ETC AG606

AG606
The Communications Edge TM
Product Information
Push-Pull CATV Amplifier
Product Features
x 50 – 860 MHz
x ±0.7 dB Gain Flatness
x +20 dBm P1dB
x +37 dBm Output IP3
x +73 dBm Output IP2
x -68 dBc CTB
Product Description
Functional Diagram
The AG606 is a dual amplifier containing two internal
matched amplifiers optimal for a push-pull configuration.
The internal amplifiers employ InGaP HBT technology
for a cost-effective low-distortion solution.
The AG606 is ideal for drop amplifiers, splitters, and
other low to moderate power outside plant CATV
applications. The amplifier can also be useful in low
power headend applications such as linear laser drivers.
+34 dBmV/channel, 79 channels
x -80 dBc CSO
+34 dBmV/channel, 79 channels
x Matched amplifiers for a
push-pull configuration
x +7V Single Positive Supply
x MTTF > 1000 Years
1
8
2
7
3
6
4
5
Function
Amp 1 Input
Amp 2 Input
Amp 2 Output
Amp 1 Output
The AG606 has excellent VSWR when used in a 75 :
push-pull configuration. It is provided in a low-cost
environmentally-friendly lead-free/green/RoHS-compliant
SOT-89 package.
Ground
Pin No.
1
4
5
8
2, 3, 6, 7,
Backside
paddle
Applications
x CATV Head End Equipment
x CATV Line Amplifiers
x FTTH Repeaters
Typical Performance (3)
Single-ended Device Specifications(1)
Parameter
Units Min
Test Frequency
Gain
Output IP3 (2)
Device Current
Device Voltage
MHz
dB
dBm
mA
V
13.2
+33.5
76
Typ
800
14.3
+36
82.5
5.25
Max
Parameter
15.5
90
1. Test conditions unless otherwise noted: T = 25ºC, 800 MHz on each individual single-branch
amplifier in a 50 test fixture using a +7V supply and a 20.5 dropping resistor.
2. 3OIP measured with two tones at an output power of +5 dBm/tone separated by 1 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. Typical parameters reflect performance in a push-pull application circuit.
4. Balun, board, and connector losses have not been extracted, but typically account of 0.4 dB loss
midband and 1.1 dB loss at 860 MHz.
5. Measured at +34 dBmV/channel, 79 channels Flat Loading.
6. OIP2 is measured at f1 + f2 at 5 dBm / tone.
Absolute Maximum Rating
Parameter
Operating Case Temperature
Storage Temperature
Supply Voltage
RF Input Power (continuous)
Junction Temperature
Rating
-40 to +85 qC
-55 to +125 qC
+7 V
+13dBm
+250 qC
Operation of this device above any of these parameters may cause permanent damage.
Units
Frequency
Gain (4)
Input Return Loss
Output Return Loss
CTB (5)
CSO (5)
XMOD (5)
Output P1dB
Output IP2 (6)
Output IP3 (2)
Noise Figure (4)
Device Bias
MHz
dB
dB
dB
dBc
dBc
dBc
dBm
dBm
dBm
dB
V
Typical
50
14.3
21
17
-69
-81
-60
+20.7
+73.6
+37.5
5
250
450
860
14.2
13.9
12.9
28
18
11
18
16
18
-67
-67
-87
-80
-61
-60
+20.5 +20.3
+22
+76.1 +76.4 +76.6
+37.5 +37.3 +39.2
5
5.3
5.9
+5.25 V @ 165 mA
Ordering Information
Part No.
AG606*
AG606-G
AG606-PCB
*
Description
Push-pull Dual Amplifier
(lead-tin SOIC8 Pkg)
Push-pull CATV Amplifier
(lead-free/green/RoHS-compliant SOIC8 Pkg)
Fully Assembled CATV Evaluation Board
This package is being phased out in favor of the green package type which is backwards compatible for
existing designs.
Specifications and information are subject to change without notice.
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: [email protected]
Web site: www.wj.com
Page 1 of 6
July 2005
AG606
The Communications Edge TM
Product Information
Push-Pull CATV Amplifier
Typical Device Data 50: Z0
S-Parameters (Vdev = +5.25 V, Icc = 82.5 mA, T = 25 C, unmatched 50 ohm system, calibrated to device leads)
These represent a single-ended amplifier in the AG606, with there being two matched amplifiers inside the package.
Freq (MHz)
S11 (dB)
S11 (ang)
S21 (dB)
S21 (ang)
S12 (dB)
S12 (ang)
S22 (dB)
S22 (ang)
50
-12.03
178.56
14.61
177.32
-18.85
-0.01
-17.45
178.57
100
-12.09
174.32
14.61
175.28
-18.74
-1.56
-17.08
178.23
150
-11.81
172.20
14.62
173.13
-18.76
-2.21
-17.28
176.63
200
-11.81
169.91
14.59
170.74
-18.81
-3.25
-16.86
176.45
250
-11.64
168.30
14.62
168.67
-18.77
-3.74
-17.24
173.88
300
-11.79
166.47
14.63
165.71
-18.81
-4.12
-17.00
174.14
350
-11.76
164.70
14.68
163.24
-18.79
-4.96
-17.20
172.40
400
-12.02
162.35
14.59
161.23
-18.84
-5.99
-16.85
173.24
450
-11.92
159.27
14.48
158.25
-18.82
-5.99
-17.02
170.87
500
-11.92
156.13
14.53
156.14
-18.80
-6.63
-16.70
169.98
550
-11.77
154.71
14.48
154.05
-18.86
-7.58
-16.78
167.35
600
-11.75
151.64
14.52
151.45
-18.79
-8.02
-16.47
167.79
650
-11.67
150.04
14.45
148.59
-18.74
-9.17
-16.49
164.94
700
-11.89
147.47
14.41
146.59
-18.83
-9.41
-16.48
164.76
750
-11.72
145.07
14.43
144.30
-18.89
-10.48
-16.43
161.86
800
-11.76
143.08
14.33
141.92
-18.87
-11.22
-16.23
161.91
850
-11.56
141.20
14.36
139.40
-18.87
-11.88
-15.86
158.92
900
-11.65
138.97
14.26
137.14
-18.80
-12.23
-15.78
159.88
950
-11.57
137.28
14.28
134.86
-18.79
-13.52
-15.51
156.89
1000
-11.56
135.12
14.19
132.17
-18.86
-13.15
-15.34
156.79
Typical Device Data 37.5: Z0
S-Parameters (Vdev = +5.25 V, Icc = 82.5 mA, T = 25 C, unmatched 37.5 ohm system, calibrated to device leads)
These represent a single-ended amplifier in the AG606, with there being two matched amplifiers inside the package.
Freq (MHz)
S11 (dB)
S11 (ang)
S21 (dB)
S21 (ang)
S12 (dB)
S12 (ang)
S22 (dB)
S22 (ang)
50
-34.66
173.49
14.79
177.27
-18.66
-0.06
-19.98
-0.57
100
-33.64
133.95
14.81
175.12
-18.54
-1.71
-20.40
-3.63
150
-30.17
137.29
14.82
172.89
-18.56
-2.45
-20.15
-4.04
200
-29.21
131.02
14.80
170.45
-18.60
-3.54
-20.91
-7.28
250
-27.90
131.37
14.83
168.30
-18.57
-4.11
-20.34
-5.91
300
-28.12
124.34
14.84
165.33
-18.61
-4.51
-20.82
-9.61
350
-27.59
122.31
14.88
162.80
-18.59
-5.40
-20.57
-10.25
400
-27.52
110.86
14.79
160.77
-18.65
-6.45
-21.33
-14.80
450
-25.69
107.75
14.68
157.66
-18.62
-6.58
-21.31
-13.74
500
-24.49
101.63
14.73
155.45
-18.61
-7.32
-21.94
-15.66
550
-23.76
104.95
14.68
153.27
-18.66
-8.35
-22.13
-13.89
600
-22.84
100.16
14.72
150.61
-18.59
-8.86
-22.79
-18.83
650
-22.46
101.72
14.65
147.66
-18.53
-10.10
-23.13
-17.61
700
-22.06
95.00
14.60
145.62
-18.64
-10.38
-23.54
-19.44
750
-21.15
95.84
14.62
143.20
-18.70
-11.58
-24.06
-16.74
800
-20.79
94.07
14.53
140.77
-18.68
-12.37
-25.05
-20.60
850
-20.09
95.55
14.56
138.11
-18.67
-13.17
-26.61
-16.06
900
-19.78
92.24
14.45
135.83
-18.60
-13.53
-27.43
-23.50
950
-19.42
92.70
14.48
133.44
-18.59
-14.94
-29.28
-17.34
1000
-18.88
90.91
14.39
130.68
-18.66
-14.64
-31.32
-18.82
Specifications and information are subject to change without notice.
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: [email protected]
Web site: www.wj.com
Page 2 of 6
July 2005
AG606
The Communications Edge TM
Product Information
Push-Pull CATV Amplifier
Application Circuit PC Board Layout
Circuit Board Material: .028” FR4, 4 - layer, 1 oz copper, Microstrip line details: width = .021”,
spacing = .021”. C1, C2, R3, C3, R4 and C4 are shown in the silkscreen but are not required in the schematic.
Typical RF Performance at 25qC
Frequency
Gain(1)
Input R.L.
Output R.L.
CTB(2)
CSO(2)
XMOD(2)
Output P1dB
Output IP2(3)
Output IP3(4)
Noise Figure(1)
Device Current
Device Voltage
MHz
dB
dB
dB
dBc
dBc
dBc
dBm
dBm
dBm
dB
mA
V
50
250
450
860
14.3
14.2
13.9 12.9
21
28
18
11
17
18
16
18
-69
-67
-67
-81
-87
-80
-60
-61
-60
+20.7 +20.5 +20.3 +22
+73.6 +76.1 +76.4 +76.6
+37.5 +37.5 +37.3 +39.2
5
5
5.3
5.9
165
+5.25
T1: M/A Com ETC1-1-13
T2: M/A Com ETC1-1-13
5. All components are 0603 in size unless otherwise noted.
6. 1% tolerance is for R1 and R2.
7. The dc resistance of L1 and L2 should be less than 1 ohm.
1. Balun, board, and connector losses have not been extracted, but typically account for
0.4 dB loss midband and 1.1 dB loss at 860 MHz.
2. CSO, CTB, & XMOD are measured at +34 dBmV/channel, 79 channels Flat Loading.
3. OIP2 is measured at f1 + f2 at 5 dBm / tone.
4. OIP3 is measured at 5 dBm / tone with 1 MHz spacing.
Recommended Bias Resistor Values
Supply Voltage
R1/R2 Value
7V
8V
9V
10 V
12 V
24 V
20.5 ohms
32.5 ohms
44.5 ohms
56.5 ohms
81 ohms
227 ohms
Size
1206
1210
2010
2010
2010
2 Watts
75 : Push-Pull Application Circuit Performance
(Vsupply = +7 V, Rbias= 20.5 :, 25q C)
+25°C
-40°C
+85°C
0
0
-10
-10
-20
+25°C
-40°C
+85°C
-30
8
S22 (dB)
12
S11 (dB)
S21 (dB)
14
10
S22 vs. Frequency
S11 vs. Frequency
S21 vs. Frequency
16
0
200
400
600
800
1000
+25°C
-40°C
+85°C
-30
-40
-40
6
-20
0
200
400
600
800
1000
Frequency (MHz)
0
200
400
600
800
1000
Frequency (MHz)
Frequency (MHz)
Specifications and information are subject to change without notice.
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: [email protected]
Web site: www.wj.com
Page 3 of 6
July 2005
AG606
The Communications Edge TM
Product Information
Push-Pull CATV Amplifier
75 : Push-Pull Application Circuit Performance (Cont’d)
(Vsupply=7V, Rbias= 20.5 :, 25q C)
Noise Figure vs. Frequency
(Application Board)
P1dB vs. Frequency
7
20
18
NF (dB)
+25°C
-40°C
16
6
6
5
5
+25°C
4
14
400
600
800
1000
2
0
200
800
OIP2 (dBm)
36
+25°C
-40°C
32
-40°C
+85°C
60
30
200
400
600
800
0
1000
200
400
CSO vs. Frequency
79 Channel Flat Loading, 34 dBmV
600
800
+25°C
+85°C
-80
300
400
500
-40°C
-80
+25°C
100
36 dBmV
-70
38 dBmV
-50
300
400
500
-90
100
200
300
400
500
Frequency (MHz)
600
+25°C
+85°C
0
100
200
300
400
500
600
Frequency (MHz)
XMOD vs. Frequency
79 Channel Flat Loading at 25°C
-50
-60
-70
-80
30 dBmV
34 dBmV
38 dBmV
-90
-100
600
-40°C
-80
600
-60
-80
0
200
CSO vs. Frequency
79 Channel Flat Loading at 25°C
34 dBmV
500
-100
0
Frequency (MHz)
-60
-70
-90
+85°C
CTB vs. Frequency
79 Channel Flat Loading at 25°C
32 dBmV
400
-60
Frequency (MHz)
30 dBmV
300
XMOD vs. Frequency
79 Channel Flat Loading, 34 dBmV
-70
600
CTB (dBc)
-50
200
200
Frequency (MHz)
-100
-100
100
100
-50
-90
-90
0
XMOD
CTB
CSO
-90
0
XMOD (dBc)
-70
CTB (dBc)
-40°C
-80
-100
1000
-60
-60
1000
-70
CTB vs. Frequency
79 Channel Flat Loading, 34 dBmV
-50
-50
800
-60
Frequency (MHz)
Frequency (MHz)
600
-50
+25°C
70
400
XMOD, CTB and CSO vs. Frequency
@ 34 dBmV at 25°C
75
65
+85°C
0
200
Frequency (MHz)
80
34
0
1000
OIP2 vs. Frequency
1 MHz Spacing, +5 dBm / Tone
85
38
OIP3 (dBm)
600
Frequency (MHz)
OIP3 vs. Frequency
1 MHz Spacing, +5dBm / Tone
40
400
XMOD,CTB and CSO
(dBc)
200
Frequency (MHz)
CSO (dBc)
3
+85°C
2
0
CSO (dBc)
4
-40°C
3
+85°C
7
XMOD (dBc)
P1dB (dBm)
22
NF (dB)
24
Noise Figure vs. Frequency at 25°C
(Device)
-100
0
100
200
32 dBmv
36 dBmV
-70
-80
30 dBmV
34 dBmV
38 dBmV
-90
32 dBmV
36 dBmV
-100
300
400
500
0
600
100
200
300
400
500
600
Frequency (MHz)
Frequency (MHz)
Specifications and information are subject to change without notice.
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: [email protected]
Web site: www.wj.com
Page 4 of 6
July 2005
AG606
The Communications Edge TM
Product Information
Push-Pull CATV Amplifier
AG606 (SOIC-8 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Outline Drawing
Product Marking
The component will be marked with an
“AG606” designator with an alphanumeric lot
code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating:
Value:
Test:
Standard:
Class 1C
1000 to 2000 V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
ESD Rating: Class IV
Value
1000 V
Test:
Charge Device Model (CDM)
Standard:
JEDEC Standard JESD22-C101
MSL Rating: Level 1 at +235 C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the
proper performance of this device. Vias
should use a .35mm (#80 / .0135” ) diameter
drill and have a final plated thru diameter of
.25 mm (.010” ).
2. Add as much copper as possible to inner and
outer layers near the part to ensure optimal
thermal performance.
3. Mounting screws can be added near the part
to fasten the board to a heatsink. Ensure that
the ground / thermal via region contacts the
heatsink.
4. Do not put solder mask on the backside of the
PC board in the region where the board
contacts the heatsink.
5. RF trace width depends upon the PC board
material and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches).
Angles are in degrees.
Land Pattern
MTTF vs. GND Tab Temperature
Thermal Specifications
Rating
Operating Case Temperature
Thermal Resistance, Rth (1)
Junction Temperature, Tjc (2)
-40 to +85q C
63q C/W
142q C
Notes:
1. The thermal resistance is referenced from the hottest
part of the junction to ground tab.
2. This corresponds to the typical biasing condition of
+5.16V, 175 mA at an 85 C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 177 C.
MTTF (Million Hrs)
Parameter
10000
1000
100
10
1
50
60
70
80
90
100
Tab Temperature (°C)
Specifications and information are subject to change without notice.
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: [email protected]
Web site: www.wj.com
Page 5 of 6
July 2005
AG606
The Communications Edge TM
Product Information
Push-Pull CATV Amplifier
AG606-G (Lead-Free Package) Mechanical Information
This package is lead-free/green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free
(maximum 260qC reflow temperature) and lead (maximum 245qC reflow temperature) soldering processes.
Outline Drawing
Product Marking
The component will be marked with an
“ AG606G” designator with an alphanumeric
lot code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “ Application
Notes” section.
ESD / MSL Information
ESD Rating:
Value:
Test:
Standard:
Class 1C
1000 to 2000 V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
ESD Rating:
Value
Test:
Standard:
Class IV
Passes greater than 1000 V
Charge Device Model (CDM)
JEDEC Standard JESD22-C101
MSL Rating: Level 2 at +260 C convection reflow
Standard:
JEDEC Standard J-STD-020A
Mounting Config. Notes
1.
2.
Land Pattern
3.
4.
5.
6.
7.
8.
9.
Thermal Specifications
Rating
Operating Case Temperature
Thermal Resistance, Rth (1)
Junction Temperature, Tjc (2)
-40 to +85q C
63q C/W
142q C
Notes:
1. The thermal resistance is referenced from the hottest part
of the junction to ground tab underneath the device.
2. This corresponds to the typical biasing condition of
+5.16V, 175 mA at an 85 C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 177 C.
MTTF vs. GND Tab Temperature
10000
MTTF (Million Hrs)
Parameter
Ground / thermal vias are critical for the proper performance
of this device. Vias should use a .35mm (#80/.0135” )
diameter drill and have a final plated through diameter of
.25mm (.010” )
Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
To ensure reliable operation, device ground paddle-toground pad solder joint is critical.
Add mounting screws near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region
contacts the heatsink.
For optimal thermal performance, expose soldermask on
backside where it contacts the heatsink.
RF trace width depends upon the PC board material and
construction.
Use 1 oz. Copper minimum.
If the PCB design rules allow, ground vias should be placed
under the land pattern for better RF and thermal
performance. Otherwise ground vias should be placed as
close to the land pattern as possible.
All dimensions are in mm. Angles are in degrees.
1000
100
10
1
50
60
70
80
90
100
Tab Temperature (°C)
Specifications and information are subject to change without notice.
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: [email protected]
Web site: www.wj.com
Page 6 of 6
July 2005