REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with N.O.R. 5962-R062-94. 93-12-06 M. A. FRYE B Redrawn. Add case outline X. Technical and editorial changes throughout. 95-03-24 M. A. FRYE C Drawing updated to reflect current requirements. - ro 01-10-02 R. MONNIN REV SHEET REV SHEET REV STATUS REV C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY DAN WONNELL STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216 http://www.dscc.dla.mil CHECKED BY SANDRA ROONEY APPROVED BY MICHAEL A. FRYE MICROCIRCUIT, LINEAR, ANALOG SWITCH, MONOLITHIC SILICON DRAWING APPROVAL DATE 93-05-06 REVISION LEVEL C SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. 1 OF 5962-90737 13 5962-E640-01 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 90737 Federal stock class designator \ RHA designator (see 1.2.1) 01 M P X Device type (see 1.2.2) Device class designator (see 1.2.3) Case outline (see 1.2.4) Lead finish (see 1.2.5) / \/ Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 01 02 03 Circuit function DG417A DG418A DG419A CMOS, SPST analog switch CMOS, SPST analog switch CMOS, SPST analog switch 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, nonJAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter H P X Descriptive designator Terminals GDFP1-F10 or CDFP2-F10 GDIP1-T8 or CDIP2-T8 CDFP3-F10 10 8 10 Package style Flat pack Dual-in-line Flat pack 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-90737 A REVISION LEVEL C SHEET 2 1.3 Absolute maximum ratings. 1/ Supply voltage between V+ and V- ........................................ Supply voltage between GND and V-..................................... Digital inputs range to V- ....................................................... Digital input range VS, VD to V- ............................................ 44 V dc 25 V dc (GND -0.3 V dc) to 44 V dc 2/ (V-) -2 V dc to (V+) +2 V dc or 30 mA, whichever occurs first 2/ Current (any terminal except for S and D) continuous ........... 30 mA Current (S or D) pulsed, 1 ms, 10% duty cycle ...................... 100 mA Power dissipation (PD): Cases H and X, at +70°C .................................................. 421 mW 3/ Case P at +75°C ............................................................... 600 mW 3/ Junction temperature (TJ) ...................................................... +175°C Lead temperature (soldering, 10 seconds ) ........................... +300°C Storage temperature range .................................................... -65°C to +150°C Thermal resistance, junction-to-case (θJC) ...........................See MIL-STD-1835 1.4 Recommended operating conditions. Positive supply voltage (V+)................................................... +15 V dc Negative supply voltage (V-) .................................................. -15 V dc Logic supply voltage (VL) ....................................................... 5 V dc Ambient operating temperature range (TA)............................ -55°C to +125°C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. ______ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Signals on SX, DX, or INX exceeding V+ or V- will be clamped by internal diodes. Limit forward diode current to the maximum current ratings. 3/ For case outlines H and X, derate above TA = +70°C linearly at 5.26 mW/°C. For case outline P, derate above TA = +75°C linearly at 12 mW/°C. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-90737 A REVISION LEVEL C SHEET 3 HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth tables. The truth tables shall be as specified on figure 2. 3.3 Electrical performance characteristics and post irradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and post irradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-90737 A REVISION LEVEL C SHEET 4 TABLE I. Electrical performance characteristics. Test Drain-source ON resistance Symbol rDS(ON) Conditions 1/ -55°C ≤ TA ≤ +125°C unless otherwise specified Group A subgroups 1 IS = -10 mA, VD = ±12.5 V, Device type 01 Limits Unit Min Max 2.5 35 2.5 45 2.5 35 2.5 45 2.5 35 2.5 45 Ω VIN = 0.8 V, V+ = +13.5 V, V- = -13.5 V 2,3 IS = -10 mA, VD = ±12.5 V, 1 02 VIN = 2.4 V, V+ = +13.5 V, V- = -13.5 V IS = -10 mA, 2,3 1 2/ 03 VD = ±12.5 V, 2,3 VIN = 0.8 V, 2.4 V, V+ = +13.5 V, V- = -13.5 V Source OFF leakage current IS(OFF) 1 VD = ±15.5 V, ±0.25 01 nA VS = ±15.5 V, VIN = 2.4 V, V+ = +16.5 V, V- = -16.5 V ±20 2,3 1 VD = ±15.5 V, ±0.25 02 VS = ±15.5 V, VIN = 0.8 V, V+ = +16.5 V, V- = -16.5 V VD = ±15.5 V, ±20 2,3 1 2/ ±0.25 03 VS = ±15.5 V, ±20 2,3 VIN = 0.8 V, 2.4 V, V+ = +16.5 V, V- = -16.5 V Drain OFF leakage current ID(OFF) 1 VD = ±15.5 V, ±0.25 01 nA VS = ±15.5 V, VIN = 2.4 V, V+ = +16.5 V, V- = -16.5 V ±20 2,3 1 VD = ±15.5 V, ±0.25 02 VS = ±15.5 V, VIN = 0.8 V, V+ = +16.5 V, V- = -16.5 V ±20 2,3 See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-90737 A REVISION LEVEL C SHEET 5 TABLE I. Electrical performance characteristics – Continued. Test Symbol Conditions 1/ -55°C ≤ TA ≤ +125°C unless otherwise specified Group A subgroups Device type Limits Min Drain OFF leakage current ID(OFF) VD = ±15.5 V, 1 2/ Unit Max ±0.75 03 nA VS = ±15.5 V, ±60 2,3 VIN = 0.8 V, 2.4 V, V+ = +16.5 V, V- = -16.5 V Drain ON leakage current ID(ON) 1 VD = ±15.5 V, ±0.4 01 nA VS = ±15.5 V, VIN = 0.8 V, V+ = +16.5 V, V- = -16.5 V ±40 2,3 1 VD = ±15.5 V, ±0.4 02 VS = ±15.5 V, VIN = 2.4 V, V+ = +16.5 V, V- = -16.5 V VD = ±15.5 V, ±40 2,3 1 2/ ±0.75 03 VS = ±15.5 V, ±60 2,3 VIN = 0.8 V, 2.4 V, V+ = +16.5 V, V- = -16.5 V Logic input current, input voltage low IIL VIN = 0.8 V 1,2,3 All ±0.5 µA Logic input current, input voltage high IIH VIN = 2.4 V 1,2,3 All ±0.5 µA Turn-ON time tON RL = 300 Ω, CL = 35 pF, 9 01,02 10 175 ns VS = ±10 V, see figure 3 10,11 10 250 RL = 300 Ω, CL = 35 pF, 9 10 145 VS = ±10 V, see figure 3 10,11 10 210 RL = 300 Ω, CL = 35 pF, 9 10 175 10 250 Turn-OFF time Transition time tOFF ttrans 01,02 03 10,11 VS1 = ±10 V, VS2 = ±10 V, ns ns see figures 4 and 6 See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-90737 A REVISION LEVEL C SHEET 6 TABLE I. Electrical performance characteristics – Continued. Test Break-before-make time delay Symbol tD Conditions 1/ -55°C ≤ TA ≤ +125°C unless otherwise specified Group A subgroups RL = 300 Ω, CL = 36 pF, Device type 9 03 7,8 All 1 All Limits Unit Min Max 5 150 ns ±1 µA VS1 = VS2 = ±10 V, TA = +25°C, see figures 5 and 6 Functional tests FT See 4.4.1c Positive supply current I+ V+ = +16.5 V, V- = -16.5 V, Negative supply current I- V+ = +16.5 V, V- = -16.5 V, 1 IL V+ = +16.5 V, V- = -16.5 V, 1 IGND V+ = +16.5 V, V- = -16.5 V, 1 ±1 All µA ±5 ±1 All µA ±5 2,3 VIN = 0 V, 5 V µA ±5 2,3 VIN = 0 V, 5 V Ground current ±1 All 2,3 VIN = 0 V, 5 V Logic supply current ±5 2,3 VIN = 0 V, 5 V 1/ Unless otherwise specified, V+ = +15 V, V- = -15 V, VL = 5 V, and GND = 0 V. 2/ VIN = input voltage to perform proper function. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change as defined in MIL-PRF-38535, appendix A. 3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 82 (see MIL-PRF-38535, appendix A). STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-90737 A REVISION LEVEL C SHEET 7 Device types 01 Case outlines 02 03 01 02 H and X 03 P Terminal number 1 Terminal number S S D S D D 2 NC NC S1 NC NC S1 3 GND GND GND GND GND GND 4 V+ V+ V+ V+ V+ V+ 5 NC NC NC VL VL VL 6 NC NC NC IN IN IN 7 VL VL VL V- V- V- 8 IN IN IN D S S2 9 V- V- V- --- --- --- 10 D D S2 --- --- --- NC = No connection FIGURE 1. Terminal connections. Device type 01 Device type 02 Device type 03 Logic Switch Logic Switch Logic Switch 1 Switch 2 0 ON 0 OFF 0 ON OFF 1 OFF 1 ON 1 OFF ON NOTE: Logic “0” ≤ 0.8 V, logic “1” ≥ 2.4 V. FIGURE 2. Truth table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-90737 A REVISION LEVEL C SHEET 8 FIGURE 3. Timing diagram. FIGURE 4. Transition time. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-90737 A REVISION LEVEL C SHEET 9 FIGURE 5. Break-before-make time delay. FIGURE 6. Transition time and break-before-make time delay test circuit. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-90737 A REVISION LEVEL C SHEET 10 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015. (2) TA = +125°C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein. 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table II herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF-38535, appendix B. 4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, and 6 in table I, method 5005 of MIL-STD-883 shall be omitted. c. For device class M, subgroups 7 and 8 tests shall be sufficient to verify the truth table. For device classes Q and V, subgroups 7 and 8 shall include verifying the truth table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-90737 A REVISION LEVEL C SHEET 11 TABLE II. Electrical test requirements. Test requirements Interim electrical parameters (see 4.2) Final electrical parameters (see 4.2) Group A test requirements (see 4.4) Group C end-point electrical parameters (see 4.4) Group D end-point electrical parameters (see 4.4) Group E end-point electrical parameters (see 4.4) Subgroups (in accordance with MIL-STD-883, method 5005, table I) Device class M 1 Subgroups (in accordance with MIL-PRF-38535, table III) Device class Q Device class V 1 1 1 1,2,3,7,8, 1/ 9,10,11 1,2,3,7,8, 9,10,11 1 1,2,3,7,8, 2/ 9,10,11 1,2,3,7,8, 9,10,11 1,2,3 1 1 1 1,2,3,7,8, 1/ 9,10,11 1,2,3,7,8,9,10,11 --- --- --- 1/ PDA applies to subgroup 1. 2/ PDA applies to subgroups 1 and 7. 4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table II herein. 4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883: a. Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883. b. TA = +125°C, minimum. c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883. 4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table II herein. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-90737 A REVISION LEVEL C SHEET 12 4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). a. End-point electrical parameters shall be as specified in table II herein. b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device classes must meet the post irradiation end-point electrical parameter limits as defined in table I at TA = +25°C ±5°C, after exposure, to the subgroups specified in table II herein. c. When specified in the purchase order or contract, a copy of the RHA delta limits shall be supplied. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor prepared specification or drawing. 6.1.2 Substitutability. Device class Q devices will replace device class M devices. 6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus when a system application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.4 Comments. Comments on this drawing should be directed to DSCC-VA , Columbus, Ohio 43216-5000, or telephone (614) 692-0547. 6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535 and MIL-HDBK-1331. 6.6 Sources of supply. 6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535. The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and have agreed to this drawing. 6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DSCC-VA. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-90737 A REVISION LEVEL C SHEET 13 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 01-10-02 Approved sources of supply for SMD 5962-90737 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 during the next revision. MIL-HDBK-103 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next dated revision of MIL-HDBK-103. Standard microcircuit drawing PIN 1/ 5962-9073701MHA Vendor CAGE number 3/ Vendor similar PIN 2/ DG417AL/883B 5962-9073701MPA 1ES66 DG417AK/883B 17856 DG417AK/883 5962-9073701MXC 1ES66 DG417AL/883B 5962-9073702MHA 3/ DG418AL/883B 5962-9073702MPA 1ES66 DG418AK/883B 17856 DG418AK/883 5962-9073702MXC 1ES66 DG418AL/883B 5962-9073703MHA 3/ DG419AL/883B 5962-9073703MPA 1ES66 DG419AK/883B 17856 DG419AK/883 1ES66 DG419AL/883B 5962-9073703MXC 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. 3/ Not available from an approved source of supply. 1 of 2 STANDARD MICROCIRCUIT DRAWING BULLETIN - CONTINUED Vendor CAGE number Vendor name and address 1ES66 Maxim Integrated Products 120 San Gabriel Drive Sunnyvale, CA 94086-5125 17856 Siliconix, Incorporated 2201 Laurelwood Road Santa Clara, CA 95054-1516 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin. 2 of 2