BRIGHT VIEW ELECTRONICS CO.,LTD ULTRA BRIGHTNESS SMD LED BVS-301QT4 PACKAGE CONFIGURATION 3.60 2.40 DESCRIPTION 1.9 Dice Material : AlInGaP/GaP Orange Red Light Color : Orange Red Color Lens Color : Water Transparent 2.70 RADIATION PATTERN -30° 0° INFRARED/VAPOR PHASE REFLOW SOLDERING 30° 4.45 3.20 0.15 -60° 60° 0.80 3.60 100 75 50 25 0 25 50 75 100 Relative Luminous Intensity ( Iv % ) ABSOLUTE MAXIMUM RATINGS AT Ta = 25 к ELECTRICAL / OPTICAL CHARACTERISTICS AT Ta = 25 PARAMETER Forward Voltage Reverse Current Peak Emission Wavelength Dominant Wavelength Viewing Angle 1.65 Tolerance ± 0.25 р PARAMETER Power Dissipation Continuous Forward Current Peak Forward Current ( 1/10 Duty Cycle , 0.1ms Pulse Width ) Reverse Voltage Derating Linear From 50 к Operating Temperature Range Storage Temperature Range Reflow Soldering Condition 230 к for 10 seconds SYMBOL VF IR ӳp ӳd 2Ӱ1/2 2.41 1.90 TEST COND. I F = 20 mA V R = 5V I F = 20 mA I F = 20 mA I F = 20 mA MIN. MAX. 100 35 60 5 0.35 Ё40 to Ѐ 100 Ё40 to Ѐ 100 UNIT mW mA mA V mA/oC o C o C к TYP. 2.3 MAX. 2.8 100 634 629 110 UNIT V ӴA nm nm Deg BIN GRADE LIMITS ( I F = 20 mA ) LUMINOUS INTENSITY / mcd Bin Min. Max. C 168 218 D 218 280 E 280 360 F G H 360 465 600 465 600 780 Tolerance ± 15%mcd *Bright View reserves the rights to alter specifications and remove availability of products at any time without notice. *Dominant Wavelength, ӳd is according to CIE Chromaticity Diagram base on color of lamps. *Ӱ1/2 is the off-axis angle where the luminous intensity is one half the on-axis intensity. 2004/9/30 – B BRIGHT VIEW ELECTRONICS CO.,LTD SMD APPLICATION ( PB FREE SOLDERING ) Apply to BVS-3XXΕ1XX series. Description: (1) Manual soldering (We do not recommend this method strongly.) (1.1) To prevent cracking,please bake (65к,24hrs)before soldering. (1.2) Temperature at tip of iron: 250к Max.(25W) (1.3) It's banned to load any stress on the resin during soldering. (1.4) Soldering time: 3 sec. Max.(one time only) (2) Reflow Soldering (2.1) To prevent cracking,please bake (65к,24hrs)before soldering. (2.2) When soldering,do not put stress on the LEDs during heating. (2.3) Never take next process until the component is cooled down to room temperature after reflow. (2.4) After soldering,do not warp the circuit board. (2.5) The recommended reflow soldering profile(measuring on the surface of the LED resin)is following: 10 SEC. MAX. 245 C MAX. 0.5к/SEC MAX. 217к 217к TEMPERATURE 150к 1к/SEC. MAX. 50 SEC. MAX. ~75к ~25к 210 SEC. MIN. 100 SEC. MAX. TIME The reflow temperature 240к~245к is recommended and the soldering temperature should be not higher than 245к(one time only) 2005 / 10 / 20 - B BRIGHT VIEW TOP LEDS PACKING (A) ELECTRONICS CO.,LTD 2.0 0.05 Gap : Left Side + BVS-301 + 4.0 0.10 BVS-312 + BVS-301-B + + + + BVS-313 + BVS-311 - + + BVS-313 + - 4.0 0.10 + 0.3 MAX. 1.5 0.10 1.75 0.10 5.5 0.05 12.0 0.3 9.3 2.6 MAX. Feeding direction Blue / Green / White : Black tape Others : Transparent tape UNIT : mm BVS-311-B 50 MIN. 178 2.0 13 TYP. Reel : 1,500PCS UNIT : mm Label 2 Bright View Label 1 Bright View PART NO.: PART NO.: Electronics Co.,Ltd. BVS-30XXXX LOT NO.: GRADE: LOT NO.: GRADE: pcs Q'ty X- Normal QA ńłŖŕŊŐŏ pcs Q'ty Electronics Co.,Ltd. QA ELECTROSTATIC SENSITIVE DEVICES DO NOT OPEN OR HANDLE EXCEPT AT A STATIC-FREE WORKSTATION 24 Anti-electrostatic bag X: Bin grade : Wavelength : Vf 39 RE Y CARTON Dimension(cm): 39*24*22 22 ITEM NO. DEVICE: Q'TY N. W.: G. W.: PCS. KGS. KGS. Carton : 20 Reels Total : 30,000PCS 2003 / 10 / 24 - B