TI DS96F172MQML

DS96F172MQML,DS96F174MQML
DS96F172MQML/DS96F174MQML EIA-485/EIA-422 Quad Differential Drivers
Literature Number: SNOSAS8
April 28, 2011
EIA-485/EIA-422 Quad Differential Drivers
General Description
Features
The DS96F172 and the DS96F174 are high speed quad differential line drivers designed to meet EIA-485 Standards.
The DS96F172 and the DS96F174 offer improved performance due to the use of L-FAST bipolar technology. The use
of LFAST technology allows the DS96F172 and DS96F174
to operate at higher speeds while minimizing power consumption.
The DS96F172 and the DS96F174 have TRI-STATE® outputs and are optimized for balanced multipoint data bus transmission at rates up to 15 Mbps. The drivers have wide positive
and negative common mode range for multipoint applications
in noisy environments. Positive and negative current-limiting
is provided which protects the drivers from line fault conditions
over a +12V to −7.0V common mode range. A thermal shutdown feature is also provided. The DS96F172 features an
active high and active low Enable, common to all four drivers.
The DS96F174 features separate active high Enables for
each driver pair.
■
■
■
■
■
■
■
■
■
Meets EIA-485 and EIA-422 standards
Monotonic differential output switching
TRI-STATE outputs
Designed for multipoint bus transmission
Common mode output voltage range: −7.0V to +12V
Operates from single +5.0V supply
Reduced power consumption
Thermal shutdown protection
DS96F172 and DS96F174 are lead and function
compatible with the SN75172/174 or the AM26LS31/
MC3487
Ordering Information
SMD Part Number
NS Package Number
DS96F172ME/883
NS Part Number
5962-9076501M2A
E20A
20LD Leadless Chip Carrier
Package Description
DS96F172MJ/883
5962-9076501MEA
J16A
16LD Ceramic Dip
DS96F174ME/883
5962-9076502M2A
E20A
20LD Leadless Chip Carrier
DS96F174MJ/883
5962-9076502MEA
J16A
16LD Ceramic Dip
DS96F174MJ-QMLV
5962-9076502VEA
J16A
16LD Ceramic Dip
TRI-STATE® is a registered trademark of National Semiconductor Corporation.
© 2011 National Semiconductor Corporation
201640
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DS96F172MQML/DS96F174MQML EIA-485/EIA-422 Quad Differential Drivers
DS96F172MQML/
DS96F174MQML
DS96F172MQML/DS96F174MQML
Connection Diagrams
16-Lead Ceramic Dual-In-Line Package
(NS Package Number J16A)
DS96F172
DS96F174
20164001
20164002
Top View
Top View
20-Lead Ceramic Leadless Chip Carrier (NS Package Number E20A)
20164018
20164019
Top View
NC = No connection
Top View
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2
DS96F172
DS96F174
20164014
20164015
DS96F174
Function Tables
DS96F172
(Each Driver)
Input
Enable
Outputs
A
E
E
Y
Z
H
H
X
H
L
L
H
X
L
H
H
X
L
H
L
L
X
L
L
H
X
L
H
Z
Z
Input
Enable
A
E
Y
Outputs
H
H
H
L
L
H
L
H
X
L
Z
Z
Z
H = High Level
L = Low Level
X = Don't Care
Z = High Impedance (Off)
3
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DS96F172MQML/DS96F174MQML
Logic Diagrams
DS96F172MQML/DS96F174MQML
Absolute Maximum Ratings (Note 1)
−65°C ≤ TA ≤ +175°C
300°C
Storage Temperature Range (TStg)
Lead Temperature (Soldering, 60 sec.)
Maximum Package Power Dissipation at 25°C (Note 2)
Ceramic LCC (E)
Ceramic DIP (J)
Ceramic Flatpak (W)
Supply Voltage
Enable Input Voltage
2,000 mW
1,800 mW
1,000 mW
7.0V
5.5V
Recommended Operating Conditions
Min
4.50
−7.0
Supply Voltage (VCC)
Common Mode Output Voltage (VOC)
Output Current High (IOH)
Output Current Low (IOL)
Operating Temperature (TA)
−55
Max
5.50
+12.0
−60
60
+125
Units
V
V
mA
mA
°C
Quality Conformance Inspection
Mil-Std-883, Method 5005 - Group A
Subgroup
Description
Temp (°C)
1
Static tests at
+25
2
Static tests at
+125
3
Static tests at
-55
4
Dynamic tests at
+25
5
Dynamic tests at
+125
6
Dynamic tests at
-55
7
Functional tests at
+25
8A
Functional tests at
+125
8B
Functional tests at
-55
9
Switching tests at
+25
10
Switching tests at
+125
11
Switching tests at
-55
12
Settling time at
+25
13
Settling time at
+125
14
Settling time at
-55
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4
AC/DC Parameters
(Note 5)
The following conditions apply, unless otherwise specified.
DC:
VCC = 5.5V
AC:
VCC = 5.0V
Symbol
Parameter
Conditions
VIL
Logical 0 Input Voltage
VIH
Logical 1 Input Voltage
VIC
Input Clamp Voltage
I = -18mA
VOD1
Differential Output Voltage
IO = 0mA
VOD2
Differential Output Voltage
VCC = 4.5V, RL = 54Ω
Figure 1
VOD2
Differential Output Voltage
VCC = 4.5V, RL = 100Ω
Figure 1
ΔVOD1
Change In Magnitude of VOD2
VCC = 4.5V, RL = 54Ω
ΔVOD2
Change In Magnitude of VOD2
VCC = 4.5V, RL = 100Ω
VOC
Common Mode Output Voltage
VOC
Notes
Min
Unit
0.8
V
1
0.7
V
2, 3
2.0
V
1, 2, 3
-1.5
V
1, 2, 3
6.0
(Note 3)
Subgroups
Max
V
1, 2, 3
1.5
V
1, 2
1.2
V
3
2.0
V
1, 2, 3
(Note 6)
-200
200
mV
1, 2
(Note 3,
Note 6)
-400
400
mV
3
(Note 6)
-200
200
mV
1, 2
(Note 3,
Note 6)
-400
400
mV
3
RL = 54Ω
Figure 1
3.0
V
1, 2, 3
Common Mode Output Voltage
RL = 100Ω
Figure 1
3.0
V
1, 2, 3
ΔVOC
Change in Magnitude of VOC
VCC = 4.5V, RL = 54Ω
Figure 1
(Note 6)
-200
200
mV
1, 2, 3
ΔVOC
Change in Magnitude of VOC
VCC = 4.5V, RL = 100Ω
Figure 1
(Note 7)
-200
200
mV
1, 2, 3
IO
Output Current With Power Off
VCC = 0V, VO = -7V to 12V
-50
50
µA
1, 2, 3
IOZ
High Impedance State Output
Current
VO = -7V to 12V
-50
50
µA
1, 2, 3
IIH
Logical 1 Input Current
VI = 2.4V
20
µA
1, 2, 3
IIL
Logical 0 Input Current
VI = 0.4V
µA
1, 2, 3
ICC
Supply Current
Outputs Enabled
50
mA
1, 2, 3
ICCX
Supply Current
Outputs Disabled
30
mA
1, 2, 3
IOS1
Short Circuit Output Current
VO = -7V
(Note 4)
-250
mA
1, 2, 3
IOS2
Short Circuit Output Current
VO = 0V
(Note 4)
-150
mA
1, 2, 3
IOS3
Short Circuit Output Current
VO = VCC
(Note 4)
150
mA
1, 2, 3
IOS4
Short Circuit Output Current
VO = 12V
(Note 4)
250
mA
1, 2, 3
tPLH
Propagation Delay Lo to Hi level
RL = 27Ω, CL = 15pF
Figure 4
25
ns
10, 11
16
ns
9
tPHL
Propagation Delay Hi to Low
Level
RL = 27Ω, CL = 15pF
Figure 4
25
ns
10, 11
16
ns
9
SKEW
Output to Output Delay Time
RL = 60Ω
10
ns
10, 11
4
ns
9
tLZ
Output Disable Time From Low
Level
RL = 110Ω, CL = 50pF
Figure 6
40
ns
10, 11
25
ns
9
-50
5
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DS96F172MQML/DS96F174MQML
DS96F172/DS96F174 Electrical Characteristics
DS96F172MQML/DS96F174MQML
Symbol
Parameter
Conditions
Notes
Min
Max
Unit
Subgroups
10, 11
tHZ
Output Disable Time From High
Level
RL = 110Ω, CL = 50pF
Figure 5
80
ns
30
ns
9
tZL
Output Enable Time to Low Level RL = 110Ω, CL = 50pF
Figure 6
100
ns
10, 11
40
ns
9
tZH
Output Enable Time to High Level RL = 110Ω, CL = 50pF
Figure 4
40
ns
10, 11
32
ns
9
ns
10, 11
tDD
Differential Output Delay Time
RL = 60Ω, CL = 15pF
Figure 3
30
22
ns
9
tTD
Differential Output Transition
Time
RL = 60Ω, CL = 15pF
Figure 3
40
ns
10, 11
22
ns
9
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed
specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test
conditions.
Note 2: Above TA = 25°C, derate “E” package 13.3, “J” package 12.5, “W” package 7.1 mW/°C
Note 3: −55°C limit exceeds EIA standard RS−485 specification
Note 4: 0.2µF cap is connected between the output and Gnd to reduce oscillation.
Note 5: All currents into the device pins are positive; all currents out of the device pins are negative. All voltages are reference to ground unless otherwise specified.
Note 6: Δ|VOD| is the change in magnitude of VOD, that occurs when the input is changed between high and low levels.
Note 7: Δ|VOC| is the change in magnitude of the VOC that occurs when the input is changed between high and low levels.
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6
20164013
20164003
FIGURE 2. Differential Output Voltage with
Varying Common Mode Voltage
FIGURE 1. Differential and Common
Mode Output Voltage
20164005
20164004
FIGURE 3. Differential Output Delay and Transition Times
20164006
20164007
FIGURE 4. Propagation Delay Times
7
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DS96F172MQML/DS96F174MQML
Parameter Measurement Information
DS96F172MQML/DS96F174MQML
20164009
20164008
FIGURE 5. tZH and tHZ
20164011
20164010
FIGURE 6. tZL, tLZ, tLZL
Note 8: The input pulse is supplied by a generator having the following characteristics: f = 1.0 MHz, duty cycle = 50%, tr ≤ 5.0 ns, tf ≤ 5.0 ns, ZO = 50Ω.
Note 9: CL includes probe and jig capacitance.
Note 10: DS96F172 with active high and active low Enables is shown. DS96F174 has active high Enable only.
Note 11: To test the active low Enable E of DS96F172 ground E and apply an inverted waveform to E . DS96F174 has active high Enable only.
Note 12: For more information see Application Bulletin, Contact Product Marketing.
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8
DS96F172MQML/DS96F174MQML
Typical Application
20164012
The line length should be terminated at both ends in its characteristic impedance.
Stub lengths off the main line should be kept as short as possible.
9
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DS96F172MQML/DS96F174MQML
Revision History
Released
Revision
8–Apr-11
A
www.national.com
Section
Changes
New Release, Corporate format
10
2 MDS data sheets converted into one Corp. data
sheet format. MNDS96F172M-X Rev 1A0 &
MNDS96F174M-X Rev 1B0 will be archived.
DS96F172MQML/DS96F174MQML
Physical Dimensions inches (millimeters) unless otherwise noted
20-Lead Ceramic Leadless Chip Carrier (E)
NS Package Number E20A
16-Lead Ceramic Dual-In-Line Package (J)
NS Package Number J16A
11
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DS96F172MQML/DS96F174MQML EIA-485/EIA-422 Quad Differential Drivers
Notes
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