DYNEX TK12

TK12
TK12
Phase Control Thyristor
Advance Information
Replaces January 2000 version, DS4252-4.0
DS4252-5.0 July 2001
FEATURES
KEY PARAMETERS
■ High Surge Capability
VDRM
2000V
IT(AV)
75A
ITSM
1400A
dVdt*
200V/µs
dI/dt
500A/µs
APPLICATIONS
■ High Power Drives
■ High Voltage Power Supplies
■ DC Motor Control
*Higher dV/dt selections available
■ Welding
■ Battery Chargers
VOLTAGE RATINGS
Type Number
TK12 20 M or K
TK12 18 M or K
TK12 16 M or K
TK12 14 M or K
Repetitive Peak
Voltages
VDRM VRRM
V
Conditions
2000
1800
1600
1400
Tvj = 0˚ to 125˚C,
IDRM = IRRM = 100mA,
VDRM, VRRM tp = 10ms,
VDSM & VRSM =
VDRM & VRRM + 100V
Respectively
Lower voltage grades available.
ORDERING INFORMATION
When ordering, select the required part number shown in the
Voltage Ratings selection table, then:-
Outline type code: TO94.
See Package Details for further information.
Fig. 1 Package outline
Add K to type number for 1/2" 20 UNF thread, e.g. TK12 18K.
or
Add M to type number for M12 thread, e.g. TK12 14M.
Note: Please use the complete part number when ordering and
quote this number in any future correspondance relating to your
order.
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TK12
CURRENT RATINGS
Tcase = 60˚C unless stated otherwise.
Symbol
Parameter
Conditions
Half wave resistive load
Max.
Units
104
A
IT(AV)
Mean on-state current
IT(RMS)
RMS value
-
163
A
Continuous (direct) on-state current
-
139
A
Conditions
Max.
Units
75
A
IT
Tcase = 80˚C unless stated otherwise.
Symbol
Parameter
Half wave resistive load
IT(AV)
Mean on-state current
IT(RMS)
RMS value
-
120
A
Continuous (direct) on-state current
-
100
A
IT
SURGE RATINGS
Parameter
Symbol
ITSM
I2t
ITSM
I2t
Surge (non-repetitive) on-state current
I2t for fusing
Surge (non-repetitive) on-state current
Conditions
Max.
Units
10ms half sine; Tcase = 125oC
1.12
kA
VR = 50% VRRM - 1/4 sine
6.2 x 103
A2s
10ms half sine; Tcase = 125oC
1.4
kA
VR = 0
9.8 x 103
A2s
I2t for fusing
THERMAL AND MECHANICAL DATA
Symbol
Conditions
Parameter
Min.
Max.
Units
Rth(j-c)
Thermal resistance - junction to case
dc
-
0.24
o
Rth(c-h)
Thermal resistance - case to heatsink
Mounting torque 15.0Nm
with mounting compound
-
0.08
o
On-state (conducting)
-
125
o
Reverse (blocking)
-
125
o
Storage temperature range
–40
150
o
Mounting torque
12.0
15.0
Tvj
Tstg
-
C/W
C/W
C
Virtual junction temperature
C
C
Nm
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TK12
DYNAMIC CHARACTERISTICS
Symbol
Parameter
Conditions
Min.
Max.
Units
Maximum on-state voltage
At 150A peak, Tcase = 25oC
-
2.0
V
Peak reverse and off-state current
At VRRM/VDRM, Tcase = 125oC
-
10
mA
dV/dt
Maximum linear rate of rise of off-state voltage
To 60% VDRM Tj = 125oC, Gate open circuit
-
200
V/µs
-
500
A/µs
Rate of rise of on-state current
Gate source 20V, 20Ω
tr ≤ 0.5µs, Tj = 125˚C
Repetitive 50Hz
dI/dt
Non-repetitive
-
800
A/µs
VTM
IRRM/IDRM
Threshold voltage
At Tvj = 125oC
-
1.4
V
rT
On-state slope resistance
At Tvj = 125oC
-
4.0
mΩ
tgd
Delay time
VD = 300V, IG = 1A, IT = 50A, dI/dt = 50A/µs,
dIG/dt = 1A/µs, Tj = 25oC
-
1.5
µs
IL
Latching current
Tj = 25oC, VD = 12V
-
-
mA
IH
Holding current
Tj = 25oC, VD = 12V, ITM = 1A
-
50
mA
Typ.
Max.
Units
VT(TO)
GATE TRIGGER CHARACTERISTICS AND RATINGS
Symbol
Parameter
Conditions
VGT
Gate trigger voltage
VDRM = 12V, Tcase = 25oC, RL = 6Ω
-
3.0
V
IGT
Gate trigger current
VDRM = 12V, Tcase = 25oC, RL = 6Ω
-
125
mA
VGD
Gate non-trigger voltage
At VDRM Tcase = 125oC, RL = 12Ω
-
0.2
V
VFGM
Peak forward gate voltage
Anode positive with respect to cathode
-
3.0
V
VFGN
Peak forward gate voltage
Anode negative with respect to cathode
-
0.25
V
VRGM
Peak reverse gate voltage
-
5
V
IFGM
Peak forward gate current
-
4
A
PGM
Peak gate power
-
16
W
PG(AV)
Mean gate power
-
3
W
Anode positive with respect to cathode
-
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TK12
CURVES
Instantaneous on-state current, IT - (A)
2000
SINUSOIDAL CURRENT WAVEFORM
Measured under pulse conditions
Tj = 125˚C
1500
1000
RECTANGULAR CURRENT WAVEFORM
500
0
0
4.0
8.0
Instantaneous on-state voltage VT - (V)
12.0
Fig.2 Maximum (limit) on-state characteristics
Fig.3 Maximum on-state power dissipation for sinusoidal
current waveform
Fig.4 Maximum allowable case temperature for sinusoidal
current waveform
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TK12
Fig.5 Maximum on-state power dissipation for rectangular
current waveform
Fig.6 Maximum allowable case temperature for rectangular
current waveform
Fig.7 Gate trigger characteristics
Fig.8 Transient thermal impedance - junction to case
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TK12
Fig.9 Multiplying factor for non-repetive sub-cycle surge onstate current and I2t rating
Fig.10 Multiplying factor for non-repetive surge
on-state current
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TK12
PACKAGE DETAILS
For further package information, please contact your nearest Customer Service Centre. All dimensions in mm, unless stated otherwise.
DO NOT SCALE.
Ø4
15 max
Ø8.4 ± 0.3
8 min
210 ± 10
160 ± 10
30 max
Hex. 27AF
8 min
M = M12
K = 1/2" 20 UNF
K = 20.6 ± 0.6
M = 18.0 ± 0.5
Nominal weight: 120g
Mounting torque: 15Nm ±10%
Gate lead colour: White
Cathode lead colour: Red
Package outine type code: TO94
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TK12
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor,
and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages and current capability
of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The
Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our
customers.
Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete Solution
(PACs).
DEVICE CLAMPS
Disc devices require the correct clamping force to ensure their safe operation. The PACS range includes a varied selection of pre-loaded
clamps to suit all of our manufactured devices. Types available include cube clamps for single side cooling of ‘T’ 23mm and ‘E’ 30mm
discs, and bar clamps right up to 83kN for our ‘Z’ 100mm thyristors and diodes.
Clamps are available for single or double side cooling, with high insulation versions for high voltage assemblies.
Please refer to our application note on device clamping, AN4839
HEATSINKS
The Power Assembly group has its own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the
performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on
request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or customer
service office.
http://www.dynexsemi.com
e-mail: [email protected]
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: 00-44-(0)1522-500500
Fax: 00-44-(0)1522-500550
DYNEX POWER INC.
99 Bank Street, Suite 410,
Ottawa, Ontario, Canada, K1P 6B9
Tel: 613.723.7035
Fax: 613.723.1518
Toll Free: 1.888.33.DYNEX (39639)
CUSTOMER SERVICE CENTRES
Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: (613) 723-7035. Fax: (613) 723-1518.
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
SALES OFFICES
Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (949) 733-3005. Fax: (949) 733-2986.
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2001 Publication No. DS4252-5 Issue No. 5.0 July 2001
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
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