ETC 5962-9459301VPA

REVISIONS
LTR
DESCRIPTION
DATE (YR-MO-DA)
APPROVED
A
Changes in accordance with N.O.R. 5962-R179-96.
96-07-11
M. A. FRYE
B
Drawing updated to reflect current requirements. - ro
00-12-20
R. MONNIN
C
Add case outline “H” and radiation hardness requirements. - gt
02-07-31
R. MONNIN
`
REV
SHEET
REV
SHEET
REV STATUS
REV
C
C
C
C
C
C
C
C
C
C
OF SHEETS
SHEET
1
2
3
4
5
6
7
8
9
10
PMIC N/A
PREPARED BY
RICK OFFICER
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
http://www.dscc.dla.mil
CHECKED BY
RAJESH PITHADIA
APPROVED BY
MICHAEL FRYE
DRAWING APPROVAL DATE
96-04-29
REVISION LEVEL
C
MICROCIRCUIT, LINEAR, 800 MHz, CURRENT
FEEDBACK AMPLIFIER, MONOLITHIC
SILICON
SIZE
CAGE CODE
A
67268
SHEET
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
1 OF
5962-94593
10
5962-E428-02
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and
M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the
Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the
PIN.
1.2 PIN. The PIN is as shown in the following example:
5962



Federal
stock class
designator
\



RHA
designator
(see 1.2.1)
94593
01



Device
type
(see 1.2.2)
/
M



Device
class
designator
(see 1.2.3)
P



Case
outline
(see 1.2.4)
X



Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and
are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
Generic number
01
Circuit function
AD8001
800 MHz, current feedback amplifier
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
M
Q or V
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant,
non-JAN class level B microcircuits in accordance with MIL-PRF-38535,
appendix A
Certification and qualification to MIL-PRF-38535
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
Terminals
Package style
P
H
GDIP1-T8 or CDIP2-T8
GDFP1-F10
8
10
Dual-in-line
Flat pack
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-94593
A
REVISION LEVEL
C
SHEET
2
1.3 Absolute maximum ratings. 1/
Supply voltage (VS) ........................................................................................ 12.6 V
Input voltage (common mode) ........................................................................ ±VS
Differential input voltage ................................................................................. ±1.2 V
Power dissipation (PD) ................................................................................... 0.9 W 2/
Storage temperature range ............................................................................ -65°C to +150°C
Lead temperature range (soldering, 60 seconds) ........................................... +300°C
Thermal resistance, junction-to-case (θJC) .................................................... See MIL-STD-1835
Thermal resistance, junction-to-ambient (θJA)
Case P ...................................................................................................... 110°C/W
Case H ..................................................................................................... 120°C/W
1.4 Recommended operating conditions.
Supply voltage (VS) ........................................................................................ ±5 V
Ambient operating temperature range (TA) .................................................... -55°C to +125°C
1.5 Radiation features.
Maximum total dose available (dose rate = 50 – 300 rads(Si)/s) .................... 100 Krads(si) 3/
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in
the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
HANDBOOKS
1/
2/
3/
Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
Maximum internal power dissipation is specified so that the junction temperature dose not exceed +175°C.
Derate at 9mW/°C for TA > +32°C.
These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects.
Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883,
method 1019, condition A.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-94593
A
REVISION LEVEL
C
SHEET
3
DEPARTMENT OF DEFENSE
MIL-HDBK-103 MIL-HDBK-780 -
List of Standard Microcircuit Drawings (SMD's).
Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document
revision level control and shall be made available to the preparing and acquiring activity upon request.
3.3 Electrical performance characteristics and post irradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and post irradiation parameter limits are as specified in table I and shall apply over the
full ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space
limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the
RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535.
Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this
drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535
and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for
device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2
herein) involving devices acquired to this drawing is required for any change as defined in MIL-PRF-38535.
3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain
the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made
available onshore at the option of the reviewer.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-94593
A
REVISION LEVEL
C
SHEET
4
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions 1/ 2/ 3/
-55°C ≤ TA ≤ +125°C
unless otherwise specified
Group A
subgroups
Device
type
Limits
Min
DC performance section
Input offset voltage
1
VOS
M, D, P, L, R
Positive input bias current
M, D, P, L, R
Negative input bias current
M, D, P, L, R
Open loop transresistance
ROLT
6.5
9.0
4/
01
-6
+6
1
-10
10
2,3
-12
+12
-25
+25
01
1
-25
+25
2,3
-35
+35
4
VOUT = ±2.5 V
5.5
1
1
-IIB
Max
2,3
1
+IIB
01
Unit
01
250
5,6
mV
µA
µA
kΩ
175
Input characteristics section
Common mode rejection
ratio
4/
CMRR
1
VCM = ±2.5 V
01
50
2,3
dB
47
Output characteristics section
Output voltage swing
4/
Output current
4/
IOUT
Short circuit current
4/
IOS
Power supply operating 4/
range
Quiescent current
VPS
VOUT
1
RL = 150 Ω
01
2,3
-2.7
+2.7
-2.6
+2.6
V
RL = 37.5 Ω, TA = +25°C
1
01
50
mA
TA = +25°C
1
01
85
mA
1,2,3
01
±3
1
01
Power supply section
IQ
M, D, P, L, R
Power supply rejection
ratio
PSRR
V
5.5
mA
1
5.5
2,3
6.0
1,2,3
+VS = +4 V to +6 V,
±6
01
60
dB
-VS = -5 V
4/
-VS = -4 V to –6 V,
+VS = +5 V
1
50
2,3
47
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-94593
A
REVISION LEVEL
C
SHEET
5
TABLE I. Electrical performance characteristics – Continued.
Test
Symbol
Conditions 1/ 2/ 3/
-55°C ≤ TA ≤ +125°C
unless otherwise specified
Group A
subgroups
Device
type
Limits
Min
Unit
Max
Dynamic performance section
Small signal bandwidth
4/ 5/
SSBW
4
-3 dB, G = +2, RF = 750 Ω,
01
350
MHz
peaking < 0.1 dB,
TA = +25°C
650
-3 dB, G = +1, RF = 1 kΩ,
peaking < 1 dB,
TA = +25°C
Bandwidth for 0.1 dB
flatness
4/ 5/
BW
G = +2, RF = 750 Ω,
4
01
85
MHz
4
01
800
V/µs
TA = +25°C
Slew rate
4/
5/
SR
G = +2, VOUT = 2 V step,
TA = +25°C
960
G = -1, VOUT = 2 V step,
TA = +25°C
Noise and harmonic performance section
Differential gain error 4/ 5/
DGE
G = +2, RL = 150 Ω,
4
01
0.025
%
4
01
0.04
Degree
TA = +25°C
Differential phase error 4/ 5/ DPE
G = +2, RL = 150 Ω,
TA = +25°C
1/
Devices supplied to this drawing will meet all levels M, D, P, L, R of irradiation. However, this device is only tested at the
“R” level. Pre and Post irradiation values are identical unless otherwise specified in table I. When performing post
irradiation electrical measurements for any RHA level, TA = +25°C.
2/
These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects.
Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883,
method 1019, condition A.
3/
Unless otherwise specified, VS = ±5 V and RL = 100 Ω.
4/
Not tested post irradiation.
5/
If not tested, shall be guaranteed to the limits specified in table I herein.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-94593
A
REVISION LEVEL
C
SHEET
6
Device type
01
Case outline
P
H
Terminal
number
1
Terminal
symbol
NC
Terminal
symbol
NC
2
-INPUT
NC
3
+INPUT
-INPUT
4
-VS
+INPUT
5
NC
-VS
6
OUTPUT
NC
7
+VS
OUTPUT
8
NC
+VS
9
NC
10
NC
NC = no connection
FIGURE 1. Terminal connections.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-94593
A
REVISION LEVEL
C
SHEET
7
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 49 (see MIL-PRF-38535, appendix A).
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with
MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan
shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be
in accordance with MIL-PRF-38535, appendix A.
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted
on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in
accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.
4.2.1 Additional criteria for device class M.
a.
Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition B. The test circuit shall be maintained by the manufacturer under document revision level control
and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test
method 1015.
(2) TA = +125°C, minimum.
b.
Interim and final electrical test parameters shall be as specified in table IIA herein.
4.2.2 Additional criteria for device classes Q and V.
a.
The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the
device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under
document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test
method 1015 of MIL-STD-883.
b.
Interim and final electrical test parameters shall be as specified in table IIA herein.
c.
Additional screening for device class V beyond the requirements of device class Q shall be as specified in
MIL-PRF-38535, appendix B.
4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in
accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for
groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).
4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with
MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for
device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed
for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections
(see 4.4.1 through 4.4.4).
4.4.1 Group A inspection.
a.
Tests shall be as specified in table IIA herein.
b.
Subgroups 7, 8, 9, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-94593
A
REVISION LEVEL
C
SHEET
8
TABLE IIA. Electrical test requirements.
Test requirements
Subgroups
(in accordance with
MIL-PRF-38535, table III)
Subgroups
(in accordance with
MIL-STD-883,
method 5005, table I)
Interim electrical
parameters (see 4.2)
Device
class M
Device
class Q
Device
class V
---
---
---
Final electrical
parameters (see 4.2)
1,2,3,4,5,6 1/
1,2,3,4,5,6 1/
Group A test
requirements (see 4.4)
1,2,3,4,5,6
1,2,3,4,5,6
1,2,3,4,5,6
Group C end-point electrical
parameters (see 4.4)
1
1
1
Group D end-point electrical
parameters (see 4.4)
1
1
1
Group E end-point electrical
parameters (see 4.4)
---
---
1,2,3,4,5,6 1/ 2/
2/
1
1/ PDA applies to subgroup 1. Deltas excluded from PDA.
2/ See table IIB for delta parameters. See table I for conditions.
Table IIB. 240 burn-in and group C end-point electrical parameters.
Parameter
Device type
IQ
VOS
01
01
Burn-in
Limit
5.5 mA
±5.5 mV
Life test limit
Delta Limit
6.0 mA
±7.5 mV
0.55 mA
±2.0 mV
4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein.
4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883:
a.
Test condition B. The test circuit shall be maintained by the manufacturer under document revision level control and
shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs,
outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of
MIL-STD-883.
b.
TA = +125°C, minimum.
c.
Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature,
or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The
test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify
the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of
MIL-STD-883.
4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-94593
A
REVISION LEVEL
C
SHEET
9
4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness
assured (see 3.5 herein). RHA levels for device classes M, Q, and V shall be as specified in MIL-PRF-38535. End-point
electrical parameters shall be as specified in table IIA herein.
4.4.4 Total dose irradiation testing. Total dose irradiation testing shall be performed in accordance with MIL-STD-883
method 1019 condition A and as specified herein.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device
classes Q and V or MIL-PRF-38535, appendix A for device class M.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor
prepared specification or drawing.
6.1.2 Substitutability. Device class Q devices will replace device class M devices.
6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus when a system
application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users
and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering
microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544.
6.4 Comments. Comments on this drawing should be directed to DSCC-VA , Columbus, Ohio 43216-5000, or telephone
(614) 692-0547.
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in
MIL-PRF-38535 and MIL-HDBK-1331.
6.6 Sources of supply.
6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535.
The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and have agreed to
this drawing.
6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103.
The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been
submitted to and accepted by DSCC-VA.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-94593
A
REVISION LEVEL
C
SHEET
10
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 02-07-31
Approved sources of supply for SMD 5962-94593 are listed below for immediate acquisition information only and
shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be
revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a
certificate of compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next
dated revision of MIL-HDBK-103 and QML-38535.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-9459301MPA
24355 (2)
AD8001SQ
5962-9459301VPA
24355 (5)
AD8001SQ/QMLV
5962-9459301VHA
24355 (5)
AD8001SL/QMLV
5962R9459301VPA
24355 (5)
AD8001SQ/QMLR
5962R9459301VHA
24355 (5)
AD8001SL/QMLR
1/ The lead finish shown for each PIN representing
a hermetic package is the most readily available
from the manufacturer listed for that part. If the
desired lead finish is not listed contact the vendor
to determine its availability.
2/ Caution. Do not use this number for item
acquisition. Items acquired to this number may not
satisfy the performance requirements of this drawing.
Vendor CAGE
number
Vendor name
and address
24355
Analog Devices (2)
RT 1 Industrial Park
PO Box 9106
Norwood, MA 02062
Point of contact: 804 Woburn Street
Wilmington, MA 01887-3462
24355
Analog Devices (5)
RT 1 Industrial Park
PO Box 9106
Norwood, MA 02062
Point of contact: 1500 Space Park Drive
PO Box 58020
Santa Clara, CA 95052-8020
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.