CD54AC163, CD74AC163 4-BIT SYNCHRONOUS BINARY COUNTERS SCHS299 – APRIL 2000 D D D D D Internal Look-Ahead for Fast Counting Carry Output for n-Bit Cascading Synchronous Counting Synchronously Programmable Package Options Include Plastic Small-Outline (M), Standard Plastic (E) and Ceramic (F) DIPs CD54AC163 . . . F PACKAGE CD74AC163 . . . E OR M PACKAGE (TOP VIEW) CLR CLK A B C D ENP GND description 1 16 2 15 3 14 4 13 5 12 6 11 7 10 VCC RCO QA QB QC QD ENT LOAD 9 8 The CD54AC163 and CD74AC163 devices are 4-bit binary counters. These synchronous, presettable counters feature an internal carry look-ahead for application in high-speed counting designs. Synchronous operation is provided by having all flip-flops clocked simultaneously so that the outputs change coincident with each other when instructed by the count-enable (ENP, ENT) inputs and internal gating. This mode of operation eliminates the output counting spikes normally associated with synchronous (ripple-clock) counters. A buffered clock (CLK) input triggers the four flip-flops on the rising (positive-going) edge of the clock waveform. The counters are fully programmable; that is, they can be preset to any number between 0 and 9 or 15. Presetting is synchronous; therefore, setting up a low level at the load input disables the counter and causes the outputs to agree with the setup data after the next clock pulse, regardless of the levels of the enable inputs. The clear function is synchronous. A low level at the clear (CLR) input sets all four of the flip-flop outputs low after the next low-to-high transition of CLK, regardless of the levels of the enable inputs. This synchronous clear allows the count length to be modified easily by decoding the Q outputs for the maximum count desired. The active-low output of the gate used for decoding is connected to CLR to synchronously clear the counter to 0000 (LLLL). The carry look-ahead circuitry provides for cascading counters for n-bit synchronous applications without additional gating. ENP, ENT, and a ripple-carry output (RCO) are instrumental in accomplishing this function. Both ENP and ENT must be high to count, and ENT is fed forward to enable RCO. Enabling RCO produces a high-level pulse while the count is maximum (9 or 15 with QA high). This high-level overflow ripple-carry pulse can be used to enable successive cascaded stages. Transitions at ENP or ENT are allowed, regardless of the level of CLK. These devices feature a fully independent clock circuit. Changes at control inputs (ENP, ENT, or LOAD) that modify the operating mode have no effect on the contents of the counter until clocking occurs. The function of the counter (whether enabled, disabled, loading, or counting) is dictated solely by the conditions meeting the stable setup and hold times. The CD54AC163 is characterized for operation over the full military temperature range of –55°C to 125°C. The CD74AC163 is characterized for operation from –40°C to 85°C. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2000, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 CD54AC163, CD74AC163 4-BIT SYNCHRONOUS BINARY COUNTERS SCHS299 – APRIL 2000 FUNCTION TABLE INPUTS OUTPUTS FUNCTION CLR CLK ENP ENT LOAD A,B,C,D Qn RCO L ↑ X X X X L L h ↑ X X l l L L h ↑ X X l h H Note 1 h ↑ h h h X Count Note 1 h X l X h X Note 1 h X X l h X qn qn Reset (clear) L Parallel load Count Inhibit H = high level, L = low level, X = don’t care, h = high level one setup time prior to the CLK low-to-high transition, l = low level one setup time prior to the CLK low-to-high transition, q = the state of the referenced output prior to the CLK low-to-high transition, ↑ = CLK low-to-high transition. NOTE 1: The RCO output is high when ENT is high and the counter is at terminal count (HHHH). logic symbol† 1 CLR 9 LOAD ENT ENP CLK A B C D 10 7 2 3 CTRDIV16 5CT=0 M1 M2 3CT=15 RCO G3 G4 C5/2,3,4+ 1,5D 4 5 6 [1] [2] [4] [8] † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. 2 15 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 14 13 12 11 QA QB QC QD CD54AC163, CD74AC163 4-BIT SYNCHRONOUS BINARY COUNTERS SCHS299 – APRIL 2000 logic diagram (positive logic) LOAD ENT ENP 9 10 15 LD† 7 RCO CK† CLK CLR 2 1 CK LD R A B C D M1 G2 1, 2T/1C3 G4 3D 4R 3 M1 G2 1, 2T/1C3 G4 3D 4R 4 M1 G2 1, 2T/1C3 G4 3D 4R 5 M1 G2 1, 2T/1C3 G4 3D 4R 6 14 13 12 11 QA QB QC QD † For simplicity, routing of complementary signals LD and CK is not shown on this overall logic diagram. The uses of these signals are shown on the logic diagram of the D/T flip-flops. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 CD54AC163, CD74AC163 4-BIT SYNCHRONOUS BINARY COUNTERS SCHS299 – APRIL 2000 logic symbol, each D/T flip-flop LD (Load) M1 TE (Toggle Enable) G2 CK (Clock) 1, 2T/1C3 G4 D (Inverted Data) 3D R (Inverted Reset) 4R Q (Output) logic diagram, each D/T flip-flop (positive logic) CK LD TE LD† TG TG LD† Q TG TG CK† D TG CK† R † The origins of LD and CK are shown in the logic diagram of the overall device. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 CK† TG CK† CD54AC163, CD74AC163 4-BIT SYNCHRONOUS BINARY COUNTERS SCHS299 – APRIL 2000 typical clear, preset, count, and inhibit sequence The following sequence is illustrated below: 1. Clear outputs to zero (synchronous) 2. Preset to binary 12 3. Count to 13, 14, 15, 0, 1, and 2 4. Inhibit CLR LOAD A Data Inputs B C D CLK ENP ENT QA Data Outputs QB QC QD RCO 12 13 14 15 0 1 Count 2 Inhibit Sync Preset Clear POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 CD54AC163, CD74AC163 4-BIT SYNCHRONOUS BINARY COUNTERS SCHS299 – APRIL 2000 absolute maximum ratings over operating free-air temperature range† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 6 V Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA Package thermal impedance, θJA (see Note 3): E package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W M package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 3. The package thermal impedance is calculated in accordance with JESD 51. recommended operating conditions (see Note 4) TA = 25°C MIN MAX VCC VIH VIL Supply voltage High-level input voltage Low-level input voltage 1.5 MIN MAX MIN MAX 1.5 5.5 1.5 5.5 1.2 2.1 2.1 2.1 VCC = 5.5 V VCC = 1.5 V 3.85 3.85 3.85 1.2 0.3 VCC = 3 V VCC = 5.5 V Input voltage 0 Output voltage 0 IOH IOL High-level output current 0.9 0.9 1.65 1.65 0 VCC VCC 0 0 –24 24 VCC = 1.5 V to 3 V VCC = 3.6 V to 5.5 V 0.3 0.9 0 V V 1.65 VCC VCC UNIT 1.2 0.3 –24 Low-level output current Input transition rise or fall rate CD74AC163 VCC = 1.5 V VCC = 3 V VI VO ∆t/∆v 5.5 CD54AC163 24 V VCC VCC V –24 mA 24 mA 0 50 0 50 0 50 0 20 0 20 0 20 V ns TA Operating free-air temperature – 55 125 – 40 85 °C NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 CD54AC163, CD74AC163 4-BIT SYNCHRONOUS BINARY COUNTERS SCHS299 – APRIL 2000 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = –50 µA VOH VI = VIH or VIL IOH = –4 mA IOH = –24 mA IOH = –50 mA† IOH = –75 mA† IOL = 50 µA VOL II ICC VI = VIH or VIL VI = VCC or GND VI = VCC or GND, VCC TA = 25°C MIN MAX CD54AC163 MIN MAX CD74AC163 MIN 1.5 V 1.4 1.4 1.4 3V 2.9 2.9 2.9 4.5 V 4.4 4.4 4.4 3V 2.58 2.4 2.48 4.5 V 3.94 3.7 3.8 5.5 V – 3.85 – 5.5 V – – MAX UNIT V 3.85 1.5 V 0.1 0.1 0.1 3V 0.1 0.1 0.1 4.5 V 0.1 0.1 0.1 IOL = 12 mA IOL = 24 mA IOL = 50 mA† 3V 0.36 0.5 0.44 4.5 V 0.36 0.5 0.44 5.5 V – 1.65 – IOL = 75 mA† 5.5 V – – 1.65 5.5 V ±0.1 ±1 ±1 µA 5.5 V 8 160 80 µA 10 10 10 IO = 0 Ci V pF † Test one output at a time, not exceeding 1-second duration. Measurement is made by forcing indicated current and measuring voltage to minimize power dissipation. Test verifies a minimum 50-Ω transmission-line drive capability at 85°C and 75-Ω transmission-line drive capability at 125°C. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 CD54AC163, CD74AC163 4-BIT SYNCHRONOUS BINARY COUNTERS SCHS299 – APRIL 2000 timing requirements over recommended operating free-air temperature range (unless otherwise noted) VCC fclock tw Clock frequency Pulse duration CLK high or low A, B, C, or D ENP or ENT tsu time before CLK↑ ↑ Setup time, LOAD low CLR inactive A, B, C, or D ENP or ENT th ↑ Hold time, time after CLK↑ LOAD low CLR inactive 8 POST OFFICE BOX 655303 CD54AC163 MIN MAX CD74AC163 MIN MAX 1.5 V 7 8 3.3 V ± 0.3 V 64 73 5 V ± 0.5 V 90 103 1.5 V 69 61 3.3 V ± 0.3 V 7.7 6.8 5 V ± 0.5 V 5.5 4.8 1.5 V 63 55 3.3 V ± 0.3 V 7 6.1 5 V ± 0.5 V 5 4.4 1.5 V 63 55 3.3 V ± 0.3 V 9.6 8.2 5 V ± 0.5 V 5 4.4 1.5 V 75 66 3.3 V ± 0.3 V 8.4 7.4 5 V ± 0.5 V 6 5.3 1.5 V 75 66 3.3 V ± 0.3 V 8.4 7.4 5 V ± 0.5 V 6 5.3 1.5 V 0 0 3.3 V ± 0.3 V 0 0 5 V ± 0.5 V 0 0 1.5 V 0 0 3.3 V ± 0.3 V 0 0 5 V ± 0.5 V 0 0 1.5 V 0 0 3.3 V ± 0.3 V 0 0 5 V ± 0.5 V 0 0 1.5 V 0 0 3.3 V ± 0.3 V 0 0 5 V ± 0.5 V 0 0 • DALLAS, TEXAS 75265 UNIT MHz ns ns ns CD54AC163, CD74AC163 4-BIT SYNCHRONOUS BINARY COUNTERS SCHS299 – APRIL 2000 switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) fmax RCO VCC Any Q RCO CD74AC163 MIN MAX 7 8 64 73 5 V ± 0.5 V 90 103 1.5 V – 209 – 3.3 V ± 0.3 V 6 23.4 6 21 4.3 16.7 4.3 15.2 UNIT MHz 190 – 207 – 188 3.3 V ± 0.3 V 5.9 23.1 5.9 21 5 V ± 0.5 V 4.2 16.5 4.2 15 1.5 V ENT MAX 1.5 V 1.5 V tpd MIN 3.3 V ± 0.3 V 5 V ± 0.5 V CLK CD54AC163 – 129 – 117 3.3 V ± 0.3 V 3.6 14.4 3.7 13.1 5 V ± 0.5 V 2.6 10.3 2.7 9.4 TEST CONDITIONS TYP ns operating characteristics, TA = 25°C PARAMETER Cpd Power dissipation capacitance No load POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 66 UNIT pF 9 CD54AC163, CD74AC163 4-BIT SYNCHRONOUS BINARY COUNTERS SCHS299 – APRIL 2000 PARAMETER MEASUREMENT INFORMATION 2 × VCC S1 R1 = 500 Ω From Output Under Test Open GND R2 = 500 Ω CL = 50 pF (see Note A) TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 2 × VCC GND tw VCC NOTE When VCC = 1.5 V, R1 and R2 = 1 kΩ. Input 50% VCC 50% VCC LOAD CIRCUIT 0V VOLTAGE WAVEFORMS PULSE DURATION VCC CLR Input VCC Reference Input 50% VCC 0V 50% VCC 0V tsu trec VCC Data Input 50% 10% 50% VCC CLK 0V th 90% 90% tr VOLTAGE WAVEFORMS RECOVERY TIME Input VCC 50% VCC 50% VCC tPLH tPHL 50% 10% 90% 90% tr tPHL Out-of-Phase Output tf VOLTAGE WAVEFORMS SETUP AND HOLD AND INPUT RISE AND FALL TIMES 0V In-Phase Output VCC 50% VCC 10% 0 V 90% tPLH 50% VCC 10% tf 50% 10% VCC Output Control VOH Output 50% VCC Waveform 1 10% VOL S1 at 2 × V CC tf (see Note B) 90% VOH VOL tr VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT TRANSITION TIMES 50% VCC 50% VCC 0V tPLZ tPZL 50% VCC tPZH Output Waveform 2 S1 at Open (see Note B) 50% VCC [ VCC VOL + 0.3 V VOL tPHZ VOH VOH – 0.3 V 0V [ VOLTAGE WAVEFORMS OUTPUT ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and test-fixture capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 3 ns, tf = 3 ns. Phase relationships between waveforms are arbitrary. D. For clock inputs, fmax is measured with the input duty cycle at 50%. E. The outputs are measured one at a time with one input transition per measurement. F. tPLH and tPHL are the same as tpd. G. tPZL and tPZH are the same as ten. H. tPLZ and tPHZ are the same as tdis. Figure 1. Load Circuit and Voltage Waveforms 10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. Customers are responsible for their applications using TI components. In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof. 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