MICROSEMI LX1701CLQ

LX1701
®
TM
2W Filterless Mono Class-D Audio Amplifier
P RODUCTION D ATA S HEET
KEY FEATURES
DESCRIPTION
The LX1701 family provides very
low quiescent current consumption
through the use of a proprietary output
modulation scheme. This technology
enables filter-less operation in many
applications. The part features on board,
low Rdson, complementary output
MOSFET’s that reduces the need for
external components.
The LX1701 is offered in a small
footprint, low profile surface mountable
16-pin MLPQ package.
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IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
PRODUCT HIGHLIGHT
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PVDD
VDD
No Output Filter Required
Low EMI Design
Low Quiescent Current: 2mA
Low Shutdown Current:1µA
Low And Wide Supply Voltage
Range: 1.8-6.0 Volt
2W Output Power Into 4Ω Load
With THD<1%
3W Into 2Ω With THD<1%
THD+N As Low As 0.09%
Small Form Factor: 16-pin MLPQ
Package: 4mmx4mm
-40 to +85°C Operating Range
Only 1 External Component
Needed, No Input AC Coupling
Capacitor Required, Under
Certain Conditions
Built-in Clock Frequency 200KHz
Built-in Feedback Loop, Allows
High Audio Fidelity
14dB/8dB Gain Selectable
20/300Hz Bandwidth Selectable
Shut-down Function
Internal Thermal Shut-down
High Efficiency: 85% Through
Modulation Scheme And Class-D
Operation
Built-in De-pop Circuit, No Turn
ON/OFF “POP” Noise
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PVDD
ƒ
GAIN
Clock
Gain
Decoder
APPLICATIONS/BENEFITS
OUTP
INP
Audio
Input
WWW . Microsemi .C OM
The LX1701 family represents a
new generation of a fully integrated
audio mono class-D amplifier from
Microsemi. This CMOS monolithic
class-D amplifier series is optimized
for low voltage, low power operation
and minimum system cost. The
products are ideal for use in battery
powered applications where low
power consumption is desirable such
as cell phones, PDA’s, web tablets
and other low power systems.
+
INN
PDA's
Cell Phones
Portable Audio
Laptop Computer Speaker
Amplifier
ƒ LCD TV/Desktop Monitor
Speaker Amplifier
ƒ PC Audio Multimedia Amplifier
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H-Bridge
& Driver
PWM
_
OUTN
LPF
VDD
LPF
De-POP
LX1701
VSS
PVSS
LX1701
PACKAGE ORDER INFO
TJ (°C)
-40 to 85
Bare Die
LX1701
Plastic MLPQ
LQ 16-Pin
LX1701CLQ
Note: Available in Tape & Reel. Append the letters “TR” to the part number.
(i.e. LX1701CLQTR)
Copyright © 2004
Rev. 1.0a, 2004-07-09
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove CA. 92841 714-898-8121, FAX 714-893-2570
Page 1
LX1701
®
TM
2W Filterless Mono Class-D Audio Amplifier
P RODUCTION D ATA S HEET
ABSOLUTE MAXIMUM RATINGS
PACKAGE PIN OUT
GAIN
12
11
10
9
VDD
13
8
BW_SEL
3LEL
14
7
EN
VSS
15
6
VSS
PVSS
16
5
PVSS
3
4
PVDD
OUTP
OUTN
THERMAL DATA
2
PVDD
1
WWW . Microsemi .C OM
VINN
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal.
VINP
Package Peak Temp for Solder Reflow(40 second maximum exposure)...... 250°C (+5, -0)
TOVL
Positive Supply Voltage (VDD, PVDD)............................................. -0.3 to 7.0V
Operating Temperature ..................................................................-40°C to +85°C
Maximum Operating Junction Temperature ................................................ 150°C
Storage Temperature......................................................................-65°C to 150°C
Lead Temperature (Soldering, 10 seconds) ................................................ 300°C
LQ PACKAGE
(Top View)
LQ
Plastic Micro Lead Quad Package 16-Pin
Pb-free 100% Matte Tin Finish
THERMAL RESISTANCE-JUNCTION TO CASE, θJC
3.22°C/W
38.1°C/W
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
Junction Temperature Calculation: TJ = TA + (PD x θJA).
The θJA numbers are guidelines for the thermal performance of the device/pc-board system. All of the
above assume no ambient airflow. Thermal Test Board: JESD5-7 (Leaded Surface Mount Package)
FUNCTIONAL PIN DESCRIPTION
Name
Description
OUTN
Negative Audio (PWM) Output
PVDD
Positive Supply to Negative Output Stage
PVDD
Positive Supply to Positive Output Stage
OUTP
Positive Audio (PWM) Output
PVSS
Negative Supply to Positive Output Stage (ground)
VSS
Negative Supply to Analog Stage (ground)
Enable Pin, Active High.
BW_SEL
Bandwidth Selection Pin:
VDD 300Hz HP filter
VSS No HP (< 20Hz)
GAIN
Gain Selection Pin:
Tied to VDD Gain = 14dB
Tied to VSS Gain = 8dB
VINN
Negative Audio Input
VINP
Positive Audio Input
TOVL
Thermal Overload Indicator Output, Active HIGH.
VDD
Analog Positive Power Supply
3LVL
Three Level Modulation Selection Pin:
Tied to VSS 2 LEVEL PWM Modulation Scheme, +PVDD | -PVDD;
Tied to VDD 3 LEVEL PWM Modulation Scheme, +PVDD | PVSS | -PVDD;
VSS
Negative Power Supply to Analog Stage
PVSS
PACKAGE DATA
EN
Negative Supply to Negative Output Stage (ground)
Copyright © 2004
Rev. 1.0a, 2004-07-09
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove CA. 92841 714-898-8121, FAX 714-893-2570
Page 2
LX1701
®
TM
2W Filterless Mono Class-D Audio Amplifier
P RODUCTION D ATA S HEET
Parameter
Supply Current, Quiescent
Supply Current, Shutdown Mode
Symbol
IQQ
IQQSD
Test Conditions
1.2
No Load, VDD = PVDD = 3.3V
1.3
1.8
No Load, VDD = PVDD = 5.0V
2.0
2.5
Disable pin active
PO
VDD = PVDD = 5V,
Fin = 1kHz
PO
VDD = PVDD = 3.3V,
Fin = 1kHz
VDD = PVDD = 5V,
Fin = 1kHz
Output Power @ 2 Ohms
PO
VDD = PVDD = 3.3V,
Fin = 1kHz
Power Efficiency
Total Harmonic Distortion @ 50% of
Max Power
Signal-to-Noise Ratio
Max
0.9
VDD = PVDD = 3.3V,
Fin = 1kHz
Output Power @ 4 Ohms
LX1701
Typ
No Load, VDD = PVDD = 1.8V
VDD = PVDD = 5V,
Fin = 1kHz
Output Power @ 8 Ohms
Min
1
THD+N = 1%
1.3
THD+N = 10%
1.8
THD+N = 1%
0.5
THD+N = 10%
0.7
THD+N = 1%
2.1
THD+N = 10%
2.8
THD+N = 1%
0.9
THD+N = 10%
1.2
THD+N = 1%
3.0
THD+N = 10%
3.9
THD+N = 1%
1.3
THD+N = 10%
1.8
Units
mA
µA
W
W
W
η
VDD = PVDD = 5V, Fin = 1kHz, RL = 8 Ω
85
%
THD+N
VDD = PVDD = 5V, Fin = 1kHz, RL = 8 Ω
0.09
%
SNR
VDD = PVDD = 5V, F = 1KHz, PO = 1W,
A-Weighted
99
dB
25
µVRMS
Output Noise Floor
VN
Input Grounded A-weighted 20-20kHz
Frequency Response Lower Corner
Frequency
FLO
3dB relative to 1kHz, BW Select = VSS
20
Hz
FHI
3dB relative to 1kHz, BW Select = VDD
300
Hz
VDD = PVDD = 1.8 to 5.5V, RL = 4 Ω ,
PO = 200mW @ 20~80KHz, filterless
Frequency Response
3
dB
Power Supply Rejection Ratio
PSRR
VDD = PVDD = 1.8V to 5.5V
65
dB
Common Mode Rejection Ratio
CMRR
VDD = PVDD = 1.8V to 5.5V
70
dB
Gain
GSYS
Pin 9 tied to VDD, VDD = PVDD = 1.8V to 5.5V
14
Pin 9 tied to VSS, VDD = PVDD = 1.8V to 5.5V
8
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove CA. 92841 714-898-8121, FAX 714-893-2570
dB
ELECTRICALS
Copyright © 2004
Rev. 1.0a, 2004-07-09
WWW . Microsemi .C OM
SYSTEM CHARACTERISTICS
Unless otherwise specified, the following specifications apply over the operating ambient temperature TA = 25°C except where otherwise
noted and the following test conditions: Default settings: 20Hz corner low frequency, 14dB gain.
Page 3
LX1701
®
TM
2W Filterless Mono Class-D Audio Amplifier
P RODUCTION D ATA S HEET
ELECTRICAL CHARACTERISTICS
Parameter
Symbol
Test Conditions
VDD
PVDD
Supply Voltage
Oscillator Frequency
fSW
Supply Current, Quiescent
IQQ
Min
≤
85°C except where
LX1701
Typ
1.8
Units
6.0
V
200
225
KHz
VDD = PVDD = 5V
2.0
2.5
VDD = PVDD = 3.3V
1.3
1.8
VDD = PVDD = 1.8V
0.9
1.2
VDD = PVDD = 1.8~5.5V
No Load
Max
180
1
mA
Supply Current, Shutdown Mode
IQQSD
Disable Pin active
Power Supply Rejection Ratio
PSRR
VDD = PVDD = 1.8V to 5.5V
65
dB
Common Mode Rejection Ratio
CMRR
VDD = PVDD = 1.8V to 5.5V
70
dB
WWW . Microsemi .C OM
Unless otherwise specified, the following specifications apply over the operating ambient temperature -40°C ≤ TA
otherwise noted.
µA
Input Impedance
Input voltage Range
VDD = PVDD = 1.8~5.5V
KIN
Gain = 14dB, BW = 20Hz
65
Gain = 14dB, BW = 300Hz
72
Gain = 8dB, BW = 20Hz
98
Gain = 8dB, DB = 300Hz
102
Input Resistance Differential
Output DC Offset
VINOFF
Gain = 14dB BW = 20Hz, PVDD = 5V
0.14
Gain = 14dB, BW = 300Hz, PVDD = 5V
1.50
Gain = 8dB, BW = 20Hz, PVDD = 5V
0.25
Gain = 8dB, BW = 300Hz, PVDD = 5V
2.70
RDSON
VDD = PVDD=3.3V
VDD = PVDD=1.8V
Thermal Indicator Output
Under Voltage Threshold Level
Enable Threshold
2
P Channel
360
N Channel
350
P Channel
490
N Channel
460
P Channel
600
N Channel
600
Pin 9 tied to VDD, VDD = PVDD = 1.8V to 5.5V
14
GL
Pin 9 tied to VSS, VDD = PVDD = 1.8V to 5.5V
8
TJ
V
mΩ
†
dB
150
VDD = PVDD =3.3V
°C
VDD
VDD
+0.3
V
1.55
1.65
1.75
V
1.3
1.5
1.7
V
VDD = PVDD = 1.8~5.5V
VUV
mV
†
GH
VTOVL
8
† At +85°C ambient temperature.
Copyright © 2004
Rev. 1.0a, 2004-07-09
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove CA. 92841 714-898-8121, FAX 714-893-2570
Page 4
ELECTRICALS
Thermal Indicator Junction
V
KΩ
VOFF
VDD = PVDD=5V
Stage Gain
-0.3
Input shorted to GND, 20Hz corner, 14dB gain
VDD = PVDD = 3.3V
Input DC Offset Dynamic Range
Max. with Output VOFF < 200mV
Static Drain-to-source ONResistance
VDD
+0.3
VIN
LX1701
®
TM
2W Filterless Mono Class-D Audio Amplifier
P RODUCTION D ATA S HEET
SIMPLIFIED BLOCK DIAGRAM
GAIN
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Triangle Wave
Generator
EN
Gain
Decoder
VINP
Driver
OUTP
Driver
OUTN
Dynamic pulse
generator
VINN
LPF
LPF
VDD
De-pop ground
signal ground
generation
VSS
PVSS
PVSS
PVDD
PVDD
Figure 1 – LX1701 Simplified Block Diagram
BLOCK DIAGRAM
Copyright © 2004
Rev. 1.0a, 2004-07-09
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove CA. 92841 714-898-8121, FAX 714-893-2570
Page 5
LX1701
®
TM
2W Filterless Mono Class-D Audio Amplifier
P RODUCTION D ATA S HEET
TYPICAL APPLICATION SCHEMATIC
WWW . Microsemi .C OM
VBAT
JP3
VINP
12
TOVL
LX1701
2
13
PVDD
OUTN
VDD
Thermal
Indicator
11
PVDD
14
15
4
3
2
VBAT
1
PVSS
C3
J2
1
VINN
VSS
2
10
5
OUTP
3LEL
Audio
In
6
PVSS
C2
1
GAIN
7
VSS
9
J1
8
EN
JP1
BW_SEL
VBAT
JP4
16
VBAT
VBAT
GND
J3
1
2
VBAT
+
C1
Figure 2 – LX1701 Typical Application Circuit
APPLICATIONS
Copyright © 2004
Rev. 1.0a, 2004-07-09
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove CA. 92841 714-898-8121, FAX 714-893-2570
Page 6
LX1701
TM
®
2W Filterless Mono Class-D Audio Amplifier
P RODUCTION D ATA S HEET
FUNCTIONAL DESCRIPTION
FILTERLESS 3-LEVEL CLASS-D MODULATION
The LX1701 output stage is configured as a full H-bridge
push-pull driver. The speaker must be driven differentially
from the OUTP and OUTN pins. Each side of the speaker
is driven by a 200KHz switching signal that transitions
between Vdd and GND. With zero input voltage, the duty
cycle at each output is around 50% and the signals are inphase with each other. In this case, there is basically no
differential voltage across the speaker.
When the input
signal goes positive, the duty cycle at OUTP increases
above 50% and the duty cycle at OUTN decreases below
50%. This causes a net positive current to flow into the
speaker. A negative input voltage causes the OUTN duty
cycle to increase and the OUTP duty cycle to decrease
which causes a net negative current to flow into the
speaker. The differential voltage across the speaker has a
fundamental frequency of twice the 200KHz switching
frequency. The speaker itself serves as the low pass filter
which then recreates the audio signal. This type of
modulation can be described as driving +Vdd, -Vdd, and
0V across the speaker which is why it is referred to as 3Level modulation.
Classical, 2-Level modulation drives either +Vdd or –Vdd
across the speaker at all times. This scheme requires an LC filter between the amplifier’s outputs and the speaker in
order to keep the output current low.
ACTIVE DC INPUT OFFSET CANCELLATION
An internal DC servo loop senses the output differential
voltage and feeds it back to the error amplifier through a
low pass filter. The corner frequency of this filter can be
set at 20Hz or 300Hz via a control pin. This allows the
LX1701 to reject signals below these frequencies. Since
this is an active control loop, it does not have the same
dynamic range as a purely passive solution (such as an
input AC-coupling capacitor). The dynamic range of the
offset cancellation loop is a function of the selected gain
and high pass corner frequency. In applications where the
input offset may be higher than the DC offset cancellation
range, AC-coupling capacitors should be used.
DIFFERENTIAL SIGNAL PATH, WIDE DYNAMIC RANGE,
AND BUILT-IN THERMAL OVERLOAD PROTECTION
The fully differential signal path uses delta-sigma
techniques and multiple feedback loops to provide high
performance and low distortion. This is all fully-integrated
to eliminate the need for any external feedback
components or filters. The gain can be selected to be either
8 or 14dB by a control pin. The differential signal path
and internal voltage boosters allow for wide dynamic
range. In fact, the LX1701 can be operated from supplies
as low as 1.8V and as high as 6V. The output power will
be limited by the available supply voltage. An internal
thermal sensing circuit shuts down the outputs and forces
the TOVL output pin high when the junction temperature
exceeds about 150degC to provide thermal overload
protection.
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove CA. 92841 714-898-8121, FAX 714-893-2570
Page 7
DESCRIPTION
Copyright © 2004
Rev. 1.0a, 2004-07-09
LOW-EMI OUTPUT STAGE WITH SLEW RATE LIMITING
AND ACTIVE OVERSHOOT CLAMPING
With 3-Level modulation, the carrier frequency drives a
full amplitude common-mode signal to the speaker wires.
This can cause high EMI radiation. One way to combat
this would be to filter the outputs with L-C filters or ferrite
beads located close to the amplifier. In the LX1701, the
output stage has been carefully designed to minimize EMI
radiation so that these types of filters are not required.
Slew rate limiting is used to keep the outputs from
switching too quickly. Active overshoot clamping is used
to minimize the inductive overshoot which occurs at each
transition. These two techniques allow the LX1701 to
easily meet FCC standards for radiated emissions when
driving up to 3 meters of speaker wire.
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GENERAL DESCRIPTION
The LX1701 is a filterless, low-EMI, class-D audio
power amplifier. It offers high performance (THD+N is
just 0.1% at 2W), high efficiency (>85% at 1.2W), and best
in class EMI radiation (just 20dBuV/m). The internal
signal path is completely differential to minimize commonmode noise pickup. The inputs may be driven single-ended
or differentially and they may be direct or AC coupled. The
LX1701 may be operated with just a single decoupling
capacitor.
LX1701
®
TM
2W Filterless Mono Class-D Audio Amplifier
P RODUCTION D ATA S HEET
EVALUATION MODULE TEST SET-UP
WWW . Microsemi .C OM
Power Supply
+
-
VBAT
Audio
Precision
System
One
GND
C1
IN -
Order
RC LPF
C2
TP+
Output -
On-Board
Resistor
Load
LX1701
Output +
Audio
Precision
System
One
2nd
C3
OUT TP -
IN +
LX1701 Eval Kit
INPUT +
OUT+
GND
INPUT -
2nd Order
RC LPF
Figure 3 – Typical Test Setup Circuit
Default Settings:
Equipments: Audio Precision SYSTEM 1,
Oscilloscope,
Power Supply ~+5V;
Supply Voltage: 1.8V/3.3V/5.0V 3 corner voltages
On-Board passive LPF: 40KHz cut off frequency (-3dB)
On-Board resistor load: 2/4/8 Ω, 5W
AP settings: 10Hz ~ 22KHz BPF
EVALUATION
Copyright © 2004
Rev. 1.0a, 2004-07-09
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove CA. 92841 714-898-8121, FAX 714-893-2570
Page 8
LX1701
®
TM
2W Filterless Mono Class-D Audio Amplifier
P RODUCTION D ATA S HEET
APPLICATION INFORMATION
R2
470
JP3
11
C9
LX1701
VINP
12
TOVL
2
JP4
Option
PVDD
PVDD
OUTN
VDD
J2
1
Thermal
Indicator
VINN
For Test Purpose
13
14
15
4
3
2
VBAT
GND
2
R1
4/2W
1
C7
470nF
J4
JP5
16
R4
470
VBAT
J3
1
VBAT
C6
470nF
PVSS
2
10
C3
2200pF
5
OUTP
VSS
Audio
In
GAIN
3LEL
1
9
6
PVSS
C8
7
VSS
J1
8
EN
JP1
TP1
C2
4700pF
JP2
BW_SEL
VBAT
R3
470
WWW . Microsemi .C OM
VBAT
VBAT
R5
470
C4
4700pF
+
C1
TP2
C5
2200pF
For Test Purpose
*C1 Value is dependant on the current drain from power supply, 1.0 ~ 33µF with output power 350mW ~ 3.5W
Figure 4 – LXE1701 Evaluation Module Schematic
APPLICATIONS
Copyright © 2004
Rev. 1.0a, 2004-07-09
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove CA. 92841 714-898-8121, FAX 714-893-2570
Page 9
LX1701
®
TM
2W Filterless Mono Class-D Audio Amplifier
P RODUCTION D ATA S HEET
THD+N vs. Power
WWW . Microsemi .C OM
THD+N vs. Power
100
8 OHM,f=1KHz,
10~22KHz BPF
14dB, BW - 20Hz
10
100
50
10
VDD=3.3V
VDD=1.8V
1
8 OHM,f=1KHz,
10~22KHz BPF
14dB, BW - 300Hz
VDD=3.3V
VDD=1.8V
1
%
%
0.1
0.1
VDD=5.0V
VDD=5.0V
0.01
0.01
0.001
10m
20m
50m
100m
200m
500m
1
2
0.001
10m
W
20m
50m
100m
200m
500m
1
2
W
THD+N vs. Power
THD+N vs. Power
100
100
8OHM,f=1KHz,
10~22KHz BPF
8dB, BW - 20Hz
50
10
50
10
VDD=1.8V
1
VDD=3.3V
T
8 OHM,f=1KHz,
10~22KHz BPF
8dB, BW - 300Hz
%
VDD=3.3V
VDD=1.8V
1
%
0.1
0.1
VDD=5.0V
VDD=5.0V
0.01
0.01
0.001
10m
20m
50m
100m
200m
500m
1
0.001
10m
2
20m
50m
100m
200m
500m
1
2
W
THD+N vs. Power
THD+N vs. Power
100
50
10
100
50
4 OHM,f=1KHz,
10~22KHz BPF
14dB, BW - 20Hz
VDD=3.3V
10
VDD=1.8V
1
4 OHM,f=1KHz,
10~22KHz BPF
14dB, BW - 300Hz
VDD=3.3V
VDD=1.8V
1
0.1
0.1
VDD=5.0V
VDD=5.0V
0.01
0.001
10m
0.01
20m
50m
100m
200m
500m
1
2
0.001
10m
3
W
Copyright © 2004
Rev. 1.0a, 2004-07-09
CHARTS
%
%
20m
50m
100m
200m
500m
1
2
3
W
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove CA. 92841 714-898-8121, FAX 714-893-2570
Page 10
LX1701
®
TM
2W Filterless Mono Class-D Audio Amplifier
P RODUCTION D ATA S HEET
100
50
4 OHM,f=1KHz,
10~22KHz BPF
8dB, BW - 20Hz
10
VDD=3.3V
10
VDD=3.3V
VDD=1.8V
VDD=1.8V
1
4 OHM,f=1KHz,
10~22KHz BPF
8dB, BW - 300Hz
WWW . Microsemi .C OM
THD+N vs. Power
THD+N vs. Power
100
50
1
%
%
0.1
0.1
VDD=5.0V
VDD=5.0V
0.01
0.01
0.001
10m
20m
50m
100m
200m
500m
1
2
0.001
10m
3
20m
50m
100m
W
10
500m
1
2
3
THD+N vs. Power
THD+N vs. Power
100
50
200m
W
100
50
2 OHM,f=1KHz,
10~22KHz BPF
14dB, BW - 20Hz
10
VDD=3.3V
VDD=1.8V
2 OHM,f=1KHz,
10~22KHz BPF
14dB, BW - 300Hz
VDD=3.3V
VDD=1.8V
1
1
%
%
0.1
0.1
VDD=5.0V
VDD=5.0V
0.01
0.01
0.001
10m
0.001
10m
20m
50m
100m
200m
500m
1
2
20m
50m
100m
4
THD+N vs. Power
1
2
4
THD+N vs. Power
100
50
10
500m
W
W
100
50
200m
2OHM,f=1KHz,
10~22KHz BPF
8dB, BW - 20Hz
10
VDD=3.3V
T
1
VDD=3.3V
VDD=1.8V
1
VDD=1.8V
T
2 OHM,f=1KHz,
10~22KHz BPF
8dB, BW - 300Hz
%
CHARTS
0.1
%
VDD=5.0V
0.1
VDD=5.0V
0.01
0.01
0.001
10m
0.001
10m
20m
50m
100m
200m
500m
1
2
4
20m
50m
100m
200m
500m
1
2
4
W
W
Copyright © 2004
Rev. 1.0a, 2004-07-09
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove CA. 92841 714-898-8121, FAX 714-893-2570
Page 11
LX1701
®
TM
2W Filterless Mono Class-D Audio Amplifier
P RODUCTION D ATA S HEET
THD+N vs. Frequency
THD+N vs. Frequency
100
100
4OHM,Po=50%Pmax,
10~22KHz BPF
4OHM,Po=100mW,
10
10~22KHz BPF
10
VDD=1.8V
1
%
WWW . Microsemi .C OM
LX1701 2W mono Class-D Audio Amplifier
LX1701 2W mono Class-D Audio Amplifier
VDD=1.8V
1
VDD=5.0V
%
VDD=3.3V
0.1
0.1
VDD=5.0V
VDD=3.3V
0.01
0.01
0.001
0.001
100
200
500
1k
2k
5k
10k
100
20k
200
500
1k
2k
5k
10k
20k
Hz
Hz
LX1701 2W mono Class-D Audio Amplifier
LX1701 2W mono Class-D Audio Amplifier
THD+N vs. Frequency
8OHM,Po=100mW,
20Hz Corner Frequency
8OHM,Po=100mW,
10~22KHz BPF
+3
10
+1
VDD=1.8V
1
Frequency Response
+5
100
VDD=1.8V/3.3V/5.0V
dBr
%
VDD=5.0V
-1
0.1
VDD=3.3V
-3
0.01
0.001
100
200
500
1k
2k
5k
10k
-5
20
20k
100
500
1k
50k 80k
LX1701 2W mono Class-D Audio Amplifier
Frequency Response
LX1701 2W mono Class-D Audio Amplifier
Frequency Response
+5
5k 10k
Hz
Hz
+5
8OHM,Po=100mW,
300Hz Corner Frequency
4OHM,Po=100mW,
20Hz Corner Frequency
+3
+3
VDD=1.8V/3.3V/5.0V
+1
VDD=1.8V/3.3V/5.0V
+1
CHARTS
dBr
dBr
-1
-1
-3
-3
-5
20
50 100
500 1k
5k 10k
50k 80k
Hz
Copyright © 2004
Rev. 1.0a, 2004-07-09
-5
20
50 100
500 1k
5k 10k
50k 80k
Hz
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove CA. 92841 714-898-8121, FAX 714-893-2570
Page 12
LX1701
®
TM
2W Filterless Mono Class-D Audio Amplifier
P RODUCTION D ATA S HEET
LX1701 2W mono Class-D Audio Amplifier
System Gain
+12
+5
4OHM,Po=100mW,
300Hz Corner Frequency
WWW . Microsemi .C OM
LX1701 2W mono Class-D Audio Amplifier
Frequency Response
4OHM,Po=100mW,
8dB GAIN Setting
+10
VDD=1.8V/3.3V/5.0V
20Hz Corner Freq.
+3
+8
VDD=1.8V/3.3V/5.0V
+1
dBr
+6
dBr
-1
VDD=1.8V/3.3V/5.0V
300Hz Corner Freq.
+4
-3
+2
0
-520
50 100
500 1k
5k 10k
50k 80k
20
50
100
200
500
LX1701 2W mono Class-D Audio Amplifier
System Gain
+12
2k
5k
10k 20k
+10
LX1701 2W mono Class-D Audio Amplifier
System Gain
+12
8OHM,Po=100mW,
8dB GAIN Setting
8OHM,Po=100mW,
8dB GAIN Setting
+10
VDD=1.8V/3.3V/5.0V
20Hz Corner Freq.
+8
1k
Hz
Hz
VDD=1.8V/3.3V/5.0V
20Hz Corner Freq.
+8
dBr
dBr
+6
+6
VDD=1.8V/3.3V/5.0V
300Hz Corner Freq.
+4
+2
0
VDD=1.8V/3.3V/5.0V
300Hz Corner Freq.
+4
+2
20
50 100
500
1k
0
5k 10k 20k
20
50 100
500
LX1701 2W mono Class-D Audio Amplifier
System Gain
+20
+18
+16
8OHM,Po=100mW,
14dB GAIN Setting
+18
+16
+14
VDD=1.8V/3.3V/5.0V
20Hz Corner Freq.
+14
+12
dBr
dBr +10
+12
+10
VDD=1.8V/3.3V/5.0V
300Hz Corner Freq.
+8
+6
+6
+4
+4
+2
+2
0
0
20
50
100
200
500
1k
2k
5k
10k 20k
20
50
100
500 1k
Hz
5k
CHARTS
VDD=1.8V/3.3V/5.0V
300Hz Corner Freq.
+8
5k 10k 20k
LX1701 2W mono Class-D Audio Amplifier
System Gain
+20
4OHM,Po=100mW,
14dB GAIN Setting
VDD=1.8V/3.3V/5.0V
20Hz Corner Freq.
1k
Hz
Hz
10k 20k
Hz
Copyright © 2004
Rev. 1.0a, 2004-07-09
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove CA. 92841 714-898-8121, FAX 714-893-2570
Page 13
LX1701
®
TM
2W Filterless Mono Class-D Audio Amplifier
P RODUCTION D ATA S HEET
LX1701 2W mono Class-D Audio Amplifier
SIgnal-to-Noise Ratio
WWW . Microsemi .C OM
LX1701 2W mono Class-D Audio Amplifier
SIgnal-to-Noise Ratio
+0
+0
-20 4OHM,10~22KHz BPF
1.8V / 3.3V / 5.0V
-20
8OHM,10~22KHz BPF
1.8V / 3.3V / 5.0V
-40
-40
-60
-60
-80
-100
dBr
dBr
-120
-80
-100
-140
-120
-160
-140
-180
20
50
100
200
500
1k
2k
5k
10k
20k
20
50
100
200
500
1k
2k
5k
10k
20k
Hz
Hz
LXE1701 3 Feet Speaker Wire.
Test DIstance: 3 Meters; Horizential
Date: 1/16/2004 Time: 1:08:40PM
CKC Laboratories
LXE1701 3 Feet Speaker Wire.
Test DIstance: 3 Meters; Vertical
Date: 1/16/2004 Time: 1:22:07PM
CKC Laboratories
50
50
40
40
dBµ V/m
dBµ V/m
30
20
30
20
10
10
0
-10
30
100
1000
-10
30
100
1000
Frequency (MHz)
Frequency (MHz)
1 - CISPR 22 B Radiated
1 - CISPR 22 B Radiated
CHARTS
Copyright © 2004
Rev. 1.0a, 2004-07-09
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove CA. 92841 714-898-8121, FAX 714-893-2570
Page 14
LX1701
®
TM
2W Filterless Mono Class-D Audio Amplifier
P RODUCTION D ATA S HEET
Power Efficiency (8 Ohm)
PVDD=VDD=4.0V +/-1V,
8OHM Load
-45
100%
-50
90%
-55
80%
Efficiency (%)
dBr
--60
63.25
5-65
-70
-75
-80
-85
-90
70%
60%
50%
40%
30%
20%
-95
-100
WWW . Microsemi .C OM
LX1701 Power Supply Rejection Ratio
-40
10%
10
20
50 100 200
500 1k
2k
5k 10k 20k
3.0V
4.5V
5.5V
0%
80k
0
Hz
200
400
600
800
1000
1200
1400
POUT (mW)
IQQ Vs. Supply Voltage
1.8
IQQ (mA)
1.6
1.4
1.2
1.0
0.8
8ohm spk
0.6
1.5
2.0
2.5
3.0
3.5
4.0
Voltage (V)
4.5
5.0
5.5
6.0
CHARTS
Copyright © 2004
Rev. 1.0a, 2004-07-09
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove CA. 92841 714-898-8121, FAX 714-893-2570
Page 15
LX1701
®
TM
2W Filterless Mono Class-D Audio Amplifier
P RODUCTION D ATA S HEET
PCB DESIGN GUIDELINES
DESIGN OF PCB LAND PATTERN FOR PACKAGE
TERMINALS
As a general rule, the PCB lead finger pad (Y) should be
designed 0.2-0.5mm longer than the package terminal
length for good filleting. The pad length should extended
0.05mm towards the centerline of the package. The pad
width (X) should be a minimum 0.05mm wider than the
package terminal width (0.025mm per side), refer to figure
5. However, the pad width is reduced to the width of the
component terminal for lead pitches below 0.65mm. This is
done to minimize the risk of solder bridging.
EXPOSED PAD PCB DESIGN
The construction of the Exposed Pad MLP enables
enhanced thermal and electrical characteristics. In order to
take full advantage of this feature the exposed pad must be
physically connected to the PCB substrate with solder.
The thermal pad (D2th) should be greater than D2 of the
MLP whenever possible, however adequate clearance (Cpl
> 0.15mm) must be met to prevent solder bridging. If this
clearance cannot be met, then D2th should be reduced in
area. The formula would be: D2TH >D2 only if D2TH <
Gmin - (2 x Cpl).
WWW . Microsemi .C OM
PCB DESIGN GUIDELINES
One of the key efforts in implementing the MLP package
on a pc board is the design of the land pattern. The MLP
has rectangular metallized terminals exposed on the bottom
surface of the package body. Electrical and mechanical
connection between the component and the pc board is
made by screen printing solder paste on the pc board and
reflowing the paste after placement. To guarantee reliable
solder joints it is essential to design the land pattern to the
MLP terminal pattern, exposed PAD and Thermal PAD via.
There are two basic designs for PCB land pads for the
MLP: Copper Defined style (also known as Non Solder
Mask Defined (NSMD)) and the Solder Mask Defined style
(SMD). The industry has had some debate of the merits of
both styles of land pads, and although we recommend the
Copper Defined style land pad (NSMD), both styles are
acceptable for use with the MLP package. NSMD pads are
recommended over SMD pads due to the tighter tolerance
on copper etching than solder masking. NSDM by
definition also provides a larger copper pad area and allows
the solder to anchor to the edges of the copper pads thus
providing improved solder joint reliability.
Zmin
4.55mm
D2th
2.5mm Max
Gmin
2.9mm
Figure 6 – Land Pattern for LQ16 (4x4mm)
Zmin= D + aaa + 2(0.2)
(where pkg body tolerance aaa=0.15)
(where 0.2 is outer pad extension)
Gmin= D-2(Lmax)-2(0.05)
(where 0.05 is inner pad extension)
(Lmax=0.50 for this example)
D2th max = Gmin-2(CpL)
(where CpL=0.2)
Part
Part Lead
Solder
PCB Pad
PCB
0.20mm
Y1
APPLICATIONS
0.05mm
Y2
(X1) Min: 0.025mm
Per side for lead
pitches > 0.65mm
Figure 5 – PC Board Land Pattern Geometry for MLP Terminals
Copyright © 2004
Rev. 1.0a, 2004-07-09
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove CA. 92841 714-898-8121, FAX 714-893-2570
Page 16
LX1701
®
TM
2W Filterless Mono Class-D Audio Amplifier
P RODUCTION D ATA S HEET
PCB DESIGN GUIDELINES (CONTINUED)
For LX1701 with MLPQ-4x4 16Lds p ackage, which has
θjA =38.1°C/W by package itself, with maximum 2W
(@4ohm) output it only has 300mW power dispassion
(assuming 85% efficiency), which only has 11.4°C
temperature rise. So the non-via type thermal PAD is
suggested.
1 - 1.2mm
0.05mm minimum
0.5mm
0.15mm
minimum gap
WWW . Microsemi .C OM
THERMAL PAD VIA DESIGN
There are two types of on-board thermal PAD design, one
is using thermal vias to sink the heat to the other layer with
metal traces. Based on Jedec Specification JESD 51-5, the
thermal vias should be designed like Figure 7. Another one
is the no via thermal PAD which is using the same side
copper PAD as heatsink, this type of thermal PAD is good
for two layer board, since the bottom side is filled with all
other kinds of trace also, it’s hard to use the whole plane for
the heatsink. But you still can use vias to sink the heat to
the bottom layer by the metal traces, then layout a NMSD
on which a metal heatsink is put to sink the heat to the
air.
0.15mm minimum
2.50mm
Maximum
0.37mm Nominal
Package Pad
PCB Land
Thermal Via
0.3mm Dia.
0.28mm
Pin 1 Indicator
(bottom of Package)
Top View
Figure 8 – Recommended Land Pad with Vias for LQ16
Micro Lead Quad
Package Land Pattern
Land Pattern for Four
Layer Board with Vias
Figure 7 – Comparison of land pattern theory
APPLICATIONS
Copyright © 2004
Rev. 1.0a, 2004-07-09
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove CA. 92841 714-898-8121, FAX 714-893-2570
Page 17
LX1701
TM
®
2W Filterless Mono Class-D Audio Amplifier
P RODUCTION D ATA S HEET
APPLICATION INFORMATION
WWW . Microsemi .C OM
Figure 9 – LXE1701 Evaluation Module PCB Layout
6mm
4mm
APPLICATIONS
Figure 10 – LX1701 real PCB area with decoupling capacitor
Copyright © 2004
Rev. 1.0a, 2004-07-09
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove CA. 92841 714-898-8121, FAX 714-893-2570
Page 18
LX1701
®
TM
2W Filterless Mono Class-D Audio Amplifier
P RODUCTION D ATA S HEET
PACKAGE DIMENSIONS
WWW . Microsemi .C OM
LQ
16-Pin MLPQ Plastic (4x4mm EP / 114x114Cu Exposed Pad)
D
b
E2
L
D2
E
e
A
A1
K
A3
Dim
INCHES
MIN
MAX
0.031 0.039
0
0.002
0.008 REF
0.009 0.015
0.157 BSC
0.157 BSC
0.026 BSC
0.100 0.110
0.100 0.110
0.008
0.012 0.020
MECHANICALS
A
A1
A3
b
D
E
e
D2
E2
K
L
MILLIMETERS
MIN
MAX
0.80
1.00
0
0.05
0.2 REF
0.23
0.38
4.00 BSC
4.00 BSC
0.65 BSC
2.55
2.80
2.55
2.80
0.20
0.30
0.50
Note:
1. Dimensions do not include mold flash or protrusions;
these shall not exceed 0.155mm(.006”) on any side. Lead
dimension shall not include solder coverage.
Copyright © 2004
Rev. 1.0a, 2004-07-09
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove CA. 92841 714-898-8121, FAX 714-893-2570
Page 19
LX1701
TM
®
2W Filterless Mono Class-D Audio Amplifier
P RODUCTION D ATA S HEET
NOTES
WWW . Microsemi .C OM
NOTES
PRODUCTION DATA – Information contained in this document is proprietary to Microsemi and is
current as of publication date. This document may not be modified in any way without the express
written consent of Microsemi. Product processing does not necessarily include testing of all
parameters. Microsemi reserves the right to change the configuration and performance of the
product and to discontinue product at any time.
Copyright © 2004
Rev. 1.0a, 2004-07-09
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove CA. 92841 714-898-8121, FAX 714-893-2570
Page 20