TI SN54BCT2828A

SCBS058A − APRIL 1987 − REVISED NOVEMBER 1993
•
•
•
•
•
SN54BCT2828A . . . JT OR W PACKAGE
SN74BCT2828B . . . DW OR NT PACKAGE
(TOP VIEW)
State-of-the-Art BiCMOS Design
Significantly Reduces ICCZ
ESD Protection Exceeds 2000 V
Per MIL-STD-883C, Method 3015
Output Ports Have Equivalent 33-Ω Series
Resistors, So No External Resistors Are
Required
3-State Inverting Outputs Drive Bus Lines
or Buffer Memory Address Registers
Flow-Through Architecture Optimizes
PCB Layout
Package Options Include Plastic
Small-Outline (DW) Packages, Ceramic
Chip Carriers (FK) and Flatpacks, and
Standard Plastic and Ceramic 300-mil DIPs
(JT, NT)
OE1
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
GND
1
24
2
23
3
22
4
21
5
20
6
19
7
18
8
17
9
16
10
15
11
14
12
13
VCC
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Y8
Y9
Y10
OE2
SN54BCT2828A . . . FK PACKAGE
(TOP VIEW)
A2
A1
description
These 10-bit bus/MOS memory drivers provide a
high-performance bus interface for wide data
paths or buses carrying parity.
A3
A4
A5
NC
A6
A7
A8
4
3 2 1 28 27 26
25
6
24
7
23
8
22
9
21
10
20
11
19
12 13 14 15 16 17 18
Y3
Y4
Y5
NC
Y6
Y7
Y8
A9
A10
GND
NC
OE2
Y10
Y9
The 3-state control gate is a 2-input AND gate with
active-low inputs so that if either output-enable
(OE1 or OE2) input is high, all ten outputs are in
the high-impedance state. The outputs are also in
the high-impedance state during power-up and
power-down conditions. The outputs remain in the
high-impedance state while the device is powered
down.
5
OE1
NC
VCC
Y1
Y2
•
The outputs, which are designed to source or sink
up to 12 mA, include 33-Ω series resistors to
reduce overshoot and undershoot.
NC − No internal connection
The SN54BCT2828A is characterized for operation over the full military temperature range of
− 55°C to 125°C. The SN74BCT2828B is
characterized for operation from 0°C to 70°C.
FUNCTION TABLE
INPUTS
A
OUTPUT
Y
L
L
H
L
H
L
H
X
X
Z
X
H
X
Z
OE1
OE2
L
L
Copyright  1993, Texas Instruments Incorporated
!"#$%&'#! ( )*$$+!' &( #" ,*-.)&'#! /&'+0
$#/*)'( )#!"#$% '# (,+)")&'#!( ,+$ '1+ '+$%( #" +2&( !('$*%+!'(
('&!/&$/ 3&$$&!'40 $#/*)'#! ,$#)+((!5 /#+( !#' !+)+((&$.4 !).*/+
'+('!5 #" &.. ,&$&%+'+$(0
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2−1
SCBS058A − APRIL 1987 − REVISED NOVEMBER 1993
logic symbol†
1
OE1
OE2
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
logic diagram (positive logic)
OE1
&
2
3
OE2
EN
13
23
1
22
4
21
5
20
6
19
7
18
8
17
9
16
10
15
11
14
A1
1
13
2
23
Y1
Y2
Y3
Y4
To Nine Other Channels
Y5
Y6
Y7
Y8
Y9
Y10
† This symbol is in accordance with ANSI/IEEE Std 91-1984
and IEC Publication 617-12.
Pin numbers shown are for the DW, JT, NT, and W packages.
schematic of each output
VCC
Output
GND
2−2
•
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POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
•
Y1
SCBS058A − APRIL 1987 − REVISED NOVEMBER 1993
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the disabled or power-off state, VO . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high state, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −30 mA
Current into any output in the low state, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 mA
Operating free-air temperature range: SN54BCT2828A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55°C to 125°C
SN74BCT2828B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The input negative-voltage rating may be exceeded if the input clamp-current rating is observed.
recommended operating conditions (see Note 2)
SN54BCT2828A
SN74BCT2828B
MIN
NOM
MAX
MIN
NOM
MAX
4.5
5
5.5
4.5
5
5.5
UNIT
VCC
VIH
Supply voltage
VIL
IIK
Low-level input voltage
0.8
0.8
V
Input clamp current
−18
−18
mA
IOH
IOL
High-level output current
−1
−1
mA
Low-level output current
12
12
mA
70
°C
High-level input voltage
2
TA
Operating free-air temperature
NOTE 2: Unused or floating inputs must be held high or low.
2
−55
125
V
V
0
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
SN54BCT2828A
MIN TYP‡
MAX
TEST CONDITIONS
SN74BCT2828B
MIN TYP‡
MAX
VIK
VOH
VCC = 4.5 V,
VCC = 4.5 V to 5.5 V,
II = −18 mA
IOH = − 1 mA
VOL
VCC = 4.5 V
IOL = 1 mA
IOL = 12 mA
II
IIH
VCC = 5.5 V,
VCC = 5.5 V,
VI = 7 V
VI = 2.7 V
0.1
20
20
µA
IIL
IOZH
VCC = 5.5 V,
VCC = 5.5 V,
VI = 0.5 V
VO = 2.7 V
−0.2
−0.2
mA
20
20
µA
IOZL
IOL
IO§
VCC = 5.5 V,
VCC = 4.5 V,
VO = 0.5 V
VO = 2 V
−20
−20
VCC = 5.5 V,
VCC = 5.5 V,
VO = 2.25 V
Outputs open
VCC = 5.5 V,
VCC = 5 V,
Outputs open
ICCL
ICCZ
Ci
Co
−1.2
VCC −2
−1.2
UNIT
VCC −2
0.35
0.5
50
0.5
0.42
0.8
0.1
−112
V
mA
µA
mA
−30
−112
mA
28
40
mA
3.5
3.5
6
mA
5
5
pF
8
pF
VCC = 5 V,
8
‡ All typical values are at VCC = 5 V, TA = 25°C.
§ Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
•
0.35
28
VI = 2.5 V or 0.5 V
VO = 2.5 V or 0.5 V
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•
V
50
−30
V
2−3
SCBS058A − APRIL 1987 − REVISED NOVEMBER 1993
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, CL = 50 pF (unless otherwise noted) (see Note 3)
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
A
Y
tPZH
tPZL
OE
Y
tPHZ
tPLZ
OE
Y
PARAMETER
VCC = 5 V,
TA = 25°C
SN54BCT2828A
MIN
TYP
MAX
MIN
MAX
MIN
MAX
1.8
2.7
5.9
1.5
10
1.3
6.6
1.2
3.1
4.8
1.5
9
0.9
5
3.6
5.8
7.8
2
15
2.9
9
5.5
7.9
10.2
2
21
4.8
11.5
4.7
7.2
9.3
2
18
3.8
10.8
3.3
5.4
7.2
2
15
2.7
8.7
NOTE 3: Load circuits and voltage waveforms are shown in Section 1.
2−4
•
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POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
•
SN74BCT2828B
UNIT
ns
ns
ns
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74BCT2828BDW
OBSOLETE
SOIC
DW
24
TBD
Call TI
Call TI
SN74BCT2828BNT
OBSOLETE
PDIP
NT
24
TBD
Call TI
Call TI
SNJ54BCT2828AFK
OBSOLETE
LCCC
FK
28
TBD
Call TI
Call TI
SNJ54BCT2828AJT
OBSOLETE
CDIP
JT
24
TBD
Call TI
Call TI
SNJ54BCT2828AW
OBSOLETE
CFP
W
24
TBD
Call TI
Call TI
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MCER004A – JANUARY 1995 – REVISED JANUARY 1997
JT (R-GDIP-T**)
CERAMIC DUAL-IN-LINE
24 LEADS SHOWN
PINS **
A
13
24
B
1
24
28
A MAX
1.280
(32,51)
1.460
(37,08)
A MIN
1.240
(31,50)
1.440
(36,58)
B MAX
0.300
(7,62)
0.291
(7,39)
B MIN
0.245
(6,22)
0.285
(7,24)
DIM
12
0.070 (1,78)
0.030 (0,76)
0.100 (2,54) MAX
0.320 (8,13)
0.290 (7,37)
0.015 (0,38) MIN
0.200 (5,08) MAX
Seating Plane
0.130 (3,30) MIN
0.023 (0,58)
0.015 (0,38)
0°–15°
0.014 (0,36)
0.008 (0,20)
0.100 (2,54)
4040110/C 08/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a ceramic lid using glass frit.
Index point is provided on cap for terminal identification.
Falls within MIL STD 1835 GDIP3-T24, GDIP4-T28, and JEDEC MO-058 AA, MO-058 AB
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MCFP007 – OCTOBER 1994
W (R-GDFP-F24)
CERAMIC DUAL FLATPACK
0.375 (9,53)
0.340 (8,64)
Base and Seating Plane
0.006 (0,15)
0.004 (0,10)
0.090 (2,29)
0.045 (1,14)
0.045 (1,14)
0.026 (0,66)
0.395 (10,03)
0.360 (9,14)
0.360 (9,14)
0.240 (6,10)
1
0.360 (9,14)
0.240 (6,10)
24
0.019 (0,48)
0.015 (0,38)
0.050 (1,27)
0.640 (16,26)
0.490 (12,45)
0.030 (0,76)
0.015 (0,38)
12
13
30° TYP
1.115 (28,32)
0.840 (21,34)
4040180-5 / B 03/95
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a ceramic lid using glass frit.
Falls within MIL-STD-1835 GDFP2-F24 and JEDEC MO-070AD
Index point is provided on cap for terminal identification only.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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