CHENMKO BAS21BPT

CHENMKO ENTERPRISE CO.,LTD
BAS21BPT
SURFACE MOUNT
FAST SWITCHING DIODE
VOLTAGE RANGE 250 Volts CURRENT 200 mAmpere
FEATURES
* Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
* For surface mounted applications
* Low profile package
* Built-in strain relief
* Low power loss, high efficiency
* High current capability, low forward voltage drop
* Power dissipation: 250mW
* Repetitive peak forward surge current: 625mA
* High temperature soldering guaranteed :
260oC/10 seconds at terminals
SOD-123
MECHANICAL DATA
0.153(3.90)
0.140(3.55)
0.112(2.85)
0.098(2.50)
0.028(0.70)
0.018(0.45)
Case: JEDEC SOD-123 molded plastic
Terminals: Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity: Color band denotes cathode end
Weight: 0.001 ounce 0.032 gram
MARKING
MAX.
0.008(0.2)
* K1
2
0.071(1.80)
0.055(1.40)
0.053(1.35)
0.035(0.90)
1
0.004(0.12)
0.02(0.5)
Tpy
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25oC ambient temperature unless otherwise specified.
Single phase, half wave, 60 HZ, resistive or inductive load.
For capacitive load, derate current by 20%.
Dimensions in inches and (millimeters)
SOD-123
MAXIMUM RATINGES ( At TA = 25oC unless otherwise noted )
RATINGS
SYMBOL
BAS21BPT
UNITS
Maximum Recurrent Peak Reverse Voltage
VRRM
250
Volts
Maximum RMS Voltage
VRMS
141
Volts
Maximum DC Blocking Voltage
VDC
200
Volts
IO
200
mAmps
Maximum Average Forward Rectified Current at TL = 100oC
@ t=1.0uS
Non-Repetitive Peak Forward Surge Current
@ t=1.0S
IFSM
2.5
0.5
Amps
Typic Junction Capacitance (Note 2)
CJ
5.0
pF
Maximum Reverse Recovery Time (Note 3)
TRR
50
nS
R
Typical Thermal Resistance (Note 1)
Storage and Operating Temperature Range
JA
TJ, TSTG
833
-65 to +150
o
C/W
o
C
o
ELECTRICAL CHARACTERISTICS ( At TA = 25 C unless otherwise noted )
CHARACTERISTICS
SYMBOL
@ IF = 100 mA
Breakdown Voltage(Minimun)
1.00
UNITS
Volts
VF
Maximum Instantaneous Forward Voltage
Maximum Average Reverse Current
at Ratied DC Blocking Voltage
BAS21BPT
@ IF = 200 mA
1.25
Volts
@ TA = 25oC
100
nAmps
15
uAmps
IR
@ TJ = 100oC
Bv
250
NOTES : 1. Thermal Resistance ( Junction to Lead ) : PC Board Mounted on 0.06 X 0.06" ( 0.15X 0.15mm ) copper pad area.
2. Measured at 1.0 MHZ and applied reverse voltage of 0 volt.
3. IF=IR=30 mA, IRR=0.1XIR, RL=100 ohms
Volts
2002-9
FIG. 1 - TYPICAL FORWARD CURRENT
DERAING CURVE
125
FIG. 2 - FORWARD CHARACTERISTICS
500
FORWARD CURRENT, (mA)
AVERAGE FORWARD CURRENT, (%)
RATING CHARACTERISTIC CURVES ( BAS21BPT )
100
75
50
25
0
200
100
50
Ta=85oC
50oC
25oC
0oC
o
- 30 C
20
10
5
2
1
25
0
50
75
100
125
150
0
o
0.4
0.6
0.8
1.0
1.4
1.2
FORWARD VOLTAGE, (V)
FIG. 3 - TYPICAL JUNCTION CAPACITANCE
FIG. 4 - REVERSE CHARACTERISTICS
5
10u
Ta=100oC
1u
75oC
f=1MHz
REVERSE CURRENT, (nA)
JUNCTION CAPACITANCE, (pF)
0.2
AMBIENT TEMPERATURE, ( C)
4
2
1.6
50oC
100
25oC
10
0oC
-
25oC
1
0.1
0
0
2
4
6
8
10
12
14
REVERSE VOLTAGE, (V)
16
18
20
0
50
100
150
REVERSE VOLTAGE, (V)
200