DRV8837 www.ti.com SLVSBA4A – JUNE 2012 – REVISED AUGUST 2012 LOW-VOLTAGE H-BRIDGE IC Check for Samples: DRV8837 FEATURES DESCRIPTION • The DRV8837 provides an integrated motor-driver solution for cameras, consumer products, toys, and other low-voltage or battery-powered motion-control applications. The device has one H-bridge driver, and can drive one dc motor or one winding of a stepper motor, as well as other devices like solenoids. The output driver block consists of N-channel power MOSFETs configured as an H-bridge to drive the motor winding. An internal charge pump generates needed gate-drive voltages. 1 2 • • • • • • • H-Bridge Motor Driver – Drives a DC Motor or One Winding of a Stepper Motor or Other Loads – Low MOSFET On-Resistance: HS + LS 280 mΩ 1.8-A Maximum Drive Current 1.8-V to 11-V Motor-Operating Supply-Voltage Range Separate Motor and Logic Supply Pins PWM (IN/IN) Interface Low-Power Sleep Mode With 120-nA Maximum Combined Supply Current Dedicated SLEEP Pin 2-mm × 2-mm 8-Pin WSON Package APPLICATIONS • • • • • • Cameras DSLR Lenses Consumer Products Toys Robotics Medical Devices The DRV8837 can supply up to 1.8 A of output current. It operates on a motor power-supply voltage from 1.8 V to 11 V, and a device power-supply voltage of 1.8 V to 7 V. The DRV8837 has a PWM (IN/IN) input interface, which is compatible with industry-standard devices. There are internal shutdown functions for overcurrent protection, short-circuit protection, undervoltage lockout and overtemperature. The DRV8837 package is an 8-pin 2-mm × 2-mm WSON PowerPAD™ package. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2012, Texas Instruments Incorporated DRV8837 SLVSBA4A – JUNE 2012 – REVISED AUGUST 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION (1) (1) ORDERABLE PART NUMBER PACKAGE TOPSIDE MARKING SHIPPING DRV8837DSGR WSON – DSG 837 Reel of 3000 DRV8837DSGT WSON – DSG 837 Reel of 250 For the most-current packaging and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com. FUNCTIONAL BLOCK DIAGRAM 1.8 to 11 V VM VM VM Drives DC Motor or ½ Stepper Gate Drive Charge Pump OCP OUT1 1.8 to 7 V Step Motor VCC DCM VM VCC Logic Gate Drive OCP OUT2 IN1 IN2 OverTemp Osc SLEEP GND B0479-01 Figure 1. Functional Block Diagram 2 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: DRV8837 DRV8837 www.ti.com SLVSBA4A – JUNE 2012 – REVISED AUGUST 2012 DRV8837 DSG Package (Top View) VM 1 OUT1 2 OUT2 3 GND 4 Thermal Pad (GND) 8 VCC 7 SLEEP 6 IN1 5 IN2 P0145-01 PIN DESCRIPTIONS PIN NAME NO. I/O DESCRIPTION EXTERNAL COMPONENTS OR CONNECTIONS Power and Ground GND 4 – Device ground VCC 8 – Device supply Bypass to GND with a 0.1-μF 6.3-V ceramic capacitor. VM 1 – Motor supply Bypass to GND with a 0.1-μF 16-V ceramic capacitor. IN1 6 I Input 1 Logic-high sets OUT1 high Internal pulldown resistor IN2 5 I Input 2 Logic-high sets OUT2 high Internal pulldown resistor SLEEP 7 I Sleep mode input Logic-low puts device in low-power sleep mode Logic-high for normal operation Internal pulldown resistor OUT1 2 O Output 1 OUT2 3 O Output 2 Control Output Connect to motor winding ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) (2) VALUE UNIT VM Power supply voltage range –0.3 to 12 V VCC Power supply voltage range –0.3 V to 7 V Digital pin voltage range –0.5 V to 7 V Peak motor drive output current Internally limited A TJ Operating virtual junction temperature range –40 to 150 ºC Tstg Storage temperature range –60 to 150 ºC (1) (2) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to network ground terminal. Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: DRV8837 3 DRV8837 SLVSBA4A – JUNE 2012 – REVISED AUGUST 2012 www.ti.com THERMAL INFORMATION DRV8837 THERMAL METRIC (1) DSG UNIT 8 PINS Junction-to-ambient thermal resistance (2) θJA (3) 60.9 °C/W θJCtop Junction-to-case (top) thermal resistance 71.4 °C/W θJB Junction-to-board thermal resistance (4) 32.2 °C/W ψJT Junction-to-top characterization parameter (5) 1.6 °C/W 32.8 °C/W 9.8 °C/W (6) ψJB Junction-to-board characterization parameter θJCbot Junction-to-case (bottom) thermal resistance (7) (1) (2) (3) (4) (5) (6) (7) 4 For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDECstandard test exists, but a close description can be found in the ANSI SEMI standard G30-88. The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8. The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7). The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7). The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. Spacer Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: DRV8837 DRV8837 www.ti.com SLVSBA4A – JUNE 2012 – REVISED AUGUST 2012 RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VCC Device power supply voltage range 1.8 7 V VM Motor power-supply voltage range 1.8 11 V IOUT H-bridge output current (1) 0 1.8 A fPWM Externally applied PWM frequency 0 250 kHz VIN Logic-level input voltage 0 5.5 V TYP MAX UNIT VM = 5 V, VCC = 3 V, no PWM 40 100 µA VM = 5 V, VCC = 3 V, 50-kHz PWM 0.8 1.5 mA (1) Power dissipation and thermal limits must be observed. ELECTRICAL CHARACTERISTICS TA = 25°C, VM = 5 V, VCC = 3 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN Power Supplies IVM VM operating supply current IVMQ VM sleep-mode supply current IVCC VCC operating supply current IVCQ VCC sleep-mode supply current VUVLO VCC undervoltage lockout voltage VM = 5 V, VCC = 3 V, SLEEP = 0 V 30 95 nA VM = 5 V, VCC = 3 V, no PWM 300 500 µA VM = 5 V, VCC = 3 V, 50-kHz PWM 0.7 1.5 mA VM = 5 V, VCC = 3 V, SLEEP = 0 V 5 25 nA VCC rising 1.8 VCC falling 1.7 V Logic-Level Inputs VIL Input low voltage VIH Input high voltage 0.25 VCC 0.38 VCC 0.46 VCC VHYS Input hysteresis 0.08 VCC IIL Input low current VIN = 0 V IIH Input high current VIN = 3.3 V RPD Pulldown resistance V 0.5 VCC V V –5 5 µA 50 µA 100 kΩ H-Bridge FETs rds(on) HS + LS FET on-resistance VCC = 3 V, VM = 5 V, IO = 800 mA, TJ = 25°C IOFF Off-state leakage current VOUT = 0 V 280 330 mΩ ±200 nA Protection Circuits IOCP Overcurrent protection trip level tOCR OCP retry time tTSD Thermal shutdown temperature 1.9 3.5 1 Die temperature 150 A ms 160 180 ºC TIMING REQUIREMENTS TA = 25°C, VM = 5 V, VCC = 3 V, RL = 20 Ω MIN MAX UNIT 1 t1 Output enable time 120 ns 2 t2 Output disable time 120 ns 3 t3 Delay time, INx high to OUTx high 120 ns 4 t4 Delay time, INx low to OUTx low 120 ns 5 t5 Output rise time 50 150 ns 6 t6 Output fall time 50 150 ns Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: DRV8837 5 DRV8837 SLVSBA4A – JUNE 2012 – REVISED AUGUST 2012 www.ti.com IN1 IN2 t1 t2 t4 Z OUT1 Z t3 OUT2 Z Z DRV8837 80% 80% OUTx 20% 20% t5 t6 T0542-01 Figure 2. Input/Output Timing FUNCTIONAL DESCRIPTION Bridge Control The DRV8837 is controlled using a PWM input interface, also called an IN/IN interface. Each output is controlled by a corresponding input pin. The following table shows the logic for the DRV8837: IN1 IN2 OUT1 OUT2 0 0 Z Z Function (DC Motor) Coast 0 1 L H Reverse 1 0 H L Forward 1 1 L L Brake Sleep Mode If the nSLEEP pin is brought to a logic-low state, the DRV8837 enters a low-power sleep mode. In this state, all unnecessary internal circuitry is powered down. Power Supplies and Input Pins The input pins may be driven within their recommended operating conditions with or without the VCC and/or VM power supplies present. No leakage current path exists to the supply. There is a weak pulldown resistor (approximately 100 kΩ) to ground on each input pin. 6 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: DRV8837 DRV8837 www.ti.com SLVSBA4A – JUNE 2012 – REVISED AUGUST 2012 VCC and VM may be applied and removed in any order. When VCC is removed, the device enters a low-power state and draws very little current from VM. If the supply voltage is between 1.8 V and 7 V, VCC and VM may be connected together. Protection Circuits The DRV8837 is fully protected against undervoltage, overcurrent, and overtemperature events. OVERCURRENT PROTECTION (OCP) An analog current limit circuit on each FET limits the current through the FET by removing the gate drive. If this analog current limit persists for longer than the OCP time, all FETs in the H-bridge are disabled. After approximately 1 ms, the bridge is re-enabled automatically. Overcurrent conditions on both high- and low-side devices, that is, a short to ground, supply, or across the motor winding all result in an overcurrent shutdown. THERMAL SHUTDOWN (TSD) If the die temperature exceeds safe limits, all FETs in the H-bridge are disabled. Once the die temperature has fallen to a safe level, operation automatically resumes. UNDERVOLTAGE LOCKOUT (UVLO) If at any time the voltage on the VCC pin falls below the undervoltage lockout threshold voltage, all circuitry in the device is disabled and internal logic is reset. Operation resumes when VCC rises above the UVLO threshold. THERMAL INFORMATION Thermal Protection The DRV8837 has thermal shutdown (TSD) as described in the Protection Circuits section. If the die temperature exceeds approximately 150°C, the device is disabled until the temperature drops to a safe level. Any tendency of the device to enter thermal shutdown is an indication of either excessive power dissipation, insufficient heatsinking, or too high an ambient temperature. Power Dissipation Power dissipation in the DRV8837 is dominated by the power dissipated in the output FET resistance, or rDS(on). Average power dissipation can be roughly estimated by: PTOT = r DS(on) ´ (IOUT(RMS) )2 (1) where PTOT is the total power dissipation, rDS(on) is the resistance of the HS plus LS FETs, and IOUT(RMS) is the rms or dc output current being supplied to the load. The maximum amount of power that can be dissipated in the device is dependent on ambient temperature and heatsinking. Note that rDS(on) increases with temperature, so as the device heats, the power dissipation increases. Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: DRV8837 7 PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) DRV8837DSGR ACTIVE WSON DSG 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 837 DRV8837DSGT ACTIVE WSON DSG 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 837 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 Samples PACKAGE MATERIALS INFORMATION www.ti.com 20-Jun-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DRV8837DSGR WSON DSG 8 3000 330.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2 DRV8837DSGT WSON DSG 8 250 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 20-Jun-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DRV8837DSGR WSON DSG 8 3000 367.0 367.0 35.0 DRV8837DSGT WSON DSG 8 250 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated