TECHNICAL DATA IN74HC373A Octal 3-State Noninverting Transparent Latch High-Performance Silicon-Gate CMOS The IN74HC373A is identical in pinout to the LS/ALS373. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LS/ALSTTL outputs. These latches appear transparent to data (i.e., the outputs change asynchronously) when Latch Enable is high. When Latch Enable goes low, data meeting the setup and hold time becomes latched. The Output Enable input does not affect the state of the latches, but when Output Enable is high, all device outputs are forced to the highimpedance state. Thus, data may be latched even when the outputs are not enabled. • Outputs Directly Interface to CMOS, NMOS, and TTL • Operating Voltage Range: 2.0 to 6.0 V • Low Input Current: 1.0 µA • High Noise Immunity Characteristic of CMOS Devices ORDERING INFORMATION IN74HC373AN Plastic IN74HC373ADW SOIC TA = -55° to 125° C for all packages PIN ASSIGNMENT LOGIC DIAGRAM FUNCTION TABLE Inputs PIN 20=VCC PIN 10 = GND Output Output Enable Latch Enable D Q L H H H L H L L L L X No Change H X X Z X = Don’t Care Z = High Impedance Rev. 00 IN74HC373A MAXIMUM RATINGS* Symbol Parameter Value Unit -0.5 to +7.0 V VCC DC Supply Voltage (Referenced to GND) VIN DC Input Voltage (Referenced to GND) -1.5 to VCC +1.5 V DC Output Voltage (Referenced to GND) -0.5 to VCC +0.5 V DC Input Current, per Pin ±20 mA IOUT DC Output Current, per Pin ±35 mA ICC DC Supply Current, VCC and GND Pins ±75 mA PD Power Dissipation in Still Air, Plastic DIP+ SOIC Package+ 750 500 mW -65 to +150 °C 260 °C VOUT IIN Tstg TL Storage Temperature Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP or SOIC Package) * Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. +Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C SOIC Package: : - 7 mW/°C from 65° to 125°C RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN, VOUT Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) TA Operating Temperature, All Package Types tr, tf Input Rise and Fall Time (Figure 1) VCC =2.0 V VCC =4.5 V VCC =6.0 V Min Max Unit 2.0 6.0 V 0 VCC V -55 +125 °C 0 0 0 1000 500 400 ns This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND≤(VIN or VOUT)≤VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. Rev. 00 IN74HC373A DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) VCC Symbol Parameter VIH Minimum High-Level Input Voltage VIL VOH Test Conditions V 25 °C to -55°C ≤85 °C ≤125 °C Unit VOUT=0.1 V or VCC-0.1 V IOUT≤ 20 µA 2.0 4.5 6.0 1.5 3.15 4.2 1.5 3.15 4.2 1.5 3.15 4.2 V Maximum Low Level Input Voltage VOUT=0.1 V or VCC-0.1 V IOUT ≤ 20 µA 2.0 4.5 6.0 0.5 1.35 1.8 0.5 1.35 1.8 0.5 1.35 1.8 V Minimum High-Level Output Voltage VIN=VIH or VIL IOUT ≤ 20 µA 2.0 4.5 6.0 1.9 4.4 5.9 1.9 4.4 5.9 1.9 4.4 5.9 V 4.5 6.0 3.98 5.48 3.84 5.34 3.7 5.2 2.0 4.5 6.0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 VIN= VIL or VIH IOUT ≤ 6.0 mA IOUT ≤ 7.8 mA 4.5 6.0 0.26 0.26 0.33 0.33 0.4 0.4 VIN=VIH or VIL IOUT ≤ 6.0 mA IOUT ≤ 7.8 mA VOL Guaranteed Limit Maximum Low-Level Output Voltage VIN= VIL or VIH IOUT ≤ 20 µA V IIN Maximum Input Leakage Current VIN=VCC or GND 6.0 ±0.1 ±1.0 ±1.0 µA IOZ Maximum ThreeState Leakage Current Output in High-Impedance State VIN= VIL or VIH VOUT=VCC or GND 6.0 ±0.5 ±5.0 ±10 µA ICC Maximum Quiescent Supply Current (per Package) VIN=VCC or GND IOUT=0µA 6.0 4.0 40 160 µA Rev. 00 IN74HC373A AC ELECTRICAL CHARACTERISTICS (CL=50pF,Input tr=tf=6.0 ns) VCC Symbol Parameter Guaranteed Limit V 25 °C to -55°C ≤85°C ≤125°C Unit tPLH, tPHL Maximum Propagation Delay, Input D to Q (Figures 1 and 5) 2.0 4.5 6.0 125 25 21 155 31 26 190 38 32 ns tPLH, tPHL Maximum Propagation Delay , Latch Enable to Q (Figures 2 and 5) 2.0 4.5 6.0 140 28 24 175 35 30 210 42 36 ns tPLZ, tPHZ Maximum Propagation Delay ,Output Enable to Q (Figures 3 and 6) 2.0 4.5 6.0 150 30 26 190 38 33 225 45 38 ns tPZL, tPZH Maximum Propagation Delay , Output Enable to Q (Figures 3 and 6) 2.0 4.5 6.0 150 30 26 190 38 33 225 45 38 ns tTLH, tTHL Maximum Output Transition Time, Any Output (Figures 1 and 5) 2.0 4.5 6.0 60 12 10 75 15 13 90 18 15 ns Maximum Input Capacitance - 10 10 10 pF Maximum Three-State Output Capacitance (Output in High-Impedance State) - 15 15 15 pF CIN COUT CPD Power Dissipation Capacitance (Per Enabled Output) Typical @25°C,VCC=5.0 V Used to determine the no-load dynamic power consumption: PD=CPDVCC2f+ICCVCC 36 pF TIMING REQUIREMENTS (CL=50pF,Input tr=tf=6.0 ns) VCC Guaranteed Limit Symbol Parameter V 25 °C to -55°C ≤85°C ≤125°C Unit tSU Minimum Setup Time, Input D to Latch Enable (Figure 4) 2.0 4.5 6.0 25 5.0 5.0 30 6.0 6.0 40 8.0 7.0 ns th Minimum Hold Time,Latch Enable to Input D (Figure 4) 2.0 4.5 6.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 ns tw Minimum Pulse Width, Latch Enable (Figure 2) 2.0 4.5 6.0 60 12 10 75 15 13 90 18 15 ns tr, tf Maximum Input Rise and Fall Times (Figure 1) 2.0 4.5 6.0 1000 500 400 1000 500 400 1000 500 400 ns Rev. 00 IN74HC373A Figure 1. Switching Waveforms Figure 2. Switching Waveforms Figure 3. Switching Waveforms Figure 4. Switching Waveforms Figure 5. Test Circuit Figure 6. Test Circuit EXPANDED LOGIC DIAGRAM Rev. 00 IN74HC373A N SUFFIX PLASTIC DIP (MS - 001AD) A Dimension, mm 11 20 B 1 10 Symbol MIN MAX A 24.89 26.92 B 6.1 7.11 5.33 C F L C -T- SEATING PLANE D 0.36 0.56 F 1.14 1.78 G 2.54 H 7.62 N G K M J H D 0.25 (0.010) M T NOTES: 1. Dimensions “A”, “B” do not include mold flash or protrusions. Maximum mold flash or protrusions 0.25 mm (0.010) per side. J 0° 10° K 2.92 3.81 L 7.62 8.26 M 0.2 0.36 N 0.38 D SUFFIX SOIC (MS - 013AC) A 20 11 H Dimension, mm B 1 P 10 G R x 45 C -TK D SEATING PLANE J 0.25 (0.010) M T C M NOTES: 1. Dimensions A and B do not include mold flash or protrusion. 2. Maximum mold flash or protrusion 0.15 mm (0.006) per side for A; for B ‑ 0.25 mm (0.010) per side. F M Symbol MIN MAX A 12.6 13 B 7.4 7.6 C 2.35 2.65 D 0.33 0.51 F 0.4 1.27 G 1.27 H 9.53 J 0° 8° K 0.1 0.3 M 0.23 0.32 P 10 10.65 R 0.25 0.75 Rev. 00