EMP107 5.9 – 7.9 GHz Power Amplifier MMIC UPDATED 05/08/2008 FEATURES • • • • 5.9 – 7.9 GHz Operating Frequency Range 24dBm Output Power at 1dB Compression 19.0 dB Typical Small Signal Gain -41dBc OIMD3 @Each Tone Pout 14 dBm APPLICATIONS • • Dimension: 1130um X 2250um Thickness: 85um + 15um Point-to-point and point-to-multipoint radio Military Radar Systems Caution! ESD sensitive device. ELECTRICAL CHARACTERISTICS (Tb = 25 °C, 50 ohm, Vds = 7 V, Idsq = 200 mA, Unless Otherwise Specified) SYMBOL F P1dB Gss OIMD3 Input RL Output RL PARAMETER/TEST CONDITIONS MIN TYP MAX UNITS 7.9 GHz Operating Frequency Range 5.9 Output Power at 1dB Gain Compression 23 24 dBm 17.0 19.0 dB Small Signal Gain Output 3rd Order Intermodulation Distortion ∆f=10MHz, Each Tone Pout 14dBm, 7V, 60%+10%Idss -41 -38 dBc Input Return Loss -12 -8 dB Output Return Loss -6 Idss Saturated Drain Current Vds Vds =3V, VGS =0V 245 dB 285 330 mA Drain to Source Voltage 7 8 V NF Noise Figure @7GHz 8 Rth Thermal Resistance (Au-Sn Eutectic Attach) 44 Tb Operating Base Plate Temperature dB o C/W - 35 + 85 ºC MAXIMUM RATINGS AT 25°C1,2 SYMBOL CHARACTERISTIC ABSOLUTE CONTINUOUS Vds Drain to Source Voltage 12V 8V VGS Gate to Source Voltage -8V -4V Ids Drain Current Idss 325mA IGSF Forward Gate Current 28mA 4.5 mA PIN Input Power 21dBm @ 3dB compression TCH Channel Temperature 175°C 150°C TSTG Storage Temperature -65/175°C -65/150°C 3.1W 2.6W PT Total Power Dissipation 1. Operating the device beyond any of the above rating may result in permanent damage. 2. Bias conditions must also satisfy the following equation Vds*Ids < (TCH –Tb)/RTH Specifications are subject to change without notice. Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085 Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com page 1 of 4 Revised May 2008 EMP107 5.9 – 7.9 GHz Power Amplifier MMIC UPDATED 05/08/2008 Typical Performance: 1. Small Signal Performance (@7V, 200mA) EMP107 Small Signal Performance 25 20 15 10 DB(|S[2,1]|) * DB(|S[1,1]|) * 5 DB(|S[2,2]|) * 0 -5 -10 -15 -20 -25 4 6 8 Frequency (GHz) 2. OIMD VS Pout @7V, 200mA (@7GHz, ∆f=10MHz) 3. P-1 VS Vds @Idsq=200mA EMP107 P1dB(dBm) vs. Vds 27 26 25 24 OIMD3 -35 -40 -45 -50 -55 -60 -65 -70 OIMD5 dBm OIMD (dBc) EMP107 OIMD (dBc) vs. Pout(dBm) 0 -5 -10 -15 -20 -25 -30 10 Vds=5V 23 Vds=7V 22 21 20 19 0 5 10 15 20 Each Tone Pout (dBm) 25 5 6 7 8 9 Frequency (GHz) APPLICATION INFORMATION (CAUTION: THIS IS AN ESD SENSITIVE DEVICE) Chip carrier should match GaAs thermal coefficienat of expansion and have high thermal conductivity, such as copper tungsten or copper molybdenum. The chip carrier should be nickel-gold plated and capable of withstanding 325ºC for 20 minutes. Die attach should be done with Gold/Tin (80/20) eutectic alloy in inert ambient gas. The backside is used as heatsinking, DC, and RF contacts. All die attach and wire bond equipment, especially the tools which touch a die, should be well grounded to avoid accidental discharge through a die. Specifications are subject to change without notice. Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085 Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com page 2 of 4 Revised May 2008 EMP107 UPDATED 05/08/2008 5.9 – 7.9 GHz Power Amplifier MMIC ASSEMBLY DRAWING The length of RF wires should be as short as possible. Use at least two wires between RF pad and 50 ohm line and separate the wires to minimize the mutual inductance. CHIP OUTLINE Chip Size 1130um X 2250um Chip Thickness: 85 ± 15 microns PAD Dimensions: 100 x 100 microns All Dimensions in Microns Specifications are subject to change without notice. Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085 Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com page 3 of 4 Revised May 2008 EMP107 UPDATED 05/08/2008 5.9 – 7.9 GHz Power Amplifier MMIC DISCLAIMER EXCELICS SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. EXCELICS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN. LIFE SUPPORT POLICY EXCELICS SEMICONDUCTOR PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF EXCELICS SEMICONDUCTOR, INC. AS HERE IN: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Specifications are subject to change without notice. Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085 Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com page 4 of 4 Revised May 2008