EXCELICS EMP312

EMP312
21.0 – 24.0 GHz Power Amplifier MMIC
UPDATED 04/04/2008
FEATURES
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•
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21.0 – 24.0 GHz Operating Frequency Range
28.5dBm Output Power at 1dB Compression
13.0 dB Typical Small Signal Gain
-40dBc OIMD3 @Each Tone Pout 18.5dBm
APPLICATIONS
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Point-to-point and point-to-multipoint radio
Military Radar Systems
Dimension: 2140um X 2650um
Thickness: 75um ± 13um
Caution! ESD sensitive device.
ELECTRICAL CHARACTERISTICS (Ta = 25 °C, 50 ohm, VDD=7V, IDQ=760mA)
SYMBOL
F
P1dB
Gss
OIMD3
Input RL
Output RL
PARAMETER/TEST CONDITIONS
MIN
TYP
MAX
UNITS
24.0
GHz
Operating Frequency Range
21.0
Output Power at 1dB Gain Compression
27.0
28.5
dBm
Small Signal Gain
Output 3rd Order Intermodulation Distortion
@∆f=10MHz, Each Tone Pout 18.5dBm
10.0
13.0
dB
-40
-37
dBc
Input Return Loss
-15
-10
dB
Output Return Loss
-15
-10
dB
1072
1288
mA
8
V
Idss
Saturate Drain Current
VDS =3V, VGS =0V
VDD
Power Supply Voltage
Rth
Thermal Resistance (Au-Sn Eutectic Attach)
Tb
Operating Base Plate Temperature
858
7
o
8
-35
C/W
+85
ºC
ABSOLUTE MAXIMUM RATINGS FOR CONTINUOUS OPERATION1,2
SYMBOL
CHARACTERISTIC
VALUE
VDS
Drain to Source Voltage
8V
VGS
Gate to Source Voltage
-4 V
IDD
Drain Current
Idss
IGSF
Forward Gate Current
PIN
Input Power
TCH
Channel Temperature
150°C
TSTG
Storage Temperature
-65/150°C
PT
15mA
@ 3dB compression
Total Power Dissipation
12.6W
1. Operating the device beyond any of the above rating may result in permanent damage.
2. Bias conditions must also satisfy the following equation VDS*IDS < (TCH –THS)/RTH; where THS = ambient temperature
Specifications are subject to change without notice.
Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085
Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com
page 1 of 2
Revised April 2008
EMP312
UPDATED 04/04/2008
21.0 – 24.0 GHz Power Amplifier MMIC
ASSEMBLY DRAWING
The length of RF wires should be as short as possible. Use at least two wires between RF pad and 50 ohm line and
separate the wires to minimize the mutual inductance.
CHIP OUTLINE
Chip size 2140 X 2650 microns
Chip Thickness: 75±13 microns
PAD Dimensions: 100 x 100 microns
All Dimensions in Microns
Specifications are subject to change without notice.
Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085
Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com
page 2 of 2
Revised April 2008