TLV809J25, TLV809L30 TLV809K33, TLV809I50 www.ti.com SLVSA03C – JUNE 2010 – REVISED FEBRUARY 2012 3-Pin Supply Voltage Supervisors Check for Samples: TLV809J25, TLV809L30, TLV809K33, TLV809I50 FEATURES APPLICATIONS • • • • • • • • • • • 1 2 • • • 3-Pin SOT23 Package Supply Current: 9 µA (Typical) Precision Supply Voltage Monitor: 2.5 V, 3 V, 3.3 V, 5 V Power-On Reset Generator with Fixed Delay Time of 200 ms Pin-for-Pin Compatible with MAX809 Temperature Range: –40°C to +85°C DSPs, Microcontrollers, and Microprocessors Wireless Communication Systems Portable/Battery-Powered Equipment Programmable Controls Intelligent Instruments Industrial Equipment Notebook and Desktop Computers Automotive Systems DESCRIPTION The TLV809 family of supervisory circuits provides circuit initialization and timing supervision, primarily for DSPs and processor-based systems. During power-on, RESET is asserted when the supply voltage (VDD) becomes higher than 1.1 V. Thereafter, the supervisory circuit monitors VDD and keeps RESET active as long as VDD remains below the threshold voltage VIT. An internal timer delays the return of the output to the inactive state (high) to ensure proper system reset. The delay time (td(typ) = 200 ms) starts after VDD has risen above the threshold voltage, VIT. When the supply voltage drops below the VIT threshold voltage, the output becomes active (low) again. No external components are required. All the devices in this family have a fixed sense-threshold voltage (VIT) set by an internal voltage divider. The product spectrum is designed for supply voltages of 2.5 V, 3 V, 3.3 V, and 5 V. The circuits are available in a 3-pin SOT-23 package. The TLV809 devices are characterized for operation over a temperature range of –40°C to +85°C. Figure 1. TYPICAL APPLICATION TLV809 DBV/DBZ Packages 3.3-V LDO GND 1 3.3 V 5V 3 RESET VDD 2 OUT IN GND VDD VDD DSP/FPGA/ASIC TLV809K33 RESET RESET GND GND 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2010–2012, Texas Instruments Incorporated TLV809J25, TLV809L30 TLV809K33, TLV809I50 SLVSA03C – JUNE 2010 – REVISED FEBRUARY 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION (1) PRODUCT TLV809J25 THRESHOLD VOLTAGE 2.25 V PACKAGELEAD PACKAGE DESIGNATOR SPECIFIED OPERATING TEMPERATURE PACKAGE MARKING DBV –40°C to +85°C VTCI SOT23-3 DBZ DBV TLV809L30 2.64 V DBV 2.93 V DBV 4.55 V –40°C to +85°C –40°C to +85°C BCMZ VTRI –40°C to +85°C –40°C to +85°C BCMX VTBI SOT23-3 DBZ (1) VTXI SOT23-3 DBZ TLV809I50 –40°C to +85°C BCMT SOT23-3 DBZ TLV809K33 –40°C to +85°C –40°C to +85°C BCMV ORDERING INFORMATION TRANSPORT MEDIA, QUANTITY TLV809J25DBVR Tape and Reel, 3000 TLV809J25DBVT Tape and Reel, 250 TLV809J25DBZR Tape and Reel, 3000 TLV809J25DBZT Tape and Reel, 250 TLV809L30DBVR Tape and Reel, 3000 TLV809L30DBVT Tape and Reel, 250 TLV809L30DBZR Tape and Reel, 3000 TLV809L30DBZT Tape and Reel, 250 TLV809K33DBVR Tape and Reel, 3000 TLV809K33DBVT Tape and Reel, 250 TLV809K33DBZR Tape and Reel, 3000 TLV809K33DBZT Tape and Reel, 250 TLV809I50DBVR Tape and Reel, 3000 TLV809I50DBVT Tape and Reel, 250 TLV809I50DBZR Tape and Reel, 3000 TLV809I50DBZT Tape and Reel, 250 For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or visit the device product folder at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range (unless otherwise noted) . VDD Supply voltage (2) All other pins (2) VALUE UNIT 7 V –0.3 to 7 V 5 mA IOL Maximum low output current IOH Maximum high output current –5 mA IIK Input clamp current (VI < 0 or VI > VDD) ±20 mA IOK Output clamp current (VO < 0 or VO > VDD) ±20 mA TA Operating free-air temperature range –40 to +85 °C Tstg Storage temperature range –65 to +150 °C +260 °C Soldering temperature (1) (2) 2 Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to GND. For reliable operation the device should not be operated at 7 V for more than t = 1000h continuously Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated Product Folder Link(s): TLV809J25 TLV809L30 TLV809K33 TLV809I50 TLV809J25, TLV809L30 TLV809K33, TLV809I50 www.ti.com SLVSA03C – JUNE 2010 – REVISED FEBRUARY 2012 THERMAL INFORMATION TLV809 THERMAL METRIC (1) TLV809 DBV DBZ 3 PINS 3 PINS UNITS θJA Junction-to-ambient thermal resistance 242.1 286.9 θJCtop Junction-to-case (top) thermal resistance 213.0 105.6 θJB Junction-to-board thermal resistance 123.4 124.4 ψJT Junction-to-top characterization parameter 45.7 25.8 ψJB Junction-to-board characterization parameter 130.9 107.9 θJCbot Junction-to-case (bottom) thermal resistance — — (1) °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. RECOMMENDED OPERATING CONDITIONS At specified temperature range (unless otherwise noted). VDD Supply voltage TA Operating free-air temperature range MIN MAX 2 6 UNIT V –40 +85 °C TYP MAX UNIT ELECTRICAL CHARACTERISTICS Over recommended operating free-air temperature range (unless otherwise noted). PARAMETER VOH VOL TEST CONDITIONS High-level output voltage Low-level output voltage Power-up reset voltage (1) MIN VDD = 2.5 V to 6 V, IOH = –500 µA VDD – 0.2 VDD = 3.3 V, IOH = –2 mA VDD – 0.4 VDD = 6 V, IOH = –4 mA VDD – 0.4 VDD = 2 V to 6 V, IOH = 500 µA 0.2 VDD = 3.3 V, IOH = 2 mA 0.4 VDD = 6 V, IOH = 4 mA 0.4 VDD ≥ 1.1 V, IOL = 50 µA Negative-going input threshold voltage (2) TLV809L30 TLV809K33 TA = –40°C to 85°C TLV809I50 Vhys Hysteresis Supply current Ci Input capacitance (1) (2) 2.20 2.25 2.30 2.58 2.64 2.70 2.87 2.93 2.99 4.45 4.55 4.65 TLV809J25 30 TLV809L30 35 TLV809K33 40 TLV809I50 IDD V 0.2 TLV809J25 VIT– V V v mV 60 VDD = 2 V, Output unconnected 9 12 VDD = 6 V, Output unconnected 20 25 VI = 0 V to VDD 5 µA pF The lowest supply voltage at which RESET becomes active. tr, VDD ≥ 15 ms/V. To ensure best stability of the threshold voltage, a bypass capacitor ( 0.1-µF ceramic) should be placed near the supply terminals. Copyright © 2010–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TLV809J25 TLV809L30 TLV809K33 TLV809I50 3 TLV809J25, TLV809L30 TLV809K33, TLV809I50 SLVSA03C – JUNE 2010 – REVISED FEBRUARY 2012 www.ti.com TIMING REQUIREMENTS At RL = 1 MΩ, CL = 50 pF, TA = +25°C. PARAMETER tw TEST CONDITIONS Pulse width at VDD MIN VDD = VIT– + 0.2 V, VDD = VIT– – 0.2 V TYP MAX 3 UNIT µs SWITCHING CHARACTERISTICS At RL = 1 MΩ, CL = 50 pF, TA = +25°C. PARAMETER TEST CONDITIONS VDD ≥ VIT– + 0.2 V; see timing diagram td Delay time tPHL Propagation (delay) time, high-to-low-level output VDD to RESET delay MIN TYP MAX 120 200 VIL = VIT– – 0.2 V, VIH = VIT– + 0.2 V 1 280 UNIT ms µs FUNCTIONAL BLOCK DIAGRAM TLV809 R1 _ VDD + Reset Logic + Timer RESET R2 GND Oscillator Reference Voltage of 1.137 V TIMING DIAGRAM VDD V(NOM) VIT 1.1 V t RESET 1 0 t td td For VDD < 1.1 V Undefined Behavior of RESET Output 4 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated Product Folder Link(s): TLV809J25 TLV809L30 TLV809K33 TLV809I50 TLV809J25, TLV809L30 TLV809K33, TLV809I50 www.ti.com SLVSA03C – JUNE 2010 – REVISED FEBRUARY 2012 TYPICAL CHARACTERISTICS LOW-LEVEL OUTPUT VOLTAGE vs LOW-LEVEL OUTPUT CURRENT 2.75 SUPPLY CURRENT vs SUPPLY VOLTAGE 20 VDD = 2.5 V +85°C 2.25 2.00 TA = 25°C 1.75 1.50 TA = 85°C 1.25 TA = 0°C 1.00 0.75 ICC - Supply Current - mA VOL − Low-Level Output Voltage − V 2.50 TA =−40°C 0.50 15 +25°C 10 0°C 5 +40°C 0.25 0.00 0.0 2.5 5.0 7.5 10.0 0 12.5 0 1 2 3 4 VCC - Supply Voltage - V IOL − Low-Level Output Current − mA Figure 2. Figure 3. HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL OUTPUT CURRENT HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL OUTPUT CURRENT 6.5 3.00 VDD = 6 V 5.5 5.0 4.5 TA =−40°C 4.0 3.5 TA = 0°C 3.0 2.5 TA = 85°C 2.0 1.5 1.0 TA = 25°C 6 VDD = 2.5 V 2.75 VOH − High-Level Output Voltage − V 6.0 VOH − High-Level Output Voltage − V 5 2.50 2.25 2.00 TA =−40°C 1.75 1.50 TA = 0°C 1.25 1.00 TA = 85°C 0.75 0.50 TA = 25°C 0.25 0.5 0.0 0.00 0 −10 −20 −30 −40 IOH − High-Level Output Current − mA Figure 4. Copyright © 2010–2012, Texas Instruments Incorporated −50 0 −2 −4 −6 −8 −10 IOH − High-Level Output Current − mA Figure 5. Submit Documentation Feedback Product Folder Link(s): TLV809J25 TLV809L30 TLV809K33 TLV809I50 5 TLV809J25, TLV809L30 TLV809K33, TLV809I50 SLVSA03C – JUNE 2010 – REVISED FEBRUARY 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) 3.5 1.001 VDD = 2.3 V 1.000 0.999 0.998 0.997 0.996 0.995 −40 −20 0 20 40 60 TA − Free-Air Temperature − °C Figure 6. 6 MINIMUM PULSE DURATION AT VDD vs VDD THRESHOLD OVERDRIVE VOLTAGE t w − Minimum Pulse Duration at V DD − µ s Normalized Threshold Voltage V IT (T A ), V IT (25 ° C) NORMALIZED INPUT THRESHOLD VOLTAGE vs FREE-AIR TEMPERATURE AT VDD Submit Documentation Feedback 85 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0.0 0.2 0.4 0.6 0.8 1.0 VDD − Threshold Overdrive Voltage − V Figure 7. Copyright © 2010–2012, Texas Instruments Incorporated Product Folder Link(s): TLV809J25 TLV809L30 TLV809K33 TLV809I50 TLV809J25, TLV809L30 TLV809K33, TLV809I50 www.ti.com SLVSA03C – JUNE 2010 – REVISED FEBRUARY 2012 REVISION HISTORY NOTE: Page numbers from previous revisions may differ from page numbers in the current version. Changes from Revision B (September 2010) to Revision C Page • Changed TLV809L30 DBZ ordering information column in Package/Ordering Information table ........................................ 2 • Changed TLV809K33 DBZ ordering information column in Package/Ordering Information table ....................................... 2 • Changed first TLV809I50 DBZ ordering information entry in Package/Ordering Information table ..................................... 2 Changes from Revision A (July 2010) to Revision B Page • Updated document format to current standards ................................................................................................................... 1 • Added DBZ package to pinout figure .................................................................................................................................... 1 • Added DBZ package to Package/Ordering Information table ............................................................................................... 2 • Added Thermal Information table ......................................................................................................................................... 2 • Changed Figure 3 ................................................................................................................................................................. 5 Copyright © 2010–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TLV809J25 TLV809L30 TLV809K33 TLV809I50 7 PACKAGE OPTION ADDENDUM www.ti.com 22-Feb-2012 PACKAGING INFORMATION Orderable Device (1) Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp TLV809I50DBVR ACTIVE SOT-23 DBV 3 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV809I50DBVT ACTIVE SOT-23 DBV 3 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV809I50DBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV809I50DBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV809J25DBVR ACTIVE SOT-23 DBV 3 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV809J25DBVT ACTIVE SOT-23 DBV 3 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV809J25DBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV809J25DBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV809K33DBVR ACTIVE SOT-23 DBV 3 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV809K33DBVT ACTIVE SOT-23 DBV 3 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV809K33DBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV809K33DBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV809L30DBVR ACTIVE SOT-23 DBV 3 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV809L30DBVT ACTIVE SOT-23 DBV 3 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV809L30DBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV809L30DBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM The marketing status values are defined as follows: Addendum-Page 1 (3) Samples (Requires Login) PACKAGE OPTION ADDENDUM www.ti.com 22-Feb-2012 ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 13-Aug-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) TLV809I50DBVR SOT-23 DBV 3 3000 180.0 9.0 3.3 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3.2 1.47 4.0 8.0 Q3 TLV809I50DBVT SOT-23 DBV 3 250 180.0 9.0 3.3 3.2 1.47 4.0 8.0 Q3 TLV809I50DBZR SOT-23 DBZ 3 3000 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3 TLV809I50DBZT SOT-23 DBZ 3 250 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3 TLV809J25DBVR SOT-23 DBV 3 3000 180.0 9.0 3.3 3.2 1.47 4.0 8.0 Q3 TLV809J25DBVT SOT-23 DBV 3 250 180.0 9.0 3.3 3.2 1.47 4.0 8.0 Q3 TLV809J25DBZR SOT-23 DBZ 3 3000 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3 TLV809J25DBZT SOT-23 DBZ 3 250 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3 TLV809K33DBVR SOT-23 DBV 3 3000 178.0 9.0 3.3 3.2 1.47 4.0 8.0 Q3 TLV809K33DBVR SOT-23 DBV 3 3000 180.0 9.0 3.3 3.2 1.47 4.0 8.0 Q3 TLV809K33DBZR SOT-23 DBZ 3 3000 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3 TLV809K33DBZT SOT-23 DBZ 3 250 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3 TLV809L30DBVR SOT-23 DBV 3 3000 180.0 9.0 3.3 3.2 1.47 4.0 8.0 Q3 TLV809L30DBVT SOT-23 DBV 3 250 180.0 9.0 3.3 3.2 1.47 4.0 8.0 Q3 TLV809L30DBZR SOT-23 DBZ 3 3000 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3 TLV809L30DBZT SOT-23 DBZ 3 250 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 13-Aug-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV809I50DBVR SOT-23 DBV 3 3000 182.0 182.0 20.0 TLV809I50DBVT SOT-23 DBV 3 250 182.0 182.0 20.0 TLV809I50DBZR SOT-23 DBZ 3 3000 203.0 203.0 35.0 TLV809I50DBZT SOT-23 DBZ 3 250 203.0 203.0 35.0 TLV809J25DBVR SOT-23 DBV 3 3000 182.0 182.0 20.0 TLV809J25DBVT SOT-23 DBV 3 250 182.0 182.0 20.0 TLV809J25DBZR SOT-23 DBZ 3 3000 203.0 203.0 35.0 TLV809J25DBZT SOT-23 DBZ 3 250 203.0 203.0 35.0 TLV809K33DBVR SOT-23 DBV 3 3000 180.0 180.0 18.0 TLV809K33DBVR SOT-23 DBV 3 3000 182.0 182.0 20.0 TLV809K33DBZR SOT-23 DBZ 3 3000 203.0 203.0 35.0 TLV809K33DBZT SOT-23 DBZ 3 250 203.0 203.0 35.0 TLV809L30DBVR SOT-23 DBV 3 3000 182.0 182.0 20.0 TLV809L30DBVT SOT-23 DBV 3 250 182.0 182.0 20.0 TLV809L30DBZR SOT-23 DBZ 3 3000 203.0 203.0 35.0 TLV809L30DBZT SOT-23 DBZ 3 250 203.0 203.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. 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