TI SLK2501IPZP

SLLS502A – OCTOBER 2001 – REVISED NOVEMBER 2001
D Fully Integrated SONET/SDH Transceiver to
D
D
D
D
D
D
D
D
Support Clock/Data Recovery and
Multiplexer/Demultiplexer Functions
Supports OC-48, OC-24, OC-12, Gigabit
Ethernet and OC-3 Data Rate With Autorate
Detection
Supports Transmit Only, Receiver Only,
Transceiver and Repeater Functions in a
Single Chip Through Configuration Pins
Supports SONET/SDH Frame Detection
On-Chip PRBS Generation and Verification
Supports 4-Bit LVDS (OIF99.102) Electrical
Interface
Parity Checking and Generation for the
LVDS Interface
Single 2.5-V Power Supply
Interfaces to Back Plane, Copper Cables, or
Optical Modules
D Hot Plug Protection
D Low Jitter PECL Compatible Differential
D
D
D
D
D
D
D
D
D
Serial Interface With Programmable
De-Emphasis for the Serial Output
On-Chip Termination for LVDS and PECL
Compatible Interface
Receiver Differential Input Thresholds
150 mV Min
Supports SONET Loop Timing
Low Power <900 mW at OC-48 Rate
ESD Protection >2 kV
622-MHz Reference Clock
Maintains Clock Output in Absence of Data
Local and Remote Loopback
100-Pin PZP Package With PowerPad
Design
description
The SLK2501 is a single chip multirate transceiver IC used to derive high speed timing signals for SONET/SDH
based equipment. The chip performs clock and data recovery, serial-to-parallel/parallel-to-serial conversion
and frame detection function conforming to the SONET/SDH standards.
The device can be configured to operate under OC-48, OC-24, OC-12, or OC-3 data rates through the rate
selection pins or the autorate detection function. An external reference clock operating at 622.08 MHz is
required for the recovery loop, and it also provides a stable clock source in the absence of serial data transitions.
The SLK2501 accepts 4 bit LVDS parallel data/clock and generates a NRZ SONET/SDH-compliant signal at
OC-3, OC-12, OC-24 or OC-48 rates. It also recovers the data and clock from the serial SONET stream and
demultiplexes it into 4-bit LVDS parallel data for full duplex operation. TXDATA0 and RXDATA0 are the first bits
that are transmitted and received in time, respectively. The serial interface is a low jitter, PECL compatible
differential interface.
The SLK2501 provides a comprehensive suite of built-in tests for self-test purposes including local and remote
loopback and PRBS (27-1) generation and verification.
The device comes in a 100-pin VQFP package that requires a single 2.5-V supply with 3.3-V tolerant inputs on
the control pins. The SLK2501 is very power efficient, dissipating less than 900 mW at 2.488 Gbps, the OC-48
data rate, and it is characterised for operation from –40°C to 85°C.
AVAILABLE OPTIONS
PACKAGE
TA
PowerPAD QUAD
(PZP)
–40°C to 85°C
SLK2501IPZP
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
Copyright  2001, Texas Instruments Incorporated
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POST OFFICE BOX 655303
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1
SLLS502A – OCTOBER 2001 – REVISED NOVEMBER 2001
block diagram
PRBSEN
PRBS
Generator
4
SPILL
TXDATA0..TXDATA3
TXCLKP
FIFO
4-Bit
Register
2:1
MUX
4
4
4:1
MUX
STXDOP
MUX
STXDON
4
TXCLKN
Parity
Checker
TXPARP
TXPARN
PAR_VALID
RLOOP
TXCLKSRCP
TXCLKSRCN
REFCLKP
Transmit Clock
Synthesizer
REFCLKN
Rate
Select
MUX
LCKREFN
LOOPTIME
RSEL(0–1)
To All The Logic
Recovered
Clock
RESET
Receive Clock
Recovery
LOL
LLOOP
PRBS
Verification
PRBSPASS
Parity
Generator
4-Bit
Register
RXDAT0..RXDATA3
4
Frame
Sync
4
4
1:4
MUX
Q
D
SRXDIP
SRXDIN
LOS
SIGDET
RXPARP
RXPARN
RXCLKP
DIV
TXCLKN
FRAMEN
FSYNCP
FSYNCN
2
2:1
MUX
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SLLS502A – OCTOBER 2001 – REVISED NOVEMBER 2001
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
GNDLVDS
TXPARP
TXPARN
VDDLVDS
GNDLVDS
REFCLKN
REFCLKP
GNDLVDS
VDDLVDS
VDDLVDS
VDDLVDS
GNDLVDS
TXDATA0P
TXDATA0N
TXDATA1P
TXDATA1N
TXDATA2P
TXDATA2N
TXDATA3P
TXDATA3N
TXCLKN
TXCLKP
VDDLVDS
GNDLVDS
GNDLVDS
PZP PACKAGE
(TOP VIEW)
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
VDDLVDS
FSYNCN
FSYNCP
VDDLVDS
TXCLKSRCN
TXCLKSRCP
GNDLVDS
RXCLKN
RXCLKP
RXDATA0P
RXDATA0N
RXDATA1P
RXDATA1N
VDDLVDS
GNDLVDS
RXDATA2P
RXDATA2N
RXDATA3P
RXDATA3N
RXPARP
RXPARN
RLOOP
LLOOP
RSVD
LOOPTIME
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• DALLAS, TEXAS 75265
LOL
LOS
RX_MONITOR
RESET
SPILL
VDD
ENABLE
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
GND
LCKREFN
VDD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
GND
FRAME_EN
GND
VDD
GND
GND
VDD
GND
AUTO_DETECT
VDD
RATEOUT1
RATEOUT0
RSEL1
RSEL0
GND
PRBSEN
PRBSPASS
TESTEN
GND
PAR_VALID
VDD
PRE1
PRE2
GND
VDDA
STXDON
STXDOP
GNDA
VDDPLL
GNDPLL
GNDA
SRXDIP
SRXDIN
VDDA
CONFIG0
CONFIG1
GND
SIGDET
PS
VDD
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SLLS502A – OCTOBER 2001 – REVISED NOVEMBER 2001
Terminal Functions
clock pins
TERMINAL
NAME
NO.
TYPE
DESCRIPTION
REFCLKP,
REFCLKN
94
95
LVDS/PECL
compatible input
Differential reference input clock. There is an on-chip 100-Ω termination resistor differentially
placed between REFCLKP and REFCLKN. The dc bias is also provided on-chip for ac-coupled
case.
TXCLKP,
TXCLKN
79
80
LVDS input
Transmit data clock. The data on TXDATA(0:3) is latched on the rising edge of TXCLKP.
TXCLKSRCP,
TXCLKSRCN
70
71
LVDS output
Transmit clock source. A clock source generated from the SLK2501 to the downstream device
(i.e., framer) that could be used by the downstream device to transmit data back to the SLK2501.
This clock is frequency-locked to the local reference clock.
RXCLKP,
RXCLKN
67
68
LVDS output
Receive data clock. The data on RXDATA(0:3) is on the falling edges of RXCLKP. The interface
of RXDATA(0:3) and RXCLKP is source synchronous (refer to Figure 7).
serial side data pins
TERMINAL
NAME
TYPE
NO.
DESCRIPTION
STXDOP,
STXDON
9
8
PECL compatible
output
Transmit differential pairs; high speed serial outputs.
SRXDIP,
SRXDIN
14
15
PECL compatible
input
Receive differential pairs; high speed serial inputs.
parallel side data pins
TERMINAL
NAME
TXDATA[0:3]
P/N
NO.
TYPE
DESCRIPTION
88–81
LVDS input
Transmit data pins. Parallel data on this bus is clocked on the rising edge of TXCLKP.
TXDATA0 is the first bit transmitted in time.
99
98
LVDS input
Transmit data parity input
66–63,
60–57
LVDS output
Receive data pins. Parallel data on this bus is valid on the falling edge of RXCLKP (refer to
Figure 7). RXDATA0 is the first bit received in time.
RXPARP,
RXPARN
56
55
LVDS output
Receive data parity output
FSYNCP,
FSYNCN
73
74
LVDS output
Frame sync pulse. This signal indicates the frame boundaries of the incoming data stream. If the
frame-detect circuit is enabled, FSYNC pulses for four RXCLKP and RXCLKN clock cycles,
when it detects the framing patterns.
TXPARP,
TXPARN
RXDATA[0:3]
P/N
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Terminal Functions(Continued)
control/status pins
TERMINAL
NAME
NO.
TYPE
DESCRIPTION
RSEL0, RSEL1
39
38
TTL input (with pulldown)
Data rate configuration pins. Put the device under one of the four data rate operations:
OC-48, OC-24, OC-12 or OC-3.
CONFIG0,
CONFIG1
17
18
TTL input (with pulldown)
Configuration pins. Put the device under one of the four operation modes: TX only, RX
only, transceiver, or repeater mode.
PRE1,
PRE2
4
5
TTL input (with pulldown)
Programmable preemphasis control. Combinations of these two bits can be used to
optimize serial data transmission.
RESET
48
TTL input
TXFIFO and LOL reset pin. Low is reset and high is normal operation.
AUTO_DETECT
34
TTL input (with pulldown)
Data rate autodetect enable. Enable the autodetection function for different data rates.
LLOOP
53
TTL input (with pulldown)
Local loopback enable. When high, the serial output is internally looped back to its
serial input
RLOOP
54
TTL input (with pulldown)
Remote loopback enable. When high, the serial input is internally looped back to its
serial output with the timing extracted from the serial data.
ENABLE
44
TTL input (with pullup)
Standby enable. When this pin is held low, the device is disabled for IDDQ testing.
When high, the device operates normally.
FRAME_EN
27
TTL input (with pullup)
Frame sync enable. When this pin is asserted high, the frame synchronization circuit
for byte alignment is turned on.
PRBSEN
41
TTL input (with pulldown)
PRBS testing enable. When this pin is asserted high, the device is put into the PRBS
testing mode.
SIGDET
20
TTL input (with pulldown)
Signal detect. This pin is generally connected to the output of an optical receiver. This
signal may be active high or active low depending on the optical receiver. The SIGDET
input is XORed with the PS pin to select the active state. When SIGDET is in the
inactive state, data is processed normally. When activated, indicating a loss of signal
event, the transmitter transmits all zeroes and force the LOS signal to go high.
PS
21
TTL input (with pulldown)
Polarity select. This pin, used with the SIGDET pin, sets the polarity of SIGSET. When
high, SIGDET is an active low signal. When low, SIGDET is an active high signal.
RX_MONITOR
47
TTL input (with pulldown)
RX parallel data monitor in repeater mode. This pin is only used when the device is put
under repeater mode. When high, the RX demux circuit is enabled and the parallel data
is presented. When low, the demux is shut down to save power.
LCKREFN
24
TTL input (with pullup)
Lock to reference. When low, RXCLKP/N output is forced to lock to REFCLK. When
high, RXCLKP/N is the divided down clock extracted from the receive serial data.
LOOPTIME
51
TTL input (with pulldown)
Loop timing mode. When high, the PLL for clock synthesizer is bypassed. The
recovered clock timing is used to send the transmit data.
TESTEN
43
TTL input (with pulldown)
Production test mode enable. This pin should be left unconnected or tied low.
RATEOUT0,
RATEOUT1
37
36
TTL output
Autorate detection outputs. When AUTO_DETECT is high, the autodetection circuit
generates these two bits to indicate the data rates for the downstream device.
LOL
45
TTL output
Loss of lock. When the clock recovery loop has locked to the input data stream and the
phase differs by less than 100 ppm from REFCLK then LOL is high. When the phase of
the input data stream differs by more than 100 ppm from REFCLK, then LOL is low. If
the difference is too big (> 500 ppm), the LOL output is not valid.
LOS
46
TTL output
Loss of signal. When no transitions appear on the input data stream for more than
2.3 µs, a loss of signal occurs and LOS goes high. The device also transmits all zeroes
downstream using REFCLK as its clock source. When a valid SONET signal is
received the LOS signal goes low.
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SLLS502A – OCTOBER 2001 – REVISED NOVEMBER 2001
Terminal Functions(Continued)
control/status pins (continued)
TERMINAL
NAME
TYPE
NO.
DESCRIPTION
PRBSPASS
42
TTL output
PRBS test result. This pin reports the status of the PRBS test results (High = pass).
When PRBSEN is disabled, the PRBSPASS pin is set low. When PRBSEN is enabled
and a valid PRBS is received, then the PRBSPASS pin is set high.
PAR_VALID
2
TTL output
Parity checker output. The internal parity checker on the parallel side of the transmitter
checks for even parity. If there is a parity error, the pin is pulsed low for two clock cycles.
SPILL
49
TTL output
TX FIFO collision output
voltage supply and reserved pins
TERMINAL
NAME
NO.
TYPE
DESCRIPTION
VDDLVDS
62, 72, 75, 78,
90, 91, 92, 97
Supply
LVDS supply voltage (2.5 V)
GNDLVDS
61, 69, 76, 77,
89, 93, 96, 100
Ground
LVDS ground
VDD
3, 22, 25, 29,
32, 35, 50
Supply
Digital logic supply voltage (2.5 V)
GND
1, 6, 19, 23, 26,
28, 30, 31, 33,
40
Ground
Digital logic ground
VDDA
7, 16
Supply
Analog voltage supply (2.5 V)
GNDA
10, 13
Ground
Analog ground
VDDPLL
11
Supply
PLL voltage supply (2.5 V)
GNDPLL
12
Supply
PLL ground
RSVD
52
Reserved
This pin needs to be tied to ground or left floating for normal operation.
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SLLS502A – OCTOBER 2001 – REVISED NOVEMBER 2001
detailed description
The SLK2501 is designed to support OC-48/24/12/3. The operating data speed can be configured through
RSEL0 and RSEL1 pins as indicated in Table 1.
Table 1. Data Rate Select
SERIAL DATA RATE
RSEL0
RSEL1
PARALLEL LVDS DATA RATE
TXCLK/RXCLK
OC-48:2.488 Gb/s
0
0
622.08 Mbps
622.08 MHz
OC-24:1.244 Gb/s
1
0
311.04 Mbps
311.04 MHz
OC-12:622 Mb/s
0
1
155.52 Mbps
155.52 MHz
OC-3:155.52 Mb/s
1
1
38.88 Mbps
38.88 MHz
The user can also enable the autorate detection circuitry through the AUTO_DETECT pin. The device
automatically detects the OC-N of the data line rate and generates two bits of output to indicate the data rate
to other devices in the system. When using AUTO_DETECT, RSEL0 and RSEL1 need to be set to 00 or be
unconnected.
Table 2. Data Rate Reporting Under Autorate Detection Mode
SERIAL DATA RATE
RATEOUT0
RATEOUT1
PARALLEL LVDS DATA RATE
TXCLK/RXCLK
OC-48:2.488 Gb/s
0
0
622.08 Mbps
622.08 MHz
OC-24:1.244 Gb/s
1
0
311.04 Mbps
311.04 MHz
OC-12:622 Mb/s
0
1
155.52 Mbps
155.52 MHz
OC-3:155.52 Mb/s
1
1
38.88 Mbps
38.88 MHz
The SLK2501 has four operational modes controlled by two configuration pins. These operational modes are
listed in Table 3. When the device is put in a certain mode, unused circuit blocks are powered down to conserve
the system power.
While the transceiver mode, transmit only mode, and receive only mode are straightforward, the repeater mode
of operation is shown in Figure 5. The receive serial data is recovered by the extracted clock, and it is then sent
back out on the transmit serial outputs. The data eye is open both vertically and horizontally in this process. In
the repeater mode, user can select to turn on the RX demux function through RX_MONITOR pin and allow the
parallel data to be presented. This feature enables the repeater device not only to repeat but also to listen in.
Table 3. Operational Modes
MODE
CONFIG0
CONFIG1
DESCRIPTION
1
0
0
Full duplex transceiver mode
2
0
1
Transmit only mode
3
1
0
Receive only mode
4
1
1
Repeater mode
high-speed electrical interface
The high-speed serial I/O uses a PECL compatible interface. The line could be directly coupled or ac-coupled.
Refer to Figures 10 and 11 for configuration details. As shown in the figures, an on-chip 100-Ω termination
resistor is placed differentially at the receive end.
The PECL output also provide preemphasis for compensating ac loss when driving a cable or PCB backplane
over long distance. The level of the preemphasis is programmable via PRE1 and PRE2 pins. Users can use
software to control the strength of the preemphasis to optimize the device for a specific system requirement.
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SLLS502A – OCTOBER 2001 – REVISED NOVEMBER 2001
detailed description (continued)
Table 4. Programmable De-emphasis
DE-EMPHASIS LEVEL
(Vodp/Vodd†–1)
PRE1
PRE2
0
0
De-emphasis disabled
1
0
10%
0
1
20%
1
1
30%
† Vodp: Differential voltage swing when there is a transition in the data stream.
Vodd: Differential voltage swing when there is no transition in the data stream.
V(ODp)
V(ODd)
V(ODd)
0
Bit
Time
Bit
Time
V(ODp)
Figure 1. Output Differential Voltage Under De-emphasis
LVDS parallel data interface
The parallel data interface consists of a 4-bit parallel LVDS data and clock. The device conforms to OIF99.102
specification when operating at the OC-48 rate. When operating at lower serial rates the clock and data
frequency are scaled down accordingly, as indicated in Table 1. The parallel data TXDATA[0:3] is latched on
the rising edge of the TXCLK and then is sent to a data FIFO to resolve any phase difference between TXCLK
and REFCLK. If there is a FIFO overflow condition, the pin SPILL is set high. The FIFO resets itself to realign
between two clocks. The internal PLL for the clock synthesizer is locked to the REFCLK, and it is used as the
timing to serialize the parallel data(except for the loop timing mode where the recovered clock is used). On the
receive side, RXDATA[0:3] is updated on the rising edge of RXCLK. Figures 7 and 8 show the timing diagram
for the parallel interface.
The SLK2501 also has a built-in parity checker and generator for error detection of the LVDS interface. On the
transmit side, it accepts the parity bit, TXPARP/N, and performs the parity checking function for even parity. If
an error is detected, it pulses the PAR_VALID pin low for two clock cycles. On the receive side, the parity bit,
RXPARP/N, is generated for the downstream device for parity error checking.
Differential termination 100-Ω resistors are included on-chip between TXDATAP/N and TXCLKP/N.
reference clock
The device accepts a 622.08 MHz clock. The REFCLK input is compatible with the LVDS level and also the 3.3-V
LVPECL level using ac-coupling. A 100-Ω differential termination resistor is included on-chip, as well as a dc
biasing circuit (3 kΩ to VDD and 4.5 kΩ to GND) for the ac-coupled case. A high quality REFCLK must be used
on systems required to meet SONET/SDH standards. For non-SONET/SDH compliant systems, loose
tolerances may be used.
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POST OFFICE BOX 655303
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SLLS502A – OCTOBER 2001 – REVISED NOVEMBER 2001
detailed description (continued)
clock and data recovery
The CDR unit of SLK2501 recovers the clock and data from the incoming data streams.
In the event of receive data loss, the PLL automatically locks to the local REFCLK to maintain frequency stability.
If the frequency of the data differs by more that 100 ppm with respect to the REFCLK frequency, the LOL pin
is asserted as a warning. Actual loss of lock occurs if the data frequency differs by more than 170 ppm.
minimum transition density
The loop filter transfer function is optimized to enable the CDR to track ppm difference in the clocking and
tolerate the minimum transition density that can be received in a SONET data signal (±20 ppm). The transfer
function yields a typical capture time of 3500 bit times for random incoming NRZ data after the device is powered
up and achieves frequency locking.
The device tolerates up to 72 consecutive digits (CID) without sustaining an error.
jitter transfer
20 Log (Jitter In/Jitter Out) – dB
The jitter transfer is less than the mask shown in Figure 2 (GR-253 Figure 5-27). Jitter transfer function is defined
as the ratio of jitter on the output signal to the jitter applied on the input signal versus frequency. The input
sinusoidal jitter amplitude is applied up to the mask level in the jitter tolerance requirement (see Figure 3).
P
Slop = –20 dB / Decade
fc
(kHz)
P
(dB)
130
0.1
12
500
0.1
24
Not Specified
48
2000
OC-N/STS-N
LEVEL
3
0.1
fc
Frequency – kHz
Figure 2. Jitter Transfer
jitter tolerance
Input jitter tolerance is defined as the peak to peak amplitude of sinusoidal jitter applied on the input signal that
causes the equivalent 1 dB optical/electrical power penalty. This refers to the ability of the device to withstand
input jitter without causing a recovered data error. The device has a jitter tolerance that exceeds the mask shown
in Figure 3 (GR-253 Figure 5-28). This jitter tolerance is specified using a pseudorandom data pattern of
231 –1.
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SLLS502A – OCTOBER 2001 – REVISED NOVEMBER 2001
Input Jitter Amplitude – UIpp
jitter tolerance (continued)
A3
Slope = –20 dB / Decade
A2
Slope = –20 dB / Decade
A1
f0
f1
f2
f3
f4
Frequency – Hz
OC-N/STS-N
LEVEL
f0
(Hz)
F1
(Hz)
F2
(Hz)
F3
(kHz)
F4
(kHz)
A1
(Ulpp)
A2
(Ulpp)
A3
(Ulpp)
3
10
30
300
6.5
65
0.15
1.5
15
12
10
30
300
25
250
0.15
1.5
15
0.15
1.5
15
24
48
Not specified
10
600
6000
100
1000
Figure 3. Input Jitter Tolerance
jitter generation
The jitter of a serial clock and serial data outputs must not exceed 0.01 UI rms/0.1 UIp-p when a serial data with
no jitter is presented to the inputs. The measurement bandwidth for intrinsic jitter is 12-kHz to 20-MHz.
loop timing mode
When LOOPTIME is high, the clock synthesizer used to serialize the transmit data is bypassed and the timing
is provided by the recovered clock. However, REFCLK is still needed for the recovery loop operation.
loss of lock indicator
The SLK2501 has a lock detection circuit to monitor the integrity of the data input. When the clock recovery loop
is locked to the input serial data stream, the LOL signal goes high. If the recovered clock frequency deviates
from the reference clock frequency by more than 100 ppm, LOL goes low. If the data stream clock rate deviates
by more than 170 ppm, loss of lock occurs. If the data streams clock rate deviates more than 500 ppm from the
local reference clock, the LOL output status might be unstable. Upon power up, the LOL goes low until the PLL
is close to phase lock with the local reference clock.
loss of signal
The loss of signal (LOS) alarm is set high when no transitions appear in the input data path for more than 2.3 µs.
The LOS signal becomes active when the above condition occurs. If the serial inputs of the device are
ac-coupled to its source, the ac-couple cap needs to be big enough to maintain a signal level above the threshold
of the receiver for the 2.3 µs no transition period. Once activated, the LOS alarm pin is latched high until the
receiver detects an A1A2 pattern. The recovered clock (RXCLK) is automatically locked to the local reference
when LOS occurs. The parallel data (RXDATAx) may still be processed even when LOS is activated.
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detailed description (continued)
signal detect
The SLK2501 has an input SIGDET pin to force the device into the loss of signal state. This pin is generally
connected to the signal detect output of the optical receiver. Depending on the optics manufacturer, this signal
can be either active high or active low. To accommodate the differences, a polarity select (PS) is used. For an
active low, SIGDET input sets the PS pin high. For an active high, SIGDET input sets the PS pin low. When the
PS signal pin and SIGDET are of opposite polarities, the loss of signal state is generated and the device
transmits all zeroes downstream.
multiplexer operation
The 4-bit parallel LVDS data is clocked into an input buffer by a clock derived from the synthesized clock. The
data is then clocked into a 4:1 multiplexer. The D0 bit is the most significant bit and is shifted out first in the serial
output stream.
demultiplexer operation
The serial 2.5 Gbps data is clocked into a 1:4 demultiplexer by the recovered clock. The D0 bit is the first bit
that is received in time from the input serial stream. The 4-bit parallel data is then sent to the LVDS driver along
with the divided down recovered clock.
frame synchronization
The SLK2501 has a SONET/SDH-compatible frame detection circuit that can be enabled or disabled by the
user. Frame detection is enabled when the FRAMEN pin is high. When enabled it detects the A1, A2 framing
pattern, which is used to locate and align the byte and frame boundaries of the incoming data stream. When
FRAMEN is low the frame detection circuitry is disabled and the byte boundary is frozen to the location found
when detection was previously enabled.
The frame detect circuit searches the incoming data for three consecutive A1 bytes followed immediately by
one A2 byte. The data alignment circuit then aligns the parallel output data to the byte and frame boundaries
of the incoming data stream. During the framing process the parallel data bus will not contain valid and aligned
data. Upon detecting the third A1, A2 framing patterns that are separated by 125 µs from each other, the FSYNC
signal goes high for four RXCLK cycles, indicating frame synchronization has been achieved.
The probability that random data in a SONET/SDH data stream will mimic the framing pattern in the data payload
is extremely low. However, there is a state machine built in to prevent false reframing if a framing pattern does
show up in the data payload.
testability
The SLK2501 has a comprehensive suite of built-in self-tests. The Loopback function provides for at-speed
testing of the transmit/receive portions of the circuitry. The enable pin allows for all circuitry to be disabled so
that an Iddq test can be performed. The PRBS function allows for a BIST (built-in self-test).
IDDQ function
When held low, the ENABLE pin disables all quiescent power in both the analog and digital circuitry. This allows
for Iddq testing on all power supplies and can also be used to conserve power when the link is inactive.
local loopback
The LLOOP signal pin controls the local loopback. When LLOOP is high, the loopback mode is activated and
the parallel transmit data is selected and presented on the parallel receive data output pins. The parallel transmit
data is also multiplexed and presented on the high-speed serial transmit pins. Local Loopback can only be
enabled when the device is under transceiver mode.
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SLLS502A – OCTOBER 2001 – REVISED NOVEMBER 2001
detailed description (continued)
SRXDIP
D
SRXDIN
RXDATA (3–0)
1:4 Serial to
Parallel
Recovered Clock
RXCLK
LLOOP
TXDATA (3–0)
STXDOP
D
STXDON
4:1 Parallel to
Serial
TXCLK
2.488 GHz
PLL
Figure 4. Local Loopback Data Path
remote loopback
The RLOOP signal pin controls the remote loopback. When RLOOP is high the serial receive data is selected
and presented on the serial transmit data output pins. The serial received data is also demultiplexed and
presented on the parallel receive data pins. The remote loop can be enabled only when the device is under
transceiver mode. When the device is put under the repeater mode with RX_MONITOR high, it performs the
same function as remote loopback.
SRXDIP
SRXDIN
D
RXDATA (3–0)
1:4 Serial to
Parallel
RXCLK
Recovered Clock
STXDOP
D
STXDON
4:1 Parallel to
Serial
2.488 GHz
PLL
LLOOP
Figure 5. Remote Loopback Data Path/Repeater Mode Operation
PRBS
The SLK2501 has two built-in pseudorandom bit stream (PRBS) functions. The PRBS generator is used to
transmit a PRBS signal. The PRBS verifier is used to check and verify a received PRBS signal.
When the PRBSEN pin is high, the PRBS generator and verifier are both enabled. A PRBS is generated and
fed into the parallel transmitter input bus. Data from the normal input source is ignored in PRBS mode. The
PBRS pattern is then fed through the transmitter circuitry as if it was normal data and sent out by the transmitter.
The output can be sent to a bit error rate tester (BERT) or to the receiver of another SLK2501. If an error occurs
in the PRBS pattern, the PRBSPASS pin is set low for two RXCLKP/N cycles.
12
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detailed description (continued)
power-on reset
Upon application of minimum valid power, the SLK2501 generates a power-on reset. During the power-on reset
the PRXDATA[0:3] signal pins goes to 3-state. RXCLKP and RXCLKN are held low. The length of the power-on
reset cycle is dependent upon the REFCLKP and REFCLKN frequency but is less than 1-ms in duration.
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
Supply voltage, VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 to 3 V
Voltage range: TTL input terminals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 to 4 V
LVDS terminals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 to 3 V
Any other terminal except above . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 to VDD + 0.3 V
Package power dissipation, PD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table
Storage temperature, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
Electrostatic discharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . HBM: 2 kv
Characterized free-air operating temperature range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to 85°C
Lead temperature 1.6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATING TABLE
PACKAGE
PZP‡
PZP¶
TA ≤25°C
POWER RATING
DERATING FACTOR§
ABOVE TA = 25°C
33.78 mW/°C
3.4 W
TA = 85°C
POWER RATING
1.3 W
2.27 W
22.78 mW/°C
‡ 2 oz trace and copper pad with solder.
§ This is the inverse of the traditional junction-to-ambient thermal resistance (RθJA).
¶ 2 oz trace and copper pad without solder.
0.911 W
recommended operating conditions
PARAMETER
TEST CONDITIONS
Supply voltage, VDD
Power dissipation, PD
Frequency = 2.488 Gb/sec,
Shutdown current
Enable = 0,
MIN
NOM
MAX
2.3
2.5
2.7
V
700
900
mW
PRBS pattern
Vdda, Vdd pins,
Vdd = max
Operating free-air temperature, TA
µA
20
–40
UNIT
85
°C
start up sequence
To ensure proper start up, follow one of the following steps when powering up the SLK2501.
1. Keep ENABLE (pin 44) low until power supplies and reference clock have become stable.
2. Drive ENABLE (pin 44) low for at least 30 ns after power supplies and reference clock have become stable.
The following step is recommended with either of the above two sequences.
3. Drive RESET low for at least 10 ns after link has become stable to center the TXFIFO.
POST OFFICE BOX 655303
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SLLS502A – OCTOBER 2001 – REVISED NOVEMBER 2001
electrical characteristics over recommended operating conditions (unless otherwise noted)
TTL
PARAMETER
VIH
VIL
High-level input voltage
IIH
IIL
Input high current
VOH
VOL
High-level output voltage
CI
Input capacitance
TEST CONDITIONS
MIN
TYP
2
3.6
Low-level input voltage
VDD = MAX,
VDD = MAX,
Input low current
VIN = 2 V
VIN = 4 V
IOH = –1 mA
IOH = 1 mA
Low-level output voltage
MAX
V
0.80
V
40
µA
µA
–40
2.10
UNIT
2.3
0.25
V
0.5
V
4
pF
LVDS input signals
PARAMETER
TEST CONDITIONS
MIN
VI
VID(th)
Input voltage
825
Input differential threshold voltage
100
CI
Input capacitance
RI
Input differential impedance
On-chip termination
tsu
th
Input setup time requirement
See Figure 8
Input hold time requirement
See Figure 8
T(duty)
Input clock duty cycle
TYP
MAX
UNIT
1575
mV
mV
3
80
100
120
300
pF
Ω
ps
300
ps
40%
60%
LVDS output signals
PARAMETER
VOD
VOS
Output differential voltage
∆VOD
∆VOS
Change VOD between 1 and 0
Output common mode voltage
t(cq_max)
tr/tf
RL = 100 ±1%
MIN
TYP
MAX
300
800
1070
1375
25
Change VOS between 1 and 0
I(SP), I(SN),
I(SPN)
Ioff
t(cq_min)
TEST CONDITIONS
UNIT
mV
25
Output short circuit current
Outputs shorted to ground or shorted together
Power-off current
VDD = 0 V
24
mA
10
µA
100
Clock output time
Clock-output
See Figure 7
Output transition time
20%to80%
100
Output clock duty cycle
ps
100
300
45%
55%
4
7
Bit
times
MAX
UNIT
20
ppm
Data output to FRAME_SYNC delay
ps
timing requirements over recommended operating conditions (unless otherwise noted)
reference clock (REFCLK)
PARAMETER
TEST CONDITIONS
Frequency tolerance†
MIN
TYP
–20
Duty cycle
40%
Jitter
12 kHz to 20 MHz
50%
60%
3
ps rms
Frequency range absolute value
622.08
MHz
† The ±20 ppm tolerance is required to meet SONET/SDH requirements. For non-SONET/SDH compliant systems, looser tolerances may apply.
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SLLS502A – OCTOBER 2001 – REVISED NOVEMBER 2001
PLL performance specifications
PARAMETER
TEST CONDITIONS
MIN
PLL startup lock time
VDD, VDDC = 2.3 V, After REFCLK is stable
Acquisition lock time
Valid SONET signal or PRBS OC-48
TYP
MAX
1
UNIT
ms
Bit
Times
2031
serial transmitter/receiver characteristics
PARAMETER
TEST CONDITIONS
Vodd = |STXDOP–STXDON|, transmit
output
differential out
ut voltage under
preemphasis
V(CMT)
Transmit common mode voltage range
PRE1 = 0,
PRE2 = 0,
See Table 4 and Figure 1
MIN
Rt = 50,
NOM
MAX
UNIT
650
850
1000
mV
PRE1 = 1,
PRE2 = 0
550
750
900
PRE1 = 0,
PRE2 = 1
540
700
860
PRE1 = 1,
PRE2 = 1
500
650
800
1100
1250
1400
Rt = 50 Ω
Receiver Input voltage requirement,
Vid=|SRXDIP–SRXDIN|
150
V(CMR)
Il
Receiver common mode voltage range
1100
Receiver input leakage
–550
Rl
CI
Receiver differential impedance
mV
mV
mV
1250
2250
mV
550
µA
120
Ω
1
pF
td(TX_Latency)
50
td(RX_Latency)
50
Bit
Times
80
100
Receiver input capacitance
serial differential switching characteristics over recommended operating conditions (unless
otherwise noted)
PARAMETER
tt
tj
TEST CONDITIONS
Output jitter
RL = 50 Ω,
Jitter-free data,
12 kHz to 20 MHz, RLOOP = 1
Jitter tolerance
RLOOP = 1
See Figure 3
Jitter transfer
RLOOP = 1
See Figure 2
Differential signal rise time (20% to 80%)
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MIN
TYP
MAX
80
100
140
UNIT
ps
0.05
0.1
UI(pp)
15
SLLS502A – OCTOBER 2001 – REVISED NOVEMBER 2001
TYPICAL CHARACTERISTICS
49.9 Ω
VOD
49.9 Ω
VOS
CL = 5 pF MAX
100%
80%
VOD(H)
0V
VOD(L)
20%
0%
tr
tf
Figure 6. Test Load and Voltage Definitions for LVDS Outputs
RXCLKP
t(cq_min)
t(cq_max)
RXDATA
P/N
Figure 7. LVDS Output Waveform
TXCLKP
tsu
th
TXDATA
P/N
Figure 8. LVDS Input Waveform
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APPLICATION INFORMATION
50 Ω
CL
5 pF
50 Ω
CL
5 pF
Figure 9. Transmitter Test Setup
VDD
TXP
50
5 kΩ
RXP
5 kΩ
VDD
100 Ω
TXN
50
GND
+
_
5 kΩ
RXN
5 kΩ
GND
Transmitter
Media
Receiver
Figure 10. High-Speed I/O Directly Coupled Mode
VDD
TXP
5 kΩ
RXP
50
5 kΩ
100 Ω
TXN
VDD
GND
5 kΩ
RXN
50
+
_
5 kΩ
GND
Transmitter
Media
Receiver
Figure 11. High-Speed I/O AC Coupled Mode
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SLLS502A – OCTOBER 2001 – REVISED NOVEMBER 2001
APPLICATION INFORMATION
designing with the PowerPad package
The SLK2501 is housed in high-performance, thermally enhanced, 100-pin PZP PowerPAD packages. Use of
a PowerPAD package does not require any special considerations except to note that the PowerPAD, which
is an exposed die pad on the bottom of the device, is a metallic thermal and electrical conductor. Correct device
operation requires that the PowerPAD be soldered to the thermal land. Do not run any etches or signal vias
under the device, but have only a grounded thermal land, as explained below. Although the actual size of the
exposed die pad may vary, the minimum size required for the keepout area for the 100-pin PZP PowerPAD
package is 12 mm × 12 mm.
A thermal land, which is an area of solder-tinned-copper, is required underneath the PowerPAD package. The
thermal land varies in size depending on the PowerPAD package being used, the PCB construction, and the
amount of heat that needs to be removed. In addition, the thermal land may or may not contain numerous
thermal vias, depending on PCB construction.
Other requirements for thermal lands and thermal vias are detailed in the TI application note PowerPAD
Thermally Enhanced Package Application Report, TI literature number SLMA002, available via the TI Web
pages beginning at URL http://www.ti.com.
Figure 12. Example of a Thermal Land
For the SLK2501, this thermal land should be grounded to the low-impedance ground plane of the device. This
improves not only thermal performance but also the electrical grounding of the device. It is also recommended
that the device ground terminal landing pads be connected directly to the grounded thermal land. The land size
should be as large as possible without shorting device signal terminals. The thermal land may be soldered to
the exposed PowerPAD using standard reflow soldering techniques.
While the thermal land may be electrically floated and configured to remove heat to an external heat sink, it is
recommended that the thermal land be connected to the low-impedance ground plane of the device. More
information may be obtained from the TI application note PHY Layout, TI literature number SLLA020.
18
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SLLS502A – OCTOBER 2001 – REVISED NOVEMBER 2001
MECHANICAL DATA
PZP (S-PQFP-G100)
PowerPAD PLASTIC QUAD FLATPACK
0,27
0,17
0,50
75
0,08 M
51
50
76
Thermal Pad
(see Note D)
26
100
0,13 NOM
1
25
12,00 TYP
Gage Plane
14,20
SQ
13,80
16,20
SQ
15,80
0,25
0,15
0,05
1,05
0,95
0°–ā7°
0,75
0,45
Seating Plane
0,08
1,20 MAX
4146929/A 04/99
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion.
The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane.
This pad is electrically and thermally connected to the backside of the die and possibly selected leads.
E. Falls within JEDEC MS-026
For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm
PowerPAD is a trademark of Texas Instruments.
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19
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Copyright  2001, Texas Instruments Incorporated