TI TLK1201IRCPRG4

TLK1201RCP, TLK1201IRCP
ETHERNET TRANSCEIVERS
SLLS506E − AUGUST 2001 − REVISED MAY 2007
at 1.25 Gbps
D LVPECL Compatible Differential I/O on High
D
D
D
D
D
D
D
D
Advanced 0.25-µm CMOS Technology
No External Filter Capacitors Required
Comprehensive Suite of Built-In Testability
IEEE 1149.1 JTAG Support
2.5-V Supply Voltage for Lowest Power
Operation
3.3-V Tolerant on LVTTL Inputs
Hot Plug Protection
64-Pin VQFP With Thermally Enhanced
Package (PowerPAD™)
CPRI Data Rate Compatible (614 Mbps and
1.22 Gbps)
Industrial Temperature Range Supported:
−40°C to 85°C
GNDPLL
VDD
TXP
TXN
VDDA
VDDA
GNDA
VDDA
JTRSTN
JTMS
RXP
VDDA
RXN
GNDA
D
D
Speed Interface
Single Monolithic PLL Design
Support For 10-Bit Interface or Reduced
Interface 5-Bit DDR (Double Data Rate)
Clocking
Receiver Differential Input Thresholds
200 mV Minimum
IEEE 802.3 Gigabit Ethernet Compliant
ANSI X3.230-1994 (FC-PH) Fibre Channel
Compliant
D
D
D
D
D
1
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
48
2
47
3
46
4
45
5
44
6
43
7
42
8
41
9
40
10
39
11
38
12
37
13
36
14
35
15
34
33
16
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
JTDI
SYNC/PASS
GND
RD0
RD1
RD2
VDD
RD3
RD4
RD5
RD6
VDD
RD7
RD8
RD9
GND
TESTEN
VDDPLL
LOOPEN
VDD
GND
REFCLK
VDD
SYNCEN
GND
LOS
JTDO
ENABLE
VDD
RBC1
RBC0
RBCMODE
GND
TD0
TD1
TD2
VDD
TD3
TD4
TD5
TD6
VDD
TD7
TD8
TD9
GND
MODESEL
PRBSEN
VDD
TCK
D 0.6-Gbps to 1.3-Gbps Serializer/Deserializer
D Low Power Consumption <200 mW
description
The TLK1201 gigabit ethernet transceiver provides for ultrahigh-speed, full-duplex, point-to-point data
transmissions. This device is based on the timing requirements of the 10-bit interface specification by the IEEE
802.3 gigabit ethernet specification and is also compliant with the ANSI X3.230-1994 (FC-PH) fibre channel
standard. The device supports data rates from 0.6 Gbps to 1.3 Gbps.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
Copyright © 2001 − 2007, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
TLK1201RCP, TLK1201IRCP
ETHERNET TRANSCEIVERS
SLLS506E − AUGUST 2001 − REVISED MAY 2007
description (continued)
The primary application of this device is to provide building blocks for point-to-point baseband data transmission
over controlled impedance media of 50 Ω or 75 Ω. The transmission media can be printed-circuit board traces,
copper cables, or fiber-optical media. The ultimate rate and distance of data transfer is dependent upon the
attenuation characteristics of the media and the noise coupling to the environment.
The TLK1201I performs the data serialization, deserialization, and clock extraction functions for a physical layer
interface device. The transceiver operates at 1.25 Gbps (typical), providing up to 1 Gbps of data bandwidth over
a copper or optical media interface.
The TLK1201I supports both the defined 10-bit interface (TBI) and a reduced 5-bit interface utilizing double data
rate (DDR) clocking. In the TBI mode the serializer/deserializer (SERDES) accepts 10-bit wide 8b/10b parallel
encoded data bytes. The parallel data bytes are serialized and transmitted differentially at PECL compatible
voltage levels. The SERDES extracts clock information from the input serial stream and deserializes the data,
outputting a parallel 10-bit data byte.
In the DDR mode the parallel interface accepts 5-bit wide 8b/10b encoded data aligned to both the rising and
falling edge of the reference clock. The data is clocked most significant bit first, (bits 0 − 4 of the 8b/10b encoded
data) on the rising edge of the clock and the least significant bits (bits 5 − 9 of the 8b/10b encoded data) are
clocked on the falling edge of the clock.
The device provides a comprehensive series of built-in tests for self-test purposes including loopback and
pseudorandom binary sequence (PRBS) generation and verification. An IEEE 1149.1 JTAG port is also
supported.
The TLK1201I is housed in a high-performance, thermally enhanced, 64-pin VQFP PowerPAD package. Use
of the PowerPAD package does not require any special considerations except to note that the PowerPAD, which
is an exposed die pad on the bottom of the device, is a metallic thermal and electrical conductor. It is
recommended that the device’s PowerPAD be soldered to the thermal land on the board.
The TLK1201I is characterized for operation from −0°C to 70°C (TLK1201), or −40°C to 85°C (TLK1201I).
The TLK1201I uses a 2.5-V supply. The I/O section is 3.3-V compatible. With a 2.5-V supply the chipset is very
power-efficient, dissipating less than 200 mW typical power when operating at 1.25 Gbps.
The TLK1201I is designed to be hot plug capable. A power-on reset causes RBC0, RBC1, the parallel output
signal terminals, TXP, and TXN to be held in a high-impedance state.
differences between TLK1201/TLK1201I and TNETE2201
The TLK1201/TLK1201I is the functional equivalent of the TNETE2201. There are several differences between
the devices as noted below. See Figure 12 in the Application Information section for an example of a typical
application circuit.
D The VCC is 2.5 V for the TLK1201 vs 3.3 V for TNETE2201.
D The PLL filter capacitors on pins 16, 17, 48, and 49 of the TNETE2201 are no longer required. The TLK1201
D
uses these pins to provide added test capabilities. The capacitors, if present, do not affect the operation
of the device.
No pulldown resistors are required on the TXP/TXN outputs.
AVAILABLE OPTIONS
PACKAGE
2
TA
PLASTIC QUAD FLAT PACK
(RCP)
TAPE and REEL OPTION
−0°C to 70°C
TLK1201RCP
TLK1201RCPR
−40°C to 85°C
TLK1201IRCP
TLK1201IRCPR
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TLK1201RCP, TLK1201IRCP
ETHERNET TRANSCEIVERS
SLLS506E − AUGUST 2001 − REVISED MAY 2007
block diagram
PRBSEN
LOOPEN
PRBS
Generator
TD(0−9)
TXP
2:1
MUX
Parallel to
Serial
TXN
10 Bit
Registers
Clock
Phase Generator
REFCLK
MODESEL
Control
Logic
ENABLE
TESTEN
PRBS
Verification
RBC1
RBC0
SYNC/PASS
Interpolator
and
Clock Extraction
Clock
Clock
Serial to Parallel
and
Comma Detect
RD(0−9)
2:1
MUX
2:1
MUX
Data
RXP
RXN
SYNCEN
LOS
RBCMODE
JTMS
JTAG
Control
Register
JTRSTN
JTDI
TCK
JTDO
Terminal Functions
TERMINAL
NAME
NO.
I/O
DESCRIPTION
Mode select. This terminal selects between the 10-bit interface and a reduced 5-bit DDR interface. When
low the 10-bit interface (TBI) is selected. When pulled high, the 5-bit DDR mode is selected. The default
mode is the TBI.
SIGNAL
†
MODESEL
15
I
P/D†
LOS
26
O
RBCMODE
32
I
P/D†
Loss of signal. Indicates a loss of signal on the high-speed differential inputs RXP and RXN.
If magnitude of RXP−RXN > 150 mV, LOS = 1, valid input signal
If magnitude of RXP−RXN < 150 mV and > 50 mV, LOS is undefined
If magnitude of RXP−RXN < 50 mV, LOS = 0, loss of signal
Receive clock mode select. When RBCMODE and MODESEL are low, half-rate clocks are output on
RBC0 and RBC1. When MODESEL is low and RBCMODE is high, a full baud-rate clock is output on
RBC0 and RBC1 is held low. When MODESEL is high, RBCMODE is ignored and a full baud-rate clock is
output on RBC0 and RBC1 is held low.
P/D = Internal pulldown
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
TLK1201RCP, TLK1201IRCP
ETHERNET TRANSCEIVERS
SLLS506E − AUGUST 2001 − REVISED MAY 2007
Terminal Functions (Continued)
TERMINAL
NAME
NO.
I/O
DESCRIPTION
O
Receive byte clock. RBC0 and RBC1 are recovered clocks used for synchronizing the 10-bit output data
on RD0−RD9. The operation of these clocks is dependent upon the receive clock mode selected.
SIGNAL (continued)
RBC0
RBC1
31
30
In the half-rate mode, the 10-bit output data words are valid on the rising edges of RBC0 and RBC1.
These clocks are adjusted to half-word boundaries in conjunction with synchronous detect. The clocks
are always expanded during data realignment and never slivered or truncated. RBC0 registers bytes
1 and 3 of received data. RBC1 registers bytes 0 and 2 of received data.
In the normal rate mode, only RBC0 is valid and operates at 1/10 the serial data rate. Data is aligned
to the rising edge.
In the DDR mode, only RBC0 is valid and operates at 1/10 the serial data rate. Data is aligned to both
the rising and falling edges.
RD0−RD9
REFCLK
45, 44, 43,
41, 40, 39,
38, 36, 35,
34
O
22
I
Receive data. When in TBI mode (MODESEL = low) these outputs carry 10-bit parallel data output from
the transceiver to the protocol layer. The data is referenced to terminals RBC0 and RBC1, depending
on the receive clock mode selected. RD0 is the first bit received.
When in the DDR mode (MODESEL = high) only RD0−RD4 are valid. RD5−RD9 are held low. The 5-bit
parallel data is clocked out of the transceiver on the rising edge of RBC0.
Reference clock. REFCLK is an external input clock that synchronizes the receiver and transmitter
interface (60 MHz to 130 MHz). The transmitter uses this clock to register the input data (TD0−TD9) for
serialization.
In the TBI mode that data is registered on the rising edge of REFCLK.
In the DDR mode, the data is registered on both the rising and falling edges of REFCLK with the most
significant bits aligned to the rising edge of REFCLK.
RXP
RXN
54
52
PECL
I
Differential input receive. RXP and RXN together are the differential serial input interface from a copper
or an optical I/F module.
SYNCEN
24
I
P/U‡
Synchronous function enable. When SYNCEN is high, the internal synchronization function is activated.
When this function is activated, the transceiver detects the K28.5 comma character (0011111 negative
beginning disparity) in the serial data stream and realigns data on byte boundaries if required. When
SYNCEN is low, serial input data is unframed in RD0 − RD9.
SYNC/PASS
47
O
Synchronous detect. The SYNC output is asserted high upon detection of the comma pattern in the serial
data path. SYNC pulses are output only when SYNCEN is activated (asserted high). In PRBS test mode
(PRBSEN=high), SYNC/PASS outputs the status of the PRBS test results (high=pass).
2−4, 6−9,
11−13
I
Transmit data. When in the TBI mode (MODESEL = low) these inputs carry 10-bit parallel data output
from a protocol device to the transceiver for serialization and transmission. This 10-bit parallel data is
clocked into the transceiver on the rising edge of REFCLK and transmitted as a serial stream with TD0
sent as the first bit.
TD0−TD9
When in the DDR mode (MODESEL = high) only TD0−TD4 are valid. The 5-bit parallel data is clocked
into the transceiver on the rising and falling edge of REFCLK and transmitted as a serial stream with TD0
sent as the first bit.
TXP
TXN
62
61
PECL
O
Differential output transmit. TXP and TXN are differential serial outputs that interface to a copper or an
optical I/F module. TXP and TXN are put in a high-impedance state when LOOPEN is high and are active
when LOOPEN is low.
ENABLE
28
I
P/U‡
When this terminal is low, the device is disabled for Iddq testing. RD0 − RD9, RBCn, TXP, and TXN are
high impedance. The pullup and pulldown resistors on any input are disabled. When ENABLE is high, the
device operates normally.
JTDI
48
I
P/U‡
Test data input. IEEE1149.1 (JTAG)
JTDO
27
O
Test data output. IEEE1149.1 (JTAG)
JTMS
55
I
P/U‡
Test mode select. IEEE1149.1 (JTAG)
TEST
†
‡
4
P/D = Internal pulldown
P/U = Internal pullup
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TLK1201RCP, TLK1201IRCP
ETHERNET TRANSCEIVERS
SLLS506E − AUGUST 2001 − REVISED MAY 2007
Terminal Functions (Continued)
TERMINAL
NAME
NO.
I/O
DESCRIPTION
TEST (continued)
JTRSTN
56
I
P/U‡
Reset signal. IEEE1149.1 (JTAG)
LOOPEN
19
I
P/D†
Loop enable. When LOOPEN is high (active), the internal loop-back path is activated. The transmitted
serial data is directly routed to the inputs of the receiver. This provides a self-test capability in conjunction
with the protocol device. The TXP and TXN outputs are held in a high-impedance state during the
loop-back test. LOOPEN is held low during standard operational state with external serial outputs and
inputs active.
PRBSEN
16
I
P/D†
PRBS enable. When PRBSEN is high, the PRBS generation circuitry is enabled. The PRBS verification
circuit in the receive side is also enabled. A PRBS signal can be fed to the receive inputs and checked for
errors, that are reported by the SYNC/PASS terminal indicating low.
TCK
49
I
TESTEN
17
I
P/D†
VDD
5, 10, 20,
23, 29, 37,
42, 50, 63
Supply
Digital logic power. Provides power for all digital circuitry and digital I/O buffers.
VDDA
53, 57, 59,
60
Supply
Analog power. VDDA provides power for the high-speed analog circuits, receiver, and transmitter
18
Supply
PLL power. Provides power for the PLL circuitry. This terminal requires additional filtering.
1, 14, 21,
25, 33, 46
Ground
Digital logic ground. Provides a ground for the logic circuits and digital I/O buffers.
51, 58
Ground
Analog ground. GNDA provides a ground for the high-speed analog circuits RX and TX.
64
Ground
PLL ground. Provides a ground for the PLL circuitry.
Test clock. IEEE1149.1 (JTAG)
Manufacturing test terminal
POWER
VDDPLL
GROUND
GND
GNDA
GNDPLL
†
P/D = Internal pulldown
‡ P/U = Internal pullup
detailed description
data transmission
This device supports both the defined 10-bit interface (TBI) and a reduced 5-bit interface utilizing DDR clocking.
When MODESEL is low, the TBI mode is selected. When MODESEL is high, the DDR mode is selected.
In the TBI mode, the transmitter portion registers incoming 10-bit wide data words (8b/10b encoded data,
TD0−TD9) on the rising edge of REFCLK. The REFCLK is also used by the serializer, which multiplies the clock
by a factor of 10, providing a signal that is fed to the shift register. The 8b/10b encoded data is transmitted
sequentially bit 0 through 9 over the differential high-speed I/O channel.
In the DDR mode, the transmitter accepts 5-bit wide 8b/10b encoded data on pins TD0−TD4. In this mode, data
is aligned to both the rising and falling edges of REFCLK. The data is then formed into a 10-bit wide word and
sent to the serializer. The rising edge REFCLK clocks in bit 0−4, and the falling edge of REFCLK clocks in bits
5−9. (Bit 0 is the first bit transmitted).
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
TLK1201RCP, TLK1201IRCP
ETHERNET TRANSCEIVERS
SLLS506E − AUGUST 2001 − REVISED MAY 2007
detailed description (continued)
transmission latency
Data transmission latency is defined as the delay from the initial 10-bit word load to the serial transmission of
bit 9. The minimum latency in TBI mode is 19 bit times. The maximum latency in TBI mode is 20 bit times. The
minimum latency in DDR mode is 29 bit times, and maximum latency in DDR mode is 30 bit times.
Measured 10-Bits
Next 10-Bit Code
b7 b8 b9 b0 b1 b2 b3
TXP, TXN
td(Tx latency)
TD(0−9)
10-Bit Code
REFCLK
Figure 1. Transmitter Latency Full Rate Mode
data reception
The receiver portion deserializes the differential serial data. The serial data is retimed based on an interpolated
clock generated from the reference clock. The serial data is then aligned to the 10-bit word boundaries and
presented to the protocol controller along with receive byte clocks (RBC0, RBC1).
receiver clock select mode
There are two modes of operation for the parallel bus. 1)The 10-bit (TBI) mode and 2) 5-bit (DDR) mode. When
in TBI mode, there are two user-selectable clock modes that are controlled by the RBCMODE terminal. 1)
Full-rate clock on RBC0 and 2) Half-rate clocks on RBC0 and RBC1. When in the DDR mode, only a full-rate
clock is available on RBC0; see Table 1.
Table 1. Mode Selection
FREQUENCY
MODESEL
RBCMODE
MODE
TLK1201
TLK1201I
0
0
TBI half-rate
30−65 MHz
30−65 MHz
0
1
TBI full-rate
60−130 MHz
60−130 MHz
1
0
DDR
60−130 MHz
60−130 MHz
1
1
DDR
60−130 MHz
60−130 MHz
In the half-rate mode, two receive byte clocks (RBC0 and RBC1) are 180 degrees out of phase and operate
at one-half the data rate. The clocks are generated by dividing down the recovered clock. The received data
is output with respect to the two receive byte clocks (RBC0, RBC1) allowing a protocol device to clock the
parallel bytes using the RBC0 and RBC1 rising edges. The outputs to the protocol device, byte 0 of the received
data is valid on the rising edge of RBC1. See the timing diagram shown in Figure 2.
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TLK1201RCP, TLK1201IRCP
ETHERNET TRANSCEIVERS
SLLS506E − AUGUST 2001 − REVISED MAY 2007
receiver clock select mode (continued)
td(S)
RBC0
td(S)
RBC1
td(H)
SYNC
td(H)
RD(0−9)
K28.5
DXX.X
DXX.X
DXX.X
K28.5
DXX.X
Figure 2. Synchronous Timing Characteristics Waveforms (TBI half-rate mode)
In the normal-rate mode, only RBC0 is used and operates at full data rate (i.e., 1.25-Gbps data rate produces
a 125-MHz clock). The received data is output with respect to the rising edge of RBC0. RBC1 is low in this mode.
See the timing diagram shown in Figure 3.
RBC0
td(S)
td(H)
SYNC
RD(0−9)
K28.5
DXX.X
DXX.X
DXX.X
K28.5
DXX.X
Figure 3. Synchronous Timing Characteristics Waveforms (TBI full-rate mode)
In the double data rate mode, the receiver presents the data on both the rising and falling edges of RBC0. RBC1
is low impedance. The data is clocked bit-0 first, and aligned to the rising edge of RBC0. See the timing diagram
shown in Figure 4.
td(S)
RBC0
td(S)
td(H)
td(H)
SYNC
RD(0−4)
K28.5
K28.5
DXX.X
DXX.X
DXX.X
DXX.X
DXX.X
DXX.X
K28.5
K28.5
DXX.X
Bits 0−4 Bits 5−9
Figure 4. Synchronous Timing Characteristics Waveforms (DDR mode)
The receiver clock interpolator can lock to the incoming data without the need for a lock-to-reference preset.
The received serial data rate (RXP and RXN) is at the same baud rate as the transmitted data stream, ±0.02%
(200 PPM) for proper operation (see the recommended operating tables).
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
TLK1201RCP, TLK1201IRCP
ETHERNET TRANSCEIVERS
SLLS506E − AUGUST 2001 − REVISED MAY 2007
receiver word alignment
This device uses the IEEE 802.3 gigabit ethernet defined 10-bit K28.5 character (comma character) word
alignment scheme. The following sections explain how this scheme works and how it realigns itself.
comma character on expected boundary
This device provides 10-bit K28.5 character recognition and word alignment. The 10-bit word alignment is
enabled by forcing the SYNCEN terminal high. This enables the function that examines and compares serial
input data to the seven bit synchronization pattern. The K28.5 character is defined by 8-bit/10-bit coding scheme
as a pattern consisting of 0011111010 (a negative number beginning with disparity) with the 7 MSBs (0011111),
referred to as the comma character. The K28.5 character was implemented specifically for aligning data words.
As long as the K28.5 character falls within the expected 10-bit boundary, the received 10-bit data is properly
aligned and data realignment is not required. Figure 2 shows the timing characteristics of RBC0, RBC1, SYNC,
and RD0−RD9 while synchronized. (Note: the K28.5 character is valid on the rising edge of RBC1).
comma character not on expected boundary
If synchronization is enabled and a K28.5 character straddles the expected 10-bit word boundary, then word
realignment is necessary. Realignment or shifting the 10-bit word boundary truncates the character following
the misaligned K28.5, but the following K28.5 and all subsequent data is aligned properly as shown in
Figure 5. The RBC0 and RBC1 pulse widths are stretched or stalled in their current state during realignment.
With this design, the maximum stretch that occurs is 20 bit times. This occurs during a worst case scenario when
the K28.5 is aligned to the falling edge of RBC1 instead of the rising edge. Figure 5 shows the timing
characteristics of the data realignment.
31 Bit
Times
Max Receive
Path Latency
INPUT DATA
K28.5
DXX.X
30 Bit
Times (Max)
K28.5
DXX.X
DXX.X
DXX.X
DXX.X
K28.5
RBC0
RBC1
Worst Case
Misaligned K28.5
RD(0−9)
DXX.X
DXX.X
Misalignment Corrected
Corrupt Data
K28.5
DXX.X
DXX.X
K28.5
DXX.X
DXX.X
DXX.X
K28.5
SYNC
Figure 5. Word Realignment Timing Characteristics Waveforms
Systems that do not require framed data may disable byte alignment by tying SYNCEN low.
When a SYNC character is detected, the SYNC signal is brought high and is aligned with the K28.5 character.
The duration of the SYNC pulse is equal to the duration of the data when in TBI mode. When in DDR mode the
SYNC pulse is present for the entire RBC0 period.
data reception latency
The serial to parallel data latency is the time from when the first bit arrives at the receiver until it is output in the
aligned parallel word with RD0 received as first bit. The minimum latency in TBI mode is 21 bit times, and the
maximum latency is 31 bit times. The minimum latency in DDR mode is 27 bit times and maximum latency is
34 bit times.
8
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TLK1201RCP, TLK1201IRCP
ETHERNET TRANSCEIVERS
SLLS506E − AUGUST 2001 − REVISED MAY 2007
10-Bit Code
RXP, RXN
td(Rx latency)
10-Bit Code
RD(0−9)
RBC0
Figure 6. Receiver Latency − TBI Normal Mode Shown
loss of signal detection
This device has a loss of signal (LOS) detection circuit for conditions where the incoming signal no longer has
sufficient voltage level to keep the clock recovery circuit in lock. The LOS is intended to be an indication of gross
signal error conditions, such as a detached cable or no signal being transmitted, and not an indication of signal
coding health. Under a PRBS serial input pattern, LOS is high for signal amplitudes greater than 150 mV. The
LOS is low for all amplitudes below 50 mV. Between 50 mV and 150 mV, LOS is undetermined.
testability
The loopback function provides for at-speed testing of the transmit/receive portions of the circuitry. The enable
function allows for all circuitry to be disabled so that an Iddq test can be performed. The PRBS function also
allows for a BIST( built-in self test). The terminal setting, TESTEN high, enables the test mode. The terminal
TESTEN has an internal pulldown resistor, so it defaults to normal operation. The TESTEN is only used for
factory testing, and is not intended for end-user control.
loopback testing
The transceiver can provide a self-test function by enabling (setting LOOPEN to high level) the internal loopback
path. Enabling this function causes serial transmitted data to be routed internally to the receiver. The parallel
data output can be compared to the parallel input data for functional verification. The external differential output
is held in a high-impedance state during the loopback testing.
enable function
When held low, ENABLE disables all quiescent power in both the analog and digital circuitry. This allows an
ultralow-power idle state when the link is not active.
PRBS function
This device has a built-in 27−1 PRBS function. When the PRBSEN control bit is set high, the PRBS test is
enabled. A PRBS is generated and fed into the 10-bit parallel transmitter input bus. Data from the normal parallel
input source is ignored during PRBS test mode. The PRBS pattern is then fed through the transmit circuitry as
if it were normal data and sent out to the transmitter. The output can be sent to a bit error rate tester (BERT)
or to the receiver of another TLK1201I. Since the PRBS is not really random and is really a predetermined
sequence of ones and zeros, the data can be captured and checked for errors by a BERT. This device also has
a built-in BERT function on the receiver side that is enabled by PRBSEN. It can receive a PRBS pattern and
check for errors, and then reports the errors by forcing the SYNC/PASS terminal low. When PRBS is enabled,
RBCMODE is ignored. MODESEL must be low for the PRBS verifier to function correctly. The PRBS testing
supports two modes (normal and latched), which are controlled by the SYNCEN input. When SYNCEN is low,
the result of the PRBS bit error rate test is passed to the SYNC/PASS terminal. When SYNCEN is high the result
of the PRBS verification is latched on the SYNC/PASS output (i.e., a single failure forces SYNC/PASS to remain
low).
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
9
TLK1201RCP, TLK1201IRCP
ETHERNET TRANSCEIVERS
SLLS506E − AUGUST 2001 − REVISED MAY 2007
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
Supply voltage, VDD (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 3 V
Input voltage range at TTL terminals, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4 V
Input voltage range at any other terminal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to VDD +0.3 V
Storage temperature, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
Electrostatic discharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CDM: 1 kV, HBM:2 kV
Characterized free-air operating temperature range: TLK1201 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
TLK1201I . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.
DISSIPATION RATING TABLE
PACKAGE
TA ≤ 25°C
POWER RATING
OPERATING FACTOR‡
ABOVE TA = 25°C
TA = 70°C
POWER RATING
RCP64§
5.25 W
46.58 mW/°C
2.89 W
RCP64¶
3.17 W
23.70 mW/°C
1.74 W
RCP64#
2.01 W
13.19 mW/°C
1.11 W
‡
This is the inverse of the traditional junction-to-ambient thermal resistance (RθJA).
2 oz. Trace and copper pad with solder
¶ 2 oz. Trace and copper pad without solder
# Standard JEDEC high-K board
NOTE: For more information, see the TI application note PowerPAD Thermally Enhanced
Package, TI literature number SLMA002.
§
thermal characteristics
PARAMETER
RθJA
Junction-to-free-air thermal resistance
TEST CONDITION
Junction-to-case-thermal resistance
21.47
Board-mounted, no air flow, high conductivity TI
recommended test board with thermal land but no
solder or grease thermal connection to thermal land
42.2
0.38
Board-mounted, no air flow, high conductivity TI
recommended test board with thermal land but no
solder or grease thermal connection to thermal land
0.38
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MAX
UNIT
°C/W
75.83
Board-mounted, no air flow, high conductivity TI
recommended test board, chip soldered or greased to
thermal land
Board-mounted, no air flow, JEDEC test board
10
TYP
Board-mounted, no air flow, high conductivity TI
recommended test board, chip soldered or greased to
thermal land
Board-mounted, no air flow, JEDEC test board
RθJC
MIN
7.8
°C/W
TLK1201RCP, TLK1201IRCP
ETHERNET TRANSCEIVERS
SLLS506E − AUGUST 2001 − REVISED MAY 2007
recommended operating conditions
Supply voltage, VDD, VDD(A)
Total supply current, IDD, IDD(A)
Total power dissipation,
dissipation PD
PRBS pattern
Frequency = 1.25 Gbps,
PRBS pattern
NOM
MAX
2.3
2.5
2.7
V
90
mA
250
UNIT
mW
case†
245
mW
50
µA
500
µs
Frequency = 1.25 Gbps,
Worst
Total shutdown current, IDD, IDD(A)
Enable = 0,
VDD(A), VDD = 2.7 V
Startup lock time, PLL
VDD, VDD(A) = 2.5 V, EN↑ to PLL acquire
Operating free-air
free air temperature
temperature, TA
†
Frequency = 1.25 Gbps,
MIN
TLK1201
0
70
TLK1201I
−40
85
°C
The worst case pattern is a pattern that creates a maximum transition density on the serial transceiver.
reference clock (REFCLK) timing requirements over recommended operating conditions (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
Frequency
Minimum data rate
Frequency
Maximum data rate
MIN
TYP
MAX
TLK1201
TYP−0.01%
60
TYP+0.01%
TLK1201I
TYP−0.01%
60
TYP+0.01%
TYP−0.01%
130
TYP+0.01%
Accuracy
−100
Duty cycle
40%
Jitter, peak-to-peak
100
50%
UNIT
MHz
ppm
60%
20 kHz to 10 MHz
40
ps
TTL electrical characteristics over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VOH
High-level output voltage
IOH = −400 µA
VOL
Low-level output voltage
IOL = 1 mA
VIH
High-level input voltage
VIL
Low-level input voltage
IIH
High-level Input current
VDD = 2.3 V,
VIN = 2 V
IIL
Low-level Input current
VDD = 2.3 V,
VIN = 0.4 V
CIN
Input capacitance
MIN
TYP
VDD−0.2
2.3
GND
0.25
1.7
MAX
V
0.5
V
3.6
V
0.8
V
40
µA
−40
µA
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
UNIT
pF
11
TLK1201RCP, TLK1201IRCP
ETHERNET TRANSCEIVERS
SLLS506E − AUGUST 2001 − REVISED MAY 2007
transmitter/receiver characteristics
PARAMETER
TEST CONDITIONS
TxN|
VOD
|TxD−TxN|
O = |TxD
V(cm)
TYP
MAX
600
850
1100
Rt = 75 Ω
800
1050
1200
1100
1250
1400
mV
1600
mV
2250
mV
350
µA
2
pF
0.24
UI
0.2
UI
0.12
UI
250
ps
Rt = 50 Ω
Transmit common mode voltage range
Rt = 75 Ω
Receiver input voltage requirement, VID = |RxP − RxN|
200
Receiver common mode voltage range, (RxP +
RxN)/2
1000
Ilkg(R)
Receiver input leakage current
−350
CI
Receiver input capacitance
t(TJ)
Differential output jitter,
Random + deterministic,
PRBS pattern, Rω = 125 MHz
Serial data total jitter (peak-to-peak)
(peak to peak)
Differential output jitter,
Random + deterministic,
PRBS pattern, Rω = 106.25 MHz
1250
mV
t(DJ)
Serial data deterministic jitter (peak-to-peak)
Differential output jitter,
PRBS pattern, Rω = 125 MHz
tr, tf
Differential signal rise, fall time (20% to 80%)
RL = 50 Ω, CL = 5 pF,
See Figure 7 and Figure 8
100
Differential input jitter,
Random + deterministic,
Rω = 125 MHz
0.25
UI
0.3
UI
Serial data jitter tolerance minimum required eye
opening, (per IEEE-802.3 specification)
Differential input jitter, random +
determinisitc, PRBS pattern at
zero crossing
Receiver data acquisition lock time from powerup
500
Data relock time from loss of synchronization
td(Tx latency)
Tx latency
TBI modes
See Figure 1
See Figure 6
DDR mode
td(Rx latency)
Rx latency
19
20
29
30
20
31
27
34
TBI mode
600 − 620 Mbps
24
28
DDR mode
600 − 620 Mbps
27
31
TBI mode
1222.8 Mbps
25
29
DDR mode
1222.8 Mbps
27
33
UI = serial bit time
12
POST OFFICE BOX 655303
µs
1024 Bit times
DDR mode
TBI modes
†
UNIT†
MIN
Rt = 50 Ω
• DALLAS, TEXAS 75265
UI
UI
TLK1201RCP, TLK1201IRCP
ETHERNET TRANSCEIVERS
SLLS506E − AUGUST 2001 − REVISED MAY 2007
∼V
tf
tr
∼V
80%
50%
20%
TX−
tf
VOD
∼V
80%
50%
20%
TX+
CL
5 pF
50 Ω
∼V
50 Ω
tr
∼ 1V
80%
0V
20%
CL
5 pF
∼ −1V
Figure 7. Differential and Common-Mode
Output Voltage Definitions
Figure 8. Transmitter Test Setup
LVTTL output switching characteristics over recommended operating conditions (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
tr(RBC)
Clock rise time
0.3
1.5
tf(RBC)
Clock fall time
0.3
1.5
tr
Data rise time
0.3
1.5
tf
Data fall time
0.3
1.5
tsu(D1)
Data setup time (RD0..RD9), Data
valid prior to RBC0 rising
TBI normal mode, (see Figure 3)
2.5
ns
th(D1)
Data hold time (RD0..RD9), Data valid
after RBC0 rising
TBI normal mode, (see Figure 3)
2
ns
tsu(D2)
Data setup time (RD0..RD4)
DDR mode, Rω = 125 MHz, (see Figure 4)
2
ns
th(D2)
Data hold time (RD0..RD4)
DDR mode, Rω = 125 MHz, (see Figure 4)
0.8
ns
tsu(D3)
Data setup time (RD0..RD9)
TBI half-rate mode, Rω = 125 MHz, (see Figure 2)
2.5
ns
th(D3)
Data hold time (RD0..RD9)
TBI half-rate mode, Rω = 125 MHz, (see Figure 2)
1.5
ns
80% to 20% output voltage,
voltage C = 5 pF (see Figure 9)
ns
ns
1.4 V
CLOCK
tf
tr
80%
50%
20%
DATA
2V
0.8 V
tf
tr
Figure 9. TTL Data I/O Valid Levels for AC Measurement
transmitter timing requirements over recommended operating conditions (unless otherwise
noted)
PARAMETER
tsu(D4)
Data setup time (TD0..TD9)
th(D4)
Data hold time (TD0..TD9)
tsu(D5)
Data setup time (TD0..TD9)
th(D5)
Data hold time (TD0..TD9)
tr, tf
TD[0,9] data rise and fall time
TEST CONDITIONS
TBI modes
DDR modes
See Figure 9
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MIN
TYP
MAX
1.6
UNIT
ns
0.8
0.7
ns
0.5
2
ns
13
TLK1201RCP, TLK1201IRCP
ETHERNET TRANSCEIVERS
SLLS506E − AUGUST 2001 − REVISED MAY 2007
APPLICATION INFORMATION
8B/10B transmission code
The PCS maps GMII signals into 10-bit code groups and vice versa, using an 8b/10b block coding scheme. The
PCS uses the transmission code to improve the transmission characteristics of information to be transferred
across the link. The encoding defined by the transmission code ensures that sufficient transitions are present
in the PHY bit stream to make clock recovery possible in the receiver. Such encoding also greatly increases
the likelihood of detecting any single or multiple bit errors that may occur during transmission and reception of
information. The 8b/10b transmission code specified for use has a high-transition density, is run length limited,
and is dc-balanced. The transition density of the 8b/10b symbols range from 3 to 8 transitions per symbol. The
definition of the 8b/10b transmission code is specified in IEEE 802.3 gigabit ethernet and ANSI X3.230-1994
(FC−PH), clause 11.
14
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TLK1201RCP, TLK1201IRCP
ETHERNET TRANSCEIVERS
SLLS506E − AUGUST 2001 − REVISED MAY 2007
APPLICATION INFORMATION
8B/10B transmission code (continued)
The 8b/10b transmission code uses letter notation describing the bits of an unencoded information octet. The
bit notation of A,B,C,D,E,F,G,H for an unencoded information octet is used in the description of the 8b/10b
transmission code-groups, where A is the LSB. Each valid code group has been given a name using the
following convention: /Dx.y/ for the 256 valid data code-groups and /Kx.y/ for the special control code-groups,
where y is the decimal value of bits EDCBA and x is the decimal value of bits HGF (noted as K<HGF.EDCBA>).
Thus, an octet value of FE representing a code-group value of K30.7 would be represented in bit notation as
111 11110.
VDD
TXP
ZO
5 kΩ
RXP
7.5 kΩ
ZO
GND
+
_
VDD
ZO
5 kΩ
ZO
TXN
RXN
7.5 kΩ
GND
Transmitter
Media
Receiver
Figure 10. High-Speed I/O Directly-Coupled Mode
VDD
TXP
ZO
5 kΩ
RXP
7.5 kΩ
ZO
GND
+
_
VDD
ZO
5 kΩ
TXN
ZO
RXN
7.5 kΩ
GND
Transmitter
Media
Receiver
Figure 11. High-Speed I/O AC-Coupled Mode
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
15
TLK1201RCP, TLK1201IRCP
ETHERNET TRANSCEIVERS
SLLS506E − AUGUST 2001 − REVISED MAY 2007
APPLICATION INFORMATION
5 Ω at 100 MHz
2.5 V
2.5 V
18
VDD VDDA
GND
GNDA
17
10
16
19
24
Host
Protocol
Device
47
10
64
TLK1201I
TLK1201II
TESTEN
TXP
62
Controlled Impedance
Transmission Line
61
Controlled Impedance
Transmission Line
54
Controlled Impedance
Transmission Line
REFCLK
PRBSEN
LOOPEN
SYNCEN
TXN
SYNC/PASS
RD0−RD9
2
28
26
32
15
49
55
JTAG
Controller
GNDPLL
TD0−TD9
22
0.01 µF
VDDPLL
48
56
27
RBC0−RBC1
ENABLE
RXP
LOS
Rt
50 Ω
Rt
50 Ω
RBCMODE
MODESEL
TCK
JTMS
RXN
52
Controlled Impedance
Transmission Line
JTDI
JTRSTN
JTDO
Figure 12. Typical Application Circuit (AC mode)
designing with PowerPAD
The TLK1201/TLK1201I is housed in a high-performance, thermally enhanced, 64-pin VQFP (RCP64)
PowerPAD package. Use of the PowerPAD package does not require any special considerations except to note
that the PowerPAD, which is an exposed die pad on the bottom of the device, is a metallic thermal and electrical
conductor. Therefore, if not implementing PowerPAD PCB features, the use of solder masks (or other assembly
techniques) may be required to prevent any inadvertent shorting by the exposed PowerPAD of connection
etches or vias under the package. It is strongly recommended that the PowerPAD be soldered to the thermal
land. The recommended convention, however, is to not run any etches or signal vias under the device, but to
have only a grounded thermal land as explained below. Although the actual size of the exposed die pad may
vary, the minimum size required for the keepout area for the 64-pin PFP PowerPAD package is 8 mm × 8 mm.
16
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TLK1201RCP, TLK1201IRCP
ETHERNET TRANSCEIVERS
SLLS506E − AUGUST 2001 − REVISED MAY 2007
APPLICATION INFORMATION
designing with PowerPAD (continued)
It is recommended that there be a thermal land, which is an area of solder-tinned-copper, underneath the
PowerPAD package. The thermal land varies in size depending on the PowerPAD package being used, the PCB
construction, and the amount of heat that needs to be removed. In addition, the thermal land may or may not
contain numerous thermal vias depending on PCB construction.
Other requirements for thermal lands and thermal vias are detailed in the TI application note PowerPAD
Thermally Enhanced Package Application Report, TI literature number SLMA002, available via the TI Web
pages beginning at URL: http://www.ti.com.
Figure 13. Example of a Thermal Land
For the TLK1201I, this thermal land must be grounded to the low-impedance ground plane of the device. This
improves not only thermal performance but also the electrical grounding of the device. It is also recommended
that the device ground pin landing pads be connected directly to the grounded thermal land. The land size must
be as large as possible without shorting device signal pins. The thermal land may be soldered to the exposed
PowerPAD using standard reflow soldering techniques.
While the thermal land may be electrically floated and configured to remove heat to an external heat sink, it is
recommended that the thermal land be connected to the low-impedance ground plane for the device. More
information may be obtained from the TI application note PHY Layout, TI literature number SLLA020.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
17
PACKAGE OPTION ADDENDUM
www.ti.com
15-May-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TLK1201IRCP
NRND
HVQFP
RCP
64
160
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
TLK1201IRCPG4
NRND
HVQFP
RCP
64
160
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
TLK1201RCP
NRND
HVQFP
RCP
64
160
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
TLK1201RCPG4
NRND
HVQFP
RCP
64
160
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DLP® Products
www.dlp.com
Communications and
Telecom
www.ti.com/communications
DSP
dsp.ti.com
Computers and
Peripherals
www.ti.com/computers
Clocks and Timers
www.ti.com/clocks
Consumer Electronics
www.ti.com/consumer-apps
Interface
interface.ti.com
Energy
www.ti.com/energy
Logic
logic.ti.com
Industrial
www.ti.com/industrial
Power Mgmt
power.ti.com
Medical
www.ti.com/medical
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Space, Avionics &
Defense
www.ti.com/space-avionics-defense
RF/IF and ZigBee® Solutions www.ti.com/lprf
Video and Imaging
www.ti.com/video
Wireless
www.ti.com/wireless-apps
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2010, Texas Instruments Incorporated