TH97/10561QM BYD57DA - BYD57VA IATF 0060636 SGS TH07/1033 ULTRA-FAST SOFT-RECOVERY CONTROLLED AVALANCHE RECTIFIERS SMA (DO-214AC) FEATURES : Glass passivated junction chip High maximum operating temperature Low leakage current Excellent stability Smallest surface mount rectifier outline Pb / RoHS Free 1.1 ± 0.3 4.5 ± 0.15 5.0 ± 0.15 PRV : 200 - 1400 Volts Io : 1.0 - 1.2 Amperes * * * * * * TW00/17276EM 0.2 ± 0.07 1.2 ± 0.2 2.1 ± 0.2 2.6 ± 0.15 MECHANICAL DATA : * * * * * * Case : SMA Molded plastic Epoxy : UL94V-O rate flame retardant Lead : Lead Formed for Surface Mount Polarity : Color band denotes cathode end Mounting position : Any Weight : 0.067 gram 2.0 ± 0.2 Dimensions in millimeters MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Rating at 25 °C ambient temperature unless otherwise specified RATING BYD BYD BYD BYD BYD BYD 57DA 57GA 57JA 57KA 57MA 57UA 57VA VRRM 200 400 600 800 1000 1200 1400 V VR 200 400 600 800 1000 1200 1400 V V(BR)R-min 300 500 700 900 1100 1300 1500 V SYMBOL Maximum Repetitive Peak Reverse Voltage Maximum Continuous Reverse Voltage Min. Reverse Avalanche Breakdown Voltage @ I R = 0.1 mA Maximum Average Forward Current 1.0 IF(AV) BYD (1) 1.2 0.4 UNIT (1) (2) A Maximum Non-Repetitive Peak Forward Surge Current (Note 3) IFSM Maximum Repetitive Peak Forward Current at Ttp = 85 °C IFRM 8.5 Maximum Forward Voltage at IF = 1.0 A ; TJ = 25 °C VF 3.6 Maximum Reverse Current at VR =VRRMmax TJ = 25 °C IR 5.0 μA TJ = 165 °C IR(H) 100 μA Maximum Reverse Recovery Time (Note 4) Trr 5 30 A 75 11 A 2.3 V 150 ns Thermal Resistance from Junction to Tie-Point Rth j-tp 30 K/W Thermal Resistance from Junction to Ambient (Note 5) Rth j-a 150 K/W Junction Temperature Range TJ - 65 to + 175 °C Storage Temperature Range TSTG - 65 to + 175 °C Notes : (1) Ttp = 85 °C; see Fig. 1and 2; averaged over any 20 ms period; see also Fig.5 and 6. (2) Tamb = 60 °C; PCB mounting ; see Fig. 3 and 4; averaged over any 20 ms period; see also Fig.5 and 6. (3) t=10ms half sine wave; Tj = Tjmax prior to surge; V R = VRRMmax (4) Reverse Recovery Test Conditions : IF = 0.5 A, I R = 1.0 A, Irr = 0.25 A. (5) Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer ≥ 40 μm. Page 1 of 3 Rev. 00 : February 13, 2008 TH97/10561QM TW00/17276EM IATF 0060636 SGS TH07/1033 RATING AND CHARACTERISTIC CURVES ( BYD57DA - BYD57VA ) FIG.1 - MAXIMUM PERMISSIBLE AVERAGE FORWARD CURRENT AS A FUNCTION OF TIE-POINT TEMPERATURE FIG.2 - MAXIMUM PERMISSIBLE AVERAGE FORWARD CURRENT AS A FUNCTION OF TIE-POINT TEMPERATURE 2.0 2.0 BYD57UA to VA 1.6 AVERAGE FORWARD CURRENT, IF(AV) (A) AVERAGE FORWARD CURRENT, IF(AV) (A) BYD57DA to MA 1.2 0.8 0.4 1.6 1.2 0.8 0.4 0 0 0 40 80 120 160 200 0 TIE-POINT TEMPERATURE, Ttp ( °C) 0.6 BYD57DA to MA 0.5 0.4 0.3 0.2 0.1 0 40 80 120 160 200 160 200 BYD57UA to VA 0.4 0.2 0 0 40 80 120 160 200 AMBIENT TEMPERATURE, Tamp ( °C) FIG.5 - MAXIMUM STEADY STATE POWER DISSIPATION AS A FUNCTION OF AVERAGE FORWARD CURRENT FIG.6 - MAXIMUM STEADY STATE POWER DISSIPATION AS A FUNCTION OF AVERAGE FORWARD CURRENT 6 a =3 2.5 2 1.57 1.42 2 1 BYD57DA to MA a = IF(RMS)/IF(AV) ; VR = VRRMmax ; δ = 0.5 0 POWER DISSIPATION, P D (W) 3 POWER DISSIPATION, P D (W) 120 0.6 AMBIENT TEMPERATURE, Tamp ( °C) BYD57UA to VA 5 a =3 4 2.5 2 1.57 1.42 3 2 1 a = IF(RMS)/IF(AV) ; VR = VRRMmax ; δ = 0.5 0 0 0.5 AVERAGE FORWARD CURRENT, I F(AV) (A) Page 2 of 3 80 FIG.4 - MAXIMUM PERMISSIBLE AVERAGE FORWARD CURRENT AS A FUNCTION OF AMBIENT TEMPERATURE AVERAGE FORWARD CURRENT, I F(AV) (A) AVERAGE FORWARD CURRENT, I F(AV) (A) FIG.3 - MAXIMUM PERMISSIBLE AVERAGE FORWARD CURRENT AS A FUNCTION OF AMBIENT TEMPERATURE 0 40 TIE-POINT TEMPERATURE, Ttp ( °C) 0 0.4 0.8 1.2 1.6 2.0 AVERAGE FORWARD CURRENT, I F(AV) (A) Rev. 00 : February 13, 2008 TH97/10561QM TW00/17276EM IATF 0060636 SGS TH07/1033 RATING AND CHARACTERISTIC CURVES ( BYD57DA - BYD57VA ) FIG.7 - FORWARD CURRENT AS FUNCTION FIG.8 - FORWARD CURRENT AS FUNCTION OF FORWARD VOLTAGE OF FORWARD VOLTAGE 4 4 BYD57UA to VA 3 FORWARD CURRENT, I F (A) FORWARD CURRENT, I F (A) BYD57DA to MA TJ = 25 °C 2 1 3 TJ = 25 °C 2 1 0 0 0 2 4 6 8 0 1 2 3 4 FORWARD VOLTAGE, V F (V) FORWARD VOLTAGE, V F (V) FIG.9 - REVERSE CURRENT AS FUNCTION OF JUNCTION TEMPERATURE REVERSE CURRENT, IR (μA) 1000 100 VR =VRRMmax 10 1 0 100 200 JUNCTION TEMPERATURE, TJ ( °C) Page 3 of 3 Rev. 00 : February 13, 2008