TI OPA4743UA

OPA743
OPA2743
OPA4743
OPA
743
OPA
743
OPA
743
OPA
743
®
SBOS201 – MAY 2001
12V, 7MHz, CMOS, Rail-to-Rail I/O
OPERATIONAL AMPLIFIERS
FEATURES
DESCRIPTION
● HIGH SPEED: 7MHz, 10V/µs
● RAIL-TO-RAIL INPUT AND OUTPUT
● WIDE SUPPLY RANGE:
Single Supply: 3.5V to 12V
Dual Supplies: ±1.75V to ±6V
● LOW QUIESCENT CURRENT: 1.1mA
● FULL-SCALE CMRR: 84dB
● MicroSIZE PACKAGES:
SOT23-5, MSOP-8, TSSOP-14
● LOW INPUT BIAS CURRENT: 1pA
The OPA743 series utilizes a state-of-the-art 12V analog
CMOS process and offers outstanding AC performance,
such as 7MHz GBW, 10V/µs slew rate and 0.0008% THD+N.
Optimized for single supply operation up to 12V, the input
common-mode range extends beyond the power supply rails
and the output swings to within 100mV of the rails. The low
quiescent current of 1.1mA makes it well suited for use in
battery operated equipment.
The OPA743 series’ ability to drive high output currents
together with 12V operation makes it particularly useful for
use as gamma correction reference buffer in LCD panels.
For ease of use the OPA743 op-amp family is fully specified
and tested over the supply range of ±1.75V to ±6V. Single,
dual and quad versions are available.
The single versions (OPA743) are available in the MicroSIZE
SOT23-5 and in the standard SO-8 surface-mount, as well as
DIP-8 packages. Dual versions (OPA2743) are available versions in the MSOP-8, SO-8, and DIP-8 packages. The quad
versions (OPA4743) are available in the TSSOP-14 and SO-14
packages. All are specified for operation from –40°C to +85°C.
APPLICATIONS
● LCD GAMMA CORRECTION
● AUTOMOTIVE APPLICATIONS:
Audio, Sensor Applications, Security Systems
● PORTABLE EQUIPMENT
● ACTIVE FILTERS
● TRANSDUCER AMPLIFIER
● TEST EQUIPMENT
● DATA ACQUISITION
OPA743
OPA743
Out
1
V–
2
+In
5
3
4
SOT23-5
V+
–In
NC
1
8
NC
–In
2
7
V+
+In
3
6
Out
V–
4
5
NC
OPA2743
Out A
1
–In A
2
+In A
3
V–
4
A
B
SO-8, DIP-8
OPA4743
Out A
1
14
Out D
–In A
2
13
–In D
A
D
+In A
3
12
+In D
V+
4
11
V–
+In B
5
10
+In C
8
V+
7
Out B
6
–In B
–In B
6
9
–In C
5
+In B
Out B
7
8
Out C
B
MSOP-8, SO-8, DIP-8
C
TSSOP-14, SO-14
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright © 2001, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
www.ti.com
ABSOLUTE MAXIMUM RATINGS(1)
ELECTROSTATIC
DISCHARGE SENSITIVITY
Supply Voltage, V+ to V– ................................................................. 13.2V
Signal Input Terminals, Voltage(2) ............................. (V–) –0.3V to (V+) +0.3V
Current(2) .................................................... 10mA
Output Short-Circuit(3) ....................................................................................... Continuous
Operating Temperature .................................................. –55°C to +125°C
Storage Temperature ..................................................... –65°C to +150°C
Junction Temperature .................................................................... +150°C
Lead Temperature (soldering, 10s) ............................................... +300°C
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
NOTES: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may degrade
device reliability. (2) Input terminals are diode-clamped to the power supply
rails. Input signals that can swing more than 0.3V beyond the supply rails
should be current-limited to 10mA or less. (3) Short-circuit to ground, one
amplifier per package.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
PACKAGE/ORDERING INFORMATION
PRODUCT
PACKAGE
PACKAGE
DRAWING
NUMBER
Single
OPA743NA
SOT23-5
331
D43
"
"
"
SO-8
182
OPA743UA
"
"
"
OPA743PA
DIP-8
006
OPA743PA
Dual
OPA2743EA
MSOP-8
337
E43
"
"
"
"
OPA2743UA
SO-8
182
OPA2743UA
"
"
"
"
OPA2743PA
DIP-8
006
OPA2743PA
Quad
OPA4743EA
TSSOP-14
357
OPA4743EA
"
"
"
"
OPA4743UA
SO-14
235
OPA4743UA
"
"
"
"
"
OPA743UA
"
PACKAGE
MARKING
ORDERING
NUMBER(1)
TRANSPORT
MEDIA
OPA743NA/250
OPA743NA/3K
OPA743UA
OPA743UA/2K5
OPA743PA
Tape and Reel
Tape and Reel
Rails
Tape and Reel
Rails
OPA2743EA/250
OPA2743EA/2K5
OPA2743UA
OPA2743UA/2K5
OPA2743PA
Tape and Reel
Tape and Reel
Rails
Tape and Reel
Rails
OPA4743EA/250
OPA4743EA/2K5
OPA4743UA
OPA4743UA/2K5
Tape and Reel
Tape and Reel
Rails
Tape and Reel
NOTE: (1) Models with a slash (/) are available only in Tape and Reel in the quantities indicated (e.g., /3K indicates 3000 devices per reel). Ordering 3000
pieces of “OPA743NA/3K” will get a single 3000-piece Tape and Reel.
2
OPA743
SBOS201
ELECTRICAL CHARACTERISTICS: VS = 3.5V to 12V
Boldface limits apply over the specified temperature range, TA = –40°C to +85°C
At TA = +25°C, RL = 10kΩ connected to VS / 2 and VOUT = VS / 2, unless otherwise noted.
OPA743NA, UA, PA
OPA2743EA, UA, PA
OPA4743EA, UA
PARAMETER
OFFSET VOLTAGE
Input Offset Voltage
Drift
vs Power Supply
Over Temperature
Channel Separation, dc
f = 10kHz
CONDITION
VOS
dVOS / dT
PSRR
INPUT VOLTAGE RANGE
Common-Mode Voltage Range
Common-Mode Rejection Ratio
over Temperature
VS = ±5V, VCM = 0V
TA = –40°C to +85°C
VS = ±1.75V to ±6V, VCM = –0.25
VS = ±1.75V to ±6V, VCM = –0.25
VCM
CMRR
IB
IOS
VS = ±5V, (V–) – 0.1V < VCM < (V+) + 0.1V
VS = ±5V, (V–) < VCM < (V+)
VS = ±5V, (V–) – 0.1V < VCM < (V+) – 2V
VS = ±5V, (V–) < VCM < (V+) – 2V
VS = ±1.75V, (V–) – 0.1V < VCM < (V+) + 0.1V
(V–) – 0.1
66
60
70
70
60
VS = ±6V, VCM = 0V
VS = ±6V, VCM = 0V
OPEN-LOOP GAIN
Open-Loop Voltage Gain
over Temperature
en
in
AOL
over Temperature
OUTPUT
Voltage Output Swing from Rail
over Temperature
over Temperature
Output Current
Short-Circuit Current
Capacitive Load Drive
FREQUENCY RESPONSE
Gain-Bandwidth Product
Slew Rate
Settling Time, 0.1%
0.01%
Overload Recovery Time
Total Harmonic Distortion + Noise
POWER SUPPLY
Specified Voltage Range, Single Supply
Specified Voltage Range, Dual Supplies
Quiescent Current (per amplifier)
over Temperature
TEMPERATURE RANGE
Specified Range
Operating Range
Storage Range
Thermal Resistance
SOT23-5 Surface-Mount
MSOP-8 Surface-Mount
TSSOP-14 Surface-Mount
SO-8 Surface Mount
SO-14 Surface Mount
DIP-8
OPA743
SBOS201
MAX
±1.5
±8
10
±7
IOUT
ISC
VS = ±6V, VCM = 0V
VS = ±6V, VCM = 0V
VS = ±6V, VCM = 0V
RL = 100kΩ, (V–)+0.1V < VO < (V+)–0.1V
RL = 100kΩ, (V–)+0.125V < VO < (V+)–0.125V
RL = 1k, (V–)+0.325V < VO < (V+)–0.325V
RL = 1k, (V–)+0.450 < VO < (V+)–0.450V
RL = 100kΩ, AOL > 106dB
RL = 100kΩ, AOL > 100dB
RL = 1kΩ, AOL > 86dB
RL = 1kΩ, AOL > 96dB
|VS – VOUT| < 1V
CLOAD
GBW
SR
tS
THD+N
VS
VS
IQ
106
100
86
96
(V+) + 0.1
V
dB
dB
dB
dB
dB
±10
±10
pA
pA
90
4 • 109 || 4
5 • 1012 || 4
Ω || pF
Ω || pF
11
30
2.5
µVp-p
nV/√Hz
fA/√Hz
120
dB
dB
dB
dB
100
7
10
9
15
200
0.0008
3.5
±1.75
IO = 0
mV
µV/°C
µV/V
µV/V
µV/V
dB
75
100
100
125
300
325
425
450
±20
±30
See Typical Characteristics
CL = 15pF
G = +1
VS = ±6V, G = +1
VS = ±6V, 5V Step, G = +1
VS = ±6V, 5V Step, G = +1
VIN • Gain = VS
VS = ±6V, VO = 1Vrms, G = +1, f = 6kHz
UNITS
100
200
84
±1
±0.5
INPUT IMPEDANCE
Differential
Common-Mode
NOISE
Input Voltage Noise, f = 0.1Hz to 10Hz
Input Voltage Noise Density, f = 10kHz
Current Noise Density, f = 1kHz
TYP
1
110
over Temperature
INPUT BIAS CURRENT
Input Bias Current
Input Offset Current
MIN
1.1
–40
–55
–65
θJA
200
150
100
150
100
100
mV
mV
mV
mV
mA
mA
MHz
V/µs
µs
µs
ns
%
12
±6
1.5
1.7
V
V
mA
mA
85
125
150
°C
°C
°C
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
3
TYPICAL CHARACTERISTICS
At TA = +25°C, VS = ±6V, and RL = 10kΩ, unless otherwise noted.
CMRR vs FREQUENCY
120
120
100
100
80
80
60
60
40
40
20
20
120
100
80
CMRR (dB)
140
Phase (º)
Gain (dB)
GAIN AND PHASE vs FREQUENCY
140
60
40
0
0
–20
10
100
1k
10k
100k
1M
10M
((V–) – 100mV) ≤ VCM ≤ (V+) – 2V
20
0
–20
100M
10
100
1k
10k
100k
1M
Frequency (Hz)
Frequency (Hz)
PSRR vs FREQUENCY
MAXIMUM AMPLITUDE vs FREQUENCY
120
7
V+
6
100
5
Amplitude (V)
PSRR (dB)
V–
80
60
40
4
VS = ± 6V
3
2
20
1
0
0
10
100
1k
10k
100k
1M
10
100
1k
10k
100k
1M
Frequency (Hz)
Frequency (Hz)
CHANNEL SEPARATION vs FREQUENCY
INPUT CURRENT AND VOLTAGE SPECTRAL
NOISE vs FREQUENCY
140
10M
10k
10k
1k
1k
100
80
60
40
20
0
100
10
10
1
1
0.1
10
4
100
100
1k
10k
100k
Frequency (Hz)
1M
10M
Current Noise (fA/√Hz)
Voltage Noise (nV/√Hz)
Channel Separation (dB)
120
0.1
0.1
1
10
100
1k
10k
100k
1M
Frequency (Hz)
OPA743
SBOS201
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, VS = ±6V, and RL = 10kΩ, unless otherwise noted.
INPUT BIAS CURRENT (IB) vs COMMON-MODE
VOLTAGE (VCM) TEMPERATURE = 85°C
INPUT BIAS CURRENT (IB) vs COMMON-MODE
VOLTAGE (VCM) TEMPERATURE = 25ºC
15
500
400
10
300
VS = ±5V
IB (pA)
IB (pA)
VS = ±5V
200
5
0
–5
100
0
–100
–200
–300
–10
–400
–500
–15
–6
–5
–4
–3
–2
–1
0
1
2
3
4
5
–6
6
–5
–4
–3
VCM (V)
INPUT BIAS (IB) AND OFFSET (IOS) CURRENT
vs TEMPERATURE
–1 0
1
VCM (V)
2
3
4
5
6
OPEN-LOOP GAIN vs TEMPERATURE
140
100k
10k
130
IB
RL = 100kΩ
1k
120
AOL (dB)
Bias Current (pA)
–2
100
10
110
100
1.0
RL = 1kΩ
90
0.1
IOS
0.01
–50
–25
0
25
50
75
100
125
150
80
–100 –75 –50 –25
175
Temperature (°C)
PSRR vs TEMPERATURE
0
25 50 75
Temperature (°C)
100 125 150 175
CMRR vs TEMPERATURE
120
120
110
100
100
80
CMRR (dB)
PSRR (dB)
(V–) ≤ VCM ((V+) – 2V)
90
60
80
40
70
20
60
–100 –75 –50 –25
OPA743
SBOS201
0
25 50 75
Temperature (°C)
100 125 150 175
(V–) ≤ VCM ≤ V+
0
–100 –75 –50 –25
0
25 50 75
Temperature (°C)
100 125 150 175
5
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, VS = ±6V, and RL = 10kΩ, unless otherwise noted.
QUIESCENT CURRENT vs SUPPLY VOLTAGE
2.0
1.5
1.5
IQ per Amplifier (mA)
IQ per Amplitude (mA)
QUIESCENT CURRENT vs TEMPERATURE
2.0
1.0
0.5
0.0
–100 –75 –50 –25
1.0
0.5
0.0
0
25 50 75
Temperature (°C)
2
100 125 150 175
50
40
40
Sourcing
30
20
Sinking
10
0
–100 –75 –50 –25
4
5
6
7
8
9 10
Supply Voltage (V)
11
12
13
14
SHORT-CIRCUIT CURRENT vs SUPPLY VOLTAGE
50
Short-Circuit Current (mA)
Short-Circuit Current (mA)
SHORT-CIRCUIT CURRENT vs TEMPERATURE
3
Sourcing
30
Sinking
20
10
0
0
25 50 75
Temperature (°C)
100 125 150 175
2
3
4
5
6
7
8
9 10
Supply Voltage
11
12
13
14
TOTAL HARMONIC DISTORTION PLUS NOISE
(Gain = ±1 V/V, VOUT = 1.0Vrms, BW = 80kHz)
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT
0.1
6
–55°C
25°C
THD Plus Noise (%)
Output Voltage (V)
4
2
125°C
0
125°C
–2
0.01
RL = 1kΩ
0.001
25°C
–4
RL = 10kΩ
–55°C
0.0001
–6
0
6
10
20
30
Output Current (±mA)
40
50
1
10
100
1k
Frequency (Hz)
10k
100k
OPA743
SBOS201
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, VS = ±6V, and RL = 10kΩ, unless otherwise noted.
OVERSHOOT (%) vs CAPACITANCE
SETTLING TIME vs GAIN
100
25
80
20
0.01%
Overshoot (%)
Settling Time (µs)
G = –1
90
VOUT = 5Vp-p
15
10
70
60
G = +1
50
40
30
G = +5
20
5
0.1%
10
0
0
1
10
10
100
100
1k
10k
Load Capacitance Value (pF)
Noninverting Gain (V/V)
VOS DRIFT PRODUCTION DISTRIBUTION
VOS PRODUCTION DISTRIBUTION
30
15
10
Frequency (%)
Frequency (%)
25
5
20
15
10
5
0
60
50
40
30
20
10
0
–10
–20
–30
–40
–50
8.0
7.0
6.0
5.0
4.0
3.0
2.0
0
1.0
–1.0
–2.0
–3.0
–5.0
–6.0
–4.0
Voltage Offset (mV)
Voltage Offset Drift (µV/°C)
SMALL SIGNAL STEP RESPONSE
(G = +1V/V, RL = 10kΩ, CL = 15pF)
SMALL SIGNAL STEP RESPONSE
(G = –1V/V, RF = 100kΩ, CF = 1pF, RL = 10kΩ, CL = 15pF)
10mV/div
10mV/div
–7.0
0
100ns/div
1µs/div
NOTE: CF is used to optimize settling time.
OPA743
SBOS201
7
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, VS = ±6V, and RL = 10kΩ, unless otherwise noted.
LARGE SIGNAL STEP RESPONSE
(G = –1V/V, RL = 10kΩ, CL = 15pF)
2V/div
2V/div
LARGE SIGNAL STEP RESPONSE
(G = +1V/V, RL = 10kΩ, CL = 15pF)
1µs/div
8
1µs/div
OPA743
SBOS201
APPLICATIONS INFORMATION
OPA743 series op amps can operate on 1.1mA quiescent
current from a single (or split) supply in the range of 3.5V
to 12V (±1.75V to ±6V), making them highly versatile and
easy to use. The OPA743 is unity-gain stable and offers
7MHz bandwidth and 10V/µs slew rate.
+V
IOVERLOAD
10mA max
VOUT
OPA743
VIN
Rail-to-rail input and output swing helps maintain dynamic
range, especially in low supply applications. Figure 1 shows
the input and output waveforms for the OPA743 in unitygain configuration. On a ±6V supply with a 100kΩ load
connected to VS /2. The output is tested to swing within
100mV to the rail.
FIGURE 2. Input Current Protection for Voltages Exceeding
the Supply Voltage.
Power-supply pins should be bypassed with 1000pF ceramic
capacitors in parallel with 1µF tantalum capacitors.
INPUT VOLTAGE
8
G = +1, VS ± 6V
Input
6
4
2V/div
2
0
–2
–4
R
V–
Device inputs are protected by ESD diodes that will conduct if
the input voltages exceed the power supplies by more than
approximately 300mV. Momentary voltages greater than 300mV
beyond the power supply can be tolerated if the current is limited
to 10mA. This is easily accomplished with an input resistor, in
series with the op amp input as shown in Figure 2. Many input
signals are inherently current-limited to less than 10mA; therefore, a limiting resistor is not always required. The OPA743
features no phase inversion when the inputs extend beyond
supplies if the input current is limited, as seen in Figure 3.
–6
Output (Inverted on osciloscope)
–8
20µs/div
VS = ±6V, VIN = 13Vp-p, G = +1
OPERATING VOLTAGE
OPA743 series op amps are fully specified and guaranteed
from 3.5V to 12V over a temperature range of –40ºC to
+85ºC. Parameters that vary significantly with operating
voltages or temperature are shown in the Typical Characteristics.
RAIL-TO-RAIL INPUT
The input common-mode voltage range of the OPA743 series
extends 100mV beyond the supply rails at room temperature.
This is achieved with a complementary input stage—an Nchannel input differential pair in parallel with a P-channel
differential pair. The N-channel pair is active for input voltages close to the positive rail, typically (V+) – 2.0V to 100mV
above the positive supply, while the P-channel pair is on for
inputs from 100mV below the negative supply to approximately (V+) – 1.5V. There is a small transition region,
typically (V+) – 2.0V to (V+) – 1.5V, in which both pairs are
on. This 500mV transition region can vary ±100mV with
process variation. Thus, the transition region (both stages on)
can range from (V+) – 2.1V to (V+) – 1.4V on the low end,
up to (V+) – 1.9V to (V+) – 1.6V on the high end. Most railto-rail op amps on the market use this two input stage
approach, and exhibit a transition region where CMRR, offset
voltage, and THD may vary compared to operation outside
this region.
OPA743
SBOS201
2V/div
FIGURE 1. Rail-to-Rail Input and Output.
20µs/div
FIGURE 3. OPA743—No Phase Inversion with Inputs
Greater than the Power-Supply Voltage.
RAIL-TO-RAIL OUTPUT
A class AB output stage with common-source transistors is
used to achieve rail-to-rail output. This output stage is
capable of driving 1kΩ loads connected to any point between V+ and V–. For light resistive loads (> 100kΩ), the
output voltage can swing to 100mV from the supply rail.
With 1kΩ resistive loads, the output can swing to within
325mV from the supply rails while maintaining high openloop gain (see the typical performance curve “Output Voltage Swing vs Output Current”).
9
CAPACITIVE LOAD AND STABILITY
The OPA743 series op amps can drive up to 1000pF pure
capacitive load. Increasing the gain enhances the amplifier’s
ability to drive greater capacitive loads (see the typical
performance curve “Small Signal Overshoot vs Capacitive
Load”).
One method of improving capacitive load drive in the unitygain configuration is to insert a 10Ω to 20Ω resistor inside
the feedback loop, as shown in Figure 4. This reduces
ringing with large capacitive loads while maintaining DC
accuracy.
RS
20Ω
OPA743
VOUT
VIN
RL
CL
FIGURE 4. Series Resistor in Unity-Gain Buffer Configuration Improves Capacitive Load Drive.
APPLICATION CIRCUITS
The OPA743 series op amps are optimized for driving
medium-speed sampling data converters. The OPA743 op
amps buffer the converter’s input capacitance and resulting
charge injection while providing signal gain.
DAC7644
NC
48
NC
47
NC
46
NC
45
VOUTA Sense
44
VOUTA
43
VREFL AB Sense
42
VREFL AB
41
VREFH AB
40
VREFH AB Sense
39
VOUTB Sense
38
VOUTB
37
Figure 5 shows the OPA743 in a dual supply buffered
reference configuration for the DAC7644.
REFERENCE BUFFER FOR LCD SOURCE DRIVERS
In modern high resolution TFT LCD displays, gamma correction must be performed to correct for nonlinearities in the
glass transmission characteristics of the LCD panel. The
typical LCD source driver for 64 Bits of Grayscale uses
internal DAC to convert the 6-Bit data into analog voltages
applied to the LCD. These DAC typically require external
voltage references for proper operation. Normally these external reference voltages are generated using a simple resistive ladder, like the one shown in Figure 6.
Typical laptop or desktop LCD panels require 6 to 8 of the
source driver circuits in parallel to drive all columns of the
panel. Although the resistive load of one internal string DAC
is only around 10kΩ, 6 to 8 in parallel represent a very
substantial load. The power supply used for the LCD source
drivers for laptops is typically in the order of 10V. To
maximize the dynamic range of the DAC, rail-to-rail output
performance is required for the upper and lower buffer. The
OPA4743’s ability to operate on 12V supplies, to drive
heavy resistive loads (as low as 1kΩ), and to swing to within
325mV of the supply rails, makes it very well suited as a
buffer for the reference voltage inputs of LCD source drivers.
During conversion, the DAC’s internal switches create current glitches on the output of the reference buffer. The
capacitor CL (typically 100nF) functions as a charge reservoir that provides/absorbs most of the glitch energy. The
series resistor RS isolates the outputs of the OPA4743 from
the heavy capacitive load and helps to improve settling time.
+V
V–
VOUT
–2.5V
1/2
OPA2743
Ref
Negative
Reference
500pF
V+
500pF
1/2
OPA2743
VOUT
+2.5V
Ref
Positive
Reference
–V
FIGURE 5. OPA743 as Dual Supply Configuration-Buffered References for the DAC7644.
10
OPA743
SBOS201
VCC
GMA1
1/4
OPA4743
RS
20Ω
GMA2
CL
100nF
GMA3
GMA4
1/4
OPA4743
RS
20Ω
GMA5
CL
100nF
GMA6
1/4
OPA4743
RS
20Ω
GMA7
CL
100nF
GMA8
GMA9
1/4
OPA4743
RS
20Ω
CL
100nF
GMA10
LCD Source Driver
NOTE: The actual values of RS and CL are application specific and may not be needed.
FIGURE 6. OPA743 Configured as a Reference Buffer for an LCD Display.
OPA743
SBOS201
11
PACKAGE OPTION ADDENDUM
www.ti.com
16-Aug-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
OPA2743EA/250
ACTIVE
VSSOP
DGK
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAUAGLevel-2-260C-1 YEAR
OPA2743EA/250G4
ACTIVE
VSSOP
DGK
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAUAGLevel-2-260C-1 YEAR
OPA2743EA/2K5
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAUAGLevel-2-260C-1 YEAR
OPA2743EA/2K5G4
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAUAGLevel-2-260C-1 YEAR
OPA2743PA
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
OPA2743PAG4
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
OPA2743UA
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
OPA2743UA/2K5
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
OPA2743UA/2K5G4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
OPA2743UAG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
OPA4743EA/250
ACTIVE
TSSOP
PW
14
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
OPA4743EA/250G4
ACTIVE
TSSOP
PW
14
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
OPA4743UA
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
OPA4743UA/2K5
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
OPA4743UA/2K5G4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
OPA4743UAG4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
OPA743NA/250
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Addendum-Page 1
Samples
(Requires Login)
PACKAGE OPTION ADDENDUM
www.ti.com
16-Aug-2012
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
OPA743NA/250G4
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
OPA743NA/3K
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
OPA743NA/3KG4
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
OPA743PA
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
OPA743PAG4
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
OPA743UA
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
OPA743UAG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Samples
(Requires Login)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
16-Aug-2012
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Aug-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
OPA2743EA/250
VSSOP
DGK
8
250
180.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
OPA2743EA/2K5
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
OPA2743UA/2K5
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
OPA4743EA/250
TSSOP
PW
14
250
180.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
OPA4743UA/2K5
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
OPA743NA/250
SOT-23
DBV
5
250
180.0
8.4
3.2
3.1
1.39
4.0
8.0
Q3
OPA743NA/3K
SOT-23
DBV
5
3000
180.0
8.4
3.2
3.1
1.39
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Aug-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
OPA2743EA/250
VSSOP
DGK
OPA2743EA/2K5
VSSOP
DGK
8
250
210.0
185.0
35.0
8
2500
367.0
367.0
35.0
OPA2743UA/2K5
SOIC
D
8
2500
367.0
367.0
35.0
OPA4743EA/250
TSSOP
PW
14
250
210.0
185.0
35.0
OPA4743UA/2K5
SOIC
D
14
2500
367.0
367.0
38.0
OPA743NA/250
SOT-23
DBV
5
250
210.0
185.0
35.0
OPA743NA/3K
SOT-23
DBV
5
3000
210.0
185.0
35.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Mobile Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated