TI TMS320C5420GGUA200

SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
D 200-MIPS Dual-Core DSP Consisting of Two
D
D
D
D
D
D
D
D
D
D
D
D
D
Independent Subsystems
Each Core Has an Advanced Multibus
Architecture With Three Separate 16-Bit
Data Memory Buses and One Program Bus
40-Bit Arithmetic Logic Unit (ALU)
Including a 40-Bit Barrel-Shifter and Two
40-Bit Accumulators Per Core
Each Core Has a 17- × 17-Bit Parallel
Multiplier Coupled to a 40-Bit Adder for
Non-Pipelined Single-Cycle Multiply/
Accumulate (MAC) Operations
Each Core Has a Compare, Select, and
Store Unit (CSSU) for the Add/Compare
Selection of the Viterbi Operator
Each Core Has an Exponent Encoder to
Compute an Exponent Value of a 40-Bit
Accumulator Value in a Single Cycle
Each Core Has Two Address Generators
With Eight Auxiliary Registers and Two
Auxiliary Register Arithmetic Units
(ARAUs)
16-Bit Data Bus With Data Bus Holder
Feature
256K × 16 Extended Program Address
Space
Total of 192K × 16 Dual- and Single-Access
On-Chip RAM
Single-Instruction Repeat and
Block-Repeat Operations
Instructions With 32-Bit Long Word
Operands
Instructions With 2 or 3 Operand Reads
Fast Return From Interrupts
D Arithmetic Instructions With Parallel Store
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
and Parallel Load
Conditional Store Instructions
Output Control of CLKOUT
Output Control of TOUT
Power Consumption Control With IDLE1,
IDLE2, and IDLE3 Instructions
Dual 1.8-V (Core) and 3.3-V (I/O) Power
Supplies for Low Power, Fast Operation
10-ns Single-Cycle Fixed-Point Instruction
Execution
Interprocessor Communication via Two
Internal 8-Element FIFOs
12 Channels of Direct Memory Access
(DMA) for Data Transfers With No CPU
Loading (6 Channels Per Subsystem)
Six Multichannel Buffered Serial Ports
(McBSPs) (Three McBSPs Per Subsystem)
16-Bit Host-Port Interface (HPI16)
Multiplexed With External Memory Interface
Pins
Software-Programmable Phase-Locked
Loop (PLL) Provides Several Clocking
Options (Requires External TTL Oscillator)
On-Chip Scan-Based Emulation Logic
Two Software-Programmable Timers
(One Per Subsystem)
Software-Programmable Wait-State
Generator (14 Wait States Maximum)
Provided in 144-pin BGA Ball Grid Array
(GGU Suffix) and 144-pin Low-Profile Quad
Flatpack (LQFP) (PGE Suffix) Packages
NOTE: This data sheet is designed to be used in conjunction with the TMS320C54x DSP Functional Overview (literature
number SPRU307).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
TMS320C54x is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
Copyright  2008, Texas Instruments Incorporated
! " #$%! " &$'(#! )!%*
)$#!" # ! "&%##!" &% !+% !%" %," "!$%!"
"!)) -!.* )$#! &#%""/ )%" ! %#%""(. #($)%
!%"!/ (( &%!%"*
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1
SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
Table of Contents
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Functional Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Multicore Reset Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
On-Chip Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
16-bit Host-Port Interface (HPI16) . . . . . . . . . . . . . . . . . . 24
Multichannel Buffered Serial Port (McBSP) . . . . . . . . . . . 26
Direct Memory Access Unit (DMA) . . . . . . . . . . . . . . . . . . 27
Subsystem Communications . . . . . . . . . . . . . . . . . . . . . . . 29
General-Purpose I/O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Memory-Mapped Registers . . . . . . . . . . . . . . . . . . . . . . . . 33
Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
IDLE3 Power-Down Mode . . . . . . . . . . . . . . . . . . . . . . . . . 39
Emulating the 5420 Device . . . . . . . . . . . . . . . . . . . . . . . . 39
Documentation Support . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . .
Recommended Operating Conditions . . . . . . . . . . . . . . .
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .
External Multiply-By-N Clock Option . . . . . . . . . . . . . . . .
Bypass Option . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
External Memory Interface Timing for One Wait State . .
Ready Timing for Externally Generated Wait States . . .
Parallel I/O Interface Timing . . . . . . . . . . . . . . . . . . . . . . .
I/O Port Timing for Externally Generated Wait States . .
Reset, BIO, Interrupt, and XIO Timing . . . . . . . . . . . . . . .
External Flag (XF) and Timer Output (TOUT) Timing . .
General-Purpose Input/Output (GPIO) Timing . . . . . . . .
SELA/B Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Multichannel Buffered Serial Port Timing . . . . . . . . . . . . .
HPI16 Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
41
41
42
43
44
45
49
51
53
55
57
58
59
60
68
76
REVISION HISTORY
REVISION
PRODUCT STATUS
HIGHLIGHTS
*
March 1999
Advance Information
Original
A
April 1999
Advance Information
Updated characteristics data.
B
September 1999
Production Data
Updated characteristics data.
C
April 2000
Production Data
Updated characteristics data.
D
June 2000
Production Data
Updated characteristics data.
E
April 2001
Production Data
Removed 4K × 16-bit block of on-chip memory labeled SARAM4.
This is no longer a supported feature of this device.
Production Data
Signal Descriptions table:
− Added footnote about TRST
Mechanical Data section:
− Added paragraph about packaging information
− Added “Package Thermal Resistance Characteristics” section
− Mechanical drawings will be appended to this document via an
automated process
F
2
DATE
October 2008
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SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
description
The TMS320VC5420 fixed-point digital signal processor (DSP) is a dual CPU device capable of up to 200-MIPS
performance. The 5420 consists of two independent 54x subsystems capable of core-to-core communications.
Each subsystem CPU is based on an advanced, modified Harvard architecture that has one program memory
bus and three data memory buses. The processor also provides an arithmetic logic unit (ALU) that has a high
degree of parallelism, application-specific hardware logic, on-chip memory, and additional on-chip peripherals.
Each subsystem has separate program and data spaces, allowing simultaneous accesses to program
instructions and data. Two read operations and one write operation can be performed in one cycle. Instructions
with parallel store and application-specific instructions can fully utilize this architecture. Furthermore, data can
be transferred between program and data spaces. Such parallelism supports a powerful set of arithmetic, logic,
and bit manipulation operations that can be performed in a single machine cycle. In addition, the 5420 includes
the control mechanisms to manage interrupts, repeated operations, and function calls.
The 5420 is offered in two temperature ranges and individual part numbers as shown below. (Please note that
the industrial temperature device part numbers do not follow the typical numbering tradition.)
Commercial temperature devices (0°C to 100°C)
TMS320VC5420PGE200 (144-pin LQFP)
TMS320VC5420GGU200 (144-pin BGA)
Industrial temperature range devices (−40°C to 100°C)
TMS320C5420PGEA200 (144-pin LQFP)
TMS320C5420GGUA200 (144-pin BGA)
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3
SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
109
111
110
112
113
114
115
116
117
119
118
120
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
75
35
74
36
73
PPA14
PPA15
VSS
PPA16
PPA17
B_INT0
B_INT1
B_NMI
IS
B_GPIO2/BIO
B_GPIO1
B_GPIO0
B_BFSR1
B_BDR1
CVDD
VSS
B_BCLKR1
B_BFSX1
VSS
B_BDX1
B_BCLKX1
CVDD
VSS
TEST
XIO
B_RS
B_XF
B_CLKOUT
HMODE
HPIRS
PPA13
PPA12
VSS
DVDD
PPA11
PPA10
VSS
PPD15
PPD14
VSS
PPD13
PPD12
A_BFSR0
A_BDR0
A_BCLKR0
A_BFSX0
VSS
CVDD
A_BDX0
A_BCLKX0
MSTRB
DS
PS
B_BCLKX0
B_BDX0
DV DD
V SS
B_BFSX0
B_BCLKR0
B_BDR0
CVDD
V SS
B_BFSR0
R/W
PPA2
PPA3
SELA/B
PPD8
PPD9
PPD10
PPD11
VSS
72
76
34
71
77
33
70
78
32
69
79
31
68
80
30
67
81
29
66
82
28
65
83
27
64
84
26
63
85
25
62
86
24
61
87
23
60
88
22
59
89
21
58
90
20
57
91
19
56
92
18
55
93
17
54
94
16
53
95
15
52
96
14
51
97
13
50
98
12
49
99
11
48
100
10
47
101
9
46
102
8
45
103
7
44
104
6
43
105
5
42
106
4
41
3
40
107
39
108
2
38
1
37
PPD7
PPA8
PPA0
DVDD
PPA9
PPD1
A_INT1
A_NMI
IOSTRB
A_GPIO2/BIO
A_GPIO1
A_RS
A_GPIO0
VSS
VSS
CVDD
A_BFSR1
A_BDR1
A_BCLKR1
A_BFSX1
CVDD
VSS
A_BDX1
A_BCLKX1
A_XF
A_CLKOUT
VCO
TCK
TMS
TDI
TRST
EMU1/OFF
DVDD
A_INT0
EMU0
TDO
143
144
VSS
PPD0
PPD5
PPD4
PPD6
A_BFSX2
A_BDX2
A_BFSR2
A_BDR2
A_BCLKR2
VSS
CV DD
A_BCLKX2
READY
DVDD
CLKIN
NC
VSSA
AV DD
VSS
B_BCLKX2
B_BDX2
B_BFSX2
B_BCLKR2
CVDD
VSS
B_BDR2
B_BFSR2
PPD2
PPD3
PPA1
PPA5
DV DD
PPA4
PPA6
PPA7
TMS320VC5420 PGE PACKAGE†‡§
(TOP VIEW)
† NC = No internal connection
‡ DVDD is the power supply for the I/O pins while CVDD is the power supply for the core CPU. VSS is the ground for both the I/O
pins and the core CPU.
§ Pin configuration shown for nonmultiplexed mode only. See the Pin Assignments for the TMS320VC5420PGE table for multiplexed
functions of specific pins.
4
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SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
TMS320VC5420 GGU PACKAGE
( BOTTOM VIEW )
13 12 11 10 9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
The pin assignments table for the TMS320VC5420GGU lists each pin name and its associated pin number for
this 144-pin ball grid array (BGA) package.
POST OFFICE BOX 1443
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5
SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
pin assignments
The 5420 pin assignments tables list each pin name and corresponding pin number for the two package types.
Some of the 5420 pins can be configured for one of two functions. For these pins, the primary pin name is listed
in the primary column. The secondary pin name is listed in the secondary column and is shaded grey.
Pin Assignments for the TMS320VC5420PGE
(144-Pin Low-Profile Quad Flatpack)
PRIMARY
SIGNAL NAME
SECONDARY
SIGNAL NAME
PIN
NO.
PRIMARY
SIGNAL NAME
SECONDARY
SIGNAL NAME
PIN
NO.
PPD7
HD7
1
PPA8
PPA0
A_HINT
3
DVDD
5
PPD1
7
A_NMI
8
9
A_GPIO2/BIO
10
A_GPIO1
11
A_RS
12
A_GPIO0
13
14
VSS
A_BFSR1
15
VSS
CVDD
17
A_BDR1
18
A_BCLKR1
19
A_BFSX1
20
CVDD
21
23
VSS
A_BCLKX1
22
A_BDX1
A_XF
25
A_CLKOUT
26
VCO
27
TCK
28
TMS
29
TDI
30
TRST
31
EMU1
32
DVDD
33
A_INT0
34
EMU0
35
TDO
36
PPA9
A_INT1
2
4
HD1
6
A_GPIO3
IOSTRB
A_TOUT
VSS
PPD14
37
PPD15
HD14
39
PPD13
HD13
24
HD15
38
41
VSS
PPD12
A_BFSR0
43
A_BDR0
44
A_BCLKR0
45
A_BFSX0
46
VSS
A_BDX0
47
CVDD
48
49
A_BCLKX0
MSTRB
HCS
51
DS
PS
HDS1
40
HD12
42
50
HDS2
52
53
B_BCLKX0
54
B_BDX0
55
DVDD
56
VSS
B_BCLKR0
57
B_BFSX0
58
59
B_BDR0
60
CVDD
61
62
63
VSS
R/W
HR/W
64
65
PPA3
HCNTL0
66
B_BFSR0
PPA2
HCNTL1
SELA/B
6
16
67
PPD8
HD8
68
PPD9
HD9
69
PPD10
HD10
70
PPD11
HD11
71
VSS
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SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
Pin Assignments for the TMS320VC5420PGE
(144-Pin Low-Profile Quad Flatpack) (Continued)
PRIMARY
SIGNAL NAME
SECONDARY
SIGNAL NAME
PIN
NO.
PRIMARY
SIGNAL NAME
SECONDARY
SIGNAL NAME
PIN
NO.
PPA10
73
PPA11
74
DVDD
75
76
PPA12
77
VSS
PPA13
HPIRS
79
HMODE
80
B_CLKOUT
81
B_XF
82
B_RS
83
XIO
84
TEST
85
86
CVDD
87
VSS
B_BCLKX1
B_BDX1
89
90
B_BFSX1
91
VSS
B_BCLKR1
VSS
B_BDR1
93
CVDD
94
95
B_BFSR1
96
B_GPIO0
97
B_GPIO1
B_GPIO2/BIO
99
B_NMI
101
B_INT1
102
B_INT0
103
PPA17
104
PPA16
105
107
VSS
PPA14
106
PPA15
109
PPA6
110
111
DVDD
113
PPA1
B_HINT
114
HD2
116
PPA7
PPA4
HAS
PPA5
PPD3
88
92
98
B_GPIO3
100
108
112
115
PPD2
B_BFSR2
117
B_BDR2
118
VSS
B_BCLKR2
119
CVDD
120
121
B_BFSX2
122
B_BDX2
123
B_BCLKX2
124
VSS
VSSA
125
AVDD
NC
126
127
CLKIN
129
DVDD
130
READY
HD3
IS
78
HRDY
128
131
A_BCLKX2
132
CVDD
133
134
A_BCLKR2
135
VSS
A_BDR2
A_BFSR2
137
A_BDX2
A_BFSX2
139
PPD6
HD6
140
HD5
142
PPD4
HD4
141
PPD5
PPD0
HD0
143
VSS
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136
138
144
7
SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
Pin Assignments for the TMS320VC5420GGU
(144-Pin MicroStar BGA)
PRIMARY
SIGNAL NAME
PPD7
SECONDARY
SIGNAL NAME
HD7
BALL
NO.
PRIMARY
SIGNAL NAME
SECONDARY
SIGNAL NAME
BALL
NO.
A1
PPA8
B1
C1
A_NMI
D1
A_RS
E1
CVDD
F1
A_BDR1
G1
CVDD
H1
A_XF
J1
TMS
K1
EMU1/OFF
L1
EMU0
M1
VSS
N1
PPD0
HD0
A2
VSS
B2
PPA0
A_HINT
C2
A_INT1
D2
A_GPIO1
E2
VSS
F2
A_BFSR1
G2
VSS
H2
A_CLKOUT
J2
TDI
K2
DVDD
L2
TDO
M2
PPD15
HD15
DVDD
N2
PDD6
HD6
A3
PPD4
HD4
B3
PPD5
HD5
C3
PPD1
HD1
D3
A_GPIO2/BIO
E3
VSS
F3
A_BCLKR1
G3
A_BDX1
H3
VCO
J3
TRST
A_INT0
L3
PPD14
VSS
N3
A_BFSR2
A4
A_BDX2
B4
A_BFSX2
C4
PPA9
D4
IOSTRB
A_GPIO0
F4
A_BFSX1
G4
A_BCLKX1
H4
TCK
J4
K3
HD14
M3
A_GPIO3
PPD13
K4
PPD12
M4
A_BDR0
N4
CVDD
A5
VSS
B5
A_BCLKR2
C5
A_BDR2
D5
A_BCLKR0
K5
A_BFSX0
L5
VSS
M5
CVDD
N5
CLKIN
A6
DVDD
B6
C6
A_BCLKX2
D6
K6
A_BCLKX0
L6
M6
DS
AVDD
A7
VSS
B7
VSSA
C7
NC
D7
HRDY
A_BDX0
MSTRB
HCS
MicroStar BGA is a trademark of Texas Instruments.
8
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HD12
E4
A_BFSR0
READY
HD13
A_TOUT
HDS2
L4
N6
SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
Pin Assignments for the TMS320VC5420GGU
(144-Pin MicroStar BGA) (Continued)
PRIMARY
SIGNAL NAME
SECONDARY
SIGNAL NAME
DVDD
BALL
NO.
PRIMARY
SIGNAL NAME
SECONDARY
SIGNAL NAME
BALL
NO.
K7
B_BDX0
L7
M7
B_BCLKX0
N7
B_BCLKX2
A8
B_BDX2
B8
B_BFSX2
C8
B_BCLKR2
D8
B_BDR0
K8
B_BCLKR0
L8
B_BFSX0
M8
VSS
N8
CVDD
A9
VSS
B9
B_BDR2
C9
B_BFSR2
D9
HR/W
K9
B_BFSR0
L9
M9
CVDD
PPD2
HD2
A10
PPD3
PPA1
B_HINT
C10
PPA5
D10
E10
B_BFSR1
F10
B_BCLKR1
G10
TEST
H10
B_CLKOUT
J10
PPA12
K10
SELA/B
L10
PPA3
PS
R/W
HDS1
VSS
N9
HD3
B10
B_GPIO3
IS
B_TOUT
HCNTL0
M10
PPA2
HCNTL1
N10
DVDD
A11
PPA4
HAS
B11
VSS
C11
D11
B_GPIO2/BIO
E11
B_INT0
B_BDR1
F11
B_BFSX1
G11
VSS
H11
B_XF
J11
PPA13
K11
PPD10
HD10
L11
M11
PPD8
HD8
N11
PPA6
A12
PPA14
B12
PPA16
C12
B_INT1
D12
B_GPIO1
E12
CVDD
F12
B_BDX1
G12
CVDD
H12
B_RS
J12
HPIRS
K12
DVDD
L12
VSS
M12
N12
PPA7
A13
PPA15
B13
PPA17
C13
B_NMI
D13
B_GPIO0
E13
VSS
F13
VSS
G13
B_BCLKX1
H13
XIO
J13
HMODE
K13
VSS
L13
PPA11
M13
PPA10
N13
PPD9
PPD11
HD9
HD11
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SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
signal descriptions
The 5420 signal descriptions table lists each pin name, function, and operating mode(s) for the 5420 device.
Some of the 5420 pins can be configured for one of two functions; a primary function and a secondary function.
The names of these pins in secondary mode are shaded in grey in the following table.
Signal Descriptions
NAME
TYPE†
DESCRIPTION
DATA SIGNALS
PPA17 (MSB)
PPA16
PPA15
PPA14
PPA13
PPA12
PPA11
PPA10
PPA9
PPA8
PPA7
PPA6
PPA5
PPA4‡§
PPA3
PPA2
PPA1
PPA0 (LSB)
PPD15 (MSB)
PPD14
PPD13
PPD12
PPD11
PPD10
PPD9
PPD8
PPD7
PPD6
PPD5
PPD4
PPD3
PPD2
PPD1
PPD0 (LSB)
Parallel port address bus. The DSP can access the external memory locations by way of the external memory
interface using PPA[17:0] in external memory interface (EMIF) mode when the XIO pin is logic high.
I/O/Z
The PPA[17:0] pins are also multiplexed with the HPI interface. In HPI mode (XIO pin is low), the external address
pins PPA[17:0] are used by a host processor for access to the memory map by way of the on-chip HPI. Refer
to the HPI section of this table for details on the secondary functions of these pins.
These pins are placed into the high-impedance state when OFF is low.
Parallel port data bus. The DSP uses this bidirectional data bus to access external memory when the device is
in external memory interface (EMIF) mode (the XIO pin is logic high).
This data bus is also multiplexed with the 16-bit HPI data bus. When in HPI mode, the bus is used to transfer data
between the host processor and internal DSP memory via the HPI. Refer to the HPI section of this table for details
on the secondary functions of these pins.
I/O/Z¶
The data bus includes bus holders to reduce power dissipation caused by floating, unused pins. The bus holders
also eliminate the need for external pullup resistors on unused pins. When the data bus is not being driven by
the 5420, the bus holders keep data pins at the last driven logic level. The data bus keepers are disabled at reset
and can be enabled/disabled via the BH bit of the BSCR register.
These pins are placed into high-impedance state when OFF is low.
INITIALIZATION, INTERRUPT, AND RESET OPERATIONS
A_INT0§
B_INT0§
A_INT1§
B_INT1§
A_NMI§
B_NMI§
I
External user interrupts. INT0−INT3 are prioritized and are maskable by the interrupt mask register (IMR) and
the interrupt mode bit. INT0 −INT3 can be polled and reset by way of the interrupt flag register (IFR).
I
Nonmaskable interrupt. NMI is an external interrupt that cannot be masked by way of the INTM or the IMR. When
NMI is activated, the processor traps to the appropriate vector location.
† I = Input, O = Output, S = Supply, Z = High Impedance
‡ This pin has an internal pullup resistor.
§ These pins have Schmitt trigger inputs.
¶ This pin has an internal bus holder controlled by way of the BSCR register in subchip A.
# This pin is used by Texas Instruments for device testing and should be left unconnected.
|| This pin has an internal pulldown resistor.
k Although this pin includes an internal pulldown resistor, a 470-Ω external pulldown is required. If the TRST pin is connected to multiple DSPs,
a buffer is recommended to ensure the VIL and VIH specifications are met.
10
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SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
Signal Descriptions (Continued)
NAME
TYPE†
DESCRIPTION
INITIALIZATION, INTERRUPT, AND RESET OPERATIONS (CONTINUED)
A_RS§
B_RS§
I
Reset. RS causes the digital signal processor (DSP) to terminate execution and causes a reinitialization of the
CPU and peripherals. When RS is brought to a high level, execution begins at location 0FF80h of program
memory. RS affects various registers and status bits.
The XIO pin is used to configure the parallel port as a host-port interface (HPI mode when XIO pin is low), or as
an asynchronous memory interface (EMIF mode when XIO pin is high).
XIO
I
At device reset, the logic combination of the XIO, HMODE, and SELA/B pin levels determines the initialization
value of the MP/MC bit (a bit in the processor mode status (PMST) register ) Refer to the memory section for
details.
GENERAL-PURPOSE I/O SIGNALS
A_XF
B_XF
A_GPIO0
B_GPIO0
A_GPIO1
B_GPIO1
O
External flag output (latched software-programmable output-only signal). Bit addressable. A_XF and B_XF are
placed into the high-impedance state when OFF is low.
General-purpose I/O pins (software-programmable I/O signal). Values can be latched (output) by writing into the
GPIO register. The states of GPIO pins (inputs) can be read by reading the GPIO register. The GPIO direction
is also programmable by way of the DIRn field in the GPIO register.
I/O
General-purpose I/O. These pins can be configured in the same manner as GPIO0–1; however in input mode,
the pins also operate as the traditional branch control bit (BIO). If application code does not perform
BIO-conditional instructions, these pins operate as general inputs.
A_GPIO2/BIO
B_GPIO2/BIO
PRIMARY
A_GPIO3
(A_TOUT)
B_GPIO3
(B_TOUT)
IOSTRB
I/O
O
IS
When the device is in HPI mode and HMODE = 0 (multiplexed), these pins are controlled
by the general-purpose I/O control register. TOUT bit must be set to “1” to drive the timer
output on the pin. IF TOUT = 0, then these pins are general-purpose I/Os. In EMIF mode
(XIO pin high), these signals serve their primary functions and are active during external
I/O space accesses.
MEMORY CONTROL SIGNALS
Program space select signal. The PS signal is asserted during external program space accesses. This pin is
placed into the high-impedance state when OFF is low.
PS‡
O
This pin is also multiplexed with the HPI, and functions as the HDS1 data strobe input signal in HPI mode. Refer
to the HPI section of this table for details on the secondary function of this pin.
Data space select signal. The DS signal is asserted during external data space accesses. This pin is placed into
the high-impedance state when OFF is low.
DS‡
O
This pin is also multiplexed with the HPI, and functions as the HDS2 data strobe input signal in HPI mode. Refer
to the HPI section of this table for details on the secondary function of this pin.
I/O space select signal. The IS signal is asserted during external I/O space accesses. This pin is placed into the
high-impedance state when OFF is low.
IS
O
MSTRB‡§
O
This pin is also multiplexed with the general purpose I/O feature, and functions as the B_GPIO3 (B_TOUT)
input/output signal in HPI mode. Refer to the General Purpose I/O section of this table for details on the secondary
function of this pin.
Program and data memory strobe (active in EMIF mode). This pin is placed into the high-impedance state when
OFF is low.
† I = Input, O = Output, S = Supply, Z = High Impedance
‡ This pin has an internal pullup resistor.
§ These pins have Schmitt trigger inputs.
¶ This pin has an internal bus holder controlled by way of the BSCR register in subchip A.
# This pin is used by Texas Instruments for device testing and should be left unconnected.
|| This pin has an internal pulldown resistor.
k Although this pin includes an internal pulldown resistor, a 470-Ω external pulldown is required. If the TRST pin is connected to multiple DSPs,
a buffer is recommended to ensure the VIL and VIH specifications are met.
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11
SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
Signal Descriptions (Continued)
NAME
TYPE†
DESCRIPTION
MEMORY CONTROL SIGNALS (CONTINUED)
READY
I
Data-ready input signal. READY indicates that the external device is prepared for a bus transaction to be
completed. If the device is not ready (READY = 0), the processor waits one cycle and checks READY again. The
processor performs the READY detection if at least two software wait states are programmed.
This pin is also multiplexed with the HPI, and functions as the Host-port data ready (output) in HPI mode. Refer
to the HPI section of this table for details on the secondary function of this pin.
Read/write output signal. R/W indicates transfer direction during communication to an external device. R/W is
normally in the read mode (high), unless it is asserted low when the DSP performs a write operation.
R/W
O
This pin is also multiplexed with the HPI, and functions as the Host-port Read/write input in HPI mode. Refer to
the HPI section of this table for details on the secondary function of this pin.
This pin is placed into the high-impedance state when OFF is low.
I/O space memory strobe. External I/O space is accessible by the CPU and not the direct memory access (DMA)
controller. The DMA has its own dedicated I/O space that is not accessible by the CPU.
IOSTRB
O
This pin is also multiplexed with the general pupose I/O feature, and functions as the A_GPIO3(A_TOUT) signal
in HPI mode. Refer to the general purpose I/O section of this table for details on the secondary function of this
pin.
This pin is placed into the high-impedance state when OFF is low.
The SELA/B pin designates which DSP subsystem has access to the parallel-port interface. Furthermore, this
pin determines which subsystem is accessible by the host via the HPI.
For external memory accesses (XIO pin high), when SELA/B is low subsystem A has control of the external
memory interface. Similarly, when SELA/B is high subsystem B has control.
SELA/B
I
See Table 7 for a truth table of SELA/B, HMODE and XIO pins and functionality.
At device reset, the logic combination of the XIO, HMODE, and SELA/B pin levels determines the initialization
value of the MP/MC bit (a bit in the processor mode status (PMST) register ) Refer to the memory section for
details.
CLOCKING SIGNALS
A_CLKOUT
B_CLKOUT
O
Master clock output signal. CLKOUT cycles at the machine-cycle rate of the CPU. The internal machine cycle
is bounded by the falling edges of this signal. The CLKOUT pin can be turned off by writing a “1” to the CLKOFF
bit of the PMST register. CLKOUT goes into the high-impedance state when EMU1/OFF is low.
CLKIN§
I
Input clock to the device. CLKIN connects to an oscillator circuit/device.
VCO
O
VCO is the output of the voltage-controlled oscillator stage of the PLL. This is a 3-state output during normal
operation. Active in silicon test/debug mode.
† I = Input, O = Output, S = Supply, Z = High Impedance
‡ This pin has an internal pullup resistor.
§ These pins have Schmitt trigger inputs.
¶ This pin has an internal bus holder controlled by way of the BSCR register in subchip A.
# This pin is used by Texas Instruments for device testing and should be left unconnected.
|| This pin has an internal pulldown resistor.
k Although this pin includes an internal pulldown resistor, a 470-Ω external pulldown is required. If the TRST pin is connected to multiple DSPs,
a buffer is recommended to ensure the VIL and VIH specifications are met.
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Signal Descriptions (Continued)
NAME
TYPE†
DESCRIPTION
MULTICHANNEL BUFFERED SERIAL PORT 0, 1, AND 2 SIGNALS
A_BCLKR0‡§
B_BCLKR0‡§
A_BCLKR1‡§
B_BCLKR1‡§
A_BCLKR2‡§
B_BCLKR2‡§
A_BCLKX0‡§
B_BCLKX0‡§
A_BCLKX1‡§
B_BCLKX1‡§
A_BCLKX2‡§
B_BCLKX2‡§
I/O/Z
Receive clocks. BCLKR serves as the serial shift clock for the buffered serial-port receiver. Input from an external
clock source for clocking data into the McBSP. When not being used as a clock, these pins can be used as
general-purpose I/O by setting RIOEN = 1.
BCLKR can be configured as an output by the way of the CLKRM bit in the PCR register.
I/O/Z
Transmit clocks. Clock signal used to clock data from the transmit register. This pin can also be configured as
an input by setting the CLKXM = 0 in the PCR register. BCLKX can be sampled as an input by way of the IN1
bit in the SPC register. When not being used as a clock, these pins can be used as general-purpose I/O by setting
XIOEN = 1.
These pins are placed into the high-impedance state when OFF is low.
A_BDR0
B_BDR0
A_BDR1
B_BDR1
A_BDR2
B_BDR2
I
Buffered serial data receive (input) pin. When not being used as data-receive pins, these pins can be used as
general-purpose I/O by setting RIOEN = 1.
A_BDX0
B_BDX0
A_BDX1
B_BDX1
A_BDX2
B_BDX2
O/Z
Buffered serial-port transmit (output) pin. When not being used as data-transmit pins, these pins can be used as
general-purpose I/O by setting XIOEN = 1. These pins are placed into the high-impedance state when OFF is
low.
A_BFSR0
B_BFSR0
A_BFSR1
B_BFSR1
A_BFSR2
B_BFSR2
I/O/Z
Frame synchronization pin for buffered serial-port input data. The BFSR pulse initiates the receive-data process
over BDR pin. When not being used as data-receive synchronization pins, these pins can be used as
general-purpose I/O by setting RIOEN = 1.
A_BFSX0
Buffered serial-port frame synchronization pin for transmitting data. The BFSX pulse initiates the transmit-data
B_BFSX0
process over BDX pin. If RS is asserted when BFSX is configured as output, then BFSX is turned into input mode
A_BFSX1
by the reset operation. When not being used as data-transmit synchronization pins, these pins can be used as
I/O/Z
B_BFSX1
general-purpose I/O by setting XIOEN = 1. These pins are placed into the high-impedance state when OFF is
A_BFSX2
low.
B_BFSX2
† I = Input, O = Output, S = Supply, Z = High Impedance
‡ This pin has an internal pullup resistor.
§ These pins have Schmitt trigger inputs.
¶ This pin has an internal bus holder controlled by way of the BSCR register in subchip A.
# This pin is used by Texas Instruments for device testing and should be left unconnected.
|| This pin has an internal pulldown resistor.
k Although this pin includes an internal pulldown resistor, a 470-Ω external pulldown is required. If the TRST pin is connected to multiple DSPs,
a buffer is recommended to ensure the VIL and VIH specifications are met.
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13
SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
Signal Descriptions (Continued)
NAME
TYPE†
DESCRIPTION
HOST-PORT INTERFACE SIGNALS
PRIMARY
HA[0:17]
HD[0:15]
I
I/O/Z
PPA[0:17]
PPD[0:15]
O
I/O/Z
HPI address inputs. HA[0:17] are used by the host device, in the HPI non-multiplexed
mode (HMODE pin is high), to address the on-chip RAM of the 5420. These pins are
shared with the external memory interface and are only used by the HPI when the interface
is in HPI mode (XIO pin is low).
Parallel bidirectional data bus. HD[0:15] are used by the host device to transfer data to
and from the on-chip RAM of the 5420. These pins are shared with the external memory
interface and are only used by the HPI when the interface is in HPI mode (XIO pin is low).
The data bus includes bus holders to reduce power dissipation caused by floating, unused
pins. The bus holders also eliminate the need for external pullup resistors on unused pins.
When the data bus is not being driven by the 5420, the bus holders keep data pins at the
last driven logic level. The data bus keepers are disabled at reset and can be
enabled/disabled via the BH bit of the BSCR register. These pins are placed into the
high-impedance state when OFF is low.
PRIMARY
HCNTL0
HCNTL1
HAS‡§
HCS‡§
HDS1‡§
HDS2‡§
HR/W
HRDY
A_HINT
B_HINT
I
PPA3
PPA2
I
PPA4‡§
I
MSTRB‡§
I
PS‡§
DS‡§
I
R/W
O
READY
O
PPA0
PPA1
O
HPI control inputs. The HCNTL0 and HCNTL1 values between HPIA, and HPID registers
during HPI reads and writes. These signals are only used in HPI multiplexed address/data
mode (HMODE pin is low).
These pins are shared with the external memory interface and are only used by the HPI
when the interface is in HPI mode (XIO pin is low).
O
Address strobe input. Hosts with multiplexed address and data pins require HAS to latch
the address in the HPIA register. This signal is only used in HPI multiplexed address/data
mode (HMODE pin is low).
This pin is shared with the external memory interface and is only used by the HPI when
the interface is in HPI mode (XIO pin is low).
O
HPI chip-select signal. This signal must be active during HPI transfers, and can remain
active between concurrent transfers.
This pin is shared with the external memory interface and is only used by the HPI when
the interface is in HPI mode (XIO pin is low).
O
HPI data strobes. HDS1 and HDS2 are driven by the host read and write strobes to control
transfer HPI transfers.
These pins are shared with the external memory interface and are only used by the HPI
when the interface is in HPI mode (XIO pin is low).
O
HPI read/write signal. This signal is used by the host to control the direction of an HPI
transfer.
This pin is shared with the external memory interface and is only used by the HPI when
the interface is in HPI mode (XIO pin is low).
I
HPI data-ready output. The ready output informs the host when the HPI is ready for the
next transfer.
This pin is shared with the external memory interface and is only used by the HPI when
the interface is in HPI mode (XIO pin is low). HRDY is placed into the high-impedance state
when OFF is low.
O
Host interrupt pin. HPI can interrupt the host by asserting this low. The host can clear this
interrupt by writing a “1” to the HINT bit of the HPIC register. Only supported in HPI
multiplexed address/data mode (HMODE pin is low). These pins are placed into the
high-impedance state when OFF is low.
† I = Input, O = Output, S = Supply, Z = High Impedance
‡ This pin has an internal pullup resistor.
§ These pins have Schmitt trigger inputs.
¶ This pin has an internal bus holder controlled by way of the BSCR register in subchip A.
# This pin is used by Texas Instruments for device testing and should be left unconnected.
|| This pin has an internal pulldown resistor.
k Although this pin includes an internal pulldown resistor, a 470-Ω external pulldown is required. If the TRST pin is connected to multiple DSPs,
a buffer is recommended to ensure the VIL and VIH specifications are met.
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SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
Signal Descriptions (Continued)
NAME
TYPE†
DESCRIPTION
HOST-PORT INTERFACE SIGNALS (CONTINUED)
HPIRS§
I
Host-port interface (HPI) reset pin. This signal resets the host port interface and both subsystems.
Host mode select. When this pin is low it selects the HPI multiplexed address/data mode. The multiplexed
address/data mode allows hosts with multiplexed address/data lines access to the HPI registers HPIC, HPIA,
and HPID. Host-to-DSP and DSP-to-host interrupts are supported in this mode.
HMODE
I
When HMODE is high, it selects the HPI nonmultiplexed mode. HPI nonmultiplexed mode allows hosts with
separate address/data buses to access the HPI address range by way of the 18-bit address bus and the HPI data
(HPID) register via the 16-bit data bus. Host-to-DSP and DSP-to-host interrupts are not supported in this mode.
SUPPLY PINS
AVDD
CVDD
S
Dedicated power supply that powers the PLL. AVDD = 1.8 V. AVDD can be connected to CVDD.
S
Dedicated power supply that powers the core CPUs. CVDD = 1.8 V
DVDD
S
Dedicated power supply that powers the I/O pins. DVDD = 3.3 V
VSS
S
Digital ground. Dedicated ground plane for the device.
VSSA
S
Analog ground. Dedicated ground for the PLL. VSSA can be connected to VSS if digital and analog grounds are
not separated.
TEST PIN
TEST#
No connection
EMULATION/TEST PINS
TCK‡§
I
Standard test clock. This is normally a free-running clock signal with a 50% duty cycle. Changes on the test
access port (TAP) of input signals TMS and TDI are clocked into the TAP controller, instruction register, or
selected test-data register on the rising edge of TCK. Changes at the TAP output signal (TDO) occur on the falling
edge of TCK.
TDI‡
I
Test data input. Pin with an internal pullup device. TDI is clocked into the selected register (instruction or data)
on a rising edge of TCK.
O
Test data pin. The contents of the selected register is shifted out of TDO on the falling edge of TCK. TDO is in
high-impedance state except when the scanning of data is in progress. These pins are placed into highimpedance state when OFF is low.
TMS‡
I
Test mode select. Pin with internal pullup device. This serial control input is clocked into the TAP controller on
the rising edge of TCK.
TRST||k
I
Test reset. When high, TRST gives the scan system control of the operations of the device. If TRST is driven low,
the device operates in its functional mode and the emulation signals are ignored. Pin with internal pulldown
device.
I/O/Z
Emulator interrupt 0 pin. When TRST is driven low, EMU0 must be high for the activation of the EMU1/OFF
condition. When TRST is driven high, EMU0 is used as an interrupt to or from the emulator system and is defined
as I/O.
TDO
EMU0
Emulator interrupt 1 pin. When TRST is driven high, EMU1/OFF is used as an interrupt to or from the emulator
system and is defined as I/O. When TRST transitions from high to low, then EMU1 operates as OFF.
EMU/OFF = 0 puts all output drivers into the high-impedance state.
EMU1/OFF
I/O/Z
Note that OFF is used exclusively for testing and emulation purposes (and not for multiprocessing applications).
Therefore, for the OFF condition, the following conditions apply:
TRST = 0, EMU0 = 1, EMU1 = 0
† I = Input, O = Output, S = Supply, Z = High Impedance
‡ This pin has an internal pullup resistor.
§ These pins have Schmitt trigger inputs.
¶ This pin has an internal bus holder controlled by way of the BSCR register in subchip A.
# This pin is used by Texas Instruments for device testing and should be left unconnected.
|| This pin has an internal pulldown resistor.
k Although this pin includes an internal pulldown resistor, a 470-Ω external pulldown is required. If the TRST pin is connected to multiple DSPs,
a buffer is recommended to ensure the VIL and VIH specifications are met.
POST OFFICE BOX 1443
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SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
functional overview
32K
Program
SARAM
C54x Core A
48K Prog/Data
SARAM
Dbus
Ebus
Cbus
Pbus
Dbus
Ebus
Cbus
Pbus
Pbus
Ebus
Dbus
Ebus
Cbus
Pbus
P, C, D, E Buses and Control Signals
16K Prog/Data
DARAM
DMA Bus
GPIO[3:0]
Peripheral Bus
McBSP0
Pheripheral Bus
CPU BUS
Modified HPI16
Host Access Bus
McBSP1
DMA Bus
Peripheral
Bus
Bridge
McBSP2
DMA
(6 channels)
TIMER
APLL
JTAG
Clocks
DSP Subsystem A
Core-to-Core
FIFO Interface
Interprocessor IRQ’s
48K Prog/Data
SARAM
16K Prog/Data
DARAM
DMA Bus
GPIO[3:0]
Host Access Bus
DMA
(6 channels)
DMA Bus
Modified HPI16
McBSP0
Peripheral Bus
CPU Bus
Peripheral
Bus
Peripheral Bus
Bridge
McBSP1
McBSP2
TIMER
JTAG
DSP Subsystem B
Figure 1. Functional Block Diagram
C54x is a trademark of Texas Instruments.
16
POST OFFICE BOX 1443
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Ebus
Dbus
Pbus
Cbus
Ebus
Dbus
Pbus
Cbus
Ebus
32K
Program
SARAM
DMA Bus
C54x Core B
Pbus
Ebus
Dbus
Pbus
Cbus
P, C, D, E Buses and Control Signals
SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
memory
The total memory address range for each 5420 subsystem is 384K 16-bit words. The memory space is divided
into three specific memory segments: 256K-word program, 64K-word data, and 64K-word I/O. The program
memory space contains the instructions to be executed as well as tables used in execution. The data memory
space stores data used by the instructions. The I/O memory space is used to interface to external
memory-mapped peripherals and can also serve as extra data storage space. The CPU I/O space should not
be confused with the DMA I/O space, which is completely independent and not accessible by the CPU.
on-chip dual-access RAM (DARAM)
The 5420 subsystems A and B each have 16K × 16-bit on-chip DARAM (2 blocks of 8K words).
Each of these RAM blocks can be accessed twice per machine cycle. This memory is intended primarily to store
data values; however, it can be used to store program as well. At reset, the DARAM is mapped into data memory
space. DARAM can be mapped into program/data memory space by setting the OVLY bit in the PMST register.
on-chip single-access RAM (SARAM)
The 5420 subsystems A and B each have 80K-word × 16-bit on-chip SARAM (ten blocks of 8K words each).
Each of these SARAM blocks is a single-access memory. This memory is intended primarily to store data values;
however, it can be used to store program as well. At reset, the SARAM (4000h−7FFFh) is mapped into data
memory space. This memory range can be mapped into program/data memory space by setting the OVLY bit
in the PMST register. The SARAM at 8000h−FFFFh is program memory at reset and can be configured as
program/data memory by setting the DROM bit. SARAM space18000h−1FFFFh is mapped as program
memory only.
program memory
The 5420 device features a paged extended memory scheme in program space to allow access of up to 256K
of program memory relative to each subsystem. This extended program memory (each subsystem) is organized
into four pages (0−3), each 64K in length. A hardware pin is used to select which DSP subsystem (A or B) has
control of the external memory interface. To implement the extended program memory scheme, the 5420 device
includes the following features:
D Two additional address lines (for a total of 18)
D A pin (SELA/B) for external memory interface arbitration between subsystem A and B
data memory
The data memory space on each 5420 subsystem contains up to 64K 16-bit word addresses. The device
automatically accesses the on-chip RAM when addressing within its bounds. When an address is generated
outside the RAM bounds, the device automatically generates an external access.
parallel I/O ports
Each subsystem of the 5420 has a total of 64K I/O ports. These ports can be addressed by PORTR and PORTW.
The IS signal indicates the read/write access through an I/O port. The devices can interface easily with external
devices through the I/O ports while requiring minimal off-chip address-decoding logic. The SELA/B pin selects
which subsystem has access to the external I/O space.
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SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
external memory interface
The 5420 has a single external memory interface shared between both subsystems. The external memory
interface enables the 5420 subsystems to connect to external memory devices or other parallel interfaces. The
SELA/B pin is used to determine which subsystem has access to the external memory interface. When the
SELA/B pin is low, subsystem A has access to the external memory interface, and when it is high, subsystem
B has access to the interface. The external memory interface is also shared with the host port interface (HPI).
The XIO pin is used to select between the external memory interface and the hostport interface. When the XIO
pin is high, the external memory interface is active, and when it is low, the host port interface is active.
processor mode status register (PMST)
Each subsystem has a processor-mode status register (PMST) that controls memory configuration. The bit
layout of the PMST register is shown in Figure 1
15
7
6
5
4
3
2
1
0
IPTR
MP/MC
OVLY
AVIS
DROM
CLKOFF
SMUL
SST
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
LEGEND: R = Read, W = Write
Figure 1. Processor Mode Status Register (PMST) Bit Layout
The functions of the PMST register bits are illustrated in the memory map. The MP/MC bit is used to map the
upper address range of all program space pages (x8000−xFFFF) as either external or internal memory. The
OVLY bit is used to overlay the on-chip DARAM0 and SARAM1 blocks from dataspace onto to program space.
Similarly, the DROM bit is used to overlay the SARAM2 block from program space onto data space. See the
TMS320C54x DSP Reference Set, Volume 1: CPU and Peripherals (literature number SPRU131) for a
description of the other bits of the PMST register.
Due to the dual-processor configuration and the several EMIF/HPI options available, the MP/MC bit is initialized
at the time of device reset to a logic level that is dependent on the XIO, HMODE, and SELA/B pins. Table 1
shows the initialized logic level of the MP/MC bit and how it depends on these pins.
Table 1. MP/MC Bit Logic Levels at Reset
5420 PINS
18
MP/MC BIT
XIO
HMODE
SELA/B
SUBSYSTEM A
SUBSYSTEM B
0
X
X
0
0
1
0
X
1
1
1
1
0
1
0
1
1
1
0
1
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memory map
Hex
0000
005F
0060
007F
0080
Data
Hex
MemoryMapped
Registers
0000
Scratch-Pad
DARAM
Program Page 0
7FFF
8000
FFFF
Hex
Program Page 2
20000
Hex
Program Page 3
30000
On-Chip
DARAM 0
(16K Words)
Prog/Data
(OVLY=1)
On-Chip
DARAM 0
(16K Words)
Prog/Data
(OVLY=1)
External
(OVLY=0)†
External
(OVLY=0)†
External
(OVLY=0)†
External
(OVLY=0)†
13FFF
14000
23FFF
24000
On-Chip
SARAM 1
(16K Words)
Prog/Data
(OVLY=1)
On-Chip
SARAM 1
(16K Words)
Prog/Data
(OVLY=1)
On-Chip
SARAM 1
(16K Words)
Prog/Data
(OVLY=1)
External
(OVLY=0)†
External
(OVLY=0)†
External
(OVLY=0)†
External
(OVLY=0)†
17FFF
18000
27FFF
28000
On-Chip
SARAM 2
(32K Words)
Prog/Data
(DROM=1)
On-Chip
SARAM 2
(32K Words)
Prog/Data
(MP/MC=0)
On-Chip
SARAM 3
(32KWords)
(MP/MC=0)
External
(DROM=0)†
External
(MP/MC=1)†
External
(MP/MC=1)†
FFFF
1FFFF
(extended)
64K
External
I/O Ports†
37FFF
38000
Reserved
(MP/MC=0)
Reserved
(MP/MC=0)
External
(MP/MC=1)†
External
(MP/MC=1)†
2FFFF
(extended)
I/O
33FFF
34000
On-Chip
SARAM 1
(16K Words)
Prog/Data
(OVLY=1)
7FFF
8000
Hex
0000
On-Chip
DARAM 0
(16K Words)
Prog/Data
(OVLY=1)
3FFF
4000
On-Chip
SARAM 1
(16K Words)
Program Page 1
On-Chip
DARAM 0
(16K Words)
Prog/Data
(OVLY=1)
On-Chip
DARAM 0
(16K Words)
3FFF
4000
Hex
10000
3FFFF
(extended)
FFFF
(extended)
† The external memory interface must be enabled by driving the XIO pin high, in order for external memory accesses to occur.
Figure 2. Memory Map for Each CPU Subsystem
multicore reset signals
The 5420 device includes three reset signals: A_RS, B_RS, and HPIRS. The A_RS and B_RS pins function
as the CPU reset signal for subsystem A and subsystem B, respectively. These signals reset the state of the
CPU registers and upon release, initiates the reset function. Additionally, the A_RS signal resets the on-chip
PLL and initializes the CLKMD register to bypass mode.
The HPI reset signal (HPIRS) places the HPI peripheral into a reset state. It is necessary to wait three clock
cycles after the rising edge of HPIRS before performing an HPI access.
reset vector initialization
The 5420 device does not have on-chip ROM and therefore does not contain bootloader routines/software.
Consequently, the user must have a valid reset vector in place before releasing the reset signal. This is referred
to as reset vector initialization. After reset, the 5420 device fetches the reset vector at address 0xFF80 in
program memory and begins to execute the instructions found in memory. The application code is raw program
and data words and does not require the traditional boot-table or boot-packet format.
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reset vector initialization (continued)
The selection of the reset initialization option is determined by the state of three pins; XIO, XMODE, and SELA/B.
The options include:
D
D
D
D
HPI (host-dependent)
EMIF-to-HPI (stand-alone)
Simultaneous EMIF (stand-alone)
Sequential EMIF (stand-alone)
HPI
The HPI method is only valid when the level of the XIO pin is low. The 5420 acts as a slave to an external master
host. The host device must keep the 5420 device in reset as it downloads code to the subsystem that is
determined by the logic level of the SELA/B pin. When SELA/B is low, the master downloads code to
subsystem A. By driving SELA/B high, the master host can subsequently download code to subsystem B. The
HMODE pin determines the configuration of the HPI (multiplexed or nonmultiplexed) and is an asynchronous
input. Therefore, HMODE can be changed to the desired configuration while A_RS and B_RS are low prior to
the transfer. Once the subsystem(s) have been loaded and are ready to execute, the master host can release
the reset pin(s).
There are two valid options for controlling the reset function of the subsystems. The first option is to hold the
A_RS and B_RS pins low while the HPIRS pin transitions from low to high. This keeps the cores in reset while
allowing the HPI full access to download the application code. The host can now drive the A_RS and B_RS
signals high simultaneously or separately to release the respective subsystem from reset. The subsystems then
fetch their respective reset vector. If the subsystems are released from reset seperately, subsystem A should
be released from reset first, since the A_RS pin resets the on-chip PLL that is common to both subsystems.
Another valid option is to keep the A_RS and B_RS pins high while the host transitions the HPIRS pin from low
to high. Special internal logic causes the HPI to be fully operable and the cores remain in reset. As a result, after
the host processor has downloaded the application code via the HPI, it must perform an additional HPI write
(any value) to address 0x2F. This releases the respective subsystem from reset. By changing the value of
SELA/B, the host can write to 0x2F via the HPI to release the other subsystem from reset.
EMIF-to-HPI
In this particular vector initialization method, the host processor controlling the HPI is one of the subsystems.
The master host is subsystem A if SELA/B is low and subsystem B when SELA/B is high. As described in the
signal descriptions table, the address, data, and control signals of the program space are multiplexed with the
HPI signals. In a special mode when XIO is high (EMIF mode) and HMODE is high (HPI nonmultiplexed mode),
these multiplexed signals are connected, making it possible for the master subsystem’s EMIF to initialize the
slave subsystem via the slave’s HPI. The master subsystem then releases the slave from reset either by
transitioning the hardware reset signal (x_RS) high, or in software, by writing to memory location 0x2F via the
HPI. As a result, the slave core fetches the reset vector.
simultaneous EMIF
The simultaneous EMIF vector initialization option allows both subsystems to access external memory
simultaneously. The subsystems are designed to operate synchronized with one another while accessing the
same locations simultaneously. In this mode, when XIO is high and HMODE is low, one subsystem is given full
control of the EMIF while the other subsystem relies on the synchronization of the two subsystems. Instructions
fetched by one subsystem are ready for both subsystems to execute. After the application code is executed or
transferred to internal memory, write accesses to external memory are prohibited.
This method requires the A_RS and B_RS pins to be tied high while HPIRS transitions from low to high. When
HPIRS transitions high, both subsystems fetches the same reset vector.
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sequential EMIF
The sequential EMIF option allows one master subsystem to run from external memory while controlling the
slave subsystem’s RS signal and the SELA/B pin. At system reset, only the master subsystem is actually reset.
Upon a low-to-high transition of the master’s RS signal, the master subsystem fetches the reset vector and
proceeds to copy external application code to internal memory space. The master subsystem begins executing
the application code, then changes the state of SELA/B, relinquishing the external EMIF to the slave subsystem.
The master then releases the slave RS signal. As a result, the slave fetches the reset vector and begins to copy
the external application code to internal memory space. Note, GPIO pins on the master subsystem can be used
to control the SELA/B and slave reset (x_RS) pins externally.
on-chip peripherals
All the 54x devices have the same CPU structure; however, they have different on-chip peripherals connected
to their CPUs. The on-chip peripheral options provided on each subsystem of the 5420 are:
D
D
D
D
D
D
Software-programmable wait-state generator
Programmable bank-switching
16-bit host-port interface (HPI16)
Multichannel buffered serial ports (McBSPs)
A hardware timer
A software-programmable clock generator with a phase-locked loop (PLL)
software-programmable wait-state generators
The Software-programmable wait-state generator can be used to extend external bus cycles up to fourteen
machine cycles to interface with slower off-chip memory and I/O devices. Note that all external memory
accesses on the 5420 require at least one wait state. The software wait-state register (SWWSR) controls the
operation of the wait-state generator. The SWWSR of a particular DSP subsystem (A or B) is used for the
external memory interface, depending on the logic level of the SELA/B pin.The 14 LSBs of the SWWSR specify
the number of wait states (0 to 7) to be inserted for external memory accesses to five separate address ranges.
This allows a different number of wait states for each of the five address ranges.
Additionally, the software wait-state multiplier (SWSM) bit of the software wait-state control register (SWCR)
defines a multiplication factor of 1 or 2 for the number of wait states. At reset, the wait-state generator is initialized
to provide seven wait states on all external memory accesses. The SWWSR bit fields are shown in Figure 3
and described in Table 2.
15
XPA
R/W-0
14
12 11
I/O
R/W-111
9 8
Data
R/W-111
6
Data
R/W-111
5
3
Program
R/W-111
2
0
Program
R/W-111
LEGEND: R=Read, W=Write, 0=Value after reset
Figure 3. Software Wait-State Register (SWWSR) [Memory-Mapped Register (MMR) Address 0028h]
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software-programmable wait-state generator (continued)
Table 2. Software Wait-State Register (SWWSR) Bit Fields
BIT
NO.
NAME
RESET
VALUE
15
XPA
0
Extended program address control bit. XPA is used in conjunction with the program space fields
(bits 0 through 5) to select the address range for program space wait states.
14−12
I/O
1
I/O space. The field value (0−7) corresponds to the base number of wait states for I/O space accesses
within addresses 0000−FFFFh. The SWSM bit of the SWCR defines a multiplication factor of 1 or 2 for
the base number of wait states.
11−9
Data
1
Upper data space. The field value (0−7) corresponds to the base number of wait states for external
data space accesses within addresses 8000−FFFFh. The SWSM bit of the SWCR defines a
multiplication factor of 1 or 2 for the base number of wait states.
8−6
Data
1
Lower data space. The field value (0−7) corresponds to the base number of wait states for external
data space accesses within addresses 0000−7FFFh. The SWSM bit of the SWCR defines a
multiplication factor of 1 or 2 for the base number of wait states.
FUNCTION
Upper program space. The field value (0−7) corresponds to the base number of wait states for external
program space accesses within the following addresses:
5−3
Program
1
-
XPA = 0: x8000 − xFFFFh
-
XPA = 1: The upper program space bit field has no effect on wait states.
The SWSM bit of the SWCR defines a multiplication factor of 1 or 2 for the base number of wait
states.
Program space. The field value (0−7) corresponds to the base number of wait states for external
program space accesses within the following addresses:
2−0
Program
1
-
XPA = 0: x0000−x7FFFh
-
XPA = 1: 00000−3FFFFh
The SWSM bit of the SWCR defines a multiplication factor of 1 or 2 for the base number of wait
states.
The software wait-state multiplier bit of the software wait-state control register (SWCR) is used to extend the
base number of wait states selected by the SWWSR. The SWCR bit fields are shown in Figure 4 and described
in Table 3.
15
1
0
SWSM
Reserved
R/W-0
R/W-0
LEGEND: R = Read, W = Write
Figure 4. Software Wait-State Control Register (SWCR) [MMR Address 002Bh]
Table 3. Software Wait-State Control Register (SWCR) Bit Fields
PIN
NO.
NAME
RESET
VALUE
15−1
Reserved
0
FUNCTION
These bits are reserved and are unaffected by writes.
Software wait-state multiplier. Used to multiply the number of wait states defined in the SWWSR by a factor
of 1 or 2.
0
22
SWSM
0
-
SWSM = 0: wait-state base values are unchanged (multiplied by 1).
-
SWSM = 1: wait-state base values are mulitplied by 2 for a maximum of 14 wait states.
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programmable bank-switching
Programmable bank-switching can be used to insert one cycle automatically when crossing memory-bank
boundaries inside program memory or data memory space. One cycle can also be inserted when crossing from
program-memory space to data-memory space (54x) or one program memory page to another program
memory page. This extra cycle allows memory devices to release the bus before other devices start driving the
bus; thereby avoiding bus contention. The size of the memory bank for the bank-switching is defined by the
bank-switching control register (BSCR). The BSCR of a particular DSP subsystem (A or B) is used for the
external memory interface depending on the logic level of the SELA/B pin.
15
12
11
10
9
8
BNKCMP
PS-DS
Reserved
IPIRQ
R/W
R/W
R/W
R/W
7
3
Reserved
2
1
0
BH
Reserved
EXIO
R/W
R/W
LEGEND: R = Read, W = Write
Figure 5. BSCR Register Bit Layout for Each DSP Subsystem
Table 4. BSCR Register Bit Functions for Each DSP Subsystem
BIT
NO.
BIT
NAME
RESET
VALUE
FUNCTION
15−12
BNKCMP
1111
Bank compare. BNKCMP determines the external memory-bank size. BNKCMP is used to mask the four
MSBs of an address. For example, if BNKCMP = 1111b, the four MSBs (bits 12−15) are compared,
resulting in a bank size of 4K words. Bank sizes of 4K words to 64K words are allowed.
11
PS-DS
1
Program read − data read access. PS-DS inserts an extra cycle between consecutive accesses of
program read and data read or data read and program read.
PS-DS = 0
No extra cycles are inserted by this feature.
PS-DS = 1
One extra cycle is inserted between consecutive data and program reads.
10−9
Reserved
0
These bits are reserved and are unaffected by writes.
8
IPIRQ
0
The IPIRQ bit is used to send an interprocessor interrupt to the other subsystem. IPIRQ=1 sends the
interrupt. IPIRQ must be cleared before subsequent interrupts can be made. Refer to the interrupts section
for more details
7−3
Reserved
0
These bits are reserved and are unaffected by writes.
2
BH
0
Bus holder. BH controls the data bus holder feature: BH is cleared to 0 at reset.
BH = 0
The bus holder is disabled.
BH = 1
The bus holder is enabled. When not driven, the data bus (PPD[15:0]) is held in the
previous logic level.
1
Reserved
0
These bits are reserved and are unaffected by writes.
0
External bus interface off. The EXIO bit controls the external bus-off function.
EXIO = 0
The external bus interface functions as usual.
EXIO = 1
The address bus, data bus, and control signals become inactive after completing the
current bus cycle. Note that the DROM, MP/MC, and OVLY bits in the PMST and the
HM bit of ST1 cannot be modified when the interface is disabled.
0
EXIO
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16-bit host-port interface (HPI16)
The HPI16 is an enhanced 16-bit version of the C54x 8-bit host-port interface (HPI). The HPI16 is designed to
allow a 16-bit host to access the DSP on-chip memory, with the host acting as the master of the interface.
Figure 6 illustrates the available memory accessible by the HPI. It should be noted that neither the CPU nor DMA
I/O spaces can be accessed using the host-port interface.
16-bit bidirectional host-port interface (HPI16)
Hex
Program Page 0
0000
Hex
Program Page 1
10000
Hex
Program Page 2
20000
Hex
Program Page 3
30000
Reserved
001F
0020
005F
0060
McBSP
DXR/DRR
MMRegs Only
Reserved
1005F
10060
13FFF
14000
7FFF
8000
33FFF
34000
27FFF
28000
1FFFF
On-Chip
DARAM 0
(Overlayed)
Prog/Data
On-Chip
SARAM 1
(Overlayed)
Prog/Data
On-Chip
SARAM 3
(32K Words)
Program
On-Chip
SARAM 2
(32K Words)
Prog/Data
3005F
30060
23FFF
24000
17FFF
18000
Reserved
On-Chip
DARAM 0
(Overlayed)
Prog/Data
On-Chip
SARAM 1
(Overlayed)
Prog/Data
On-Chip
SARAM 1
(Overlayed)
Prog/Data
FFFF
2005F
20060
On-Chip
DARAM 0
(Overlayed)
Prog/Data
On-Chip
DARAM 0
(Overlayed)
Prog/Data
3FFF
4000
Reserved
On-Chip
SARAM 1
(Overlayed)
Prog/Data
37FFF
38000
Reserved
2FFFF
Reserved
3FFFF
Figure 6. Memory Map Relative to Host-Port interface
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16-bit bidirectional host-port interface (HPI16) (continued)
Some of the features of the HPI16 include:
D
D
D
D
D
D
D
D
16-bit bidirectional data bus
Multiple data strobes and control signals to allow glueless interfacing to a variety of hosts
Multiplexed and nonmultiplexed address/data modes
18-bit address bus used in nonmultiplexed mode to allow access to all internal memory (including internal
extended address pages)
18-bit address register used in multiplexed mode. Includes address autoincrement feature for faster
accesses to sequential addresses
Interface to on-chip DMA module to allow access to entire internal memory space
HRDY signal to hold off host accesses due to DMA latency
Control register available in multiplexed mode only. Accessible by either host or DSP to provide host/DSP
interrupts, extended addressing, and data prefetch capability
The HPI16 acts as a slave to a 16-bit host processor and allows access to the on-chip memory of the DSP. There
are two modes of operation as determined by the HMODE signal: multiplexed mode and nonmultiplexed mode.
HPI multiplexed mode
In multiplexed mode, HPI16 operation is very similar to the standard 8-bit HPI, which is available with other C54x
products. A host with a multiplexed address/data bus can access the HPI16 data register (HPID), address
register (HPIA), or control register (HPIC) via the HD bidirectional data bus. The host initiates the access with
the strobe signals (HDS1, HDS2, HCS) and controls the type of access with the HCNTL, HR/W, and HAS
signals. The DSP can interrupt the host via the HINT signal, and can stall host accesses via the HRDY signal.
host/DSP interrupts
In multiplexed mode, the HPI16 offers the capability for the host and DSP to interrupt each other through the
HPIC register.
For host-to-DSP interrupts, the host must write a “1” to the DSPINT bit of the HPIC register. This generates an
interrupt to the DSP. This interrupt can also be used to wake the DSP from any of the IDLE 1,2, or 3 states. Note
that the DSPINT bit is always read as “0” by both the host and DSP.
For DSP-to-host interrupts, the DSP must write a “1” to the HINT bit of the HPIC register to interrupt the host
via the HINT pin. The host acknowledges and clear this interrupt by also writing a “1” to the HINT bit of the HPIC
register. Note that writing a “0” to the HINT bit by either host or DSP has no effect.
HPI nonmultiplexed mode
In nonmultiplexed mode, a host with separate address/data buses can access the HPI16 data register (HPID)
via the HD 16-bit bidirectional data bus, and the address register (HPIA) via the 18-bit HA address bus. The host
initiates the access with the strobe signals (HDS1, HDS2, HCS) and controls the direction of the access with
the HR/W signal. The HPI16 can stall host accesses via the HRDY signal. Note that the HPIC register is not
available in nonmultiplexed mode since there are no HCNTL signals available. All host accesses initiate a DMA
read or write access.
other HPI16 system considerations
operation during IDLE2
The HPI16 can continue to operate during IDLE1 or IDLE2 by using special clock management logic that turns
on relevant clocks to perform a synchronous memory access, and then turns the clocks back off to save power.
The DSP CPU does not wake up from the IDLE mode during this process.
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downloading code during reset
The HPI16 can download code while the DSP is in reset. However, the system provides a pin (HPIRS) that
provides a way to take the HPI16 module out of reset while leaving the DSP in reset.
emulation considerations
The HPI16 can continue operation even when the DSP CPU is halted due to debugger breakpoints or other
emulation events.
5420 boundary scan implementation
The 5420 does not implement a fully compliant IEEE1149.1 boundary scan capability. Observe-only boundary
scan cells are used on all of the device pins that allow the pins to be observed (read) but not controlled (driven)
using boundary scan. Driving nodes to perform board interconnect test must be accomplished using other
boundary scan capable devices on the board. Although this implies some reduction in testability, compared to
full boundary scan, this implementation is still compatible with the boundary scan automatic test pattern
generation (ATPG) tools.
multichannel buffered serial port (McBSP)
The 5420 device provides high-speed, full-duplex serial ports that allow direct interface to other C54x devices,
codecs, and other devices in a system. There are six multichannel buffered serial ports (McBSPs) on chip (three
per subsystem).
The McBSP is based on the standard serial port interface found on the 54x devices. Like its predecessors, the
McBSP provides:
D Full-duplex communication
D Double-buffer data registers, which allow a continuous data stream
D Independent framing and clocking for receive and transmit
In addition, the McBSP has the following capabilities:
D Direct interface to:
D
D
D
D
D
−
T1/E1 framers
−
MVIP switching-compatible and ST-BUS compliant devices
−
IOM-2 compliant device
−
Serial peripheral interface devices
Multichannel transmit and receive of up to 128 channels
A wide selection of data sizes, including: 8, 12, 16, 20, 24, or 32 bits
µ-law and A-law companding
Programmable polarity for both frame synchronization and data clocks
Programmable internal clock and frame generation
The McBSP consists of a data path and control path. The six pins, BDX, BDR, BFSX, BFSR, BCLKX, and
BCLKR, connect the control and data paths to external devices. The pins can be programmed as
general-purpose I/O pins if they are not used for serial communication.
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multichannel buffered serial port (McBSP) (continued)
Like the standard serial port interface on the McBSP, the data is communicated to devices interfacing to the
McBSP by way of the data transmit (BDX) pin for transmit and the data receive (BDR) pin for receive. Control
information in the form of clocking and frame synchronization is communicated by way of BCLKX, BCLKR,
BFSX, and BFSR. The device communicates to the McBSP by way of 16-bit-wide control registers accessible
via the internal peripheral bus. The CPU or DMA reads the received data from the data receive register (DRR)
and writes the data to be transmitted to the data transmit register (DXR). Data written to the DXR is shifted out
to BDX by way of the transmit shift register (XSR). Similarly, receive data on the BDR pin is shifted into the
receive shift register (RSR) and copied into the receive buffer register (RBR). RBR is then copied to DRR, which
can be read by the CPU or DMA. This allows internal data movement and external data communications
simultaneously. The control block consists of internal clock generation, frame synchronization signal
generation, and their control, and multichannel selection. This control block sends notification of important
events to the CPU and DMA by way of two interrupt signals, XINT and RINT, and two event signals, XEVT and
REVT.
The on-chip companding hardware allows compression and expansion of data in either µ-law or A-law format.
When companding is used, transmitted data is encoded according to specified companding law and received
data is decoded to 2’s complement format.
The sample rate generator provides the McBSP with several means of selecting clocking and framing for both
the receiver and transmitter. Both the receiver and transmitter can select clocking and framing independently.
The McBSP allows the multiple channels to be independently selected for the transmitter and receiver. When
multiple channels are selected, each frame represents a time-division multiplexed (TDM) data stream. In using
time-division multiplexed data streams, the CPU may only need to process a few of them. Thus, to save memory
and bus bandwidth, multichannel selection allows independent enabling of particular channels for transmission
and reception. Up to 32 channels in a bit stream consisting of a maximum of 128 channels can be enabled.
The clock stop mode (CLKSTP) in the McBSP provides compatibility with the SPI protocol. Clock stop mode
works with only single-phase frames and one word per frame. The word sizes supported by the McBSP are
programmable for 8-, 12-, 16-, 20-, 24-, or 32-bit operation. When the McBSP is configured to operate in SPI
mode, both the transmitter and the receiver operate together as a master or as a slave.
direct memory access unit (DMA)
The 5420 direct memory access (DMA) controller transfers data between points in the memory map without
intervention by the CPU. The DMA allows movements of data to and from internal program/data memory,
internal peripherals, such as the McBSPs and the HPI to occur in the background of the CPU operation. Each
subsystem has its own independent DMA with six programmable channels, allowing six different contexts for
DMA operation. The HPI has a dedicated auxiliary DMA channel. Figure 7 illustrates the memory map
accessible by the DMA.
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SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
direct memory access unit (DMA) (continued)
Hex
Data
0000
Reserved
Program Page 0
Reserved
Hex
McBSP
DXR/DRR
MMRegs Only
Scratch-Pad
DARAM
007F
0080
005F
0060
McBSP
DXR/DRR
MMRegs Only
17FFF
18000
On-Chip
SARAM 2
(32K Words)
Prog/Data
FFFF
FFFF
I/O
XXXX
DMA FIFO
for Core-Core
Communication{
33FFF
34000
27FFF
28000
1FFFF
Hex
On-Chip
DARAM 0
(Overlayed)
Prog/Data
On-Chip
SARAM 1
(Overlayed)
Prog/Data
On-Chip
SARAM 3
(32K Words)
Prog/Data
On-Chip
SARAM 2
(32K Words)
Prog/Data
Reserved
On-Chip
DARAM 0
(Overlayed)
Prog/Data
On-Chip
SARAM 1
(Overlayed)
Prog/Data
Program Page 3
3005F
30060
23FFF
24000
13FFF
14000
7FFF
8000
7FFF
8000
Hex
30000
2005F
20060
On-Chip
DARAM 0
(Overlayed)
Prog/Data
On-Chip
SARAM 1
(Overlayed)
Prog/Data
On-Chip
SARAM 1
(16K Words)
Program Page 2
Reserved
1005F
10060
(Overlayed)
Prog/Data
3FFF
4000
3FFF
4000
Hex
20000
Reserved
On-Chip
DARAM 0
On-Chip
DARAM 0
(16K Words)
Program Page 1
10000
001F
0020
001F
0020
005F
0060
Hex
0000
On-Chip
SARAM 1
(Overlayed)
Prog/Data
37FFF
38000
Reserved
Reserved
2FFFF
3FFFF
† When the source or destination for a DMA channel is programmed for I/O space, the channel accesses the core-to-core FIFO irrespective of
the address specified.
Figure 7. Memory Map Relative to DMA
features
The 5420 DMA has the following features:
D
D
D
D
D
D
D
D
D
28
The DMA operates independently of the CPU.
The DMA has six channels. The DMA can keep track of the contexts of six independent block transfers.
The DMA has higher priority than the CPU for internal accesses.
Each channel has independently programmable priorities.
Each channel’s source and destination address registers can have configurable indexes through memory
on each read and write transfer, respectively. The address can remain constant, postincrement,
postdecrement or be adjusted by a programmable value.
Each read or write transfer can be initialized by selected events.
On completion of a half-block or full-block transfer, each DMA channel can send an interrupt to the CPU.
An on-chip RAM DMA transfer requires 4 clock cycles to complete. External transfers are not supported.
The DMA can perform double word transfers (a 32-bit transfer of two16-bit-words).
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DMA controller synchronization events
The transfers associated with each DMA channel can be synchronized to one of several events. The DSYN bit
field of the DMA channel x sync select and frame count (DMSFCx) register selects the synchronization event
for a channel. The list of possible events and the DSYN values are shown in Table 5.
Table 5. DMA Synchronization Events
DSYN VALUE
DMA SYNCHRONIZATION EVENT
0000b
No synchronization used
0001b
McBSP0 Receive Event
0010b
McBSP0 Transmit Event
0011b
McBSP2 Receive Event
0100b
McBSP2 Transmit Event
0101b
McBSP1 Receive Event
0110b
McBSP1 Transmit Event
0111b
FIFO Receive Buffer Not Empty Event
1000b
FIFO Transmit Buffer Not Full Event
1001b − 1111b
Reserved
DMA channel interrupt selection
The DMA controller can generate a CPU interrupt for each of the six channels. However, channels 0, 1, 2, and
3 are multiplexed with other interrupt sources. DMA channels 0 and 1 share an interrupt line with the receive
and transmit portions of McBSP2 (IMR/IFR bits 6 and 7), and DMA channels 2 and 3 share an interrupt line with
the receive and transmit portions of McBSP1 (IMR/IFR bits 10 and 11). When the 5402 is reset, the interrupts
from these four DMA channels are deselected. The INTSEL bit field in the DMA channel priority and enable
control (DMPREC) register can be used to select these interrupts, as shown in Table 6.
Table 6. DMA Channel Interrupt Selection
INTSEL Value
IMR/IFR[6]
IMR/IFR[7]
IMR/IFR[10]
IMR/IFR[11]
00b (reset)
BRINT2
BXINT2
BRINT1
BXINT1
01b
BRINT2
BXINT2
DMAC2
DMAC3
10b
DMAC0
DMAC1
DMAC2
DMAC3
11b
Reserved
subsystem communications
The 5420 device provides two options for efficient core-to-core communications:
D Core-to-core FIFO communications
D EMIF-to-HPI communications (asynchronous external memory interface-to host-port interface)
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FIFO data communications
The subsystems’ FIFO communications interface is shown in the 5420 functional block diagram (Figure 1). Two
unidirectional 8-word-deep FIFOs are available in the device for efficient interprocessor communication: one
configured for core A-to-core B data transfers, and the other configured for core B-to-core A data transfers. Each
subsystem, by way of DMA control, can write to its respective output data FIFO and read from its respective
input data FIFO. The FIFOs are accessed using the DMA’s I/O space, which is completely independent of the
CPU I/O space. The DMA transfers to or from the FIFOs can be synchronized to “receive FIFO not empty” and
“transmit FIFO not full” events providing protection from overflow and underflow. Subsystems can interrupt each
other to flag when the FIFOs are either full or empty. The interprocessor interrupt request bit (IPIRQ) (bit 8 in
the BSCR register ) is set to “1” to generate an interprocessor interrupt (IPINT) in the other subsystem. See the
interrupts section for more information.
EMIF-to-HPI data communication
The 5420 also provides the capability for one subsystem to act as a master and transfer data to the other
subsystem via an EMIF-to-HPI connection. The master device is configured in EMIF mode (XIO pin is high);
while by default, when HMODE=1, the slave device external interface is configured to operate as an HPI
(nonmultiplexed mode). The data-transfer direction is defined by the logic level of SELA/B. See Table 7 for a
complete description of HMODE, SELA/B, and XIO pin functionality. The EMIF-to-HPI option is bidirectional,
but does not permit full duplex communication without external SELA/B arbitration. This mode does not offer
master/slave interrupts due to the nonmultiplexed HPI configuration.
Table 7. EMIF/HPI Modes
HMODE
SELA/B
HPI MODES (XIO PIN =0)
EMIF MODES (XIO PIN = 1)
0
0
HPI multiplexed address/data
Subsystem A slave to host
Subsystem A can access EMIF
Subsystem B has no access to EMIF or HPI
0
1
HPI multiplexed address/data
Subsystem B slave to host
Subsystem B can access EMIF
Subsystem A has no access to EMIF or HPI
1
0
HPI nonmultiplexed address/data
Subsystem A slave to host
EMIF-to-HPI master is subsystem A, slave is
subsystem B
1
1
HPI nonmultiplexed address/data
Subsystem B slave to host
EMIF-to-HPI master is subsystem B, slave is
subsystem A
general-purpose I/O
In addition to the standard XF and BIO pins, the 5420 has eight general-purpose I/O pins. These pins are:
A_GPIO0, A_GPIO1, A_GPIO2, A_GPIO3
B_GPIO0, B_GPIO1, B_GPIO2, B_GPIO3
Each subsystem’s CPU has one general-purpose I/O register located at address 0x3c in data memory. Each
I/O register controls four general-purpose I/O pins. Figure 8 shows the bit layout of the general-purpose I/O
control register and Table 8 describes the bit functions.
30
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general-purpose I/O (continued)
15
14
TOUT
12
Reserved
R/W
11
10
9
8
7
DIR3
DIR2
DIR1
DIR0
R/W
R/W
R/W
R/W
4
Reserved
3
2
1
0
DAT3
DAT2
DAT1
DAT0
R/W
R/W
R/W
R/W
LEGEND: R = Read, W = Write
Figure 8. General-Purpose I/O Control Register Bit Layout
Table 8. General-Purpose I/O Control Register Bit Functions
BIT
NO.
BIT
NAME
15
TOUT
14-12
Reserved
11−8
DIRn†
7−4
Reserved
3−0
DATn†
BIT
VALUE
FUNCTION
0
Timer output disable. Uses GPIO3 as general-purpose I/O. (Reset value)
1
Timer output enable. Overrides DIR3. Timer output is driven on GPIO3 and readable in DAT3.
X
Register bit is reserved.
0
GPIOn pin is used as an input. (Reset value)
1
GPIOn pin is used as an output.
X
Register bit is reserved.
0
GPIOn is driven with a 0 (DIRn=1). GPIOn is read as 0 (DIRn=0).
1
GPIOn is driven with a 1 (DIRn=1). GPIOn is read as 1 (DIRn=0).
† n = 0, 1, 2, or 3
The TOUT bit is used to multiplex the output of the timer and GPIO3. DIR3 has no affect when TOUT = 1. All
pins are programmable as an input or output via the direction bit (DIRn). Data is either driven or read from the
data bit field (DATn).
GPIO2 is a special case where the logic level determines the operation of BIO-conditional instructions on the
CPU. GPIO2 is always mapped as a general-purpose I/O, but the BIO function exists when this pin is configured
as an input.
hardware timer
Each subsystem of the 5420 features a 16-bit timing circuit with a 4-bit prescaler. The timer counter decrements
by one at every CLKOUT cycle. Each time the counter decrements to zero, a timer interrupt is generated. The
timer can be stopped, restarted, reset, or disabled by specific status bits. The timer output pulse is driven on
GPIO3 when the TOUT bit is set to one in the general-purpose I/O control register. The device must be in HPI
mode (XIO = 0) to drive TOUT on the GPIO3 pin.
software-programmable phase-locked loop (PLL)
The clock generator provides clocks to the 5420 device, and consists of a phase-locked loop (PLL) circuit. The
clock generator requires a reference clock input, which must be provided by using an external clock source. The
reference clock input is then divided by two (DIV mode) to generate clocks for the 5420 device. Alternately, the
PLL circuit can be used (PLL mode) to generate the device clock by multiplying the reference clock frequency
by a scale factor, allowing use of a clock source with a lower frequency than that of the CPU. The default startup
mode for the PLL on the 5420 device is bypass (multiply-by-1).
The PLL is an adaptive circuit that, once synchronized, locks onto and tracks an input clock signal. When the
PLL is initially started, it enters a transitional mode during which the PLL acquires lock with the input signal. Once
the PLL is locked, it continues to track and maintain synchronization with the input signal. Only subsystem A
controls the PLL. Subsystem B cannot access the PLL registers.
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software-programmable phase-locked loop (PLL) (continued)
The software-programmable PLL features a high level of flexibility, and includes a clock scaler that provides
various clock multiplier ratios, capability to directly enable and disable the PLL, and a PLL lock timer that can
be used to delay switching to PLL clocking mode of the device until lock is achieved. Devices that have a built-in
software-programmable PLL can be configured in one of two clock modes:
D PLL mode. The input clock (CLKIN) is multiplied by 1 of 31 possible ratios. These ratios are achieved using
the PLL circuitry.
D DIV (divider) mode. The input clock is divided by 2 or 4. Note that when DIV mode is used, the PLL can be
completely disabled in order to minimize power dissipation.
The software-programmable PLL is controlled by the 16-bit memory-mapped (address 0058h) clock mode
register (CLKMD) in subsystem A. The CLKMD register is used to define the clock configuration of the PLL clock
module.
32
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memory-mapped registers
Each 5420 subsystem has 27 memory-mapped CPU registers, which are mapped in data memory space
addresses 0h to 1Fh. Table 9 gives a list of CPU memory-mapped registers (MMRs) available on 5420. Each
subsystem device also has a set of memory-mapped registers associated with peripherals. Table 10, and
Table 11 show additional peripheral MMRs associated with the 5420.
Table 9. Processor Memory-Mapped Registers for Each DSP Subsystem
NAME
ADDRESS
DEC
HEX
DESCRIPTION
IMR
0
0
Interrupt Mask Register
IFR
1
1
Interrupt Flag Register
—
2−5
2−5
ST0
6
6
Reserved for testing
Status Register 0
ST1
7
7
Status Register 1
AL
8
8
Accumulator A Low Word (15−0)
AH
9
9
Accumulator A High Word (31−16)
AG
10
A
Accumulator A Guard Bits (39−32)
BL
11
B
Accumulator B Low Word (15−0)
BH
12
C
Accumulator B High Word (31−16)
BG
13
D
Accumulator B Guard Bits (39−32)
TREG
14
E
Temporary Register
TRN
15
F
Transition Register
AR0
16
10
Auxiliary Register 0
AR1
17
11
Auxiliary Register 1
AR2
18
12
Auxiliary Register 2
AR3
19
13
Auxiliary Register 3
AR4
20
14
Auxiliary Register 4
AR5
21
15
Auxiliary Register 5
AR6
22
16
Auxiliary Register 6
AR7
23
17
Auxiliary Register 7
SP
24
18
Stack Pointer
BK
25
19
Circular Buffer Size Register
BRC
26
1A
Block-Repeat Counter
RSA
27
1B
Block-Repeat Start Address
REA
28
1C
Block-Repeat End Address
PMST
29
1D
Processor Mode Status Register
XPC
30
1E
Extended Program Counter
—
31
1F
Reserved
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memory-mapped registers (continued)
Table 10. Peripheral Memory-Mapped Registers for Each DSP Subsystem
NAME
ADDRESS
DEC
HEX
DESCRIPTION
DRR20
32
20
McBSP 0 Data Receive Register 2
DRR10
33
21
McBSP 0 Data Receive Register 1
DXR20
34
22
McBSP 0 Data Transmit Register 2
DXR10
35
23
McBSP 0 Data Transmit Register 1
TIM
36
24
Timer Register
PRD
37
25
Timer Period Register
TCR
38
26
Timer Control Register
—
39
27
Reserved
SWWSR
40
28
Software Wait-State Register
BSCR
41
29
Bank-Switching Control Register
—
42
2A
Reserved
SWCR
43
2B
Software Wait-State Control Register
HPI Control Register (HMODE=0 only)
HPIC
44
2C
45−47
2D−2F
DRR22
48
30
McBSP 2 Data Receive Register 2
DRR12
49
31
McBSP 2 Data Receive Register 1
DXR22
50
32
McBSP 2 Data Transmit Register 2
DXR12
51
33
McBSP 2 Data Transmit Register 1
SPSA2
52
34
SPSD2
53
35
McBSP 2 Subbank Address Register†
McBSP 2 Subbank Data Register†
54−55
36−37
56
38
—
—
SPSA0
SPSD0
—
GPIO
—
Reserved
Reserved
McBSP 0 Subbank Address Register†
McBSP 0 Subbank Data Register†
57
39
58−59
3A−3B
60
3C
Reserved
General-Purpose I/O Register
61−63
3D−3F
DRR21
64
40
McBSP 1 Data Receive Register 2
DRR11
65
41
McBSP 1 Data Receive Register 1
DXR21
66
42
McBSP 1 Data Transmit Register 2
DXR11
67
43
McBSP 1 Data Transmit Register 1
68−71
44−47
72
48
—
SPSA1
SPSD1
Reserved
Reserved
McBSP 1 Subbank Address Register†
McBSP 1 Subbank Data Register†
73
49
74−83
4A−53
DMPREC
84
54
DMSA
85
55
DMSDI
86
56
DMSDN
87
57
DMA Subbank Data Register with Autoincrement‡
DMA Subbank Data Register‡
CLKMD
88
58
Clock Mode Register (CLKMD)
—
Reserved
DMA Priority and Enable Control Register
DMA Subbank Address Register‡
—
89−95
59−5F
Reserved
† See Table 11 for a detailed description of the McBSP control registers and their subaddresses.
‡ See Table 12 for a detailed description of the DMA sub-bank addressed registers.
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McBSP control registers and subaddresses
The control registers for the multichannel buffered serial port (McBSP) are accessed using the subbank
addressing scheme. This allows a set or subbank of registers to be accessed through a single memory location.
The McBSP subbank address register (SPSA) is used as a pointer to select a particular register within the
subbank. The McBSP data register (SPSDI) and the DMA autoincrement subaddress register (SPSDN) register
are used to access (read or write) the selected register. Table 11 shows the McBSP control registers and their
corresponding subaddresses.
Table 11. McBSP Control Registers and Subaddresses
McBSP0
McBSP1
McBSP2
NAME
ADDRESS
NAME
ADDRESS
NAME
ADDRESS
SUBADDRESS
SPCR10
39h
SPCR11
49h
SPCR12
35h
00h
Serial port control register 1
SPCR20
39h
SPCR21
49h
SPCR22
35h
01h
Serial port control register 2
RCR10
39h
RCR11
49h
RCR12
35h
02h
Receive control register 1
RCR20
39h
RCR21
49h
RCR22
35h
03h
Receive control register 2
XCR10
39h
XCR11
49h
XCR12
35h
04h
Transmit control register 1
XCR20
39h
XCR21
49h
XCR22
35h
05h
Transmit control register 2
SRGR10
39h
SRGR11
49h
SRGR12
35h
06h
Sample rate generator register 1
SRGR20
39h
SRGR21
49h
SRGR22
35h
07h
Sample rate generator register 2
MCR10
39h
MCR11
49h
MCR12
35h
08h
Multichannel register 1
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
DESCRIPTION
MCR20
39h
MCR21
49h
MCR22
35h
09h
Multichannel register 2
RCERA0
39h
RCERA1
49h
RCERA2
35h
0Ah
Receive channel enable register partition A
RCERB0
39h
RCERB1
49h
RCERA2
35h
0Bh
Receive channel enable register partition B
XCERA0
39h
XCERA1
49h
XCERA2
35h
0Ch
Transmit channel enable register partition A
XCERB0
39h
XCERB1
49h
XCERA2
35h
0Dh
Transmit channel enable register partition B
PCR0
39h
PCR1
49h
PCR2
35h
0Eh
Pin control register
DMA subbank addressed registers
The direct memory access (DMA) controller has several control registers associated with it. The main control
register (DMPREC) is a standard memory-mapped register. However, the other registers are accessed using
the subbank addressing scheme. This allows a set or subbank of registers to be accessed through a single
memory location. The DMA subbank address (DMSA) register is used as a pointer to select a particular register
within the subbank, while the DMA subbank data (DMSD) register or the DMA subbank data register with
autoincrement (DMSDI) is used to access (read or write) the selected register.
When the DMSDI register is used to access the subbank, the subbank address is automatically
postincremented so that a subsequent access affects the next register within the subbank. This autoincrement
feature is intended for efficient, successive accesses to several control registers. If the autoincrement feature
is not required, the DMSDN register should be used to access the subbank. Table 12 shows the DMA controller
subbank addressed registers and their corresponding subaddresses.
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SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
DMA subbank addressed registers (continued)
Table 12. DMA Subbank Addressed Registers
ÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
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ADDRESS
SUBADDRESS
DMSRC0
56h/57h
00h
DMA channel 0 source address register
DMDST0
56h/57h
01h
DMA channel 0 destination address register
DMCTR0
56h/57h
02h
DMA channel 0 element count register
DMSFC0
56h/57h
03h
DMA channel 0 sync select and frame count register
DMMCR0
56h/57h
04h
DMA channel 0 transfer mode control register
DMSRC1
56h/57h
05h
DMA channel 1 source address register
DMDST1
56h/57h
06h
DMA channel 1 destination address register
DMCTR1
56h/57h
07h
DMA channel 1 element count register
DMSFC1
56h/57h
08h
DMA channel 1 sync select and frame count register
DMMCR1
56h/57h
09h
DMA channel 1 transfer mode control register
DMSRC2
56h/57h
0Ah
DMA channel 2 source address register
DMDST2
56h/57h
0Bh
DMA channel 2 destination address register
DMCTR2
56h/57h
0Ch
DMA channel 2 element count register
DMSFC2
56h/57h
0Dh
DMA channel 2 sync select and frame count register
DMMCR2
56h/57h
0Eh
DMA channel 2 transfer mode control register
DMSRC3
56h/57h
0Fh
DMA channel 3 source address register
DMDST3
56h/57h
10h
DMA channel 3 destination address register
DMCTR3
56h/57h
11h
DMA channel 3 element count register
DMSFC3
56h/57h
12h
DMA channel 3 sync select and frame count register
DMMCR3
56h/57h
13h
DMA channel 3 transfer mode control register
DMSRC4
56h/57h
14h
DMA channel 4 source address register
DMDST4
56h/57h
15h
DMA channel 4 destination address register
DMCTR4
56h/57h
16h
DMA channel 4 element count register
DMSFC4
56h/57h
17h
DMA channel 4 sync select and frame count register
DMMCR4
56h/57h
18h
DMA channel 4 transfer mode control register
DMSRC5
56h/57h
19h
DMA channel 5 source address register
DMDST5
56h/57h
1Ah
DMA channel 5 destination address register
DMCTR5
56h/57h
1Bh
DMA channel 5 element count register
DMSFC5
56h/57h
1Ch
DMA channel 5 sync select and frame count register
DMMCR5
56h/57h
1Dh
DMA channel 5 transfer mode control register
DMSRCP
56h/57h
1Eh
DMA source program page address (common channel)
DMDSTP
56h/57h
1Fh
DMA destination program page address (common channel)
DMIDX0
56h/57h
20h
DMA element index address register 0
DMIDX1
56h/57h
21h
DMA element index address register 1
DMFRI0
56h/57h
22h
DMA frame index register 0
DMFRI1
56h/57h
23h
DMA frame index register 1
DMGSA
56h/57h
24h
DMA global source address reload register
DMGDA
56h/57h
25h
DMA global destination address reload register
DMGCR
56h/57h
26h
DMA global count reload register
DMGFR
56h/57h
27h
DMA global frame count reload register
NAME
36
DESCRIPTION
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interrupts
Vector-relative locations and priorities for all internal and external interrupts are shown in Table 13.
Table 13. 5420 Interrupt Locations and Priorities for Each DSP Subsystem
NAME
LOCATION
PRIORITY
FUNCTION
DECIMAL
HEX
RS, SINTR
0
00
1
Reset (Hardware and Software Reset)
NMI, SINT16
4
04
2
Nonmaskable Interrupt
SINT17
8
08
—
Software Interrupt #17
SINT18
12
0C
—
Software Interrupt #18
SINT19
16
10
—
Software Interrupt #19
SINT20
20
14
—
Software Interrupt #20
SINT21
24
18
—
Software Interrupt #21
SINT22
28
1C
—
Software Interrupt #22
SINT23
32
20
—
Software Interrupt #23
SINT24
36
24
—
Software Interrupt #24
SINT25
40
28
—
Software Interrupt #25
SINT26
44
2C
—
Software Interrupt #26
SINT27
48
30
—
Software Interrupt #27
SINT28
52
34
—
Software Interrupt #28
SINT29
56
38
—
Software Interrupt #29
SINT30
60
3C
—
Software Interrupt #30
INT0, SINT0
64
40
3
External User Interrupt #0
INT1, SINT1
68
44
4
External User Interrupt #1
INT2, SINT2
72
48
5
Reserved
TINT, SINT3
76
4C
6
External Timer Interrupt
BRINT0, SINT4
80
50
7
McBSP #0 Receive Interrupt
BXINT0, SINT5
84
54
8
McBSP #0 Transmit Interrupt
BRINT2 (DMAC0),
SINT6
88
58
9
McBSP #2 Receive Interrupt (default) or DMA
Channel 0 interrupt. The selection is made in
the DMPREC register.
BXINT2 (DMAC1),
SINT7
92
5C
10
McBSP #2 Receive Interrupt (default) or DMA
Channel 1 interrupt. The selection is made in
the DMPREC register.
INT3, SINT8
96
60
11
Reserved
HPINT, SINT9
100
64
12
HPI Interrupt (from DSPINT in HPIC)
BRINT1 (DMAC2),
SINT10
104
68
13
McBSP #1 Receive Interrupt (default) or DMA
Channel 2 interrupt. The selection is made in
the DMPREC register.
BXINT1 (DMAC3),
SINT11
108
6C
14
McBSP #1 transmit Interrupt (default) or DMA
channel 3 interrupt. The selection is made in the
DMPREC register.
DMAC4, SINT12
112
70
15
DMA Channel 4
DMAC5, SINT13
116
74
16
DMA Channel 5
120
78
17
Interprocessor Interrupt
124−127
7C−7F
—
Reserved
IPINT, SINT14
—
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SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
interrupts (continued)
Figure 9 shows the bit layout of the interrupt mask register (IMR) and the interrupt flag register (IFR). Table 14
describes the bit functions.
The interprocessor interrupt (IPINT) bit of the interrupt mask register (IMR) and the interrupt flag register (IFR)
allows the subsystem to perform interrupt service routines based on the other subsystem activity. Incoming
IPINT interrupts are latched in bit 14 of the IFR. Generating an interprocessor interrupt is performed by writing
a “1” to the IPIRQ field of the bank-switching control register (BSCR). Subsequent interrupts must first clear the
interrupt by writing “0” to the IPIRQ field.
For example, if subsystem A is required to notify subsystem B of a completed task, subsystem A must write a
“1” to the IPIRQ field to generate a IPINT interrupt on subsystem B. On subsystem B, the IPINT interrupt is
latched in bit 14 of the IFR.
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
RES
IPINT
DMAC5
DMAC4
BXINT1
or
DMAC3
BRINT1
or
DMAC2
HPINT
RES
BXINT2
or
DMAC1
BRINT2
or
DMAC0
BXINT0
BRINT0
TINT
RES
INT1
INT0
Figure 9. Bit Layout of the IMR and IFR Registers for Each Subsystem
Table 14. Bit Functions for IMR and IFR Registers for Each DSP Subsystem
BIT
NUMBER
38
FUNCTION
NAME
15
−
14
IPINT
Reserved
13
DMAC5
DMA channel 5 interrupt flag/mask bit
12
DMAC4
DMA channel 4 interrupt flag/mask bit
11
BXINT1/DMAC3
This bit can be configured as either the McBSP1 transmit interrupt flag/mask bit, or the DMA
channel 3 interrupt flag/mask bit. The selection is made in the DMPREC register.
10
BRINT1/DMAC2
This bit can be configured as either the McBSP1 receive interrupt flag/mask bit, or the DMA
channel 2 interrupt flag/mask bit. The selection is made in the DMPREC register.
9
HPINT
8
−
7
BXINT2/DMAC1
This bit can be configured as either the McBSP2 transmit interrupt flag/mask bit, or the DMA
channel 1 interrupt flag/mask bit. The selection is made in the DMPREC register.
6
BRINT2/DMAC0
This bit can be configured as either the McBSP2 receive interrupt flag/mask bit, or the DMA
channel 0 interrupt flag/mask bit. The selection is made in the DMPREC register.
5
BXINT0
McBSP0 transmit interrupt flag/mask bit
4
BRINT0
McBSP0 receive interrupt flag/mask bit
3
TINT
2
−
1
INT1
External interrupt 1 flag/mask bit
0
INT0
External interrupt 0 flag/mask bit
Interprocessor IRQ.
Host to 54x interrupt flag/mask
Reserved
Timer interrupt flag/mask bit
Reserved
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IDLE3 power-down mode
The IDLE1 and IDLE2 power-down modes operate as described in the TMS320C54x DSP Reference Set,
Volume 1: CPU and Peripherals (literature number SPRU131). The IDLE3 mode is special in that the clocking
circuitry is shut off to conserve power. The 5420 cannot enter an IDLE3 mode unless both subsystems execute
an IDLE3 instruction. The power-reduced benefits of IDLE3 cannot be realized until both subsystems enter the
IDLE3 state and the internal clocks are automatically shut off. The order in which subsystems enter IDLE3 does
not matter.
emulating the 5420 device
The 5420 is a single device, but actually consists of two independent subsystems that contain register/status
information used by the emulator tools. The emulator tools must be informed of the multicore device by
modifying the board.cfg file. The board.cfg file is an ASCII file that can be modified with most editors. This
provides the emulator with a description of the JTAG chain. The board.cfg file must identify two processors when
using the 5420. The file contents would look something like this:
“CPU_B” TI320C5xx
“CPU_A” TI320C5xx
Use the compose program to make this file into a binary file (board.dat), readable by the emulation tools. Place
the board.dat file in the directory that contains the emulator software.
The subsystems are serially connected together internally. Emulation information is serially transmitted into the
device using TDI. The device responds with serial scan information transmitted out the TDO pin.
POST OFFICE BOX 1443
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SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
documentation support
Extensive documentation supports all TMS320 DSP family of devices from product announcement through
applications development. The following types of documentation are available to support the design and use
of the TMS320C5000 platform of DSPs:
D
D
D
D
D
TMS320C54x DSP Functional Overview (literature number SPRU307)
Device-specific data sheets
Complete User Guides
Development-support tools
Hardware and software application reports
The five-volume TMS320C54x DSP Reference Set (literature number SPRU210) consists of:
D
D
D
D
D
Volume 1: CPU and Peripherals (literature number SPRU131)
Volume 2: Mnemonic Instruction Set (literature number SPRU172)
Volume 3: Algebraic Instruction Set (literature number SPRU179)
Volume 4: Applications Guide (literature number SPRU173)
Volume 5: Enhanced Peripherals (literature number SPRU302)
The reference set describes in detail the TMS320C54x DSP products currently available and the hardware
and software applications, including algorithms, for fixed-point TMS320 DSP family of devices.
A series of DSP textbooks is published by Prentice-Hall and John Wiley & Sons to support digital signal
processing research and education. The TMS320 DSP newsletter, Details on Signal Processing, is published
quarterly and distributed to update TMS320 DSP customers on product information.
Information regarding Texas Instruments (TI) DSP products is also available on the Worldwide Web at
http://www.ti.com uniform resource locator (URL).
TMS320 and TMS320C5000 are trademarks of Texas Instruments.
40
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absolute maximum ratings over specified temperature range (unless otherwise noted)†
Supply voltage I/O range, DVDD‡ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 0.5 V to 4.0 V
Supply voltage core range, CVDD‡ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 0.5 V to 2.0 V
Supply voltage analog PLL, AVDD‡ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 0.5 V to 2.0 V
Input voltage range, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 0.5 V to DVDD + 0.5 V
Output voltage range, Vo . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 0.5 V to DVDD + 0.5 V
Operating case temperature range, TC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 40°C to 100°C
Storage temperature range Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 65_C to 150_C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
‡ All voltage values are with respect to VSS.
recommended operating conditions
MIN
NOM
MAX
3.0
3.3
3.6
V
Device supply voltage, core
1.71
1.80
1.98
V
Device supply voltage, PLL
1.71
1.80
1.98
V
DVDD
Device supply voltage, I/O
CVDD
AVDD
VSS
VIH
High-level input voltage, I/O
VIL
Supply voltage, GND
0
Schmitt trigger inputs, TRST, SELA/B
DVDD = 3.3 ± 0.3 V
Low-level input voltage, I/O
UNIT
V
0.7DVDD
DVDD
All other inputs
2
DVDD
Schmitt trigger inputs
DVDD = 3.3 ± 0.3 V
0
0.3DVDD
All other inputs
0
0.8
V
V
IOH
High-level output current
−300
µA
IOL
Low-level output current
1.5
mA
Operating case temperature, industrial
TC
Operating case temperature, commercial
−40
100
0
100
°C
Refer to Figure 10 for 3.3-V device test load circuit values.
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SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
electrical characteristics over recommended operating case temperature range (unless otherwise
noted)
PARAMETER
TEST CONDITIONS
MIN
TYP†
MAX
UNIT
VOH
VOL
High-level output voltage‡
Low-level output voltage‡
DVDD = 3.3 ± 0.3 V, IOH = MAX
IOL = MAX
2.4
0.4
V
IIZ
Input current in high impedance
−10
10
µA
TRST
DVDD = MAX, VO = VSS to DVDD
With internal pulldown
−10
35
See pin descriptions
With internal pullups
−35
10
PPD[15:0]
Bus holders enabled, DVDD = MAX,
VI = VSS to VIL (MAX); VIH (MIN) to DVDD
−200
200
II
Input current
(VI = VSS to
VDD)
All other input-only pins
IDDC
IDDP
Supply current, both core CPUs
IDDA
Supply current, PLL
IDDC
Supply current,
standby
Ci
Input capacitance
−10
CVDD = 1.8 V, fx=100 MHz§, TC=25°C¶
DVDD = 3.3 V, fclock = 100 MHz¶, TC = 25°C#
Supply current, pins
V
µA
10
180
mA
54
mA
5
mA
IDLE2
PLL × n mode, 20 MHz input
2
mA
IDLE3
PLL x n mode, 20 MHz input
600
µA
5
pF
Co
Output capacitance
5
pF
† All values are typical unless otherwise specified.
‡ All input and output voltage levels except A_RS, B_RS, INT0 INT1, NMI, CLKIN, BCLKX, BCLKR, HAS, HCS, TCK, TRST, SELA/B, HDS1,
HDS2, and HPIRS are LVTTL-compatible.
§ Clock mode: PLL × 1 with external source
¶ This value represents the current consumption of the CPU, on-chip memory, and on-chip peripherals. Conditions include: program execution
from on-chip RAM, with 50% usage of MAC and 50% usage of NOP instructions. Actual operating current varies with program being executed.
# This value was obtained using the following conditions: external memory writes at a rate of 20 million writes per second, CLKOFF=0, full-duplex
operation of all six McBSPs at a rate of 10 million bits per second each, and 15-pF loads on all outputs. For more details on how this calculation
is performed, refer to the Calculation of TMS320C54x Power Dissipation Application Report (literature number SPRA164).
PARAMETER MEASUREMENT INFORMATION
IOL
50 Ω
Tester Pin
Electronics
VLoad
CT
IOH
Where:
IOL
IOH
VLoad
CT
=
=
=
=
1.5 mA (all outputs)
300 µA (all outputs)
1.5 V
40 pF typical load circuit capacitance
Figure 10. 3.3-V Test Load Circuit
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Output
Under
Test
SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
external multiply-by-N clock option
An external frequency can be used by injecting the frequency directly into CLKIN. This external frequency is
multiplied by N to generate the internal machine cycle.
The external frequency injected must conform to specifications listed in the timing requirements table.
switching characteristics over recommended operating conditions [H = 0.5tc(CO)] (see Figure 11
and the recommended operating conditions table)
PARAMETER
MIN
TYP
MAX
10
tc(CI)/N†
10
16
UNIT
tc(CO)
td(CIH-CO)
Cycle time, CLKOUT
tf(CO)
tr(CO)
Fall time, CLKOUT
2
ns
Rise time, CLKOUT
2
ns
tw(COL)
tw(COH)
Pulse duration, CLKOUT low
H−2
H−1
H
Pulse duration, CLKOUT high
H−2
H−1
H
ns
35
µs
Delay time, CLKIN high/low to CLKOUT high/low
4
tp
Transitory phase, PLL lock-up time
† N is the PLL multiplier. N = 1 – 15
ns
ns
ns
timing requirements (see Figure 11)
tc(CI)
tf(CI)
tr(CI)
Cycle time, CLKIN
MIN
MAX
Integer PLL multiplier N
10N
200
PLL multiplier N = x.5
10N
100
PLL multiplier N = x.25, x.75
10N
50
Fall time, CLKIN
Rise time, CLKIN
tr(CI)
tc(CI)
UNIT
ns
8
ns
8
ns
tf(CI)
CLKIN
td(CI-CO)
tc(CO)
tw(COH)
tw(COL)
tp
CLKOUT
tf(CO)
tr(CO)
Unstable
Figure 11. External Multiply-By-One Clock
POST OFFICE BOX 1443
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43
SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
bypass option
An external frequency can be used by injecting the frequency directly into CLKIN.
The external frequency injected must conform to specifications listed in the timing requirements table.
switching characteristics over recommended operating conditions [H = 0.5tc(CO)] (see Figure 12
and the recommended operating conditions table)
PARAMETER
MIN
TYP
MAX
10
tc(CI)
10
16
UNIT
tc(CO)
td(CIH-CO)
Cycle time, CLKOUT
tf(CO)
tr(CO)
Fall time, CLKOUT
2
ns
Rise time, CLKOUT
2
ns
tw(COL)
tw(COH)
Pulse duration, CLKOUT low
H−2
H−1
H
ns
Pulse duration, CLKOUT high
H−2
H−1
H
ns
Delay time, CLKIN high/low to CLKOUT high/low
4
ns
ns
timing requirements (see Figure 12)
MIN
tc(CI)
tf(CI)
Cycle time, CLKIN
10
Fall time, CLKIN
MAX
†
8
UNIT
ns
ns
tr(CI)
Rise time, CLKIN
8
ns
† This device utilizes a fully static design and therefore can operate with tc(CI) approaching 1. The device is characterized at frequencies
approaching 0 Hz.
tf(CI)
tr(CI)
tc(CI)
CLKIN
td(CI-CO)
tc(CO)
CLKOUT
tw(COH)
tw(COL)
Unstable
Figure 12. Timing Diagram for Bypass Mode
44
POST OFFICE BOX 1443
tf(CO)
• HOUSTON, TEXAS 77251−1443
tr(CO)
SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
external memory interface timing for one wait state
switching characteristics over recommended operating conditions for a one-wait-state memory
read (MSTRB = 0)† (see Figure 13)
PARAMETER
td(CLKL-A)
td(CLKH-A)
MIN
MAX
Delay time, CLKOUT low to address valid‡
−1
5
ns
Delay time, CLKOUT high (transition) to address valid§
−1
6
ns
−1
4
ns
−1
4
ns
−1
5
ns
−1
6
ns
td(CLKL-MSL) Delay time, CLKOUT low to MSTRB low
td(CLKL-MSH) Delay time, CLKOUT low to MSTRB high
th(CLKL-A)R Hold time, address valid after CLKOUT low‡
th(CLKH-A)R Hold time, address valid after CLKOUT high§
† Address, PS, and DS timings are all included in timings referenced as address.
‡ In the case of a memory read preceded by a memory read
§ In the case of a memory read preceded by a memory write
UNIT
timing requirements for a one-wait-state memory read (MSTRB = 0) [H = 0.5 tc(CO)]† (see Figure 13)
MIN
MAX
UNIT
ta(A)M
ta(MSTRBL)
Access time, read data access from address valid (1 wait state required)
4H−15
ns
Access time, read data access from MSTRB low
4H−14
ns
tsu(D)R
th(D)R
Setup time, read data before CLKOUT low
Hold time, read data after CLKOUT low
th(A-D)R
Hold time, read data after address invalid
th(D)MSTRBH Hold time, read data after MSTRB high
† Address, PS, and DS timings are all included in timings referenced as address.
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
12
ns
0
ns
0
ns
0
ns
45
SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
external memory interface timing for one wait state (continued)
CLKOUT
td(CLKL-A)
th(CLKL-A)R
PPA[17:0]
th(A-D)R
tsu(D)R
ta(A)M
th(D)R
PPD[15:0]
th(D)MSTRBH
td(CLKL-MSL)
td(CLKL-MSH)
ta(MSTRBL)
MSTRB
R/W
PS, DS
1 Wait State
Figure 13. Memory Read (MSTRB = 0)
46
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
external memory interface timing for a memory write for one wait state
switching characteristics over recommended operating conditions for a memory write
(MSTRB = 0) [H = 0.5 tc(CO)]† (see Figure 14)
MIN
MAX
td(CLKH-A)
td(CLKL-A)
Delay time, CLKOUT high to address valid‡
Delay time, CLKOUT low to address valid§
PARAMETER
−1
6
ns
−1
5
ns
td(CLKL-MSL)
td(CLKL-D)W
Delay time, CLKOUT low to MSTRB low
−1
4
ns
0
12
ns
td(CLKL-MSH)
td(CLKH-RWL)
Delay time, CLKOUT low to MSTRB high
−1
4
ns
0
4
ns
−1
4
ns
H−2
H+2
ns
−1
6
ns
MIN
MAX
UNIT
H−3
H +3§
ns
Delay time, CLKOUT low to data valid
Delay time, CLKOUT high to R/W low
td(CLKH-RWH) Delay time, CLKOUT high to R/W high
td(RWL-MSTRBL) Delay time, R/W low to MSTRB low
th(A)W
Hold time, address valid after CLKOUT high‡
† Address, PS, and DS timings are all included in timings referenced as address.
‡ In the case of a memory write preceded by a memory write
§ In the case of a memory write preceded by an I/O cycle.
UNIT
timing requirements for a memory write (MSTRB = 0) [H = 0.5 tc(CO)]† (see Figure 14)
th(D)MSH
tw(SL)MS
Hold time, write data valid after MSTRB high
Pulse duration, MSTRB low§
4H−4
tsu(A)W
Setup time, address valid before MSTRB low
tsu(D)MSH
Setup time, write data valid before MSTRB high
† Address, PS, and DS timings are all included in timings referenced as address.
§ In the case of a memory write preceded by an I/O cycle.
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
ns
H−4
4H−10
ns
4H+5§
ns
47
SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
external memory interface timing for a memory write for one wait state (continued)
CLKOUT
td(CLKH-A)
td(CLKL-A)
th(A)W
A[19:0]
td(CLKL-D)W
th(D)MSH
tsu(D)MSH
D[15:0]
td(CLKL-MSL)
td(CLKL-MSH)
tsu(A)W
MSTRB
td(CLKH-RWL)
td(CLKH-RWH)
tw(SL)MS
td(RWL-MSTRBL)
R/W
PS, DS
1 Wait State
Figure 14. Memory Write (MSTRB = 0)
48
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
ready timing for externally generated wait states
timing requirements for externally generated wait states [H = 0.5 tc(CO)]† (see Figure 15 and
Figure 16)
MIN
tsu(RDY)
th(RDY)
Setup time, READY before CLKOUT low
Hold time, READY after CLKOUT low
tv(RDY)MSTRB Valid time, READY after MSTRB low‡
th(RDY)MSTRB Hold time, READY after MSTRB low‡
MAX
UNIT
7
ns
0
ns
4H−8
ns
4H
ns
† The hardware wait states can be used only in conjunction with the software wait states to extend the bus cycles. To generate wait states by
READY, at least two software wait states must be programmed. READY is not sampled until the completion of the internal software wait states.
‡ These timings are included for reference only. The critical timings for READY are those referenced to CLKOUT
CLKOUT
A[19:0]
tsu(RDY)
th(RDY)
READY
tv(RDY)MSTRB
th(RDY)MSTRB
MSTRB
Wait States
Generated Internally
Wait State
Generated
by READY
Figure 15. Memory Read With Externally Generated Wait States
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
49
SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
ready timing for externally generated wait states (continued)
CLKOUT
A[19:0]
D[15:0]
th(RDY)
tsu(RDY)
READY
tv(RDY)MSTRB
th(RDY)MSTRB
MSTRB
Wait States
Generated Internally
Wait State Generated
by READY
Figure 16. Memory Write With Externally Generated Wait States
50
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
parallel I/O interface timing
switching characteristics over recommended operating conditions for a parallel I/O port read
(IOSTRB = 0)† (see Figure 17)
PARAMETER
td(CLKL-A)
Delay time, CLKOUT low to address valid
td(CLKH-ISTRBL) Delay time, CLKOUT high to IOSTRB low
td(CLKH-ISTRBH) Delay time, CLKOUT high to IOSTRB high
th(A)IOR
Hold time, address after CLKOUT low
† Address and IS timings are included in timings referenced as address.
MIN
MAX
−1
5
UNIT
ns
0
5
ns
0
5
ns
−1
5
ns
timing requirements for a parallel I/O port read (IOSTRB = 0) [H = 0.5 tc(CO)]† (see Figure 17)
MIN
ta(A)IO
ta(ISTRBL)IO
Access time, read data access from address valid
tsu(D)IOR
th(D)IOR
Setup time, read data before CLKOUT high
Access time, read data access from IOSTRB low
Hold time, read data after CLKOUT high
th(ISTRBH-D)R Hold time, read data after IOSTRB high
† Address and IS timings are included in timings referenced as address.
MAX
UNIT
5H−15
ns
4H−14
ns
10
ns
0
ns
0
ns
CLKOUT
th(A)IOR
td(CLKL-A)
PPA[17:0]
th(D)IOR
tsu(D)IOR
ta(A)IO
PPD[15:0]
th(ISTRBH-D)R
td(CLKH-ISTRBH)
ta(ISTRBL)IO
td(CLKH-ISTRBL)
IOSTRB
R/W
IS
1 Wait State
Figure 17. Parallel I/O Port Read (IOSTRB=0)
POST OFFICE BOX 1443
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51
SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
parallel I/O interface timing (continued)
switching characteristics over recommended operating conditions for a parallel I/O port write
(IOSTRB = 0) [H = 0.5 tc(CO)]† (see Figure 18)
MIN
MAX
td(CLKL-A)
td(CLKH-ISTRBL)
Delay time, CLKOUT low to address valid
PARAMETER
−1
5
ns
Delay time, CLKOUT high to IOSTRB low
0
5
ns
td(CLKH-D)IOW
td(CLKH-ISTRBH)
Delay time, CLKOUT high to write data valid
H−5
H+11
ns
Delay time,CLKOUT high to IOSTRB high
0
5
ns
td(CLKL-RWL)
td(CLKL-RWH)
Delay time, CLKOUT low to R/W low
0
4
ns
Delay time, CLKOUT low to R/W high
0
4
ns
th(A)IOW
th(D)IOW
Hold time, address valid after CLKOUT low
−1
5
ns
Hold time, write data after IOSTRB high
tsu(D)IOSTRBH
Setup time, write data before IOSTRB high
tsu(A)IOSTRBL
Setup time, address valid before IOSTRB low
† Address and IS timings are included in timings referenced as address.
H−3
H+5
ns
3H−9
3H+5
ns
H−3
H+3
ns
CLKOUT
tsu(A)IOSTRBL
td(CLKL-A)
th(A)IOW
PPA[17:0]
td(CLKH-D)IOW
th(D)IOW
PPD[15:0]
td(CLKH-ISTRBL)
td(CLKH-ISTRBH)
tsu(D)IOSTRBH
IOSTRB
td(CLKL-RWH)
td(CLKL-RWL)
R/W
IS
1 Wait State
Figure 18. Parallel I/O Port Write (IOSTRB=0)
52
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
UNIT
SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
I/O port timing for externally generated wait states
timing requirements for externally generated wait states [H = 0.5 tc(CO)]† (see Figure 19 and
Figure 20)
MIN
tsu(RDY)
th(RDY)
tv(RDY)IOSTRB
th(RDY)IOSTRB
MAX
UNIT
Setup time, READY before CLKOUT low
7
ns
Hold time, READY after CLKOUT low
Valid time, READY after IOSTRB low‡
0
ns
Hold time, READY after IOSTRB low‡
5H
5H−8
ns
ns
† The hardware wait states can be used only in conjunction with the software wait states to extend the bus cycles. To generate wait states using
READY, at least two software wait states must be programmed.
‡ These timings are included for reference only. The critical timings for READY are those referenced to CLKOUT.
CLKOUT
PPA[17:0]
th(RDY)
tsu(RDY)
READY
tv(RDY)IOSTRB
th(RDY)IOSTRB
IOSTRB
Wait
States
Generated
Internally
Wait State Generated
by READY
Figure 19. I/O Port Read With Externally Generated Wait States
POST OFFICE BOX 1443
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53
SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
I/O port timing for externally generated wait states (continued)
CLKOUT
PPA[17:0]
D[15:0]
th(RDY)
tsu(RDY)
READY
tv(RDY)IOSTRB
th(RDY)IOSTRB
IOSTRB
Wait States
Generated
Internally
Wait State Generated
by READY
Figure 20. I/O Port Write With Externally Generated Wait States
54
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
reset, BIO, interrupt, and XIO timing
timing requirements for reset, BIO, interrupt, and XIO [H = 0.5 tc(CO)] (see Figure 21, Figure 22,
and Figure 23)
MIN
MAX
UNIT
th(RS)
th(BIO)
Hold time, A_RS or B_RS after CLKOUT low
0
ns
Hold time, BIO after CLKOUT low
0
ns
th(INT)
th(XIO)‡
Hold time, INTn, NMI, after CLKOUT low†
0
ns
Hold time, XIO after CLKOUT low
0
ns
tw(RSL)
tw(BIO)A
Pulse duration, A_RS or B_RS low§¶
4H+5
ns
Pulse duration, BIO low, asynchronous
5H
ns
tw(INTH)A
tw(INTL)A
Pulse duration, INTn, NMI high (asynchronous)†
Pulse duration, INTn, NMI low (asynchronous)†
4H
ns
4H
ns
tw(INTL)WKP Pulse duration, INTn, NMI low for IDLE2/IDLE3 wakeup†
tsu(RS)
Setup time, A_RS or B_RS before CLKIN low¶
8
ns
7
ns
tsu(BIO)
tsu(INT)
tsu(XIO)‡
Setup time, BIO before CLKOUT low
9
ns
Setup time, INTn, NMI, A_RS or B_RS before CLKOUT low†
9
ns
Setup time, XIO before CLKOUT low
10
ns
† The external interrupts (INT0−INT1, NMI) are synchronized to the core CPU by way of a two flip-flop synchronizer which samples these inputs
with consecutive falling edges of CLKOUT. The input to the interrupt pins is required to represent a 1-0-0 sequence at the timing that is
corresponding to a three-CLKOUT sampling sequence.
‡ Once the setup and hold times are met for XIO, the following falling edge of CLKOUT is either an HPI or EMIF cycle.
§ If the PLL mode is selected, then at power-on sequence, or at wakeup from IDLE3, A_RS must be held low for at least 50 µs to ensure
synchronization and lock-in of the PLL.
¶ Note that A_RS can cause a change in clock frequency, therefore changing the value of H (see the software-programmable phase-locked loop
(PLL) section).
CLKIN
tsu(RS)
tw(RSL)
A_RS, B_RS,
INTn, NMI
tsu(INT)
th(RS)
CLKOUT
tsu(BIO)
th(BIO)
BIO
tw(BIO)S
Figure 21. Reset and BIO Timings
POST OFFICE BOX 1443
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55
SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
reset, BIO, interrupt, and XIO timing (continued)
CLKOUT
tsu(INT)
tsu(INT)
th(INT)
INTn, NMI
tw(INTH)A
tw(INTL)A
Figure 22. Interrupt Timing
CLKOUT
th(XIO)
tsu(XIO)
XIO
Figure 23. XIO Timing
56
POST OFFICE BOX 1443
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SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
external flag (XF) and timer output (TOUT) timing
switching characteristics over recommended operating conditions for external flag (XF) and TOUT
[H = 0.5 tc(CO)] (see Figure 24 and Figure 25)
MIN
MAX
Delay time, CLKOUT low to XF high
PARAMETER
0
3
Delay time, CLKOUT low to XF low
0
3
td(TOUTH)
td(TOUTL)
Delay time, CLKOUT high to TOUT high
0
5
ns
Delay time, CLKOUT high to TOUT low
0
5
ns
tw(TOUT)
Pulse duration, TOUT
td(XF)
2H−2
UNIT
ns
ns
CLKOUT
td(XF)
XF
Figure 24. External Flag (XF) Timing
CLKOUT
td(TOUTL)
td(TOUTH)
TOUT
tw(TOUT)
Figure 25. Timer (TOUT) Timing
POST OFFICE BOX 1443
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57
SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
general-purpose input/output (GPIO) timing
timing requirements for GPIO (see Figure 26)
MIN
MAX
UNIT
tsu(GPIO-COH)
Setup time, GPIOx input valid before CLKOUT high, GPIOx configured as
general-purpose input.
7
ns
th(GPIO-COH)
Hold time, GPIOx input valid after CLKOUT high, GPIOx configured as general-purpose
input.
0
ns
switching characteristics for GPIO (see Figure 26)
PARAMETER
td(COH-GPIO)
Delay time, CLKOUT high to GPIOx output change. GPIOx configured as
general-purpose output.
MIN
MAX
UNIT
0
5
ns
CLKOUT
tsu(GPIO-COH)
th(GPIO-COH)
GPIOx Input Mode
td(COH-GPIO)
GPIOx Output Mode
Figure 26. GPIO Timings
58
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
SELA/B timing
switching characteristics in XIO = 1 mode for SELA/B (see Figure 27)
PARAMETER
td(SELA/B-ABUS)
Delay time, SELA/B to address bus valid in XIO = 1 mode.
PPA[17:0]
MIN
MAX
UNIT
3
10
ns
VALID A BUS
SELA/B
td(SELA/B-ABUS)
XIO
Figure 27. SELA/B Timing in XIO = 1 Mode
POST OFFICE BOX 1443
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59
SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
multichannel buffered serial port timing
timing requirements for the McBSP† [H=0.5tc(CO)] (see Figure 28 and Figure 29)
MIN
tc(BCKRX)
tw(BCKRX)
MAX
UNIT
Cycle time, BCLKR/X
BCLKR/X ext
4H
ns
Pulse duration, BCLKR/X or BCLKR/X high
BCLKR/X ext
6
ns
BCLKR int
0
BCLKR ext
4
th(BCKRL-BFRH)
Hold time, external BFSR high after BCLKR low
th(BCKRL-BDRV)
Hold time, BDR valid after BCLKR low
th(BCKXL-BFXH)
Hold time, external BFSX high after BCLKX low
tsu(BFRH-BCKRL)
Setup time, external BFSR high before BCLKR low
tsu(BDRV-BCKRL)
Setup time, BDR valid before BCLKR low
tsu(BFXH-BCKXL)
Setup time, external BFSX high before BCLKX low
BCLKR int
0
BCLKR ext
5
BCLKX int
0
BCLKX ext
4
BCLKR int
10
BCLKR ext
4
BCLKR int
10
BCLKR ext
3
BCLKX int
10
BCLKX ext
6
ns
ns
ns
ns
ns
ns
tr(BCKRX)
Rise time, BCKR/X
BCLKR/X ext
8
ns
tf(BCKRX)
Fall time, BCKR/X
BCLKR/X ext
8
ns
† Polarity bits CLKRP = CLKXP = FSRP = FSXP = 0. If the polarity of any of the signals is inverted, then the timing references of that signal are
also inverted.
60
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
multichannel buffered serial port timing (continued)
switching characteristics for the McBSP† [H=0.5tc(CO)] (see Figure 28 and Figure 29)
PARAMETER
MIN
tc(BCKRX)
tw(BCKRXH)
Cycle time, BCLKR/X
BCLKR/X int
Pulse duration, BCLKR/X high
BCLKR/X int
4H
D−4‡
tw(BCKRXL)
td(BCKRH-BFRV)
Pulse duration, BCLKR/X low
BCLKR/X int
Delay time, BCLKR high to internal BFSR valid
td(BCKXH-BFXV)
Delay time, BCLKX high to internal BFSX valid
tdis(BCKXH-BDXHZ)
Disable time, BCLKX high to BDX high impedance following last data bit
Delay time, BCLKX high to BDX valid. This applies to all bits except the first
bit transmitted.
td(BCKXH-BDXV)
te(BCKXH-BDX)
td(BFXH-BDXV)
te(BFXH-BDX)
Delay time, BCLKX high to BDX valid.§
Only applies to first bit transmitted when in Data Delay 1
or 2 (XDATDLY=01b or 10b) modes
Enable time, BCLKX high to BDX driven.§
Only applies to first bit transmitted when in Data Delay 1
or 2 (XDATDLY=01b or 10b) modes
Delay time, BFSX high to BDX valid.§
Only applies to first bit transmitted when in Data Delay 0
(XDATDLY=00b) mode.
Enable time, BFSX high to BDX driven.§
Only applies to first bit transmitted when in Data Delay 0
(XDATDLY=00b) mode
DXENA = 0
DXENA = 1
DXENA = 0
DXENA = 1
DXENA = 0
DXENA = 1
DXENA = 0
MAX
UNIT
ns
ns
C−4‡
D+1‡
C+1‡
BCLKR int
−3
3
ns
BCLKX int
−3
8
BCLKX ext
2
15
BCLKX int
−8
5
BCLKX ext
1
19
BCLKX int
0
11
BCLKX ext
5
20
BCLKX int
11
BCLKX ext
20
BCLKX int
25
BCLKX ext
ns
ns
ns
ns
27
BCLKX int
−4
BCLKX ext
2
BCLKX int
6
BCLKX ext
12
ns
BFSX int
9
BFSX ext
12
BFSX int
25
BFSX ext
ns
26
BFSX int
−1
BFSX ext
2
BFSX int
9
ns
DXENA = 1
BFSX ext
13
† Polarity bits CLKRP = CLKXP = FSRP = FSXP = 0. If the polarity of any of the signals is inverted, then the timing references of that signal are
also inverted.
‡ T=BCLKRX period = (1 + CLKGDV) * 2H
C=BCLKRX low pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2) * 2H when CLKGDV is even
D=BCLKRX high pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2 + 1) * 2H when CLKGDV is even
§ See the TMS320C54x DSP Reference Set, Volume 5: Enhanced Peripherals (literature number SPRU302) for a description of the DX enable
(DXENA) and data delay features of the McBSP.
POST OFFICE BOX 1443
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61
SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
multichannel buffered serial port timing (continued)
tc(BCKRX)
tw(BCKRXH)
tr(BCKRX)
tw(BCKRXL)
BCLKR
td(BCKRH−BFRV)
td(BCKRH−BFRV)
tr(BCKRX)
BFSR (int)
tsu(BFRH−BCKRL)
th(BCKRL−BFRH)
BFSR (ext)
th(BCKRL−BDRV)
tsu(BDRV−BCKRL)
BDR
(RDATDLY=00b)
Bit (n−1)
(n−2)
tsu(BDRV−BCKRL)
(n−3)
(n−4)
th(BCKRL−BDRV)
BDR
(RDATDLY=01b)
Bit (n−1)
(n−2)
tsu(BDRV−BCKRL)
BDR
(RDATDLY=10b)
(n−3)
th(BCKRL−BDRV)
Bit (n−1)
(n−2)
Figure 28. McBSP Receive Timings
tc(BCKRX)
tw(BCKRXH)
tw(BCKRXL)
tr(BCKRX)
tf(BCKRX)
BCLKX
td(BCKXH−BFXV)
td(BCKXH−BFXV)
BFSX (int)
tsu(BFXH−BCKXL)
th(BCKXL−BFXH)
BFSX (ext)
te(BDFXH−BDX)
BDX
(XDATDLY=00b)
Bit 0
td(BDFXH−BDXV)
Bit (n−1)
td(BCKXH−BDXV)
(n−2)
te(BCKXH−BDX)
BDX
(XDATDLY=01b)
Bit (n−1)
Bit 0
td(BCKXH−BDXV)
(n−2)
(n−3)
te(BCKXH−BDX)
Bit 0
Bit (n−1)
Figure 29. McBSP Transmit Timings
62
(n−4)
td(BCKXH−BDXV)
tdis(BCKXH−BDXHZ)
BDX
(XDATDLY=10b)
(n−3)
POST OFFICE BOX 1443
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(n−2)
SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
multichannel buffered serial port timing (continued)
timing requirements for McBSP general-purpose I/O (see Figure 30)
MIN
tsu(BGPIO-COH)
th(COH-BGPIO)
Setup time, BGPIOx input mode before CLKOUT high†
Hold time, BGPIOx input mode after CLKOUT high†
MAX
UNIT
9
ns
0
ns
† BGPIOx refers to BCLKRx, BFSRx, BDRx, BCLKXx, or BFSXx when configured as a general-purpose input.
switching characteristics for McBSP general-purpose I/O (see Figure 30)
PARAMETER
Delay time, CLKOUT high to BGPIOx output mode‡
td(COH-BGPIO)
‡ BGPIOx refers to BCLKRx, BFSRx, BCLKXx, BFSXx, or BDXx when configured as a general-purpose output.
tsu(BGPIO-COH)
MIN
MAX
−10
10
UNIT
ns
td(COH-BGPIO)
CLKOUT
th(COH-BGPIO)
BGPIOx Input
Mode†
BGPIOx Output
Mode‡
† BGPIOx refers to BCLKRx, BFSRx, BDRx, BCLKXx, or BFSXx when configured as a general-purpose input.
‡ BGPIOx refers to BCLKRx, BFSRx, BCLKXx, BFSXx, or BDXx when configured as a general-purpose output.
Figure 30. McBSP General-Purpose I/O Timings
POST OFFICE BOX 1443
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63
SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
multichannel buffered serial port timing (continued)
timing requirements for McBSP as SPI master or slave: [H=0.5tc(CO)] CLKSTP = 10b, CLKXP = 0†
(see Figure 31)
MASTER
MIN
tsu(BDRV-BCKXL)
th(BCKXL-BDRV)
Setup time, BDR valid before BCLKX low
tsu(BFXL-BCKXH)
Setup time, BFSX low before BCLKX high
SLAVE
MAX
MIN
MAX
UNIT
12
2 − 12H
ns
4
6 + 12H
ns
10
ns
32H
ns
Hold time, BDR valid after BCLKX low
tc(BCKX)
Cycle time, BCLKX
12H
† For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
switching characteristics for McBSP as SPI master or slave: [H=0.5tc(CO)] CLKSTP = 10b,
CLKXP = 0† (see Figure 31)
MASTER‡
PARAMETER
MIN
th(BCKXL-BFXL)
td(BFXL-BCKXH)
Hold time, BFSX low after BCLKX low§
Delay time, BFSX low to BCLKX high¶
td(BCKXH-BDXV)
Delay time, BCLKX high to BDX valid
tdis(BCKXL-BDXHZ)
Disable time, BDX high impedance following last data bit from BCLKX
low
tdis(BFXH-BDXHZ)
Disable time, BDX high impedance following last data bit from BFSX
high
SLAVE
MAX
MIN
MAX
UNIT
T−5
T+5
ns
C−5
C+5
ns
−2
12
C−2
C +10
6H + 4
10H + 19
ns
ns
4H+ 4
8H + 17
ns
td(BFXL-BDXV)
Delay time, BFSX low to BDX valid
4H + 4
8H + 17
ns
† For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
‡ T = BCLKX period = (1 + CLKGDV) * 2H
C = BCLKX low pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2) * 2H when CLKGDV is even
§ FSRP = FSXP = 1. As a SPI master, BFSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on BFSX
and BFSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP
¶ BFSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock
(BCLKX).
LSB
tc(BCKX)
MSB
tsu(BFXL-BCKXH)
BCLKX
th(BCKXL-BFXL)
td(BFXL-BCKXH)
BFSX
tdis(BFXH-BDXHZ)
td(BFXL-BDXV)
td(BCKXH-BDXV)
tdis(BCKXL-BDXHZ)
BDX
Bit 0
Bit(n-1)
tsu(BDRV-BCLXL)
BDR
Bit 0
(n-2)
(n-3)
(n-4)
th(BCKXL-BDRV)
Bit(n-1)
(n-2)
(n-3)
Figure 31. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 0
64
POST OFFICE BOX 1443
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(n-4)
SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
multichannel buffered serial port timing (continued)
timing requirements for McBSP as SPI master or slave: [H=0.5tc(CO)] CLKSTP = 11b, CLKXP = 0†
(see Figure 32)
MASTER
MIN
tsu(BDRV-BCKXH)
th(BCKXH-BDRV)
Setup time, BDR valid before BCLKX high
tsu(BFXL-BCKXH)
Setup time, BFSX low before BCLKX high
Hold time, BDR valid after BCLKX high
SLAVE
MAX
MIN
MAX
UNIT
12
2 − 12H
ns
4
5 +12H
ns
10
ns
32H
ns
tc(BCKX)
Cycle time, BCLKX
12H
† For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
switching characteristics for McBSP as SPI master or slave: [H=0.5tc(CO)] CLKSTP = 11b,
CLKXP = 0† (see Figure 32)
MASTER‡
PARAMETER
SLAVE
MIN
MAX
UNIT
MIN
MAX
C−5
C+5
ns
T−5
T+5
ns
th(BCKXL-BFXL)
td(BFXL-BCKXH)
Hold time, BFSX low after BCLKX low§
Delay time, BFSX low to BCLKX high¶
td(BCKXL-BDXV)
Delay time, BCLKX low to BDX valid
−2
12
6H + 4
10H + 19
ns
tdis(BCKXL-BDXHZ)
Disable time, BDX high impedance following last data bit from BCLKX
low
−2
10
6H + 4
10H + 17
ns
td(BFXL-BDXV)
Delay time, BFSX low to BDX valid
D − 2 D +10
4H − 4
8H + 17
ns
† For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
‡ T = BCLKX period = (1 + CLKGDV) * 2H
C = BCLKX low pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2) * 2H when CLKGDV is even
D = BCLKX high pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2 + 1) * 2H when CLKGDV is even
§ FSRP = FSXP = 1. As a SPI master, BFSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on BFSX
and BFSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP
¶ BFSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock
(BCLKX).
LSB
tc(BCKX)
MSB
tsu(BFXL-BCKXH)
BCLKX
td(BFXL-BCKXH)
th(BCKXL-BFXL)
BFSX
tdis(BCKXL-BDXHZ)
BDX
td(BCKXL-BDXV)
td(BFXL-BDXV)
Bit 0
Bit(n-1)
tsu(BDRV-BCKXH)
BDR
Bit 0
(n-2)
(n-3)
(n-4)
th(BCKXH-BDRV)
Bit(n-1)
(n-2)
(n-3)
(n-4)
Figure 32. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 0
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65
SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
multichannel buffered serial port timing (continued)
timing requirements for McBSP as SPI master or slave: [H=0.5tc(CO)] CLKSTP = 10b, CLKXP = 1†
(see Figure 33)
MASTER
MIN
tsu(BDRV-BCKXH)
th(BCKXH-BDRV)
Setup time, BDR valid before BCLKX high
tsu(BFXL-BCKXL)
Setup time, BFSX low before BCLKX low
Hold time, BDR valid after BCLKX high
SLAVE
MAX
MIN
MAX
UNIT
12
2 − 12H
ns
4
6 + 12H
ns
10
ns
32H
ns
tc(BCKX)
Cycle time, BCLKX
12H
† For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
switching characteristics for McBSP as SPI master or slave: [H=0.5tc(CO)] CLKSTP = 10b,
CLKXP = 1† (see Figure 33)
MASTER‡
PARAMETER
MIN
th(BCKXH-BFXL)
td(BFXL-BCKXL)
Hold time, BFSX low after BCLKX high§
Delay time, BFSX low to BCLKX low¶
td(BCKXL-BDXV)
Delay time, BCLKX low to BDX valid
tdis(BCKXH-BDXHZ)
Disable time, BDX high impedance following last data bit from BCLKX
high
tdis(BFXH-BDXHZ)
Disable time, BDX high impedance following last data bit from BFSX
high
SLAVE
MAX
MIN
MAX
UNIT
T−5
T+5
ns
D−5
D+5
ns
−2
12
D−2
D +10
6H + 4
10H + 19
ns
ns
4H + 4
8H + 17
ns
td(BFXL-BDXV)
Delay time, BFSX low to BDX valid
4H − 4
8H + 17
ns
† For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
‡ T = BCLKX period = (1 + CLKGDV) * 2H
D = BCLKX high pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2 + 1) * 2H when CLKGDV is even
§ FSRP = FSXP = 1. As a SPI master, BFSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on BFSX
and BFSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP
¶ BFSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock
(BCLKX).
tsu(BFXL-BCKXL)
LSB
tc(BCKX)
MSB
BCLKX
th(BCKXH-BFXL)
td(BFXL-BCKXL)
BFSX
td(BFXL-BDXV)
tdis(BFXH-BDXHZ)
tdis(BCKXH-BDXHZ)
BDX
td(BCKXL-BDXV)
Bit 0
Bit(n-1)
tsu(BDRV-BCKXH)
BDR
Bit 0
(n-2)
(n-3)
th(BCKXH-BDRV)
Bit(n-1)
(n-2)
(n-3)
Figure 33. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 1
66
POST OFFICE BOX 1443
(n-4)
• HOUSTON, TEXAS 77251−1443
(n-4)
SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
multichannel buffered serial port timing (continued)
timing requirements for McBSP as SPI master or slave: [H=0.5tc(CO)] CLKSTP = 11b, CLKXP = 1†
(see Figure 34)
MASTER
MIN
tsu(BDRV-BCKXL)
th(BCKXL-BDRV)
Setup time, BDR valid before BCLKX low
tsu(BFXL-BCKXL)
Setup time, BFSX low before BCLKX low
Hold time, BDR valid after BCLKX low
SLAVE
MAX
MIN
UNIT
MAX
12
2 − 12H
ns
4
6 + 12H
ns
10
ns
32H
ns
tc(BCKX)
Cycle time, BCLKX
12H
† For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
switching characteristics for McBSP as SPI master or slave: [H=0.5tc(CO)] CLKSTP = 11b,
CLKXP = 1† (see Figure 34)
MASTER‡
PARAMETER
SLAVE
MIN
UNIT
MIN
MAX
MAX
D−5
D+5
ns
T−5
T+5
ns
th(BCKXH-BFXL)
td(BFXL-BCKXL)
Hold time, BFSX low after BCLKX high§
Delay time, BFSX low to BCLKX low¶
td(BCKXH-BDXV)
Delay time, BCLKX high to BDX valid
−2
12
6H + 4
10H + 19
ns
tdis(BCKXH-BDXHZ)
Disable time, BDX high impedance following last data bit from BCLKX
high
−2
10
6H + 4
10H + 17
ns
td(BFXL-BDXV)
Delay time, BFSX low to BDX valid
C − 2 C +10
4H − 4
8H + 17
ns
† For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
‡ T = BCLKX period = (1 + CLKGDV) * 2H
C = BCLKX low pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2) * 2H when CLKGDV is even
D = BCLKX high pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2 + 1) * 2H when CLKGDV is even
§ FSRP = FSXP = 1. As a SPI master, BFSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on BFSX
and BFSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP
¶ BFSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock
(BCLKX).
LSB
tsu(BFXL-BCKXL)
tc(BCKX)
MSB
BCLKX
th(BCKXH-BFXL)
td(BFXL-BCKXL)
BFSX
tdis(BCKXH-BDXHZ)
BDX
td(BCKXH-BDXV)
td(BFXL-BDXV)
Bit 0
Bit(n-1)
tsu(BDRV-BCKXL)
BDR
Bit 0
(n-2)
(n-3)
(n-4)
th(BCKXL-BDRV)
Bit(n-1)
(n-2)
(n-3)
(n-4)
Figure 34. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1
POST OFFICE BOX 1443
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67
SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
HPI16 timing
switching characteristics over recommended operating conditions†‡§ [H = 0.5tc(CO)]
(see Figure 35 – Figure 42)
PARAMETER
td(DSL-HDD)
Delay time, DS low to HD driven§
MIN
MAX
UNIT
3
20
ns
Case 1a: Memory accesses when
DMAC is active in 16-bit mode and
tw(DSH) < 18H
Case 1b: Memory accesses when
DMAC is active in 16-bit mode and
tw(DSH) ≥ 18H
td(DSL-HDV1)
Delay time, DS low to HDx valid for first
byte of an HPI read
18H+20 – tw(DSH)
20
Case 1c: Memory access when
DMAC is active in 32-bit mode and
tw(DSH) < 26H
Case 1d: Memory access when
DMAC is active in 32-bit mode and
tw(DSH) ≥ 26H
26H+20 – tw(DSH)
ns
20
Case 2a: Memory accesses when
DMAC is inactive and tw(DSH) < 10H
10H+20 – tw(DSH)
Case 2b: Memory accesses when
DMAC is inactive and tw(DSH) ≥ 10H
20
Case 3: Register accesses
td(DSL-HDV2)
td(DSH-HYH)
Multiplexed reads with autoincrement. Prefetch completed.
Delay time, DS high to HRDY high§
(writes and autoincrement reads)
20
No DMA channel active
12H+5
One or more 16-bit DMA channels
active
18H+5
One or more 32-bit DMA channels
active
26H+5
Writes to DSPINT and HINT
4H + 5
tv(HYH-HDV)
th(DSH-HDV)R
Valid time, HDx valid after HRDY high
td(COH-HYH)
td(DSH-HYL)
Delay time, CLKOUT rising edge to HRDY high
Delay time, HDS or HCS high to HRDY low‡
Hold time, HD valid after DS rising edge, read§
td(COH−HTX)
Delay time, CLKOUT rising edge to HINT change
† HAD stands for HCNTL0, HCNTL1, and HR/W.
‡ HDS refers to either HDS1 or HDS2.
§ DS refers to the logical OR of HCS and HDS.
68
20
3
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
0
ns
ns
7
ns
10
ns
5
ns
12
ns
5
ns
SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
HPI16 timing (continued)
timing requirements [H = 0.5tc(CO)] (see Figure 35 – Figure 42)
MIN
MAX
UNIT
tsu(HBV-DSL)
th(DSL-HBV)
Setup time, HAD valid before DS falling edge†‡
Hold time, HAD valid after DS falling edge†‡
5
ns
5
ns
tsu(HBV-HSL)
th(HSL-HBV)
Setup time, HAD valid before HAS falling edge†
Hold time, HAD valid after HAS falling edge†
5
ns
5
ns
tsu(HAV-DSH)
tsu(HAV-DSL)
Setup time, address valid before DS rising edge (nonmultiplexed write)
th(DSH-HAV)
tsu(HSL-DSL)
th(HSL-DSL)
tw(DSL)
tw(DSH)
Setup time, address valid before DS falling edge (nonmultiplexed mode)‡
Hold time, address valid after DS rising edge (nonmultiplexed mode)‡
ns
ns
1
ns
Setup time, HAS low before DS falling edge‡
Hold time, HAS low after DS falling edge‡
5
ns
2
ns
Pulse duration, DS low‡
Pulse duration, DS high‡
30
ns
10
ns
Nonmultiplexed or multiplexed mode
(no increment) with no DMA activity.
Reads
12H
ns
Writes
14H
ns
Nonmultiplexed or multiplexed mode
(no increment) with 16-bit DMA activity.
Reads
18H
ns
Writes
20H
Nonmultiplexed or multiplexed mode
(no increment) with 32-bit DMA activity.
Reads
26H
Writes
28H
Multiplexed (autoincrement) with no DMA
activity.
12H
ns
Multiplexed (autoincrement) with 16-bit DMA
activity.
18H
ns
Multiplexed (autoincrement) with 32-bit DMA
activity.
26H
ns
8H
ns
10
ns
Hold time, HD valid after DS rising edge, write‡
0
ns
Setup time, SELA/B valid before DS falling edge‡
Hold time, SELA/B valid after DS Rising edge‡
5
ns
0
ns
Cycle time, DS rising edge to next DS
rising edge‡
tc(DSH-DSH)
Cycle time, DS rising edge to next DS
rising edge‡
(In autoincrement mode, WRITE timings are the same as READ timings.)
tsu(HDV-DSH)
th(DSH-HDV)W
5
−4H − 5
Cycle time, DS rising edge to next DS rising edge writes to DSPINT and HINT
Setup time, HD valid before DS rising edge‡
tsu(SELV-DSL)
th(DSH-SELV)
† HAD stands for HCNTL0, HCNTL1, and HR/W.
‡ DS refers to the logical OR of HCS and HDS.
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
ns
69
SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
HPI16 timing (continued)
HCS
tsu(HSL−DSL)
th(HSL−DSL)
HAS
tc(DSH−DSH)
tsu(HBV−HSL)
HDS
tw(DSH)
th(HSL−HBV)
tw(DSL)
HR/W
HCNTL[1:0]
01
01
td(DSL−HDV1)
th(DSH−HDV)R
td(DSL−HDV2)
Data 1
HD[15:0]
PF Data
td(DSL−HDD)
HRDY
tv(HYH−HDV)
td(DSH−HYL)
td(DSH−HYH)
Figure 35. Multiplexed Read Timings Using HAS
HCS
tsu(HBV−DSL)
tc(DSH−DSH)
HDS
th(DSL−HBV)
tw(DSH)
tw(DSL)
HR/W
01
HCNTL[1:0]
01
td(DSL−HDV1)
th(DSH−HDV)R
td(DSL−HDV2)
Data 1
HD[15:0]
PF Data
td(DSL−HDD)
HRDY
tv(HYH−HDV)
td(DSH−HYL)
td(DSH−HYH)
Figure 36. Multiplexed Read Timings Without HAS
70
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
Á
Á
SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
HPI16 timing (continued)
HCS
tsu(HBV−HSL)
th(HSL−DSL)
HAS
tsu(HSL−DSL)
HR/W
th(HSL−HBV)
HCNTL[0:1]
01
01
tc(DSH−DSH)
HDS
tw(DSH)
tw(DSL)
tsu(HDV−DSH)
HD[15:0]
Data 1
Data n
th(DSH−HDV)W
HRDY
td(DSH−HYL)
td(DSH−HYH)
Figure 37. Multiplexed Write Timings Using HAS
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
71
SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
HPI16 timing (continued)
HCS
tc(DSH−DSH)
tw(DSH)
HDS
tw(DSL)
tsu(HBV−DSL)
HR/W
th(DSL−HBV)
HCNTL[1:0]
01
01
tsu(HDV−DSH)
HD[15:0]
th(DSH−HDV)W
Data 1
Data n
td(DSH−HYL)
HRDY
td(DSH−HYH)
Figure 38. Multiplexed Write Timings Without HAS
72
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SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
HPI16 timing (continued)
HCS
tw(DSH)
tc(DSH−DSH)
HDS
tsu(HBV−DSL)
tw(DSL)
th(DSL−HBV)
HR/W
tsu(HAV−DSL)
th(DSH−HAV)
HA[17:0]
Valid Address
Valid Address
td(DSL−HDV1)
HD[15:0]
Data
th(DSH−HDV)R
Data Valid
td(DSH−HYH)
tv(HYH−HDV)
HRDY
td(DSH−HYL)
Figure 39. Nonmultiplexed Read Timings
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73
SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
HPI16 timing (continued)
HCS
tw(DSH)
tc(DSH−DSH)
HDS
tsu(HBV−DSL)
tw(DSL)
th(DSL−HBV)
HR/W
tsu(HAV−DSH)
th(DSH−HAV)
HA[17:0]
Valid Address
Valid Address
tsu(HDV−DSH)
HD[15:0]
Data Valid
Data Valid
td(DSH−HYH)
HRDY
td(DSH−HYL)
Figure 40. Nonmultiplexed Write Timings
74
th(DSH−HDV)W
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SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
HPI16 timing (continued)
HRDY
td(COH−HYH)
CLKOUT
td(COH−HTX)
HINT
Figure 41. HRDY and HINT Relative to CLKOUT
HCS
tsu(DSL−SELV)
th(DSH−SELV)
SELA/B
HDS
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Figure 42. SELA/B Timing
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SPRS080F − MARCH 1999 − REVISED OCTOBER 2008
mechanical data
The following packaging information reflects the most current released data available for the designated
device(s). This data is subject to change without notice and without revision of this document.
package thermal resistance characteristics
Table 15 provides the estimated thermal resistance characteristics for the recommended package types used
on the device.
Table 15. Thermal Resistance Characteristics
76
PARAMETER
PGE PACKAGE
GGU PACKAGE
UNIT
RΘJA
56
38
°C/W
RΘJC
5
5
°C/W
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PACKAGE OPTION ADDENDUM
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11-Jan-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package Qty
Drawing
TMS320C5420GGUA200
ACTIVE
BGA
MICROSTAR
GGU
144
TMS320C5420GGUR200
OBSOLETE
BGA
MICROSTAR
GGU
144
TMS320C5420PGEA200
ACTIVE
LQFP
PGE
144
TMS320VC5420GGU200
ACTIVE
BGA
MICROSTAR
GGU
TMS320VC5420PGE200
ACTIVE
LQFP
TMS320VC5420ZGU200
ACTIVE
BGA
MICROSTAR
160
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Samples
(3)
(Requires Login)
(2)
TBD
SNPB
Level-3-220C-168 HR
TBD
Call TI
Call TI
60
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
144
160
TBD
SNPB
Level-3-220C-168 HR
PGE
144
60
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ZGU
144
160
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Jan-2013
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MPBG021C – DECEMBER 1996 – REVISED MAY 2002
GGU (S–PBGA–N144)
PLASTIC BALL GRID ARRAY
12,10
SQ
11,90
9,60 TYP
0,80
A1 Corner
0,80
N
M
L
K
J
H
G
F
E
D
C
B
A
1 2 3 4 5 6 7 8 9 10 11 12 13
Bottom View
0,95
0,85
1,40 MAX
Seating Plane
0,55
0,45
0,08
0,45
0,35
0,10
4073221-2/C 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice
C. MicroStar BGAt configuration
MicroStar BGA is a trademark of Texas Instruments Incorporated.
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MECHANICAL DATA
MTQF017A – OCTOBER 1994 – REVISED DECEMBER 1996
PGE (S-PQFP-G144)
PLASTIC QUAD FLATPACK
108
73
109
72
0,27
0,17
0,08 M
0,50
144
0,13 NOM
37
1
36
Gage Plane
17,50 TYP
20,20 SQ
19,80
22,20
SQ
21,80
0,25
0,05 MIN
0°– 7°
0,75
0,45
1,45
1,35
Seating Plane
0,08
1,60 MAX
4040147 / C 10/96
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-026
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1
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