PL IA NT Features *R oH S CO M ■ ■ ■ HIGH PERFORMANCE TERMINATION NETWORK Miniaturized circuitry and packaging for space reduction Designed for gigabit communication networks ■ ■ Controlled impedance RoHS compliant* CAT16-LV2F6LF - Concave Chip Array Electrical Characteristics Product Dimensions Resistance R1 .............................................165 ohms R2 .............................................140 ohms TCR........................................±200 ppm/ ˚C Temperature Range .........-55 ˚C to +125 ˚C Max. Operating Voltage ....................5 VDC Max. Power Resistance ................ .0625 W Solderability .....................>95 % Coverage 8 7 6 5 .30 ± .10 DIA. (.012 ± .004) .45 ± .10 (.018 ± .004) .60 ± .10 (.024 ± .004) .40 ± .10 (.016 ± .004) 1.60 ± .15 (.063 ± .060) .80 ± .10 (.031 ± .004) For Standard Values Used in Capacitors, Inductors, and Resistors, click here. 1 DIMENSIONS ARE: .40 ± .10 (.016 ± .004) 3.20 ± .15 (.126 ± .006) 2 3 4 MM (INCHES) Packaging Specifications 5000 pcs - per 7 " reel 4.0 ± .10 (.157 ± .004) 1.9 ± .15 (.075 ± .006) 1.1 (.043) 3.6 ± .20 (.142 ± .008) 13 ± 0.5 DIA. (.512 ± .020) 3.5 ± .05 (.138 ± .002) 1.5 +.10/-0 (.060 +.004/-0) 4.0 ±.10 (.158 ±.004) Derating Curve Rated power in percentage (%) 2.0 ± .05 (.079 ± .002) 60.0 ± 1.0 DIA. (2.36 ± .039) 8.0 ± .05 (.138 ± .012) 178.0 ± 2.0 (7.008 ± .080) 21 ± 0.5 (.827 ± .020) 1.75 ± .10 (.069 ± .004) 12.5 ± 2 (.492 ± .079) 10.0 ± 1.5 (.394 ± .059) Land Pattern Solder resist 100 80 Land 0.7 to 0.9 (.028 to .035) 60 40 Chip resistor array CAT 20 0 -55 0 70 (ϒC) Ambient temperature Schematic 7 6 R2 0.80 (.032) 5 R2 R1 1 2.0 to 2.2 (.079 to .087) 0.4 to 0.45 (.016 to .0178) 8 R1 125 R1 2 R1 3 REV. 11/06 4 *RoHS Directive 2002/95/EC Jan 27 2003 including Annex. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.