LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DUAL DIGIT LED DISPLAY (0.40 lnch) LDD405/65-XX/RP20 DATA SHEET DOC. NO : QW0905-LDD405/65-XX/RP20 REV. : A DATE : 09 - Feb. - 2006 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDD405/65-XX/RP20 Page 1/7 Package Dimensions 6.9 (0.272") 20.2 (0.795") DIG.1 DIG.2 10.16 (0.40") LDD405/65-XX/RP20 LIGITEK 12.6 (0.496") 16.0 (0.630") ψ1.3(0.051") A F Ø 0.51 TYP. DIG.2 C E 20±0.5 B D DP 2.45X7= 17.15(0.675") PIN NO.1 Note : 1.All dimension are in millimeters and (lnch) tolerance is ± 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/7 PART NO. LDD405/65-XX/RP20 Internal Circuit Diagram LDD4055-XX/RP20 4 DIG.1 5 DIG.2 A B C D E F G 15 13 1 3 2 14 16 A B C D E F G 10 12 8 6 7 11 9 LDD4065-XX/RP20 4 DIG.1 A B C D E F G 15 13 1 3 2 14 16 5 DIG.2 A B C D E F G 10 12 8 6 7 11 9 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/7 PART NO. LDD405/65-XX/RP20 Electrical Connection PIN NO. LDD4055-XX/RP20 PIN NO. LDD4065-XX/RP20 1 Anode C Dig.1 1 Cathode C Dig.1 2 Anode E Dig.1 2 Cathode E Dig.1 3 Anode D Dig.1 3 Cathode D Dig.1 4 Common Cathode Dig.1 4 Common Anode Dig.1 5 Common Cathode Dig.2 5 Common Anode Dig.2 6 Anode D Dig.2 6 Cathode D Dig.2 7 Anode E Dig.2 7 Cathode E Dig.2 8 Anode C Dig.2 8 Cathode C Dig.2 9 Anode G Dig.2 9 Cathode G Dig.2 10 Anode A Dig.2 10 Cathode A Dig.2 11 Anode F Dig.2 11 Cathode F Dig.2 12 Anode B Dig.2 12 Cathode B Dig.2 13 Anode B Dig.1 13 Cathode B Dig.1 14 Anode F Dig.1 14 Cathode F Dig.1 15 Anode A Dig.1 15 Cathode A Dig.1 16 Anode G Dig.1 16 Cathode G Dig.1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDD405/65-XX/RP20 Page 4/7 Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT SR Forward Current Per Chip IF 30 mA Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) IFP 100 mA Power Dissipation Per Chip PD 100 mW Ir 10 μA Operating Temperature Topr -25 ~ +85 ℃ Storage Temperature Tstg -25 ~ +85 ℃ Reverse Current Per Any Chip Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃ Part Selection And Application Information(Ratings at 25℃) common cathode or anode Material Emitted CHIP PART NO λP (nm) △λ Vf(v) (nm) Iv(mcd) IV-M Min. Typ. Max. Min. Typ. Common Cathode LDD4055-XX/RP20 GaAlAs LDD4065-XX/RP20 Electrical Red 660 20 1.5 1.8 Common Anode Note : 1.The forward voltage data did not including ± 0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. 2.4 3.05 5.0 2:1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/7 PART NO. LDD405/65-XX/RP20 Test Condition For Each Parameter Symbol Unit Test Condition Forward Voltage Per Chip Vf volt If=20mA Luminous Intensity Per Chip Iv mcd If=10mA Peak Wavelength λP nm If=20mA △λ nm If=20mA Ir μA Vr=5V Parameter Spectral Line Half-Width Reverse Current Any Chip Luminous Intensity Matching Ratio IV-M LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 6/7 PART NO. LDD405/65-XX/RP20 Typical Electro-Optical Characteristics Curve SR CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 2.5 2.0 1.5 1.0 0.5 0.0 0.1 2.0 1.0 3.0 4.0 1.0 5.0 10 1.2 1.1 1.0 0.9 0.8 0 20 40 60 80 100 Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 600 650 700 Wavelength (nm) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 Ambient Temperature( ℃) Ambient Temperature( ℃) Relative Intensity@20mA Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Fig.3 Forward Voltage vs. Temperature -20 1000 Forward Current(mA) Forward Voltage(V) -40 100 750 80 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDD405/65-XX/RP20 Page 7/7 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ℃±5℃ &-40 ℃±5 ℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11