TI UCC5950

UCC5950
10-Bit Serial D/A Converter
FEATURES
DESCRIPTION
•
10 Bit Resolution
•
1.1µs Output Rise Time
•
2.5µs Settling Time to 1%
•
Single +5V Supply
The UCC5950 is a self-contained, microprocessor-compatible 10-bit D/A converter. It contains all of the functions required to take data directly from a threewire serial data bus and convert it to a precise voltage, including: an input shift
register, data latches, a precision voltage reference, a precision 10-bit digital to
analog converter, and an output buffer amplifier.
•
Monotonic
•
Low Power Sleep Mode
•
Three-wire Serial Interface
•
20MHz Data Rate
•
8 Pin SOIC and DIL Package
The serial data interface is capable of clock frequencies as high as 20MHz, allowing update rates as high as two words per microsecond. The UCC5950 accepts commands encoded as 2’s-complement binary.
The data converter in the UCC5950 is inherently monotonic, making this part
ideal for use in closed-loop servo control systems as well as open-loop data
conversion. The UCC5950 uses a unique segmented data converter which offers differential linearity better than 1 LSB, integral linearity better than 2 LSB,
and fast conversion.
BLOCK DIAGRAM
UDG-95034
2/95
UCC5950
ABSOLUTE MAXIMUM RATINGS
CONNECTION DIAGRAM
VDD Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.5V
Input Voltage, Any Input . . . . . . . . . . . . . . . . –0.3V to VDD+0.3V
Output Current, Any Output . . . . . . . . . . . . . . . . . . . . . . . . ±5mA
Operating Temperature . . . . . . . . . . . . . . . . . . −55°C to +150°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . −65°C to +150°C
Lead Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
All voltages with respect to GND. All currents are positive into,
negative out of, the specified terminal. Consult Packaging Section of Databook for thermal limitations and considerations of
packages.
DIL-8, SOIC-8 (Top View)
N or J, D Package
ELECTRICAL CHARACTERISTICS Unless otherwise stated, all specifications apply for 4.5V < VDD < 5.5V, REFOUT
Load < 100pF, DACOUT Load < 100pF, 0°C < TA < +70°C, and TA = TJ.
PARAMETER
TEST CONDITIONS
MIN.
TYP.
MAX.
UNITS
OVERALL SECTION
Supply Current
SLEEP = 0V
1.5
5
mA
Supply Current
SLEEP = 5V
0.1
10
µA
2.15
2.20
V
REFERENCE SECTION
REFOUT Output Voltage
2.10
REFOUT Change with VDD
4.5V < VDD < 5.5V
1
10
mV
REFOUT Change with Load
–1mA < IREFOUT < 1mA
1
10
mV
2
LSB
D/A SECTION
Integral Nonlinearity
(Note 1)
Differential Nonlinearity
Full Scale Difference from 1.4924 x REF
–8
Zero Scale Difference from 0.5089 x REF
–8
1
LSB
8
LSB
8
LSB
DACOUT Full Scale Rise/Fall Time
From 10% to 90% of swing (Note 4)
0.7
1.1
µs
DACOUT Full Scale Settling Time (TS)
(Note 2, 3, 4)
1.4
2.5
µs
DACOUT Change with VDD
4.5V < VDD < 5.5V
1.5
10
mV
DACOUT Change with Load
–1mA < IDACOUT < 1mA
1.2
10
mV
2.5
3.5
V
5
µA
10
pF
LOGIC SECTION
Logic Input Threshold
1.5
Logic Input Current
0V < VIN < VDD
Logic Input Capacitance
(Note 4)
SLOD Setup Time to SCLK low (TSLS)
(Note 4)
2.7
50
TH
ns
SLOD Hold Time from SCLK high (TSLH)
From 10
50
ns
SDIO Setup Time to SCLK high (TDS)
(Note 4)
15
ns
SDIO Hold Time from SCLK high (TDH)
(Note 4)
7
ns
SCLK high (Note 4)
Note 1: Integral nonlinearity is defined as the worst deviation of the converter output from the best-fit straight line through
all converter output codes.
Note 2: From 10TH Rising Edge of SCLK.
Note 3: Settling time is to 1% of final value.
Note 4: Guaranteed by design. Not 100% tested in production.
2
UCC5950
TYPICAL CHARACTERISTICS
REFOUT vs Temperature
Supply Current vs Temperature
DACOUT Rising Full Scale Step Response
DACOUT Falling Full Scale Step Response
Logic Input Threshold vs Temperature
DACOUT Change with DACOUT Load Current
3
UCC5950
PIN DESCRIPTIONS
SCLK: Data is clocked into the D/A after SLOD goes low
on rising edges of SCLK. After 10 rising edges of SCLK,
the data is latched into the D/A output register and the
output is updated. Further clock signals on SCLK are ignored until SLOD initiates a new read cycle.
DACOUT: The output of the 10-bit D/A Converter. For
best settling time, minimize load capacitance.
DACOUT will go to a voltage between 1.094V and
3.208V depending on the digital code loaded into the
latches. The digital code follows this pattern:
Input Code
1000000000
1000000001
1000000010
...
1111111111
0000000000
0000000001
...
0111111110
0111111111
Typical DACOUT
1.094V
1.096V
1.098V
SDIO: After SLOD goes low, data is clocked into the D/A
from the SDIO input, on rising edges of SCLK, LSB first.
After 10 rising edges, data is latched and converted, and
further SCLK and SDIO information is ignored.
Significance
Zero Scale
SLEEP: SLEEP is the power-down input to the D/A. In
systems not requiring this function, wire SLEEP to GND.
2.151V
2.153V
2.155V
Mid Scale
3.206V
3.208V
SLOD: SLOD is the chip-select input to the UCC5950.
SLOD going low selects the D/A and enables clocking of
data from SDIO into the D/A. After 10 SCLK pulses, the
D/A is updated and SLOD is ignored until SLOD goes
high and again goes low.
Full Scale
GND: All signals are referenced to GND.
VDD: All analog and digital functions are powered from
VDD. VDD should be a well-regulated supply to minimize
output variations. Bypass VDD to GND with a ceramic
capacitor very close to the UCC5950.
REFOUT: The output of the temperature-compensated
2.15V reference. DO NOT BYPASS REFOUT! For best
stability and transient response, minimize capacitance on
REFOUT.
SERIAL DATA INTERFACE TIMING AND LOGIC TABLE
UDG-95035
SLOD
Internal Flag
SCLK
SDIO
1
0
1
don’t care
don’t care
0
rising edge
DATA
0
0
rising edge
DATA
0
1
don’t care
don’t care
Internal Count
UNITRODE INTEGRATED CIRCUITS
7 CONTINENTAL BLVD. • MERRIMACK, NH 03054
TEL. (603) 424-2410 • FAX (603) 424-3460
4
Action
DACOUT
0
no action
V(t)
<10
Shift In DATA
V(t)
10
Latch New DATA
Set Internal Flag
Reset Count
V(t+1)
0
no action
V(t)
IMPORTANT NOTICE
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright  1999, Texas Instruments Incorporated