TI 74AHCT1G126DCKRE4

SN74AHCT1G126
SINGLE BUS BUFFER GATE
WITH 3-STATE OUTPUT
SCLS380I – AUGUST 1997 – REVISED JANUARY 2003
D
D
D
D
D
D
D
DBV OR DCK PACKAGE
(TOP VIEW)
Operating Range of 4.5 V to 5.5 V
Max tpd of 6 ns at 5 V
Low Power Consumption, 10-µA Max ICC
±8-mA Output Drive at 5 V
Inputs Are TTL-Voltage Compatible
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
OE
A
GND
1
5
VCC
4
Y
2
3
description/ordering information
The SN74AHCT1G126 is a single bus buffer gate/line driver with 3-state output. The output is disabled when
the output-enable (OE) input is low. When OE is high, true data is passed from the A input to the Y output.
To ensure the high-impedance state during power up or power down, OE should be tied to GND through a
pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the
driver.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
PACKAGE†
TA
SOT (SOT
(SOT-23)
23) – DBV
40°C to 85°C
–40°C
SOT (SC-70)
(SC 70) – DCK
Reel of 3000
SN74AHCT1G126DBVR
Reel of 250
SN74AHCT1G126DBVT
Reel of 3000
SN74AHCT1G126DCKR
Reel of 250
SN74AHCT1G126DCKT
TOP-SIDE
MARKING‡
B26
B26_
BN
BN_
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
‡ The actual top-side marking has one additional character that designates the assembly/test site.
FUNCTION TABLE
INPUTS
OE
A
OUTPUT
Y
H
H
H
H
L
L
L
X
Z
logic diagram (positive logic)
OE
A
1
2
4
Y
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2003, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN74AHCT1G126
SINGLE BUS BUFFER GATE
WITH 3-STATE OUTPUT
SCLS380I – AUGUST 1997 – REVISED JANUARY 2003
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Package thermal impedance, θJA (see Note 2): DBV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206°C/W
DCK package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 252°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
Input voltage
VO
IOH
Output voltage
IOL
Dt/Dv
Low-level output current
MIN
MAX
4.5
5.5
High-level input voltage
2
UNIT
V
V
0.8
V
0
5.5
V
0
VCC
–8
High-level output current
Input transition rise or fall rate
V
mA
8
mA
20
ns/V
TA
Operating free-air temperature
–40
85
°C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VOH
TEST CONDITIONS
VCC
IOH = –50 mA
IOH = –8 mA
VOL
IOL = 50 mA
IOL = 8 mA
II
IOZ
VI = 5.5 V or GND
VO = VCC or GND
ICC
DICC‡
VI = VCC or GND,
One input at 3.4 V,
Ci
VI = VCC or GND
VO = VCC or GND
45V
4.5
TA = 25°C
MIN
TYP
MAX
4.4
4.5
0.1
0.1
0.36
0.44
V
0 V to 5.5 V
±0.1
±1
5.5 V
±0.25
±2.5
5.5 V
1
10
mA
mA
mA
1.35
1.5
mA
10
10
pF
5.5 V
5V
POST OFFICE BOX 655303
UNIT
V
3.8
4
Co
5V
10
‡ This is the increase in supply current for each input at one of the specified TTL voltage levels, rather than 0 V or VCC.
2
MAX
4.4
3.94
45V
4.5
IO = 0
Other input at VCC or GND
MIN
• DALLAS, TEXAS 75265
pF
SN74AHCT1G126
SINGLE BUS BUFFER GATE
WITH 3-STATE OUTPUT
SCLS380I – AUGUST 1997 – REVISED JANUARY 2003
switching characteristics over recommended operating free-air temperature range,
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
tPLH
tPHL
A
Y
CL = 15 pF
tPZH
tPZL
OE
Y
CL = 15 pF
tPHZ
tPLZ
OE
Y
CL = 15 pF
tPLH
tPHL
A
Y
CL = 50 pF
tPZH
tPZL
OE
Y
CL = 50 pF
tPHZ
tPLZ
OE
Y
CL = 50 pF
MIN
TA = 25°C
TYP
MAX
MIN
MAX
3.8
5.5
1
6.5
3.8
5.5
1
6.5
3.6
5.1
1
6
3.6
5.1
1
6
4.6
6.8
1
8
4.6
6.8
1
8
5.3
7.5
1
8.5
5.3
7.5
1
8.5
5.1
7.1
1
8
5.1
7.1
1
8
6.1
8.8
1
10
6.1
8.8
1
10
UNIT
ns
ns
ns
ns
ns
ns
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER
Cpd
TEST CONDITIONS
Power dissipation capacitance
No load,
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
f = 1 MHz
TYP
14
UNIT
pF
3
SN74AHCT1G126
SINGLE BUS BUFFER GATE
WITH 3-STATE OUTPUT
SCLS380I – AUGUST 1997 – REVISED JANUARY 2003
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
Test
Point
RL = 1 kΩ
From Output
Under Test
VCC
Open
S1
TEST
GND
CL
(see Note A)
CL
(see Note A)
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
Open
VCC
GND
VCC
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
3V
1.5 V
Timing Input
0V
tw
3V
1.5 V
Input
1.5 V
th
tsu
3V
1.5 V
Data Input
1.5 V
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
3V
1.5 V
Input
1.5 V
0V
tPLH
In-Phase
Output
tPHL
50% VCC
tPHL
Out-of-Phase
Output
VOH
50% VCC
VOL
Output
Waveform 1
S1 at VCC
(see Note B)
VOH
50% VCC
VOL
1.5 V
tPLZ
≈VCC
50% VCC
Output
Waveform 2
S1 at GND
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
1.5 V
0V
tPZL
tPZH
tPLH
50% VCC
3V
Output
Control
VOL + 0.3 V
VOL
tPHZ
50% VCC
VOH – 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time with one input transition per measurement.
E. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
(3)
Top-Side Markings
(4)
74AHCT1G126DBVRE4
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
(B263 ~ B26G ~
B26J ~ B26S)
74AHCT1G126DBVRG4
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
(B263 ~ B26G ~
B26J ~ B26S)
74AHCT1G126DBVTE4
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
(B263 ~ B26G ~
B26S)
74AHCT1G126DBVTG4
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
(B263 ~ B26G ~
B26S)
74AHCT1G126DCKRE4
ACTIVE
SC70
DCK
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
(BN3 ~ BNG ~ BNJ ~
BNL ~ BNS ~
BNU ~ BNY)
74AHCT1G126DCKRG4
ACTIVE
SC70
DCK
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
(BN3 ~ BNG ~ BNJ ~
BNL ~ BNS ~
BNU ~ BNY)
74AHCT1G126DCKTE4
ACTIVE
SC70
DCK
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
(BN3 ~ BNG ~ BNL ~
BNS)
74AHCT1G126DCKTG4
ACTIVE
SC70
DCK
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
(BN3 ~ BNG ~ BNL ~
BNS)
SN74AHCT1G126DBVR
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
(B263 ~ B26G ~
B26J ~ B26S)
SN74AHCT1G126DBVT
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
(B263 ~ B26G ~
B26S)
SN74AHCT1G126DCKR
ACTIVE
SC70
DCK
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
(BN3 ~ BNG ~ BNJ ~
BNL ~ BNS ~
BNU ~ BNY)
SN74AHCT1G126DCKT
ACTIVE
SC70
DCK
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
(BN3 ~ BNG ~ BNL ~
BNS)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74AHCT1G126 :
• Automotive: SN74AHCT1G126-Q1
NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Jul-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
SN74AHCT1G126DBVR
SOT-23
DBV
5
3000
180.0
8.4
3.17
1.37
4.0
8.0
Q3
SN74AHCT1G126DBVR
SOT-23
DBV
5
3000
178.0
9.2
SN74AHCT1G126DBVT
SOT-23
DBV
5
250
178.0
9.0
3.3
3.2
1.55
4.0
8.0
Q3
3.23
3.17
1.37
4.0
8.0
SN74AHCT1G126DBVT
SOT-23
DBV
5
250
178.0
9.2
Q3
3.3
3.2
1.55
4.0
8.0
SN74AHCT1G126DCKR
SC70
DCK
5
3000
178.0
Q3
9.0
2.4
2.5
1.2
4.0
8.0
Q3
SN74AHCT1G126DCKR
SC70
DCK
5
3000
SN74AHCT1G126DCKR
SC70
DCK
5
3000
178.0
9.2
2.4
2.4
1.22
4.0
8.0
Q3
180.0
9.2
2.3
2.55
1.2
4.0
8.0
SN74AHCT1G126DCKT
SC70
DCK
5
Q3
250
180.0
9.2
2.3
2.55
1.2
4.0
8.0
Q3
SN74AHCT1G126DCKT
SC70
DCK
SN74AHCT1G126DCKT
SC70
DCK
5
250
178.0
9.2
2.4
2.4
1.22
4.0
8.0
Q3
5
250
178.0
9.0
2.4
2.5
1.2
4.0
8.0
Q3
Pack Materials-Page 1
3.23
W
Pin1
(mm) Quadrant
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Jul-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74AHCT1G126DBVR
SOT-23
DBV
5
3000
202.0
201.0
28.0
SN74AHCT1G126DBVR
SOT-23
DBV
5
3000
180.0
180.0
18.0
SN74AHCT1G126DBVT
SOT-23
DBV
5
250
180.0
180.0
18.0
SN74AHCT1G126DBVT
SOT-23
DBV
5
250
180.0
180.0
18.0
SN74AHCT1G126DCKR
SC70
DCK
5
3000
180.0
180.0
18.0
SN74AHCT1G126DCKR
SC70
DCK
5
3000
180.0
180.0
18.0
SN74AHCT1G126DCKR
SC70
DCK
5
3000
205.0
200.0
33.0
SN74AHCT1G126DCKT
SC70
DCK
5
250
205.0
200.0
33.0
SN74AHCT1G126DCKT
SC70
DCK
5
250
180.0
180.0
18.0
SN74AHCT1G126DCKT
SC70
DCK
5
250
180.0
180.0
18.0
Pack Materials-Page 2
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