LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only BAR DIGIT LED DISPLAY Pb Lead-Free Parts LBD336C-XXB DATA SHEET DOC. NO : QW0905- LBD336C-XXB REV. : A DATE : 05 - Dec. - 2008 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LBD336C-XXB Page 1/9 Package Dimensions 33.0(1.30") 11.0 (0.43") 11.0 (0.43") Y R G Y 7.62 (0.3") R LBD336C -XXB LIGITEK 6.4 (0.25") 4.0±0.5 Ø0.45 TYP 2.54*6=15.24(0.6") PIN NO. 1 Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm(0.01") unless otherwise noted. 2.Specifications are subject to change without notice. .3.Film:temperature-resistant≦100° C. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/9 PART NO.LBD336C-XXB Internal Circuit Diagram LBD336C-XXB 8 a b c d A B C D E F G DP 1 14 2 4 9 10 3 5 12 13 11 7 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/9 PART NO.LBD336C-XXB Electrical Connection PIN NO. LBD336C-XXB 1. Cathode a 2. Cathode c 3. Cathode C 4. Cathode d 5. Cathode D 6. NC 7. Cathode DP 8. Common Anode 9. Cathode A 10. Cathode B 11. Cathode G 12. Cathode E 13. Cathode F 14. Cathode b LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/9 PART NO. LBD336C -XXB Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT Red Green Yellow Forward Current Per Chip IF 15 15 15 mA Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) IFP 70 80 50 mA Power Dissipation Per Chip PD 50 50 50 mW Ir 10 μA Operating Temperature Topr -25 ~ +85 ℃ Storage Temperature Tstg -25 ~ +85 ℃ Reverse Current Per Any Chip Part Selection And Application Information(Ratings at 25℃) CHIP PART NO Material LBD336C-XXB common cathode or anode Emitted GaAlAs Red GaP Green GaAsP/GaP Yellow Common Anode Electrical λP (nm) △λ Vf(v) (nm) Iv(mcd) Min. Typ. Min. Typ 660 20 1.5 2.1 565 30 1.7 2.1 --- --- 585 35 1.7 2.1 --- --- Note : 1.The forward voltage data did not including ± 0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. IV-M 1.75 3.05 2:1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LBD336C-XXB Page 5/9 Test Condition For Each Parameter Symbol Unit Test Condition Forward Voltage Per Chip Vf volt If=10mA Luminous Intensity Per Chip Iv mcd If=10mA Peak Wavelength λP nm If=20mA △λ nm If=20mA Ir μA Vr=5V Parameter Spectral Line Half-Width Reverse Current Any Chip Luminous Intensity Matching Ratio IV-M LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page6/9 PART NO. LBD336C-XXB Typical Electro-Optical Characteristics Curve SR CHIP Fig.2 Relative Intensity vs. Forward Current Fig.1 Forward current vs. Forward Voltage 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 2.5 2.0 1.5 1.0 0.5 0.0 0.1 1.0 2.0 3.0 1.0 5.0 4.0 10 1.2 1.1 1.0 0.9 0.8 0 20 40 60 80 100 Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 600 650 700 Wavelength (nm) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 Ambient Temperature( ℃) Ambient Temperature( ℃) Relative Intensity@20mA Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Fig.3 Forward Voltage vs. Temperature -20 1000 Forward Current(mA) Forward Voltage(V) -40 100 750 80 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LBD336C-XXB Page 7/9 Typical Electro-Optical Characteristics Curve G CHIP Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA Forward Current(mA) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Voltage(V) Ambient Temperature( ℃) Ambient Temperature( ℃) Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Fig.3 Forward Voltage vs. Temperature 1.0 0.5 0.0 500 550 600 Wavelength (nm) 650 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 8/9 PART NO. LBD336C-XXB Typical Electro-Optical Characteristics Curve Y CHIP Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA Forward Current(mA) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Voltage(V) Ambient Temperature( ℃) Ambient Temperature( ℃) Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Fig.3 Forward Voltage vs. Temperature 1.0 0.5 0.0 500 550 600 650 Wavelength (nm) 700 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 9/9 PART NO. LBD336C-XXB Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ℃±5℃ &-40 ℃±5 ℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11