TI TPS3839K33

TPS3831
TPS3839
www.ti.com
SBVS193B – JUNE 2012 – REVISED APRIL 2013
Ultralow Power, Supply Voltage Supervisor
Check for Samples: TPS3831, TPS3839
FEATURES
DESCRIPTION
•
•
•
•
•
•
•
The TPS3831 and TPS3839 (both referred to as the
TPS383x) are ultralow current (150 nA, typical),
voltage supervisory circuit that monitor a single
voltage. Both devices assert an active-low reset
signal whenever the VDD supply voltage drops below
the factory-trimmed reset threshold voltage. The reset
output remains asserted for 200 ms (typical) after the
VDD voltage rises above the threshold voltage. These
devices are designed to ignore fast transients on the
VDD pin. Note that the TPS3831 includes a manual
reset input.
1
2
Ultralow Supply Current: 150 nA (typ)
Operating Supply Voltage: 0.6 V to 6.5 V
Valid Reset for VDD > 0.6 V
Push-Pull RESET Output
Factory-Trimmed Reset Threshold Voltages
Temperature Range: –40°C to +85°C
Packages: 1-mm × 1-mm X2SON or 3-Pin
SOT23
APPLICATIONS
•
•
•
•
•
•
Portable and Battery-Powered Equipment
Industrial Equipment
Cell Phones
Glucose Monitors
Metering
Televisions
The ultralow current consumption of 150 nA makes
these voltage supervisors ideal for use in low-power
and portable applications. The TPS383x are specified
to have the correct output logic state for supply
voltages down to 0.6 V.
The TPS383x feature precision factory-trimmed
threshold voltages and extremely low-power
operation. The TPS3831 is available is a 4-pin 1-mm
× 1-mm (DQN) X2SON package. The TPS3839 is
available in a 3-pin SOT23 (DBZ) package or a 4-pin
1-mm × 1-mm (DQN) X2SON package.
DBZ PACKAGE
SOT23-3
(TOP VIEW)
TYPICAL APPLICATION
3.3 V
GND
C1
0.1 mF
1
VDD
3
VDD
TPS383xK33
MR
TPS3831
Only
RESET
RST
GND
2
RESET
Microprocessor
TPS3831
DQN PACKAGE
1-mm ´ 1-mm X2SON
(TOP VIEW)
RESET
4
1
VDD
TPS3839
DQN PACKAGE
1-mm ´ 1-mm X2SON
(TOP VIEW)
RESET
1
Thermal
Pad
MR
2
4
VDD
3
GND
Thermal
Pad
3
GND
NC
2
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012–2013, Texas Instruments Incorporated
TPS3831
TPS3839
SBVS193B – JUNE 2012 – REVISED APRIL 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE INFORMATION (1)
PRODUCT
THRESHOLD VOLTAGE (V)
PACKAGE-LEAD
PACKAGE
DESIGNATOR
TPS3831A09
0.900
X2SON-4
DQN
TPS3831G12
1.100
X2SON-4
DQN
TPS3831E16
1.520
X2SON-4
DQN
TPS3831G18
1.670
X2SON-4
DQN
TPS3831L30
2.630
X2SON-4
DQN
TPS3831K33
2.930
X2SON-4
DQN
TPS3831G33
3.080
X2SON-4
DQN
TPS3831K50
4.380
X2SON-4
DQN
TPS3839A09
0.900
TPS3839G12
1.100
TPS3839E16
1.520
TPS3839G18
1.670
TPS3839L30
2.630
TPS3839K33
2.930
TPS3839G33
3.080
TPS3839K50
(1)
4.380
SOT23-3
DBZ
X2SON-4
DQN
SOT23-3
DBZ
X2SON-4
DQN
SOT23-3
DBZ
X2SON-4
DQN
SOT23-3
DBZ
X2SON-4
DQN
SOT23-3
DBZ
X2SON-4
DQN
SOT23-3
DBZ
X2SON-4
DQN
SOT23-3
DBZ
X2SON-4
DQN
SOT23-3
DBZ
X2SON-4
DQN
For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS (1)
Over operating free-air temperature range, unless otherwise noted.
VALUE
Voltage
Current
Electrostatic discharge (ESD) rating:
(2)
2
MAX
–0.3
7
V
On RESET
–0.3
7
V
10
mA
Operating ambient, TA
–40
+85
°C
Storage, Tstg
–65
+150
°C
2
kV
500
V
RESET pin
Temperature (2)
(1)
MIN
VDD
Human body model (HBM)
Charge device model (CDM)
UNIT
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.
As a result of the low dissipated power in this device, it is assumed that the junction temperature is equal to the ambient temperature.
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SBVS193B – JUNE 2012 – REVISED APRIL 2013
THERMAL INFORMATION
THERMAL METRIC
TPS3839
TPS3831
TPS3839
DBZ (SOT23-3)
DQN (X2SON)
3 PINS
4 PINS
(1)
θJA
Junction-to-ambient thermal resistance
286.9
249.9
θJCtop
Junction-to-case (top) thermal resistance
105.6
N/A
θJB
Junction-to-board thermal resistance
123.4
N/A
ψJT
Junction-to-top characterization parameter
25.8
6.0
ψJB
Junction-to-board characterization parameter
107.9
N/A
θJCbot
Junction-to-case (bottom) thermal resistance
N/A
N/A
(1)
UNITS
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
ELECTRICAL CHARACTERISTICS
At TA = –40°C to +85°C, 0.9 V < VDD < 6.5 V, and C1 = 0.1 µF, unless otherwise noted.
PARAMETER
TEST CONDITIONS
VDD
Input supply voltage range
V(VO)
Minimum VDD voltage for valid output
IOL = 1 µA
IDD
Supply current (into VDD pin)
Output not connected
VOL
Low-level output voltage (RESET pin)
MIN
TYP
0.9
150
High-level output voltage (RESET pin)
VIL
Low-level input voltage (MR pin)
VIH
High-level input voltage (MR pin)
RMR
MR pin pull-up resistance
Vhys
Negative-going threshold voltage
Hysteresis voltage
V
0.6
V
500
nA
0.4
V
VDD = 1.2 V to 2.8 V, IOL = 0.5 mA
0.4
V
0.4
V
VDD = 0.9 V to 1.2 V, IOH = –50 µA
VDD – 0.4
V
VDD = 1.2 V to 3.3 V, IOH = –0.5 mA
VDD – 0.4
V
VDD = 3.3 V to 6.5 V, IOH = –2 mA
VDD – 0.4
V
0.3VDD
10
Negative-going input threshold accuracy TA = +25°C
VIT–
UNIT
6.5
VDD = 0.9 V to 1.2 V, IOL = 120 µA
VDD = 2.8 V to 6.5 V, IOL = 2 mA
VOH
MAX
V
20
0.7VDD
V
30
kΩ
±1.0%
TPS3839A09
0.874
0.900
0.914
V
TPS3839G12
1.073
1.100
1.117
V
TPS3839E16
1.482
1.520
1.543
V
TPS3839G18
1.628
1.670
1.695
V
TPS3839L30
2.564
2.630
2.669
V
TPS3839K33
2.857
2.930
2.974
V
TPS3839G33
3.003
3.080
3.126
V
TPS3839K50
4.271
4.380
4.446
V
TPS3839A09
54
mV
TPS3839G12
11
mV
TPS3839E16
15
mV
TPS3839G18
17
mV
TPS3839L30
26
mV
TPS3839K33
29
mV
TPS3839G33
31
mV
TPS3839K50
44
mV
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TPS3831
TPS3839
SBVS193B – JUNE 2012 – REVISED APRIL 2013
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TIMING REQUIREMENTS
PARAMETER
MIN
TYP
MAX
UNIT
120
200
350
ms
td
RESET delay time (power-up delay)
tpd_vdd
Propagation delay, VDD falling (power-down delay)
20
µs
tpd_mr
Propagation delay from MR low to RESET low
46
ns
TIMING DIAGRAM
VDD
0.6 V
0.0 V
RESET
td = Reset Delay
td
td
td
= Undefined State
VIT- + VHYS
VIT-
MR
0.7VDD
0.3VDD
Time
Figure 1. MR and VDD Reset Timing
4
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TPS3839
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SBVS193B – JUNE 2012 – REVISED APRIL 2013
PIN CONFIGURATIONS
TPS3831 DQN PACKAGE
1-mm × 1-mm X2SON
(TOP VIEW)
4
1
RESET
TPS3839 DQN PACKAGE
1-mm × 1-mm X2SON
(TOP VIEW)
VDD
RESET
1
Thermal
Pad
MR
2
3
4
VDD
3
GND
Thermal
Pad
GND
NC
2
TPS3839 DBZ PACKAGE
SOT23-3
(TOP VIEW)
GND
1
3
VDD
2
RESET
PIN ASSIGNMENTS
PIN NUMBER
NAME
TPS3839DBZ
TPS3839DQN
TPS3831DQN
DESCRIPTION
GND
1
3
3
Ground
MR
N/A
N/A
2
Manual reset. Pull this pin to a logic low to assert the RESET
output. After the MR pin is deasserted, the RESET output
deasserts after the reset delay (td) elapses.
NC
N/A
2
N/A
RESET
2
1
1
Active-low reset output. RESET has a push-pull output drive and is
capable of directly driving input pins. RESET is low as long as VDD
remains below the factory threshold voltage, and until the delay
time (tD) elapses after VDD rises above the threshold voltage.
Thermal pad
N/A
Available
Available
Connect to ground or floating copper plane for mechanical stability.
VDD
3
4
4
No internal connection.
Supply voltage
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TPS3831
TPS3839
SBVS193B – JUNE 2012 – REVISED APRIL 2013
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DEVICE INFORMATION
FUNCTIONAL BLOCK DIAGRAM
VDD
Delay
RESET
VREF
GND
VDD
MR
(TPS3831 Only)
Figure 2. TPS383x Block Diagram
APPLICATION CIRCUIT
3.3 V
C1
0.1 mF
VDD
TPS383xK33
MR
TPS3831
Only
RESET
Microprocessor
RST
GND
Figure 3. Typical Application Circuit
6
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SBVS193B – JUNE 2012 – REVISED APRIL 2013
TYPICAL CHARACTERISTICS
At TA = +25°C and C1 = 0.1 µF, unless otherwise noted.
200
220
VDD = 1.2 V
VDD = 3.3 V
VDD = 5.0 V
VDD = 6.5 V
Supply Current (nA)
180
170
TPS3839K33
Reset Delay Time (ms)
190
160
150
140
130
120
210
200
190
110
100
−40
−15
10
35
Temperature (°C)
60
180
−40
85
−15
10
35
Temperature (°C)
G001
Figure 4. SUPPLY CURRENT vs INPUT VOLTAGE AND
TEMPERATURE
60
85
G002
Figure 5. RESET DELAY vs TEMPERATURE
0.2
1.8
VDD = 1.8 V
1.6
−0.2
VOH (V)
Change in VIT– (%)
0
−0.4
1.4
1.2
−0.6
TA = −40°C
TA = 0°C
TA = +25°C
TA = +85°C
1
−0.8
TPS3839A09
TPS3839K50
−1
−40
−15
10
35
Temperature (°C)
60
0.8
85
0
0.5
1
1.5
2
IOH (mA)
G003
Figure 6. PERCENTAGE CHANGE IN THRESHOLD
VOLTAGE vs TEMPERATURE
2.5
3
3.5
G004
Figure 7. VOH vs IOH AND TEMPERATURE FOR VDD = 1.8 V
vs
3.5
4
VDD = 3.3 V
VDD =4.0 V
3.5
VOH (V)
VOH (V)
2.5
3
1.5
TA = −40°C
TA = 0°C
TA = +25°C
TA = +85°C
0.5
0
2
TA = −40°C
TA = 0°C
TA = +25°C
TA = +85°C
2.5
4
6
IOH (mA)
8
10
2
0
G005
Figure 8. VOH vs IOH AND TEMPERATURE FOR VDD = 3.3 V
2
4
6
IOH (mA)
8
10
12
G006
Figure 9. VOH vs IOH AND TEMPERATURE FOR VDD = 4.0 V
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TPS3839
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TYPICAL CHARACTERISTICS (continued)
At TA = +25°C and C1 = 0.1 µF, unless otherwise noted.
1.6
1.6
TA = −40°C
TA = 0°C
TA = +25°C
TA = +25°C
1.4
1.2
1.2
1
VOL (V)
1
VOL (V)
TA = −40°C
TA = 0°C
TA = +25°C
TA = +85°C
1.4
0.8
0.8
0.6
0.6
0.4
0.4
0.2
0.2
VDD = 1.8 V
0
1
2
3
4
VDD = 3.3 V
IOL (mA)
1.4
TA = −40°C
TA = 0°C
TA = +25°C
TA = +85°C
VOL (V)
1
0.8
0.6
0.4
0.2
VDD = 4.0 V
0
0
2
4
6
IOL (mA)
8
10
2
4
6
8
10
IOL (mA)
G008
Figure 11. VOL vs IOL AND TEMPERATURE FOR VDD = 3.3 V
50
Reset Occurs Above Line
45
40
35
30
25
20
15
10
0
5
G009
Figure 12. VOL vs IOL AND TEMPERATURE FOR VDD = 4.0 V
8
0
G007
Figure 10. VOL vs IOL AND TEMPERATURE FOR VDD = 1.8 V
1.2
0
5
Minimum Pulse Duration Trigger Reset (µs)
0
10
15
20
25
VDD voltage drop below VIT− (%)
30
35
G010
Figure 13. MAXIMUM PULSE DURATION vs PERCENT OF
THRESHOLD OVERDRIVE
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SBVS193B – JUNE 2012 – REVISED APRIL 2013
APPLICATION INFORMATION
VDD TRANSIENT REJECTION
The TPS383x (TPS3831 and TPS3839) has built-in rejection of fast transients on the VDD pin. Transient
rejection depends on both the duration and amplitude of the transient. Transient amplitude is measured from the
bottom of the transient to the negative threshold voltage (VIT–) of the device, as shown in Figure 14.
VDD
VITTransient
Amplitude
Transient
Duration
(tW)
Figure 14. Voltage Transient Measurement
Minimum Pulse Duration Trigger Reset (µs)
Figure 15 shows the relationship between the transient amplitude and duration required to trigger a reset. Any
combination of duration and amplitude greater than that shown in Figure 15 generates a reset signal.
50
Reset Occurs Above Line
45
40
35
30
25
20
15
10
0
5
10
15
20
25
VDD voltage drop below VIT− (%)
30
35
G010
Figure 15. TPS3839 Transient Rejection
INPUT CAPACITOR
The TPS383x uses a unique sampling scheme to maintain an extremely low average quiescent current of 150
nA. The TPS383x typically consumes only about 100 nA of dc current. However, this current rises to
approximately 15 µA for around 200 µs while the TPS383x samples the input voltage. If the source impedance
back to the supply voltage is high, then the additional current during sampling may trigger a false reset as a
result of the apparent voltage drop at VDD. For high VDD source or trace impedance applications, it is
recommended to add a small 0.1-µF bypass capacitor near the TPS3839 VDD pin. This bypass capacitor
effectively keeps the average current at 150 nA and reduces the effects of a high-impedance voltage source.
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MANUAL RESET (MR) INPUT (TPS3831 Only)
The manual reset (MR) input allows a processor, or other logic devices, to initiate a reset (TPS3831 only). A logic
low (0.3 VDD) on MR causes RESET to assert. After MR returns to a logic high and VDD is greater than the
threshold voltage, RESET is deasserted after the reset delay time, td, elapses. Note that MR is internally tied to
VDD with a 20-kΩ resistor; therefore, this pin can be left unconnected if MR is not used. If a logic signal driving
MR does not go fully to VDD, there will be some additional current draw into VDD as a result of the internal pullup resistor on MR. To minimize current draw, a logic-level FET can be used, as illustrated in Figure 16.
VDD
20 kW
MR
TPS3831
GND
Figure 16. Using Logic-Level FET to Minimize Current Draw
BIDIRECTIONAL RESET PINS
Some microcontrollers have bidirectional reset pins that act both as an input and an output. A series resistor
should be placed between the TPS383x output and the microcontroller reset pin to protect against excessive
current flow when both the TPS383x and the microcontroller attempt to drive the reset line. Figure 17 shows the
connection of the TPS3839K33 with a microcontroller using a series resistor to drive a bidirectional reset line.
3.3 V
VCC
Microprocessor
VDD
TPS3839K33
47 k:
RESET
RST
GND
Figure 17. Connection to Bidirectional Reset Pin
10
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SBVS193B – JUNE 2012 – REVISED APRIL 2013
APPLICATION EXAMPLE: SINGLE ALKALINE CELL MONITORING
Low operating voltage and threshold options make the TPS383x well-suited for monitoring single-cell, alkalinebattery applications. Figure 18 shows the TPS3839A09 used to disable a boost converter when the cell voltage
reaches 0.9 V, which is the end of the discharge voltage for a single alkaline battery cell. When the cell voltage
reaches 0.9 V, the TPS61261 enable pin is driven low. This setting disables the TPS61261 and places it in a
low-current shutdown state. The combination of the TPS3839 and TPS61261 consumes only 250 nA (typical)
from the discharged battery.
VIN
VOUT
3.3 V at 40 mA
4.7 PH
FB
L
One-Cell
Alkaline
10 PF
10 PF
VDD
TPS61261
TPS3839A09
RESET
GND
EN
RI
GND
5 k:
Figure 18. Disabled Boost Converter
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REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current verison.
Changes from Revision A (September 2012) to Revision B
•
Changed VDD test conditions for high-level output voltage parameter ................................................................................. 3
Changes from Original (June 2012) to Revision A
•
12
Page
Page
Changed data sheet status from product preview to production data .................................................................................. 1
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PACKAGE OPTION ADDENDUM
www.ti.com
21-May-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
TPS3831A09DQNR
ACTIVE
X2SON
DQN
4
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
A3
TPS3831A09DQNT
ACTIVE
X2SON
DQN
4
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
A3
TPS3831E16DQNR
ACTIVE
X2SON
DQN
4
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
A5
TPS3831E16DQNT
ACTIVE
X2SON
DQN
4
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
A5
TPS3831G12DQNR
ACTIVE
X2SON
DQN
4
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
A4
TPS3831G12DQNT
ACTIVE
X2SON
DQN
4
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
A4
TPS3831G18DQNR
ACTIVE
X2SON
DQN
4
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
A6
TPS3831G18DQNT
ACTIVE
X2SON
DQN
4
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
A6
TPS3831G33DQNR
ACTIVE
X2SON
DQN
4
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
A7
TPS3831G33DQNT
ACTIVE
X2SON
DQN
4
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
A7
TPS3831K33DQNR
ACTIVE
X2SON
DQN
4
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
A8
TPS3831K33DQNT
ACTIVE
X2SON
DQN
4
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
A8
TPS3831K50DQNR
ACTIVE
X2SON
DQN
4
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
A9
TPS3831K50DQNT
ACTIVE
X2SON
DQN
4
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
A9
TPS3831L30DQNR
ACTIVE
X2SON
DQN
4
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
BA
TPS3831L30DQNT
ACTIVE
X2SON
DQN
4
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
BA
TPS3839A09DBZR
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
PZDI
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
21-May-2013
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
TPS3839A09DBZT
ACTIVE
SOT-23
DBZ
3
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
PZDI
TPS3839A09DQNR
ACTIVE
X2SON
DQN
4
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
ZJ
TPS3839A09DQNT
ACTIVE
X2SON
DQN
4
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
ZJ
TPS3839E16DBZR
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
PZCI
TPS3839E16DBZT
ACTIVE
SOT-23
DBZ
3
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
PZCI
TPS3839E16DQNR
ACTIVE
X2SON
DQN
4
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
ZK
TPS3839E16DQNT
ACTIVE
X2SON
DQN
4
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
ZK
TPS3839G12DBZR
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
PZBI
TPS3839G12DBZT
ACTIVE
SOT-23
DBZ
3
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
PZBI
TPS3839G12DQNR
ACTIVE
X2SON
DQN
4
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
ZE
TPS3839G12DQNT
ACTIVE
X2SON
DQN
4
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
ZE
TPS3839G18DBZR
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
PZAI
TPS3839G18DBZT
ACTIVE
SOT-23
DBZ
3
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
PZAI
TPS3839G18DQNR
ACTIVE
X2SON
DQN
4
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
ZL
TPS3839G18DQNT
ACTIVE
X2SON
DQN
4
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
ZL
TPS3839G33DBZR
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
PYZI
TPS3839G33DBZT
ACTIVE
SOT-23
DBZ
3
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
PYZI
TPS3839G33DQNR
ACTIVE
X2SON
DQN
4
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
ZG
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
21-May-2013
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
TPS3839G33DQNT
ACTIVE
X2SON
DQN
4
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
ZG
TPS3839K33DBZR
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
PYYI
TPS3839K33DBZT
ACTIVE
SOT-23
DBZ
3
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
PYYI
TPS3839K33DQNR
ACTIVE
X2SON
DQN
4
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
ZF
TPS3839K33DQNT
ACTIVE
X2SON
DQN
4
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
ZF
TPS3839K50DBZR
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
PYXI
TPS3839K50DBZT
ACTIVE
SOT-23
DBZ
3
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
PYXI
TPS3839K50DQNR
ACTIVE
X2SON
DQN
4
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
ZH
TPS3839K50DQNT
ACTIVE
X2SON
DQN
4
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
ZH
TPS3839L30DBZR
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
PYWI
TPS3839L30DBZT
ACTIVE
SOT-23
DBZ
3
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
PYWI
TPS3839L30DQNR
ACTIVE
X2SON
DQN
4
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
ZI
TPS3839L30DQNT
ACTIVE
X2SON
DQN
4
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
ZI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Addendum-Page 3
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
21-May-2013
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Jul-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
TPS3831A09DQNR
X2SON
DQN
4
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3000
180.0
9.5
1.16
1.16
0.63
4.0
8.0
Q2
TPS3831A09DQNT
X2SON
DQN
4
250
180.0
9.5
1.16
1.16
0.63
4.0
8.0
Q2
TPS3831E16DQNR
X2SON
DQN
4
3000
180.0
9.5
1.16
1.16
0.63
4.0
8.0
Q2
TPS3831E16DQNT
X2SON
DQN
4
250
180.0
9.5
1.16
1.16
0.63
4.0
8.0
Q2
TPS3831G12DQNR
X2SON
DQN
4
3000
180.0
9.5
1.16
1.16
0.63
4.0
8.0
Q2
TPS3831G12DQNT
X2SON
DQN
4
250
180.0
9.5
1.16
1.16
0.63
4.0
8.0
Q2
TPS3831G18DQNR
X2SON
DQN
4
3000
180.0
9.5
1.16
1.16
0.63
4.0
8.0
Q2
TPS3831G18DQNT
X2SON
DQN
4
250
180.0
9.5
1.16
1.16
0.63
4.0
8.0
Q2
TPS3831G33DQNR
X2SON
DQN
4
3000
180.0
9.5
1.16
1.16
0.63
4.0
8.0
Q2
TPS3831G33DQNT
X2SON
DQN
4
250
180.0
9.5
1.16
1.16
0.63
4.0
8.0
Q2
TPS3831K33DQNR
X2SON
DQN
4
3000
180.0
9.5
1.16
1.16
0.63
4.0
8.0
Q2
TPS3831K33DQNT
X2SON
DQN
4
250
180.0
9.5
1.16
1.16
0.63
4.0
8.0
Q2
TPS3831K50DQNR
X2SON
DQN
4
3000
180.0
9.5
1.16
1.16
0.63
4.0
8.0
Q2
TPS3831K50DQNT
X2SON
DQN
4
250
180.0
9.5
1.16
1.16
0.63
4.0
8.0
Q2
TPS3831L30DQNR
X2SON
DQN
4
3000
180.0
9.5
1.16
1.16
0.63
4.0
8.0
Q2
TPS3831L30DQNT
X2SON
DQN
4
250
180.0
9.5
1.16
1.16
0.63
4.0
8.0
Q2
TPS3839A09DBZR
SOT-23
DBZ
3
3000
179.0
8.4
3.15
2.95
1.22
4.0
8.0
Q3
TPS3839A09DBZT
SOT-23
DBZ
3
250
179.0
8.4
3.15
2.95
1.22
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Jul-2013
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TPS3839A09DQNR
X2SON
DQN
4
3000
180.0
9.5
1.16
1.16
0.63
4.0
8.0
Q2
TPS3839A09DQNT
X2SON
DQN
4
250
180.0
9.5
1.16
1.16
0.63
4.0
8.0
Q2
TPS3839E16DBZR
SOT-23
DBZ
3
3000
179.0
8.4
3.15
2.95
1.22
4.0
8.0
Q3
TPS3839E16DBZT
SOT-23
DBZ
3
250
179.0
8.4
3.15
2.95
1.22
4.0
8.0
Q3
TPS3839E16DQNR
X2SON
DQN
4
3000
180.0
9.5
1.16
1.16
0.63
4.0
8.0
Q2
TPS3839E16DQNT
X2SON
DQN
4
250
180.0
9.5
1.16
1.16
0.63
4.0
8.0
Q2
TPS3839G12DBZR
SOT-23
DBZ
3
3000
179.0
8.4
3.15
2.95
1.22
4.0
8.0
Q3
TPS3839G12DBZT
SOT-23
DBZ
3
250
179.0
8.4
3.15
2.95
1.22
4.0
8.0
Q3
TPS3839G12DQNR
X2SON
DQN
4
3000
180.0
9.5
1.16
1.16
0.63
4.0
8.0
Q2
TPS3839G12DQNT
X2SON
DQN
4
250
180.0
9.5
1.16
1.16
0.63
4.0
8.0
Q2
TPS3839G18DBZR
SOT-23
DBZ
3
3000
179.0
8.4
3.15
2.95
1.22
4.0
8.0
Q3
TPS3839G18DBZT
SOT-23
DBZ
3
250
179.0
8.4
3.15
2.95
1.22
4.0
8.0
Q3
TPS3839G18DQNR
X2SON
DQN
4
3000
180.0
9.5
1.16
1.16
0.63
4.0
8.0
Q2
TPS3839G18DQNT
X2SON
DQN
4
250
180.0
9.5
1.16
1.16
0.63
4.0
8.0
Q2
TPS3839G33DBZR
SOT-23
DBZ
3
3000
179.0
8.4
3.15
2.95
1.22
4.0
8.0
Q3
TPS3839G33DBZT
SOT-23
DBZ
3
250
179.0
8.4
3.15
2.95
1.22
4.0
8.0
Q3
TPS3839G33DQNR
X2SON
DQN
4
3000
180.0
9.5
1.16
1.16
0.63
4.0
8.0
Q2
TPS3839G33DQNT
X2SON
DQN
4
250
180.0
9.5
1.16
1.16
0.63
4.0
8.0
Q2
TPS3839K33DBZR
SOT-23
DBZ
3
3000
179.0
8.4
3.15
2.95
1.22
4.0
8.0
Q3
TPS3839K33DBZT
SOT-23
DBZ
3
250
179.0
8.4
3.15
2.95
1.22
4.0
8.0
Q3
TPS3839K33DQNR
X2SON
DQN
4
3000
180.0
9.5
1.16
1.16
0.63
4.0
8.0
Q2
TPS3839K33DQNT
X2SON
DQN
4
250
180.0
9.5
1.16
1.16
0.63
4.0
8.0
Q2
TPS3839K50DBZR
SOT-23
DBZ
3
3000
179.0
8.4
3.15
2.95
1.22
4.0
8.0
Q3
TPS3839K50DBZT
SOT-23
DBZ
3
250
179.0
8.4
3.15
2.95
1.22
4.0
8.0
Q3
TPS3839K50DQNR
X2SON
DQN
4
3000
180.0
9.5
1.16
1.16
0.63
4.0
8.0
Q2
TPS3839K50DQNT
X2SON
DQN
4
250
180.0
9.5
1.16
1.16
0.63
4.0
8.0
Q2
TPS3839L30DBZR
SOT-23
DBZ
3
3000
179.0
8.4
3.15
2.95
1.22
4.0
8.0
Q3
TPS3839L30DBZT
SOT-23
DBZ
3
250
179.0
8.4
3.15
2.95
1.22
4.0
8.0
Q3
TPS3839L30DQNR
X2SON
DQN
4
3000
180.0
9.5
1.16
1.16
0.63
4.0
8.0
Q2
TPS3839L30DQNT
X2SON
DQN
4
250
180.0
9.5
1.16
1.16
0.63
4.0
8.0
Q2
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Jul-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS3831A09DQNR
X2SON
DQN
4
3000
180.0
180.0
30.0
TPS3831A09DQNT
X2SON
DQN
4
250
180.0
180.0
30.0
TPS3831E16DQNR
X2SON
DQN
4
3000
180.0
180.0
30.0
TPS3831E16DQNT
X2SON
DQN
4
250
180.0
180.0
30.0
TPS3831G12DQNR
X2SON
DQN
4
3000
180.0
180.0
30.0
TPS3831G12DQNT
X2SON
DQN
4
250
180.0
180.0
30.0
TPS3831G18DQNR
X2SON
DQN
4
3000
180.0
180.0
30.0
TPS3831G18DQNT
X2SON
DQN
4
250
180.0
180.0
30.0
TPS3831G33DQNR
X2SON
DQN
4
3000
180.0
180.0
30.0
TPS3831G33DQNT
X2SON
DQN
4
250
180.0
180.0
30.0
TPS3831K33DQNR
X2SON
DQN
4
3000
180.0
180.0
30.0
TPS3831K33DQNT
X2SON
DQN
4
250
180.0
180.0
30.0
TPS3831K50DQNR
X2SON
DQN
4
3000
180.0
180.0
30.0
TPS3831K50DQNT
X2SON
DQN
4
250
180.0
180.0
30.0
TPS3831L30DQNR
X2SON
DQN
4
3000
180.0
180.0
30.0
TPS3831L30DQNT
X2SON
DQN
4
250
180.0
180.0
30.0
TPS3839A09DBZR
SOT-23
DBZ
3
3000
203.0
203.0
35.0
TPS3839A09DBZT
SOT-23
DBZ
3
250
203.0
203.0
35.0
TPS3839A09DQNR
X2SON
DQN
4
3000
180.0
180.0
30.0
TPS3839A09DQNT
X2SON
DQN
4
250
180.0
180.0
30.0
Pack Materials-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Jul-2013
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS3839E16DBZR
SOT-23
DBZ
3
3000
203.0
203.0
35.0
TPS3839E16DBZT
SOT-23
DBZ
3
250
203.0
203.0
35.0
TPS3839E16DQNR
X2SON
DQN
4
3000
180.0
180.0
30.0
TPS3839E16DQNT
X2SON
DQN
4
250
180.0
180.0
30.0
TPS3839G12DBZR
SOT-23
DBZ
3
3000
203.0
203.0
35.0
TPS3839G12DBZT
SOT-23
DBZ
3
250
203.0
203.0
35.0
TPS3839G12DQNR
X2SON
DQN
4
3000
180.0
180.0
30.0
TPS3839G12DQNT
X2SON
DQN
4
250
180.0
180.0
30.0
TPS3839G18DBZR
SOT-23
DBZ
3
3000
203.0
203.0
35.0
TPS3839G18DBZT
SOT-23
DBZ
3
250
203.0
203.0
35.0
TPS3839G18DQNR
X2SON
DQN
4
3000
180.0
180.0
30.0
TPS3839G18DQNT
X2SON
DQN
4
250
180.0
180.0
30.0
TPS3839G33DBZR
SOT-23
DBZ
3
3000
203.0
203.0
35.0
TPS3839G33DBZT
SOT-23
DBZ
3
250
203.0
203.0
35.0
TPS3839G33DQNR
X2SON
DQN
4
3000
180.0
180.0
30.0
TPS3839G33DQNT
X2SON
DQN
4
250
180.0
180.0
30.0
TPS3839K33DBZR
SOT-23
DBZ
3
3000
203.0
203.0
35.0
TPS3839K33DBZT
SOT-23
DBZ
3
250
203.0
203.0
35.0
TPS3839K33DQNR
X2SON
DQN
4
3000
180.0
180.0
30.0
TPS3839K33DQNT
X2SON
DQN
4
250
180.0
180.0
30.0
TPS3839K50DBZR
SOT-23
DBZ
3
3000
203.0
203.0
35.0
TPS3839K50DBZT
SOT-23
DBZ
3
250
203.0
203.0
35.0
TPS3839K50DQNR
X2SON
DQN
4
3000
180.0
180.0
30.0
TPS3839K50DQNT
X2SON
DQN
4
250
180.0
180.0
30.0
TPS3839L30DBZR
SOT-23
DBZ
3
3000
203.0
203.0
35.0
TPS3839L30DBZT
SOT-23
DBZ
3
250
203.0
203.0
35.0
TPS3839L30DQNR
X2SON
DQN
4
3000
180.0
180.0
30.0
TPS3839L30DQNT
X2SON
DQN
4
250
180.0
180.0
30.0
Pack Materials-Page 4
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