TI ADS1610

ADS1610
¨
SBAS344A − AUGUST 2005 − REVISED SEPTEMBER 2005
16-Bit, 10MSPS
ANALOG-TO-DIGITAL CONVERTER
FEATURES
The ADS1610 is a high-speed, high-precision, deltasigma (∆Σ) analog-to-digital converter (ADC) with 16-bit
resolution operating from a +5V analog and a +3V digital
supply. Featuring an advanced multi-stage analog
modulator combined with an on-chip digital decimation
filter, the ADS1610 achieves 86dBFS signal-to-noise ratio
(SNR) in a 5MHz signal bandwidth. The device offers
outstanding performance at these speeds with a total
harmonic distortion of −94dB.
High-Speed, Wide Bandwidth ∆Σ ADC
10MSPS Output Data Rate
4.9MHz Signal Bandwidth
86dBFS Signal-to-Noise Ratio
−94dB Total Harmonic Distortion
95dB Spurious-Free Dynamic Range
The ADS1610 ∆Σ topology provides key system-level
design advantages with respect to anti-alias filtering and
clock jitter. The design of the anti-alias filter is simplified
since the on-chip digital filter greatly attenuates
out-of-band signals. The ADS1601s filter has a brick wall
response with a very flat passband (±0.0002dB of ripple)
followed immediately by a very wide stop band (5MHz to
55MHz). Clock jitter becomes especially critical when
digitizing high frequency, large-amplitude signals. The
ADS1610 significantly reduces clock jitter sensitivity by an
effective averaging of clock jitter as a result of
oversampling the input signal.
On-Chip Digital Filter Simplifies Anti-Alias
Requirements
D SYNC Pin for Simultaneous Sampling with
Multiple ADS1610s
D
D
D
D
D
Low 3µs Group Delay
Parallel Interface
Directly Connects to TMS320 DSPs
Out-of-Range Alert Pin
Pin-Compatible with ADS1605 (5MSPS ADC)
Output data is supplied over a parallel interface and easily
connects to TMS320 digital signal processors (DSPs).
The power dissipation can be adjusted with an external
resistor, allowing for reduction at lower operating speeds.
APPLICATIONS
With its outstanding high-speed performance, the
ADS1610 is well-suited for demanding applications in data
acquisition, scientific instruments, test and measurement
equipment, and communications. The ADS1610 is offered
in a TQFP-64 package and is specified from −40°C to
+85°C.
D Scientific Instruments
D Test Equipment
D Communications
AVDD VREFP VREFN VMID
RBIAS
VCAP
DVDD
PD
Bias Circuits
SYNC
CLK
AINP
∆Σ
Modulator
AINN
Digital
Filter
Parallel
Interface
CS
2xMODE
RD
DRDY
OTR
DOUT[15:0]
ADS1610
AGND
DGND
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a registered trademark of Texas Instruments. All other trademarks are the property of their respective owners.
! Copyright  2005, Texas Instruments Incorporated
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PRODUCT PREVIEW
D
D
D
D
D
D
D
DESCRIPTION
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ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1)
ADS1610
UNIT
AVDD to AGND
−0.3 to +6
V
DVDD to DGND
−0.3 to +3.6
V
−0.3 to +0.3
V
AGND to DGND
Input Current
100mA, Momentary
Input Current
10mA, Continuous
Analog I/O to AGND
−0.3 to AVDD + 0.3
V
Digital I/O to DGND
−0.3 to DVDD + 0.3
V
+150
°C
Operating Temperature Range
−40 to +105
°C
Storage Temperature Range
−60 to +150
°C
PRODUCT PREVIEW
Maximum Junction Temperature
Lead Temperature (soldering, 10s)
+260
°C
(1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not implied.
PACKAGE/ORDERING INFORMATION
For the most current package and ordering information,
see the Package Option Addendum at the end of this
document, or see the TI website at www.ti.com.
2
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
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ELECTRICAL CHARACTERISTICS
All specifications at −40°C to +85°C, AVDD = 5V, DVDD = 3V, fCLK = 60MHz, VREF = +3V, 2xMODE = low, VCM = 2.5V, and RBIAS = 18kΩ,
unless otherwise noted.
ADS1610
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Analog Input
Differential input voltage (VIN)
(AINP − AINN)
±VREF
V
2.5
V
Common-mode input voltage (VCM)
(AINP + AINN)/2
Absolute input voltage
(AINP or AINN with respect to AGND)
−0.1
4.2
V
Dynamic Specifications
Signal-to-noise ratio (SNR)
Total harmonic distortion (THD)
Signal-to-noise and distortion (SINAD)
Spurious-free dynamic range (SFDR)
10
fCLK
60MHz
Ǔ
MSPS
fSIG = 100kHz, −2dBFS
86
dBFS
fSIG = 1MHz, −2dBFS
85
dBFS
fSIG = 4MHz, −2dBFS
85
dBFS
fSIG = 100kHz, −2dBFS
−90
dB
fSIG = 100kHz, −6dBFS
−95
dB
fSIG = 100kHz, −20dBFS
−95
dB
fSIG = 1MHz, −2dBFS
−89
dB
fSIG = 1MHz, −6dBFS
−93
dB
fSIG = 1MHz, −20dBFS
−95
dB
fSIG = 4MHz, −2dBFS
−109
dB
fSIG = 4MHz, −6dBFS
−105
dB
fSIG = 4MHz, −20dBFS
−95
dB
fSIG = 100kHz, −2dBFS
85
dBFS
fSIG = 1MHz, −2dBFS
84
dBFS
fSIG = 4MHz, −2dBFS
85
dBFS
fSIG = 100kHz, −2dBFS
90
dB
fSIG = 100kHz, −6dBFS
96
dB
fSIG = 100kHz, −20dBFS
96
dB
fSIG = 1MHz, −2dBFS
91
dB
fSIG = 1MHz, −6dBFS
93
dB
fSIG = 1MHz, −20dBFS
96
dB
fSIG = 4MHz, −2dBFS
109
dB
fSIG = 4MHz, −6dBFS
105
dB
fSIG = 4MHz, −20dBFS
95
dB
TBD
dB
2
ps, rms
4
ns
Intermodulation distortion
f1 = 3.8MHz, −8dBFS
f2 = 4MHz, −8dBFS
Aperture jitter
Excludes jitter of CLK source
Aperture delay
ǒ
PRODUCT PREVIEW
Data rate
3
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ELECTRICAL CHARACTERISTICS (continued)
All specifications at −40°C to +85°C, AVDD = 5V, DVDD = 3V, fCLK = 60MHz, VREF = +3V, 2xMODE = low, VCM = 2.5V, and RBIAS = 18kΩ,
unless otherwise noted.
ADS1610
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Digital Filter Characteristics
Passband
0
4.4
−0.1dB attenuation
ǒ
ǒ
4.6
Passband transition
−3.0dB attenuation
4.9
Stop band
5.6
Stop band attenuation
80
Group delay
PRODUCT PREVIEW
fCLK
60MHz
Ǔ
±0.0002
Passband ripple
Settling time
ǒ
Ǔ
Ǔ
dB
MHz
60MHz
fCLK
60MHz
MHz
54.4
(see Figure 14)
3.0
To ±0.001%
fCLK
MHz
ǒ
60MHz
fCLK
MHz
dB
Ǔ
µs
5.5
µs
TBD
µV, rms
±0.75
LSB
±0.5
LSB
TBD
mV
Static Specifications
Resolution
No missing codes
16
Input referred noise
Integral nonlinearity
End-point fit, −2dBFS signal
Differential nonlinearity
Offset error
T = +25°C
Bits
TBD
µV//°C
Gain error
T = +25°C
TBD
%
Gain drift
Excluding reference drift
TBD
ppm/°C
Common-mode rejection
At DC
TBD
dB
Power-supply rejection
At DC
TBD
dB
Offset drift
Voltage Reference
VREF (VREFP − VREFN)
2.9
3.0
3.1
V
VREFP
3.6
4.0
4.4
V
VREFN
0.9
1.0
1.1
V
VMID
2.2
2.5
3.8
V
0.7 DVDD
DVDD
V
DGND
0.3 DVDD
V
Digital Input/Output
VIH
VIL
VOH
IOH = −50µA
VOL
IOL = 50µA
Input leakage
DGND < VDIGITAL INPUT < DVDD
0.8 DVDD
V
0.2 DVDD
V
±10
µA
5.0
5.1
V
3.0
3.6
Power-Supply Requirements
AVDD
4.9
DVDD
2.7
AVDD current
150
V
mA
DVDD current
70
mA
Power dissipation
960
mW
4
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PIN CONFIGURATION
VREFP
VMID
VREFN
VREFN
VCAP
AVDD2
AGND2
CLK
AGND
DGND
DVDD
DVDD
DGND
DVDD
DVDD
HTQFP
VREFP
Top View
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
AGND
1
48 NC
AVDD
2
47 NC
AGND
3
46 NC
AINN
4
45 NC
AINP
5
44 DOUT[15]
AGND
6
43 DOUT[14]
AVDD
7
42 DOUT[13]
RBIAS
8
9
PRODUCT PREVIEW
AGND
41 DOUT[12]
ADS1610
40 DOUT[11]
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
DOUT[1]
DOUT[2]
DOUT[3]
33 DOUT[4]
DOUT[0]
NC 16
NC
34 DOUT[5]
NC
NC 15
DVDD
35 DOUT[6]
DGND
2xMODE 14
DRDY
36 DOUT[7]
OTR
NC 13
RD
37 DOUT[8]
CS
AVDD 12
SYNC
38 DOUT[9]
DGND
AGND 11
DVDD
39 DOUT[10]
PD
AVDD 10
5
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PRODUCT PREVIEW
PIN FUNCTION DESCRIPTION
6
PIN NAME
PIN #
ANALOG/DIGITAL
INPUT/OUTPUT
AGND
1, 3, 6, 9, 11, 55
Analog
Analog Ground
AVDD
2, 7, 10, 12
Analog
Analog Supply
AINN
4
Analog Input
Negative Analog Input
AINP
5
Analog Input
Positive Analog Input
RBIAS
8
Analog
NC
13, 15, 16, 27, 28, 45-48
—
2xMODE
14
Digital Input; Active High
2xMODE (20MSPS)
PD
17
Digital Input; Active Low
Power-Down
DVDD
18, 26, 49, 50, 52, 53
Digital
Digital Supply
DGND
19, 25, 51, 54
Digital
Digital Ground
SYNC
20
Digital Input; Active Low
Digital Reset
CS
21
Digital Input; Active Low
Chip-Select
RD
22
Digital Input; Active Low
Read Enable
OTR
23
Digital Output
Analog Inputs Out-Of-Range
DRDY
24
Digital Output
Data Ready
DOUT[15:0]
29-44
Digital Output
Data Output. DOUT[15] is the MSB and DOUT[0] is the LSB.
DESCRIPTION
Analog Bias Setting Resistor
Must be left unconnected.
CLK
56
Digital Input
AGND2
57
Analog
Clock Input
Analog Ground for AVDD2
AVDD2
58
Analog
Analog Supply for Modulator Clocking
VCAP
59
Analog
Bypass Capacitor
VREFN
60, 61
Analog
Negative Reference Voltage
VMID
62
Analog
Midpoint Voltage
VREFP
63, 64
Analog
Positive Reference Voltage
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TIMING SPECIFICATIONS
t2
t1
CLK
t2
t3
t4
DRDY
t4
t6
t5
DOUT[15:0]
Data N
Data N + 1
Data N + 2
PRODUCT PREVIEW
Figure 1. Data Retrieval Timing
CLK
RD, CS
t7
t8
DOUT[15:0]
Figure 2. DOUT Inactive/Active Timing
DRDY
t11
SYNC
t9
t10
DOUT[15:0]
Valid Data
Figure 3. Reset Timing
7
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Timing Specifications
SYMBOL
t1
1/t1
DESCRIPTION
MIN
TYP
CLK Period (1/fCLK)
TBD
16.667
fCLK
PRODUCT PREVIEW
UNITS
TBD
MHz
ns
t2
CLK Pulse Width, High or Low
t3
CLK to DRDY High (propagation delay)
10
ns
t4
DRDY Pulse Width, High or Low
4 t1
ns
t5
Previous Data Valid (hold time)
t6
New Data Valid (setup time)
t7
First Rising Edge CLK After RD and/or CS Inactive (high) to DOUT High Impedance
TBD
ns
t8
First Rising Edge CLK After RD and/or CS Active (low) to DOUT Active
TBD
ns
t9
Delay from SYNC Active (low) to All-Zero DOUT[15:0]
TBD
t10
Delay from SYNC Inactive (high) to Non-Zero DOUT[15:0]
t11
Delay from Non-Zero DOUT[15:0] to Valid DOUT[15:0]
(time − 55 DRDY cycles; required for digital filter to settle).
(1) Output load = 10pF 500kΩ.
8
60
MAX
TBD
ns
TBD
ns
TBD
ns
TBD
5.5
ns
ns
µs
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TYPICAL CHARACTERISTICS
At TA = +25°C, RBIAS = 18kΩ, AVDD = 5V, DVDD = 3V, fCLK = 60MHz, VREF = 3V, and VCM = 2.5V, unless otherwise noted.
SPECTRAL RESPONSE
0
−20
−60
−80
−100
fIN = 100kHz, −6dBFS
SNR = 86dBFS
THD = −95dB
SFDR = 97dB
−20
−40
Amplitude (dB)
−40
−60
−80
−100
−120
−120
−140
−140
−160
−160
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0
0.5
1.0
1.5
Frequency (MHz)
SPECTRAL RESPONSE
0
3.5
4.0
4.5
5.0
−60
−80
−100
fIN = 1.0MHz, −6dBFS
SNR = 86dBFS
THD = −93dB
SFDR = 94dB
−20
−40
−60
−80
−100
−120
−120
−140
−140
−160
−160
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0
0.5
1.0
1.5
Frequency (MHz)
3.0
3.5
4.0
4.5
5.0
4.0
4.5
5.0
fIN = 4.0MHz, −6dBFS
SNR = 86dBFS
SFDR = 105dB
−20
−40
Amplitude (dB)
−40
2.5
SPECTRAL RESPONSE
0
fIN = 4.0MHz, −2dBFS
SNR = 86dBFS
SFDR = 109dB
−20
2.0
Frequency (MHz)
SPECTRAL RESPONSE
0
Amplitude (dB)
3.0
SPECTRAL RESPONSE
Amplitude (dB)
Amplitude (dB)
−40
2.5
0
fIN = 1.0MHz, −2dBFS
SNR = 86dBFS
THD = −91dB
SFDR = 94dB
−20
2.0
Frequency (MHz)
PRODUCT PREVIEW
Amplitude (dB)
SPECTRAL RESPONSE
0
fIN = 100kHz, −2dBFS
SNR = 86dBFS
THD = −90dB
SFDR = 90dB
−60
−80
−100
−60
−80
−100
−120
−120
−140
−140
−160
−160
0
0.5
1.0
1.5
2.0
2.5
3.0
Frequency (MHz)
3.5
4.0
4.5
5.0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
Frequency (MHz)
9
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TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, RBIAS = 18kΩ, AVDD = 5V, DVDD = 3V, fCLK = 60MHz, VREF = 3V, and VCM = 2.5V, unless otherwise noted.
SIGNAL−TO−NOISE RATIO,
TOTAL HARMONIC DISTORTION, AND
SPURIOUS−FREE DYNAMIC RANGE vs INPUT
SIGNAL AMPLITUDE
100
SNR, THD, SFDR (dB)
90
SFDR
80
THD
70
60
SNR
50
40
30
20
fIN = 100kHz
PRODUCT PREVIEW
10
−70
−60
−50
−40
−30
Input Signal (dB)
10
−20
−10
0
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The ADS1610 is a high-performance, delta-sigma ADC.
The modulator uses an inherently stable, pipelined,
delta-sigma modulator architecture incorporating proprietary circuitry that allows for very linear high-speed
operation. The modulator samples the input signal at
60MSPS (when fCLK = 60MHz). A low-ripple linear phase
digital filter decimates the modulator output by 6 to provide
data output word rates of 10MSPS with a signal passband
out to 4.9MHz. The double speed mode, enabled by digital
I/O pin 2xMODE, doubles the data rate to 20MSPS by
reducing the oversampling ratio to 3. See the 2x Mode
section on page 19 for more detail.
Conceptually, the modulator and digital filter measure the
differential input signal, VIN = (AINP − AINN), against the
differential reference, VREF = (VREFP − VREFN), as
shown in Figure 4. A 16-bit parallel data bus, designed for
direct connection to DSPs, outputs the data. A separate
power supply for the I/O allows flexibility for interfacing to
different logic families. Out-of-range conditions are
indicated with a dedicated digital output pin. Analog power
dissipation is controlled using an external resistor. This
allows reduced dissipation when operating at slower
speeds. When not in use, power consumption can be
dramatically reduced using the PD pin.
The ADS1610 supports a very wide range of input signals.
Having such a wide input range makes out-of-range
signals unlikely. However, should an out-of-range signal
occur, the digital output OTR will go high.
To achieve the highest analog performance, it is
recommended that the inputs be limited to 0.891VREF
(−1dBFS). For VREF = 3V, the corresponding
recommended input range is ±2.67.
The analog inputs must be driven with a differential signal
to achieve optimum performance. The recommended
common-mode
voltage
of
the
input
signal,
V CM + AINP ) AINN
2
, is 2.5V.
In addition to the differential and common-mode input
voltages, the absolute input voltage is also important. This
is the voltage on either input (AINP or AINN) with respect
to AGND. The range for this voltage is:
−0.1V t (AINN or AINP) t 4.2V
(1)
If either input is taken below −0.1V, ESD protection diodes
on the inputs will turn on. Exceeding 4.2V on either input
will result in linearity performance degradation. ESD
protection diodes will also turn on if the inputs are taken
above AVDD (+5V).
ANALOG INPUTS (AINP, AINN)
The ADS1610 measures the differential signal,
VIN = (AINP − AINN), against the differential reference,
VREF = (VREFP − VREFN).
VREFP VREFN
Σ
VREF
OTR
AINP
AINN
Σ
VIN
Σ∆
Modulator
Digital
Filter
Parallel
Interface
DOUT[15:0]
2xMODE
Figure 4. Conceptual Block Diagram
11
PRODUCT PREVIEW
OVERVIEW
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INPUT CIRCUITRY
The ADS1610 uses switched-capacitor circuitry to
measure the input voltage. Internal capacitors are charged
by the inputs and then discharged internally with this cycle
repeating at the frequency of CLK. Figure 5 shows a
conceptual diagram of these circuits. Switches S2
represent the net effect of the modulator circuitry in
discharging the sampling capacitors, the actual
implementation is different. The timing for switches S1 and
S2 is shown in Figure 6.
ADS1610
S1
AINP
S2
10pF
8pF
PRODUCT PREVIEW
VMID
S1
AINN
S2
10pF
8pF
Figure 7 and Figure 8 show the recommended circuits
when using single-ended or differential op amps,
respectively. The analog inputs must be driven
differentially to achieve optimum performance. If only a
single-ended input signal is available, the configuration in
Figure 8 can be used by shorting −VIN to ground.
This configuration would implement the single-ended to
differential conversion.
The external capacitors, between the inputs and from each
input to AGND, improve linearity and should be placed as
close to the pins as possible. Place the drivers close to the
inputs and use good capacitor bypass techniques on their
supplies; usually a smaller high-quality ceramic capacitor
in parallel with a larger capacitor. Keep the resistances
used in the driver circuits low-thermal noise in the driver
circuits degrades the overall noise performance. When the
signal can be AC-coupled to the ADS1610 inputs, a simple
RC filter can set the input common mode voltage. The
ADS1610 is a high-speed, high-performance ADC.
Special care must be taken when selecting the test
equipment and setup used with this device. Pay particular
attention to the signal sources to ensure they do not limit
performance when measuring the ADS1610.
VMID
AGND
392 Ω
Figure 5. Conceptual Diagram of Internal
Circuitry Connected to the Analog Inputs
−
V IN
40pF
392 Ω
O P A 2 8 22
2
0.01 µ F
t SAMPLE = 1/f CLK
On
392Ω
V CM(1)
S1
1µ F
1kΩ
(2)
392Ω
S2
V IN
392 Ω
40pF
Figure 6. Timing for the Switches in Figure 2
392Ω
O P A 2 8 22
A D S 1 6 10
(2)
1kΩ
2
0.01 µ F
V CM(1)
DRIVING THE INPUTS
100pF (3)
V CM(1)
On
Off
AINP
(2)
100pF
392 Ω
Off
49.9Ω
49.9Ω
AINN
(2)
100pF
392Ω
1µ F
AGND
The external circuits driving the ADS1610 inputs must be
able to handle the load presented by the switching
capacitors within the ADS1610. The input switches S1 in
Figure 5 are closed approximately one half of the sampling
period, tSAMPLE, allowing only ∼8ns for the internal
capacitors to be charged by the inputs, when
fCLK = 60MHz.
12
(1) Recommended VCM = 2.5V.
(2) Optional ac−coupling circuit provides common−mode input voltage.
(3) Increase to 390pF when fIN ≤ 100kHz for improved SNR and THD.
Figure 7. Recommended Driver Circuit Using the
OPA2822
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SBAS344A − AUGUST 2005 − REVISED SEPTEMBER 2005
22pF
787Ω
374Ω
12.5Ω
AINP
VIN
56.2Ω
100pF
VCM
100pF
THS4503
ADS1610
12.5Ω
AINN
402Ω
100pF
787Ω
22pF
REFERENCE INPUTS (VREFN, VREFP, VMID)
The ADS1610 operates from an external voltage
reference. The reference voltage VREF is set by the
differential voltage between VREFN and VREFP:
VREF = (VREFP − VREFN). VREFP and VREFN each
use two pins, which should be shorted together. VMID
equals approximately 2.5V and is used by the modulator.
VCAP connects to an internal node and must also be
bypassed with an external capacitor.
The voltages applied to these pins must be within the
values specified in the Electrical Characteristics table.
Typically VREFP = 4V, VMID = 2.5V, and VREFN = 1V.
The external circuitry must be capable of providing both a
DC and a transient current. Figure 9 shows a simplified
diagram of the internal circuitry of the reference. As with
the input circuitry, switches S1 and S2 open and close as
shown in Figure 6.
Figure 10 shows the recommended circuitry for driving
these reference inputs. Keep the resistances used in the
buffer circuits low to prevent excessive thermal noise from
degrading performance. Layout of these circuits is critical,
make sure to follow good high-speed layout practices.
Place the buffers and especially the bypass capacitors as
close to the pins as possible.
392Ω
0.001µF
ADS1610
VREFP
VREFP
OPA2822
10µF
4V
0.1µF
392Ω
0.1µF
0.001µF
22µF
22µF
VMID
OPA2822
10µF
2.5V
0.1µF
392Ω
ADS1610
0.001µF
22µF
S1
VREFP
VREFP
S2
300Ω
VREFN
VREFN
50pF
VREFN
VREFN
OPA2822
1V
10µF
0.1µF
S1
VCAP
0.1µF
AGND
Figure 9. Conceptual Circuitry for the Reference
Inputs
Figure 10. Recommended Reference Buffer
Circuit
13
PRODUCT PREVIEW
Figure 8. Recommended Single-Ended to Differential Conversion Circuit Using the THS4503 Differential
Amplifier
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SBAS344A − AUGUST 2005 − REVISED SEPTEMBER 2005
Table 2. Output Code Versus Input Signal
CLOCK INPUT (CLK)
The ADS1610 uses an external clock signal to be applied
to the CLK input pin. The sampling of the modulator is
controlled by this clock signal. As with any high-speed data
converter, a high quality clock is essential for optimum
performance. Crystal clock oscillators are the
recommended CLK source; other sources, such as
frequency synthesizers are usually not adequate. Make
sure to avoid excess ringing on the CLK input; keeping the
trace as short as possible will help.
PRODUCT PREVIEW
Measuring high-frequency, large-amplitude signals
requires tight control of clock jitter. The uncertainty during
sampling of the input from clock jitter limits the maximum
achievable SNR. This effect becomes more pronounced
with higher frequency and larger magnitude inputs.
Fortunately, the ADS1610 oversampling topology reduces
clock jitter sensitivity over that of Nyquist rate converters
like pipeline and successive approximation converters by
a factor of √6.
In order to not limit the ADS1610 SNR performance, keep
the jitter on the clock source below the values shown in
Table 1. When measuring lower frequency and lower
amplitude inputs, more CLK jitter can be tolerated. In
determining the allowable clock source jitter, select the
worst-case input (highest frequency, largest amplitude)
that will be seen in the application.
DATA FORMAT
The 16-bit output data is in binary two’s complement
format, as shown in Table 2. When the input is positive
out-of-range, exceeding the positive full-scale value of
VREF, the output clips to all 7FFFH and the OTR output goes
high.
Table 1. Maximum Allowable Clock Source Jitter
for Different Input Signal Frequencies and
Amplitude
MAXIMUM
AMPLITUDE
MAXIMUM
ALLOWABLE
CLOCK SOURCE
JITTER
4MHz
−1dB
1.6ps
4MHz
−20dB
14ps
2MHz
−1dB
3.3ps
2MHz
−20dB
29ps
1MHz
−1dB
6.5ps
58ps
INPUT SIGNAL
MAXIMUM
FREQUENCY
14
1MHz
−20dB
100kHz
−1dB
65ps
100kHz
−20dB
581ps
INPUT SIGNAL
(INP – INN)
IDEAL OUTPUT
CODE(1)
OTR
≥ +VREF (> 0dB)
7FFFH
1
VREF (0dB)
7FFFH
0
)V REF
0001H
0
2 15 * 1
0
0000H
0
−V REF
FFFFH
0
8000H
0
8000H
1
2 15 * 1
ǒ2 2 * 1 Ǔ
15
−V REF
15
ǒ2 2 * 1 Ǔ
v −V REF
15
15
(1) Excludes effects of noise, INL, offset and gain errors.
Likewise, when the input is negative out-of-range by going
below the negative full-scale value of VREF, the output clips
to 8000h and the OTR output goes high. The OTR remains
high while the input signal is out-of-range.
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OUT-OF-RANGE INDICATION (OTR)
If the output code on DOUT[15:0] exceeds the positive or
negative full-scale, the out-of-range digital output (OTR)
will go high on the falling edge of DRDY. When the output
code returns within the full-scale range, OTR returns low
on the falling edge of DRDY.
DRDY
outputs
updating
simultaneously.
After
synchronization, allow 55 DRDY cycles (t12) for output
data to fully settle.
DATA RETRIEVAL
ADS16101
Data retrieval is controlled through a simple parallel
interface. The falling edge of the DRDY output indicates
new data is available. To activate the output bus, both CS
and RD must be low, as shown in Table 3. Make sure the
DOUT bus does not drive heavy loads (> 20pF), as this will
degrade performance. Use an external buffer when driving
an edge connector or cables.
SYNC
SYNC
Clock
CLK
DRDY
DOUT[15:0]
DRDY1
DOUT[15:0]1
ADS16102
SYNC
CLK
DRDY
DOUT[15:0]
DRDY2
DOUT[15:0]2
CS
RD
DOUT[15:0]
0
0
Active
0
1
High impedance
1
0
High impedance
1
1
High impedance
PRODUCT PREVIEW
Table 3. Truth Table for CS and RD
CLK
SYNC
t12
DRDY1
RESETTING THE ADS1610
The ADS1610 is asynchronously reset when the SYNC
pin is taken low. During reset, all of the digital circuits are
cleared, DOUT[15:0] are forced low, and DRDY forced
high. It is recommended that the SYNC pin be released on
the falling edge of CLK. Afterwards, DRDY goes low on the
second rising edge of CLK. Allow 55 DRDY cycles for the
digital filter to settle before retrieving data. See Figure 3 for
the timing specifications.
Reset can be used to synchronize multiple ADS1610s. All
devices to be synchronized must use a common CLK
input. With the CLK inputs running, pulse SYNC on the
falling edge of CLK, as shown in Figure 11. Afterwards, the
converters will be converting synchronously with the
Settled
Data
DOUT[15:0]1
DRDY2
Settled
Data
DOUT[15:0]2
Synchronized
Figure 11. Synchronizing Multiple Converters
15
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SETTLING TIME
Be sure to allow the filter time to settle after applying a large
step in the input signal, switching the channel on a
multiplexer placed in front of the inputs, resetting the
ADS1610, or exiting the power-down mode.
1.0
0.8
Normalized Response
The settling time is an important consideration when
measuring signals with large steps or when using a
multiplexer in front of the analog inputs. The ADS1610
digital filter requires time for an instantaneous change in
signal level to propagate to the output.
0.6
0.4
0.2
0
−0.2
Figure 12 shows the settling error as a function of time for
a full-scale signal step applied at t = 0, with 2xMODE = low.
This figure uses DRDY cycles for the ADS1610 for the time
scale (X-axis). After 55 DRDY cycles, the settling error
drops below 0.001%. For fCLK = 60MHz, this corresponds
to a settling time of 5.5µs.
−0.4
0
10
20
30
40
50
60
Time (DRDY cycles)
Figure 13. Impulse Response
PRODUCT PREVIEW
FREQUENCY RESPONSE
101
The linear phase FIR digital filter sets the overall frequency
response. The decimation rate is set to 6 (2xMODE = low)
for all the figures shown in this section. Figure 14 shows
the frequency response from DC to 30MHz for
fCLK = 60MHz. The frequency response of the ADS1610
filter scales directly with CLK frequency. For example, if
the CLK frequency is decreased by half (to 30MHz), the
values on the X-axis in Figure 14 would need to be scaled
by half, with the span becoming DC to 15MHz.
Settling Error (%)
100
10−1
10−2
10−3
10−4
10−5
30
35
40
45
50
55
60
0
Settling Time (DRDY cycles)
−20
IMPULSE RESPONSE
Figure 13 plots the normalized response for an input
applied at t = 0, with 2xMODE = low. The X-axis units of
time are DRDY cycles for the ADS1610. As shown in
Figure 13, the peak of the impulse takes 30 DRDY cycles
to propagate to the output. For fCLK = 60MHz, a DRDY
cycle is 0.1µs in duration and the propagation time (or
group delay) is 30 × 0.1µs = 3.0µs.
Magnitude (dB)
Figure 12. Settling Time
−40
−60
−80
−100
−120
0
5
10
15
20
25
Frequency (MHz)
Figure 14. Frequency Response
16
30
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Figure 15 shows the passband ripple from DC to 4.4MHz
(fCLK = 60MHz). Figure 16 shows a closer view of the
passband transition by plotting the response from 4.0MHz
to 5.0MHz (fCLK = 60MHz).
−20
Magnitude (dB)
0.00020
0.00015
0.00010
Magnitude (dB)
0
−40
−60
−80
−100
0.00005
−120
0
0
−0.00005
20
40
60
80
100
120
140
160
180
Frequency (MHz)
−0.00010
Figure 17. Frequency Response Out to 120MHz
−0.00015
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
An external resistor connected between the RBIAS pin
and the analog ground sets the analog current level, as
shown in Figure 18. The current is inversely proportional
to the resistor value. Table 4 shows the recommended
values of RBIAS for different CLK frequencies. Notice that
the analog current can be reduced when using a slower
frequency CLK input because the modulator has more
time to settle. Avoid adding any capacitance in parallel to
RBIAS, since this will interfere with the internal circuitry
used to set the biasing.
Frequency (MHz)
Figure 15. Passband Ripple
0
−1
Magnitude (dB)
ANALOG POWER DISSIPATION
−2
−3
−4
−5
ADS1610
−6
RBIAS
−7
4.0
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
4.9
5.0
RBIAS
Frequency (MHz)
Figure 16. Passband Transition
AGND
The overall frequency response repeats at multiples of the
CLK frequency. To help illustrate this, Figure 17 shows the
response out to 180MHz (fCLK = 60MHz). Notice how the
passband response repeats at 60MHz, 120MHz, and
180MHz; it is important to consider this sequence when
there is high-frequency noise present with the signal. The
modulator bandwidth extends to 100MHz. High-frequency
noise around 60MHz and 120MHz will not be attenuated
by either the modulator or the digital filter. This noise will
alias back in; band and reduce the overall SNR
performance unless it is filtered out prior to the ADS1610.
To prevent this, place an anti-alias filter in front of the
ADS1610 that rolls off before 55MHz.
Figure 18. External Resistor Used to Set Analog
Power Dissipation
Table 4. Recommended RBIAS Resistor Values
for Different CLK Frequencies
fCLK
DATA
RATE
RBIAS
TYPICAL POWER
DISSIPATION
42MHz
7MHz
TBD
TBD
48MHz
8MHz
TBD
TBD
54MHz
9MHz
TBD
TBD
60MHz
10MHz
18kΩ
960mW
17
PRODUCT PREVIEW
−0.00020
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SBAS344A − AUGUST 2005 − REVISED SEPTEMBER 2005
POWER-DOWN (PD)
POWER SUPPLIES
When not in use, the ADS1610 can be powered down by
taking the PD pin low. All circuitry will be shutdown,
including the voltage reference. To minimize the digital
current during power down, stop the clock signal supplied
to the CLK input. There is an internal pull-up resistor of
170kΩ on the PD pin, but it is recommended that this pin
be connected to DVDD if not used. Make sure to allow time
for the reference to start up after exiting the power-down
mode. The internal reference typically requires 15µs. After
the reference has stabilized, allow at least 100 DRDY
cycles for the modulator and digital filter to settle before
retrieving data.
Two supplies are used on the ADS1610: analog (AVDD),
and digital (DVDD). Each supply (other than DVDD pins 49
and 50) must be suitably bypassed to achieve the best
performance. It is recommended that a 1µF and 0.1µF
ceramic capacitor be placed as close to each supply pin as
possible. Connect each supply-pin bypass capacitor to the
associated ground, as shown in Figure 19. Each main
supply bus should also be bypassed with a bank of
capacitors from 47µF to 0.1µF, as shown in Figure 19.
For optimum performance, insert 10Ω at resistors in series
with the AVDD2 supply (pin 58). This is the supply for the
modulator clocking circuitry, and the resistor decouples
switching glitches.
47µF
4.7µF
1µF
0.1µF
CP(1)
CP(1)
10Ω
CP(1)
AGND
6
AGND
7
AVDD
9
AGND
52
51
50
49
DGND(2)
3
53
DVDD(2)
AVDD
54
DGND
2
55
DVDD
AGND
57
DVDD
1
58
DGND
0.1µF
1µF
AGND
4.7µF
AGND2
47µF
AVDD2
AVDD
C P(1)
If using separate analog and
digital ground planes, connect
together on the ADS1610 PCB.
C P(1)
DGND
AGND
ADS1610
C P(1)
10 AVDD
11 AGND
DGND
DVDD
12 AVDD
DGND
C P(1)
DVDD
PRODUCT PREVIEW
DVDD
18
19
25
26
CP (1)
CP (1)
NOTES: (1) CP = 1µF   0.1µF. (2) Bypass
capacitors not required at pins 49 and 50.
Figure 19. Recommended Power-Supply Bypassing
18
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The 2xMODE digital input determines the performance
(16-bit or 14-bit) by setting the oversampling ratio. When
2xMODE = low, the oversampling ratio = 6 for 16-bit
performance. When 2xMODE = high, the oversampling
ratio = 3 for 14-bit performance. Note that when 2xMODE
is high, all 16 bits of DOUT remain active. Decreasing the
oversampling ratio from 8 to 3 doubles the data rate in 2x
mode. For fCLK = 60MHz, the data rate then becomes
20MSPS. In addition, the group delay decreases to 0.9µs
and the settling time becomes 1.3µs or 13 DRDY cycles.
With the reduced oversampling in 2x mode, the noise
increases. Typical SNR performance degrades by 14dB.
THD remains approximately the same. There is an internal
pull-down resistor of 170kΩ on the 2xMODE; however, it
is recommended that this pin be forced either high or low.
Table 5.
LAYOUT ISSUES
The ADS1610 is a very high-speed, high-resolution data
converter. In order to achieve the maximum performance,
careful attention must be given to the printed circuit board
(PCB) layout. Use good high-speed techniques for all
circuitry. Critical capacitors should be placed close to pins
as possible. These include capacitors directly connected
to the analog and reference inputs and the power supplies.
Make sure to also properly bypass all circuitry driving the
inputs and references.
Two approaches can be used for the ground planes: either
a single common plane; or two separate planes, one for the
analog grounds and one for the digital grounds. When
using only one common plane, isolate the flow of current
on AGND2 (pin 57) from pin 1; use breaks on the ground
plane to accomplish this. AGND2 carries the switching
current from the analog clocking for the modulator and can
corrupt the quiet analog ground on pin 1. When using two
planes, it is recommended that they be tied together right
at the PCB. Do not try to connect the ground planes
together after running separately through edge connectors
or cables as this reduces performance and increases the
likelihood of latch-up.
In general, keep the resistances used in the driving circuits
for the inputs and reference low to prevent excess thermal
noise from degrading overall performance. Avoid having
the ADS1610 digital outputs drive heavy loads. Buffers on
the outputs are recommended unless the ADS1610 is
connected directly to a DSP or controller situated nearby.
Additionally, make sure the digital inputs are driven with
clean signals as ringing on the inputs can introduce noise.
The ADS1610 uses TI PowerPAD technology. The
PowerPAD is physically connected to the substrate of the
silicon inside the package and must be soldered to the
analog ground plane on the PCB using the exposed metal
pad underneath the package for proper heat dissipation.
Please refer to application report SLMA002, located at
www.ti.com, for more details on the PowerPAD package.
19
PRODUCT PREVIEW
2X MODE
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APPLICATIONS INFORMATION
INTERFACING THE ADS1610 TO THE
TMS320C6000
Figure 20 illustrates how to directly connect the ADS1610
to the TMS320C6000 DSP. The processor controls
reading using output ARE. The ADS1610 is selected using
the DSP control output, CE2. The ADS1610 16-bit data
output bus is directly connected to the TMS320C6000 data
bus. The data ready output (DRDY) from the ADS1610
drives interrupt EXT_INT7 on the TMS320C6000.
ADS1610
16
DOUT[15:0]
PRODUCT PREVIEW
DRDY
CS
TMS320C6000
XD[15:0]
EXT_INT7
CE2
INTERFACING THE ADS1610 TO THE
TMS320C5400
Figure 21 illustrates how to connect the ADS1610 to the
TMS320C5400 DSP. The processor controls the reading
using the outputs R/W and IS. The I/O space-select signal
(IS) is optional and is used to prevent the ADS1610 RD
input from being strobed when the DSP is accessing other
external memory spaces (address or data). This can help
reduce the possibility of digital noise coupling into the
ADS1610. When not using this signal, replace NAND gate
U1 with an inverter between R/W and RD. Two signals,
IOSTRB and A15, combine using NAND gate U2 to select
the ADS1610. If there are no additional devices connected
to the TMS320C5400 I/O space, U2 can be eliminated.
Simply connect IOSTRB directly to CS. The ADS1610
16-bit data output bus is directly connected to the
TMS320C5400 data bus. The data ready output (DRDY)
from the ADS1610 drives interrupt INT3 on the
TMS320C5400.
ADS1610
16
DOUT[15:0]
RD
TMS320C5400
D[15:0]
ARE
DRDY
Figure 20. ADS1610—TMS320C6000 Interface
Connection
INT3
CS
U2
RD
U1
IOSTRB
A15
R/W
IS
Figure 21. ADS1610—TMS320C5400 Interface
Connection
Code Composer Studio, available from TI, provides
support for interfacing TI DSPs through a collection of data
converter plug-ins. Check the TI website, located at
www.ti.com/sc/dcplug-in, for the latest information on
ADS1610 support.
20
PACKAGE OPTION ADDENDUM
www.ti.com
2-Sep-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
ADS1610IPAPR
PREVIEW
HTQFP
PAP
64
TBD
Call TI
Call TI
ADS1610IPAPT
PREVIEW
HTQFP
PAP
64
TBD
Call TI
Call TI
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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