SN74AHC125-Q1
QUADRUPLE BUS BUFFER GATE
WITH 3-STATE OUTPUTS
SCLS525A − AUGUST 2003 − REVISED APRIL 2008
DQualified for Automotive Applications
DESD Protection Exceeds 1000 V Per
D OR PW PACKAGE
(TOP VIEW)
MIL-STD-883, Method 3015; Exceeds 150 V
Using Machine Model (C = 200 pF, R = 0)
DEPIC (Enhanced-Performance Implanted
CMOS) Process
DOperating Range 2-V to 5.5-V VCC
DLatch-Up Performance Exceeds 250 mA Per
JESD 17
1OE
1A
1Y
2OE
2A
2Y
GND
1
14
2
13
3
12
4
11
5
10
6
9
7
8
VCC
4OE
4A
4Y
3OE
3A
3Y
description/ordering information
The SN74AHC125 is a quadruple bus buffer gate featuring independent line drivers with 3-state outputs. Each
output is disabled when the associated output-enable (OE) input is high. When OE is low, the respective gate
passes the data from the A input to its Y output.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION{
−40°C
40°C to 125°C
ORDERABLE
PART NUMBER
PACKAGE‡
TA
TOP-SIDE
MARKING
SOIC − D
Tape and reel
SN74AHC125QDRQ1
AHC125Q
TSSOP − PW
Tape and reel
SN74AHC125QPWRQ1
AHC125Q
†
For the most current package and ordering information, see the Package Option Addendum at the end of
this document, or see the TI web site at http://www.ti.com.
‡ Package drawings, thermal data, and symbolization are available at http://www.ti.com/packaging.
FUNCTION TABLE
(each buffer)
INPUTS
OE
A
OUTPUT
Y
L
H
H
L
L
L
H
X
Z
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC is a trademark of Texas Instruments.
Copyright 2008, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN74AHC125-Q1
QUADRUPLE BUS BUFFER GATE
WITH 3-STATE OUTPUTS
SCLS525A − AUGUST 2003 − REVISED APRIL 2008
logic symbol†
1
1OE
1A
EN
2
1
3
4
2OE
2A
3OE
3A
4OE
4A
†
6
5
1Y
2Y
10
8
9
13
11
12
3Y
4Y
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
logic diagram (positive logic)
1OE
1A
2OE
2A
1
2
3OE
3
1Y
4
5
3A
4OE
6
2Y
4A
10
9
8
3Y
13
12
11
4Y
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
‡
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN74AHC125-Q1
QUADRUPLE BUS BUFFER GATE
WITH 3-STATE OUTPUTS
SCLS525A − AUGUST 2003 − REVISED APRIL 2008
recommended operating conditions (see Note 3)
VCC
Supply voltage
VIH
High-level
High
level input voltage
MIN
MAX
2
5.5
VCC = 2 V
1.5
VCC = 3 V
2.1
VCC = 5.5 V
UNIT
V
V
3.85
VCC = 2 V
0.5
VCC = 3 V
0.9
VIL
Low-level
Low level input voltage
VI
Input voltage
0
5.5
V
VO
Output voltage
0
VCC
V
−50
mA
IOH
High-level
High
level output current
VCC = 5.5 V
1.65
VCC = 2 V
IOL
Low-level
Low
level output current
∆t/∆v
Input transition rise or fall rate
TA
Operating free-air temperature
V
VCC = 3.3 V ± 0.3 V
−4
VCC = 5 V ± 0.5 V
−8
VCC = 2 V
50
VCC = 3.3 V ± 0.3 V
4
VCC = 5 V ± 0.5 V
8
VCC = 3.3 V ± 0.3 V
mA
mA
mA
100
VCC = 5 V ± 0.5 V
20
−40
125
ns/V
°C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
IOH = −50
50 mA
VCC
TA = 25°C
MAX
MIN
MIN
TYP
2V
1.9
2
1.9
3V
2.9
3
2.9
4.5 V
4.4
4.5
4.4
IOH = −4 mA
3V
2.58
2.48
IOH = −8 mA
4.5 V
3.94
3.8
VOH
IOL = 50 mA
MAX
V
2V
0.1
0.1
3V
0.1
0.1
4.5 V
0.1
0.1
IOL = 4 mA
3V
0.36
0.5
IOL = 8 mA
4.5 V
0.36
0.5
VOL
UNIT
V
II
VI = 5.5 V or GND
0 V to 5.5 V
±0.1
±1
mA
IOZ
VO = VCC or GND
5.5 V
±0.25
±2.5
mA
ICC
VI = VCC or GND,
4
40
mA
Ci
VI = VCC or GND
IO = 0
5.5 V
5V
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
4
10
pF
3
SN74AHC125-Q1
QUADRUPLE BUS BUFFER GATE
WITH 3-STATE OUTPUTS
SCLS525A − AUGUST 2003 − REVISED APRIL 2008
switching characteristics over recommended operating free-air temperature range,
VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
PARAMETER
tPLH
tPHL
tPZH
tPZL
tPHZ
tPLZ
tPLH
tPHL
tPZH
tPZL
tPHZ
tPLZ
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
A
Y
CL = 15 pF
OE
Y
CL = 15 pF
OE
Y
CL = 15 pF
A
Y
CL = 50 pF
OE
Y
CL = 50 pF
OE
Y
CL = 50 pF
TA = 25°C
MIN
MIN
MAX
8
1
9.5
8
1
9.5
5.4
8
1
9.5
5.4
8
1
9.5
7
9.7
1
11.5
7
9.7
1
11.5
8.1
11.5
1
13
8.1
11.5
1
13
7.9
11.5
1
13
7.9
11.5
1
13
9.5
13.2
1
15
9.5
13.2
1
15
TYP
MAX
5.6
5.6
UNIT
ns
ns
ns
ns
ns
ns
switching characteristics over recommended operating free-air temperature range,
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
tPLH
tPHL
tPZH
tPZL
tPHZ
tPLZ
tPLH
tPHL
tPZH
tPZL
tPHZ
tPLZ
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
A
Y
CL = 15 pF
OE
Y
CL = 15 pF
OE
Y
CL = 15 pF
A
Y
CL = 50 pF
OE
Y
CL = 50 pF
OE
Y
CL = 50 pF
TA = 25°C
MIN
MIN
MAX
5.5
1
6.5
5.5
1
6.5
3.6
5.1
1
6
3.6
5.1
1
6
4.6
6.8
1
8
4.6
6.8
1
8
5.3
7.5
1
8.5
5.3
7.5
1
8.5
5.1
7.1
1
8
5.1
7.1
1
8
6.1
8.8
1
10
6.1
8.8
1
10
MIN
MAX
TYP
MAX
3.8
3.8
UNIT
ns
ns
ns
ns
ns
ns
noise characteristics, VCC = 5 V, CL = 50 pF, TA = 25°C (see Note 4)
PARAMETER
VOL(P)
Quiet output, maximum dynamic VOL
VOL(V)
Quiet output, minimum dynamic VOL
VOH(V)
Quiet output, minimum dynamic VOH
4.4
VIH(D)
High-level dynamic input voltage
3.5
VIL(D)
Low-level dynamic input voltage
UNIT
0.8
V
−0.8
V
V
V
1.5
V
TYP
UNIT
NOTE 4: Characteristics are for surface-mount packages only.
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER
Cpd
4
TEST CONDITIONS
Power dissipation capacitance
No load,
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
f = 1 MHz
14
pF
SN74AHC125-Q1
QUADRUPLE BUS BUFFER GATE
WITH 3-STATE OUTPUTS
SCLS525A − AUGUST 2003 − REVISED APRIL 2008
PARAMETER MEASUREMENT INFORMATION
VCC
From Output
Under Test
RL = 1 kΩ
From Output
Under Test
Test
Point
S1
Open
TEST
GND
CL
(see Note A)
CL
(see Note A)
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
Open
VCC
GND
VCC
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
VCC
50% VCC
Timing Input
tw
tsu
VCC
50% VCC
50% VCC
Input
0V
th
VCC
50% VCC
Data Input
50% VCC
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VCC
50% VCC
Input
50% VCC
0V
tPLH
tPHL
VOH
In-Phase
Output
50% VCC
tPHL
Out-of-Phase
Output
50% VCC
VOL
Output
Waveform 1
S1 at VCC
(see Note B)
VOH
50% VCC
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
50% VCC
50% VCC
0V
tPZL
tPLZ
≈VCC
50% VCC
tPZH
tPLH
50% VCC
VCC
Output
Control
Output
Waveform 2
S1 at GND
(see Note B)
VOL + 0.3 V
VOL
tPHZ
50% VCC
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
PACKAGE OPTION ADDENDUM
www.ti.com
17-Aug-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
SN74AHC125QDRG4Q1
ACTIVE
Package Type Package
Drawing
SOIC
Pins
Package Qty
D
14
2500
Green (RoHS
& no Sb/Br)
Eco Plan
(2)
TBD
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
CU NIPDAU Level-1-260C-UNLIM
SN74AHC125QDRQ1
ACTIVE
SOIC
D
14
SN74AHC125QPWRG4Q1
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Call TI
Call TI
SN74AHC125QPWRQ1
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74AHC125-Q1 :
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
17-Aug-2012
• Catalog: SN74AHC125
• Enhanced Product: SN74AHC125-EP
• Military: SN54AHC125
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
• Military - QML certified for Military and Defense Applications
Addendum-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Mobile Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated