.15
0.2
0.25
Idig (A)
0.3
2.7
0.35
Figure 11. ISEG vs. VSEG; VDD = 5V
3.5
Rext
Rext
Rext
Rext
Rext
45
40
4.3
4.7
5.1
5.5
Vdd (V)
50
= 10k
= 13k
= 18k
= 30k
= 56k
Rext
Rext
Rext
Rext
Rext
45
40
35
= 8k2
= 10k
= 13k
= 18k
= 30k
Iseg (mA) .
35
30
30
25
25
20
20
15
15
10
10
5
5
0
0
2
2.5
3
3.5
4
4.5
5
1
1.5
2
Vseg (V)
50
40
3
3.5
4
Figure 14. ISEG vs. VSEG; VDD = 2.7V
Rext
Rext
Rext
Rext
Rext
45
2.5
Vseg (V)
Figure 13. ISEG vs. VSEG; VDD = 3.3V
= 6k8
= 8k2
= 10k
= 13k
= 18k
50
Rext
Rext
Rext
Rext
Rext
45
40
= 4k7
= 5k6
= 6k8
= 10k
= 13k
35
Iseg (mA) .
35
Iseg (mA) .
3.9
Figure 12. ISEG vs. VSEG; VDD = 4V
50
Iseg (mA) .
3.1
30
30
25
25
20
20
15
15
10
10
5
5
0
0
1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2
1
Vseg (V)
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1.2
1.4
1.6
1.8
2
2.2
2.4
2.6
Vseg (V)
Revision 1.04
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AS1116
Datasheet - D e t a i l e d D e s c r i p t i o n
8 Detailed Description
Block Diagram
Figure 15. Block Diagram (QSOP-24 Package)
Open/Short
Detection
VDD
+
–
RSET
19
+
Oszillator
VDD
–
13
ISET
8
SEGA-G,
SEGDP
Digital Control
Logic
8
2-5, 7-10
DIG0 to DIG7
(PWM, Debounce,....)
11
15-18, 20-23
LD
1
Registers
SDI
14
SCL
SPI
Interface
24
SDO
Data - Registers
Control - Registers
Scan - Registers
6
GND
AS1116
Figure 16. ESD Structure
VDD
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valid for the pins:
- SDI
- SCL
- SDO
- LD
- ISET
- SEGA-G, SEGDP
VDD
valid for the pins:
- DIG0 to DIG7
Revision 1.04
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AS1116
Datasheet - D e t a i l e d D e s c r i p t i o n
Serial-Addressing Format
The AS1116 contains a 16bit SPI interface to access the internal data and control registers of the device (see Digitand Control-Registers on page 9). The SPI interface is driven with the rising edge of SCL. A falling edge on LD signal
indicates the beginning of an access on the SPI interface, the rising edge on LD determines an access on SPI. An
access must consist of exactly 16bits for write operation and 8bits for read operation. Timing restrictions on the SPI
interface pins are defined in Figure 18.
Table 6 shows the structure of the 16bit command word for writing data, Table 7 the 8bit command word for read operation.
D0 (write operation) / D8 (read operation) is the first bit to shift into the SPI interface after the falling edge of LD, is the
last bit to write to SPI before rising edge of LD.
At a read operation an 8bit operation is executed. At the first rising edge of SCL after the rising edge of LD D7 of
addressed register is written to SDO pin. At the next rising edge of SCL D6 is written to SDO pin. LD must be kept high
during reading data from a internal data or control register of AS1116.
Table 6. 16-Bit Serial Data Format
D0
LSB
D1
D2
D3
D4
Data
D5
D6
D7
MSB
D8
D9
D10
D11
D12
Register Address (see Table 7)
D13
0
D14
R/W
D15
X
Figure 17. Read operation
1
8
9
D7
D6
16
10
SCL
LD
SDO
D5
D4
D3
D2
D1
D0
Figure 18. Interface Timing
LD
tCSW
SCL
tCSH
tCP
tCSS
tCL
tLDCK
tCH
tDH
tDS
SDI
D0
D1
D14
D15
tDO
SDO
Initial Power-Up
On initial power-up, the AS1116 registers are reset to their default values, the display is blanked, and the device goes
into shutdown mode. At this time, all registers should be programmed for normal operation.
Note: The default settings enable only scanning of one digit; the internal decoder is disabled and the Intensity Control
Register (see page 13) is set to the minimum values.
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Revision 1.04
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AS1116
Datasheet - D e t a i l e d D e s c r i p t i o n
Shutdown Mode
The AS1116 devices feature a shutdown mode, where they consume only 200nA (typ) current. Shutdown mode is
entered via a write to the Shutdown Register (see Table 8). For the AS1116, at that point, all segment current sources
and digital drivers are switched off, so that all segments are blanked.
Note: During shutdown mode the Digit-Registers maintain their data.
Shutdown mode can either be used as a means to reduce power consumption or for generating a flashing display
(repeatedly entering and leaving shutdown mode). For minimum supply current in shutdown mode, logic input should
be at GND or VDD (CMOS logic level).
When entering or leaving shutdown mode, the Feature Register is reset to its default values (all 0s) when Shutdown
Register bit D7 (page 10) = 0.
Note: When Shutdown Register bit D7 = 1, the Feature Register is left unchanged when entering or leaving shutdown mode. If the AS1116 is used with an external clock, Shutdown Register bit D7 should be set to 1 when
writing to the Shutdown Register.
Digit- and Control-Registers
The AS1116 devices contain 8 Digit-Registers,11 control-registers and 8 diagnostic-registers, which are listed in Table
7. All registers are selected using a 8-bit address word, and communication is done via the serial interface.
!
Digit Registers – These registers are realized with an on-chip 64-bit memory. Each digit can be controlled directly
without rewriting the whole register contents.
!
Control Registers – These registers consist of decode mode, display intensity, number of scanned digits, shutdown, display test and features selection registers.
Control Register
Digit Register
Type
Table 7. Register Address Map
Register
Address
D7:D0
Page
D15
D14
D13
D12
D11
D10
D9
D8
No-Op
X
0
0
0
0
0
0
0
Digit 0
X
0
0
0
0
0
0
1
N/A
Digit 1
X
0
0
0
0
0
1
0
N/A
Digit 2
X
0
0
0
0
0
1
1
Digit 3
X
0
0
0
0
1
0
0
Digit 4
X
0
0
0
0
1
0
1
Digit 5
X
0
0
0
0
1
1
0
N/A
Digit 6
X
0
0
0
0
1
1
1
N/A
Digit 7
X
0
0
0
1
0
0
0
N/A
14
N/A
(see Table 10 on page 11,
Table 11 on page 11 and
Table 12 on page 11)
N/A
N/A
Decode-Mode
X
0
0
0
1
0
0
1
(see Table 9 on page 10)
10
Global Intensity
X
0
0
0
1
0
1
0
(see Table 16 on page 13)
13
Scan Limit
X
0
0
0
1
0
1
1
(see Table 18 on page 13)
13
Shutdown
X
0
0
0
1
1
0
0
(see Table 8 on page 10)
9
Not Used
X
0
0
0
1
1
0
1
Feature
X
0/1
0
0
1
1
1
0
(see Table 19 on page 14)
N/A
14
10
Display Test Mode
X
0
0
0
1
1
1
1
(see Table 13 on page 12)
DIG0:DIG1 Intensity
X
0
0
1
0
0
0
0
(see Table 17 on page 13)
DIG2:DIG3 Intensity
X
0
0
1
0
0
0
1
(see Table 17 on page 13)
DIG4:DIG5 Intensity
X
0
0
1
0
0
1
0
(see Table 17 on page 13)
DIG6:DIG7 Intensity
X
0
0
1
0
0
1
1
(see Table 17 on page 13)
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Revision 1.04
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AS1116
Datasheet - D e t a i l e d D e s c r i p t i o n
Diagnostic Register
Type
Table 7. Register Address Map
Register
Address
D7:D0
Page
D15
D14
D13
D12
D11
D10
D9
D8
Diagnostic Digit 0
X
1
0
1
0
1
0
0
N/A
Diagnostic Digit 1
X
1
0
1
0
1
0
1
N/A
Diagnostic Digit 2
X
1
0
1
0
1
1
0
N/A
Diagnostic Digit 3
X
1
0
1
1
0
1
1
N/A
Diagnostic Digit 4
X
1
0
1
1
0
0
0
N/A
Diagnostic Digit 5
X
1
0
1
1
0
0
1
N/A
Diagnostic Digit 6
X
1
0
1
1
0
1
0
N/A
Diagnostic Digit 7
X
1
0
1
1
0
1
1
N/A
Note: Write operation: D14=0; Read operation: D14=1.
The Shutdown Register controls AS1116 shutdown mode.
Table 8. Shutdown Register Format (Address (HEX) = 0x0C))
Mode
Shutdown Mode, Reset Feature Register to Default Settings
Shutdown Mode, Feature Register Unchanged
Normal Operation, Reset Feature Register to Default Settings
Normal Operation, Feature Register Unchanged
Register Data
HEX
Code D7 D6 D5 D4 D3 D2 D1 D0
0x00 0
X
X
X
X
X
X
0
0x80 1
X
X
X
X
X
X
0
0x01 0
X
X
X
X
X
X
1
0x81 1
X
X
X
X
X
X
1
Decode Enable Register (0x09)
The Decode Enable Register sets the decode mode. BCD/HEX decoding (either BCD code – characters 0:9, E, H, L,
P, and -, or HEX code – characters 0:9 and A:F) is selected by bit D2 (page 14) of the Feature Register. The Decode
Enable Register is used to select the decode mode or no-decode for each digit. Each bit in the Decode Enable Register corresponds to its respective display digit (i.e., bit D0 corresponds to digit 0, bit D1 corresponds to digit 1 and so
on). Table 10 lists some examples of the possible settings for the Decode Enable Register bits.
Note: A logic high enables decoding and a logic low bypasses the decoder altogether.
When decode mode is used, the decoder looks only at the lower-nibble (bits D3:D0) of the data in the Digit-Registers,
disregarding bits D6:D4. Bit D7 sets the decimal point (SEG DP) independent of the decoder and is positive logic (bit
D7 = 1 turns the decimal point on). Table 10 lists the code-B font; Table 11 lists the HEX font.
When no-decode mode is selected, data bits D7:D0 of the Digit-Registers correspond to the segment lines of the
AS1116. Table 12 shows the 1:1 pairing of each data bit to the appropriate segment line.
Table 9. Decode Enable Register Format Examples
Decode Mode
No decode for digits 7:0
Code-B/HEX decode for digit 0. No decode for digits 7:1
Code-B/HEX decode for digit 0:2. No decode for digits 7:3
Code-B/HEX decode for digits 0:5. No decode for digits 7:6
Code-B/HEX decode for digits 0,2,5. No decode for digits 1, 3, 4, 6, 7
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Revision 1.04
Register Data
HEX
Code D7 D6 D5 D4 D3 D2 D1 D0
0x00 0
0
0
0
0
0
0
0
0x01
0
0
0
0
0
0
0
1
0x07 0
0
0
0
0
1
1
1
0x3F 0
0
1
1
1
1
1
1
0x25 0
0
1
0
0
1
0
1
10 - 20
AS1116
Datasheet - D e t a i l e d D e s c r i p t i o n
Table 10. Code-B Font
Register Data
Register Data
Register Data
CharCharCharacter D7 D6:D4 D3 D2 D1 D0 acter D7 D6: D4 D3 D2 D1 D0 acter D7 D6:D4 D3 D2 D1 D0
X
0
0
0
0
X
0
1
1
0
X
1
1
0
0
X
0
0
0
1
X
0
1
1
1
X
1
1
0
1
X
0
0
1
0
X
1
0
0
0
X
1
1
1
0
X
0
0
1
1
X
1
0
0
1
X
1
1
1
1
X
0
1
0
0
X
1
0
1
0
X
X
X
X
X
X
0
1
0
1
X
1
0
1
1
*
1
*
The decimal point can be enabled with every character by setting bit D7 = 1.
Table 11. HEX Font
Register Data
Register Data
Register Data
CharCharCharacter D7 D6:D4 D3 D2 D1 D0 acter D7 D6: D4 D3 D2 D1 D0 acter D7 D6:D4 D3 D2 D1 D0
*
X
0
0
0
0
X
0
1
1
0
X
1
1
0
0
X
0
0
0
1
X
0
1
1
1
X
1
1
0
1
X
0
0
1
0
X
1
0
0
0
X
1
1
1
0
X
0
0
1
1
X
1
0
0
1
X
1
1
1
1
X
0
1
0
0
X
1
0
1
0
X
X
X
X
X
X
0
1
0
1
X
1
0
1
1
*
1
The decimal point can be enabled with every character by setting bit D7 = 1.
Table 12. No-Decode Mode Data Bits and Corresponding Segment Lines
Corresponding Segment Line
D7
DP
D6
A
D5
B
D4
C
D3
D
D2
E
D1
F
D0
G
Figure 19. Standard 7-Segment LED
F
E
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A
G
D
B
C
DP
Revision 1.04
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AS1116
Datasheet - D e t a i l e d D e s c r i p t i o n
Display-Test Mode
The AS1116 can detect open or shorted LEDs. Readout of either open LEDs (D2=1) or short LEDs (D1=1) is possible,
as well as a OR relation of open and short (D1=D2=1). After a dignostic run bit D4 can be read to clearify if an error
occurred before reading out detailed diagnostic data.
Note: All settings of the digit- and control-registers are maintained.
Table 13. Testmode Register Summary
D7
X
D6
REXT_short
D5
REXT_open
D4
LED_global
D3
LED_test
D2
LED_open
D1
LED_short
D0
DISP_test
Table 14. Testmode Register Bit Description (Address (HEX) = 0x0F))
Addr: 0x0F
Address
Bit
Bit Name
Default
Access
D0
DISP_test
0
W
Optical display test. (Testmode for external visual test.)
0: Normal operation; 1: Run display test (All digits are tested
independently from scan limit & shutdown register.)
D1
LED_short
0
W
Starts a test for shorted LEDs. (Can be set together with D2)
0: Normal operation; 1: Activate testmode
D2
LED_open
0
W
Starts a test for open LEDs. (Can be set together with D1)
0: Normal operation; 1: Activate testmode
D3
LED_test
0
R
Indicates an ongoing open/short LED test
0: No ongoing LED test; 1: LED test in progress
D4
LED_global
0
R
Indicates that the last open/short LED test has detected an error
0: No error detected; 1: Error detected
D5
REXT_open
0
R
Checks if external resistor REXT is open
0: REXT correct; 1: REXT is open
D6
REXT_short
0
R
Checks if external resistor REXT is shorted
0: REXT correct; 1: REXT is shorted
0
-
Not used
D7
D7:D0
LED Diagnostic Registers
These eight registers contain the result of the LED open/short test for the individual LED of each digit.
Table 15. LED Diagnostic Register Address
Register
HEX
Address
0x14
0x15
0x16
0x17
Segment
Digit
D7
DIG0
DIG1
DP
DIG2
DIG3
D6 D5 D4 D3 D2 D1 D0
A
B
C
D
E
F
G
Register
HEX
Address
0x18
0x19
0x1A
0x1B
Segment
Digit
D7 D6 D5 D4 D3 D2 D1 D0
DIG4
DIG5
DP
DIG6
DIG7
A
B
C
D
E
F
G
Note: If more than 2 shorts occure in the LED array, detection of individual LED fault could become limited to blocs.
Intensity Control Register (0x0A)
The brightness of the display can be controlled by digital means using the Intensity Control Registers and by analog
means using RSET (see Selecting RSET Resistor Value and Using External Drivers on page 15). The intensity can be
controlled globally for all digits, or for each digit individually. The global intensity command will write intensity data to all
four individual brightness registers, while the individual intesity command will only write to the associated individual
intensity register.
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AS1116
Datasheet - D e t a i l e d D e s c r i p t i o n
Display brightness is controlled by an integrated pulse-width modulator which is controlled by the lower-nibble of the
Intensity Control Register. The modulator scales the average segment-current in 16 steps from a maximum of 15/16
down to 1/16 of the peak current set by RSET.
Table 16. Intensity Register Format
Duty Cycle
HEX Code
1/16 (min on)
2/16
3/16
4/16
5/16
6/16
7/16
8/16
0xX0
0xX1
0xX2
0xX3
0xX4
0xX5
0xX6
0xX7
MSB
0
0
0
0
0
0
0
0
Register Data
D2
D1 LSB
0
0
0
0
0
1
0
1
0
0
1
1
1
0
0
1
0
1
1
1
0
1
1
1
Duty Cycle
HEX Code
9/16
10/16
11/16
12/16
13/16
14/16
15/16
15/16 (max on)
0xX8
0xX9
0xXA
0xXB
0xXC
0xXD
0xXE
0xXF
MSB
1
1
1
1
1
1
1
1
Register Data
D2
D1 LSB
0
0
0
0
0
1
0
1
0
0
1
1
1
0
0
1
0
1
1
1
0
1
1
1
Table 17. Intensity Register Address
Register Data
Register HEX Address
Type
Global
Digit
Digit
Digit
Digit
0x0A
0x10
0x11
0x12
0x13
D7:D4
X
Digit 1 Intensity
Digit 3 Intensity
Digit 5 Intensity
Digit 7 Intensity
D3:D0
Global Intensity
Digit 0 Intensity
Digit 2 Intensity
Digit 4 Intensity
Digit 6 Intensity
Scan-Limit Register (0x0B)
The Scan-Limit Register controls which of the digits are to be displayed. When all 8 digits are to be displayed, the
update frequency is typically 0.8kHz. If the number of digits displayed is reduced, the update frequency is increased.
The frequency can be calculated using 8fOSC/N, where N is the number of digits. Since the number of displayed digits
influences the brightness, RSET should be adjusted accordingly.
Note: To avoid differences in brightness this register should not be used to blank parts of the display (leading zeros).
Table 18. Scan-Limit Register Format (Address (HEX) = 0x0B))
Scan Limit
Display digit 0 only
Display digits 0:1
Display digits 0:2
Display digits 0:3
Register Data
HEX
Code D7:D3 D2 D1 D0
0xX0
X
0
0
0
0xX1
X
0
0
1
0xX2
X
0
1
0
0xX3
X
0
1
1
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Scan Limit
Display digits 0:4
Display digits 0:5
Display digits 0:6
Display digits 0:7
Revision 1.04
Register Data
HEX
Code D7:D3 D2 D1 D0
0xX4
X
1
0
0
0xX5
X
1
0
1
0xX6
X
1
1
0
0xX7
X
1
1
1
13 - 20
AS1116
Datasheet - D e t a i l e d D e s c r i p t i o n
Feature Register (0x0E)
The Feature Register is used for enabling various features including switching the device into external clock mode,
applying an external reset, selecting code-B or HEX decoding, enabling or disabling blinking, enabling or disabling the
SPI-compatible interface, setting the blinking rate, and resetting the blink timing.
Note: At power-up the Feature Register is initialized to 0.
Table 19. Feature Register Summary
D7
blink_
start
D6
D5
D4
D3
D2
D1
D0
sync
blink_
freq_sel
blink_en
NU
decode_sel
reg_res
clk_en
Table 20. Feature Register Bit Descriptions (Address (HEX) = 0xXE)
Feature Register
Enables and disables various device features.
Bit Name
Default
Access
Bit Description
External clock active.
clk_en
0
R/W
0 = Internal oscillator is used for system clock.
1 = Pin CLK of the serial interface operates as system clock input.
Resets all control registers except the Feature Register.
0 = Reset Disabled. Normal operation.
reg_res
0
R/W
1 = All control registers are reset to default state (except the Feature
Register) identically after power-up.
Note: The Digit Registers maintain their data.
Selects display decoding for the selected digits (Table 9 on page 10).
decode_sel
0 = Enable Code-B decoding (see Table 10 on page 11).
0
R/W
1 = Enable HEX decoding (see Table 11 on page 11).
NU
Not used
Enables blinking.
blink_en
0
R/W
0 = Disable blinking. 1 = Enable blinking.
Sets blink with low frequency (with the internal oscillator enabled):
blink_freq_sel
0 = Blink period typically is 1 second (0.5s on, 0.5s off).
0
R/W
1 = Blink period is 2 seconds (1s on, 1s off).
Synchronizes blinking on the rising edge of pin LD. The multiplex and
blink timing counter is cleared on the rising edge of pin LD. By setting
sync
0
R/W
this bit in multiple devices, the blink timing can be synchronized across
all the devices.
Start Blinking with display enabled phase. When bit D4 (blink_en) is set,
bit D7 determines how blinking starts.
blink_start
0
R/W
0 = Blinking starts with the display turned off.
1 = Blinking starts with the display turned on.
Addr: 0xXE
Bit
D0
D1
D2
D3
D4
D5
D6
D7
No-Op Register (0xX0)
The No-Op Register is used when multiple AS1116 devices are cascaded in order to support displays with more than 8
digits. The cascading must be done in such a way that all SDO pins are connected to SDI of the next AS1116 (see Figure 20 on page 16). The LD and SCL signals are connected to all devices.
For example, if five devices are cascaded, in order to perform a write operation to the fifth device, the write-command
must be followed by four no-operation commands. When the LD signal goes high, all shift registers are latched. The
first four devices will receive no-operation commands and only the fifth device will receive the intended operation command, and subsequently update its register.
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AS1116
Datasheet - Ty p i c a l A p p l i c a t i o n
9 Typical Application
Selecting RSET Resistor Value and Using External Drivers
Brightness of the display segments is controlled via RSET. The current that flows between VDD and ISET defines the
current that flows through the LEDs.
Segment current is about 200 times the current in ISET. Typical values for RSET for different segment currents, operating voltages, and LED voltage drop (VLED) are given in Table 21 & Table 22. The maximum current the AS1116 can
drive is 47mA. If higher currents are needed, external drivers must be used, in which case it is no longer necessary
that the devices drive high currents.
Note: The display brightness can also be logically controlled (see Intensity Control Register (0x0A) on page 12).
Table 21. RSET vs. Segment Current and LED Forward Voltage, VDD = 2.7V & 3.3V & 3.6V
VLED
VLED
VLED
2.0V
1.5V
2.0V
2.5V
1.5V
2.0V
2.5V
3.0V
5kΩ
6.9kΩ
10.7kΩ
22.2kΩ
4.4kΩ
5.9kΩ
9.6kΩ
20.7kΩ
6.7kΩ
9.1kΩ
13.9kΩ
28.8kΩ
6.4kΩ
8.8kΩ
13.3kΩ
27.7kΩ
5.7kΩ
8.1kΩ
12.6kΩ
26kΩ
7.5kΩ
10.18kΩ
15.6kΩ
31.9kΩ
7.2kΩ
9.8kΩ
15kΩ
31kΩ
6.6kΩ
9.2kΩ
14.3kΩ
29.5kΩ
5.5kΩ
7.5kΩ
13kΩ
27.3kΩ
VDD = 3.6V
1.5V
VDD = 3.3V
40
30
20
10
VDD = 2.7V
ISEG (mA)
Table 22. RSET vs. Segment Current and LED Forward Voltage, VDD = 4.0V & 5.0V
VLED
VDD = 4.0V
40
30
20
10
1.5V
2.0V
2.5V
8.6kΩ
8.3kΩ
11.6kΩ 11.2kΩ
17.7kΩ 17.3kΩ
36.89kΩ 35.7kΩ
VLED
3.0V
3.5V
7.9kΩ
7.6kΩ 5.2kΩ
10.8kΩ 9.9kΩ 7.8kΩ
16.6kΩ 15.6kΩ 13.6kΩ
34.5kΩ 32.5kΩ 29.1kΩ
VDD = 5.0V
ISEG
(mA)
1.5V
2.0V
11.35kΩ
15.4kΩ
23.6kΩ
48.9kΩ
11.12kΩ
15.1kΩ
23.1kΩ
47.8kΩ
2.5V
3.0V
10.84kΩ 10.49kΩ
14.7kΩ 14.4kΩ
22.6kΩ
22kΩ
46.9kΩ 45.4kΩ
3.5V
4.0V
10.2kΩ
13.6kΩ
21.1kΩ
43.8kΩ
9.9kΩ
13.1kΩ
20.2kΩ
42kΩ
Calculating Power Dissipation
The upper limit for power dissipation (PD) for the AS1116 is determined from the following equation:
PD = (VDD x 5mA) + (VDD - VLED)(DUTY x ISEG x N)
(EQ 1)
Where:
VDD is the supply voltage.
DUTY is the duty cycle set by intensity register (page 13).
N is the number of segments driven (worst case is 8)
VLED is the LED forward voltage
ISEG = segment current set by RSET
Dissipation Example:
ISEG = 40mA, N = 8, DUTY = 15/16, VLED = 2.2V at 40mA, VDD = 5V
(EQ 2)
PD = 5V(5mA) + (5V - 2.2V)(15/16 x 40mA x 8) = 0.865W
(EQ 3)
Thus, for a QSOP-24 package ΘJA = +88°C/W, the maximum allowed TAMB is given by:
TJ,MAX = TAMB + PD x ΘJA = 150°C = TAMB + 0.865W x 88°C/W
(EQ 4)
In this example the maximum ambient temperature must stay below 73.88°C.
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AS1116
Datasheet - Ty p i c a l A p p l i c a t i o n
8x8 Dot Matrix Mode
The application example in Figure 20 shows the AS1116 in the 8x8 LED dot matrix mode.
The LED columns have common cathodes and are connected to the DIG0:7 outputs. The rows are connected to the
segment drivers. Each of the 64 LEDs can be addressed separately. The columns are selected via the digits as listed
in Table 7 on page 9.
The Decode Enable Register (see page 10) must be set to ‘00000000’ as described in Table 9 on page 10. Single
LEDs in a column can be addressed as described in Table 12 on page 11, where bit D0 corresponds to segment G and
bit D7 corresponds to segment DP.
Note: For a multiple-digit dot matrix, multiple AS1116 devices can be cascaded easily.
Figure 20. Application Example as LED Dot Matrix Driver
DIG0 to
DIG7
VDD
2.7 to 5V
9.53kΩ
SEG A to G
SEP DP
ISET
I/O
I/O
µP
I/O
SDI
AS1116
SCL
Diode Arrangement
LD
SDO
I/O
Diagnostic
readback: open
& shorted LEDs
GND
Supply Bypassing and Wiring
In order to achieve optimal performance the AS1116 should be placed very close to the LED display to minimize effects
of electromagnetic interference and wiring inductance.
Furthermore, it is recommended to connect a 10µF electrolytic and a 0.1µF ceramic capacitor between pins VDD and
GND to avoid power supply ripple (see Figure 20 on page 16).
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AS1116
Datasheet - P a c k a g e D r a w i n g s a n d M a r k i n g s
10 Package Drawings and Markings
The AS1116 is available in the QSOP-24 package.
Figure 21. QSOP-24 Package
Symbol
A
A1
A2
b
C
D
E
E1
e
h
L
θ
Min
Max
1.35
1.75
0.10
0.25
1.37
1.57
0.20
0.30
0.19
0.25
8.55
8.74
5.79
6.20
3.81
3.99
0.635 BSC
0.22
0.49
0.40
1.27
0º
8º
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AS1116
Datasheet - P a c k a g e D r a w i n g s a n d M a r k i n g s
Figure 22. TQFN(4x4)-24 Package
19
20
21
22
23
24
18
1
17
2
16
3
15
4
14
5
13
6
12
11
10
9
8
7
m
m
Symbol
A
A1
A3
b
D
E
D2
E2
Min
0.50
0.00
0.18
2.70
2.70
Typ
0.55
0.152REF
0.23
4.00BSC
4.00BSC
2.80
2.80
Max
0.60
0.05
0.28
2.90
2.90
Symbol
e
L
L1
aaa
bbb
ccc
ddd
eee
Min
0.30
0.00
Typ
0.50BSC
0.35
Max
0.40
0.10
0.10
0.10
0.10
0.05
0.08
Notes:Unilateral coplanarity zone applies to the exposed heat sink slug as well as the terminals.
1. Dimensioning and tolerancing conform to ASME Y14.5M-1994.
2. All dimensions are in millimeters; angles in degrees.
3. Dimension b applies to metallized terminal and is measured between 0.25mm and 0.30mm from terminal tip.
Dimension L1 represents terminal full back from package edge up to 0.1mm is acceptable.
4. Coplanarity applies to the exposed heat slug as well as the terminal.
5. Radius on terminal is optional.
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AS1116
Datasheet - O r d e r i n g I n f o r m a t i o n
11 Ordering Information
The devices are available as the standard products shown in Table 23.
Table 23. Ordering Information
Ordering Code
Marking
AS1116-BSST
AS1116
AS1116-BQFT
ASR9
Desciption
64 LED Driver with Detailed
Error Detection
64 LED Driver with Detailed
Error Detection
Delivery Form
Package
Tape and Reel
QSOP-24
Tape and Reel
TQFN(4x4)-24
All devices are RoHS compliant and free of halogene substances.
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AS1116
Datasheet
Copyrights
Copyright © 1997-2009, austriamicrosystems AG, Schloss Premstaetten, 8141 Unterpremstaetten, Austria-Europe.
Trademarks Registered ®. All rights reserved. The material herein may not be reproduced, adapted, merged,
translated, stored, or used without the prior written consent of the copyright owner.
All products and companies mentioned are trademarks or registered trademarks of their respective companies.
Disclaimer
Devices sold by austriamicrosystems AG are covered by the warranty and patent indemnification provisions appearing
in its Term of Sale. austriamicrosystems AG makes no warranty, express, statutory, implied, or by description regarding
the information set forth herein or regarding the freedom of the described devices from patent infringement.
austriamicrosystems AG reserves the right to change specifications and prices at any time and without notice.
Therefore, prior to designing this product into a system, it is necessary to check with austriamicrosystems AG for
current information. This product is intended for use in normal commercial applications. Applications requiring
extended temperature range, unusual environmental requirements, or high reliability applications, such as military,
medical life-support or life-sustaining equipment are specifically not recommended without additional processing by
austriamicrosystems AG for each application. For shipments of less than 100 parts the manufacturing flow might show
deviations from the standard production flow, such as test flow or test location.
The information furnished here by austriamicrosystems AG is believed to be correct and accurate. However,
austriamicrosystems AG shall not be liable to recipient or any third party for any damages, including but not limited to
personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or
consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the
technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of
austriamicrosystems AG rendering of technical or other services.
Contact Information
Headquarters
austriamicrosystems AG
Tobelbaderstrasse 30
A-8141 Unterpremstaetten - Graz, Austria
Tel: +43 (0) 3136 500 0
Fax: +43 (0) 3136 525 01
For Sales Offices, Distributors and Representatives, please visit:
http://www.austriamicrosystems.com/contact-us
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