LIGITEK LFD3J5-61-XX-PF

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
FOUR DIGIT LED DISPLAY (0.33 Inch)
Pb
Lead-Free Parts
LFD3J5/61-XX-PF
DATA SHEET
DOC. NO
:
QW0905- LFD3J5/61-XX-PF
REV.
:
A
DATE
: 01 - Sep.- 2006
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LFD3J5/61-XX-PF
Page 1/8
Package Dimensions
7.0
(0.28")
30.0(1.18")
DIG.1
DIG.3
DIG.2
DIG.4
UC
AM
8.4
(0.33")
14.0
(0.55')
LC
10.16
(0.4")
PM
DP
ALM
LFD3J5/61-XX-PF
LIGITEK
A
F G
E
D
5.0±0.5
Ø 0.51
TYP
2.54*9=22.86(0.9")
PIN NO.1
Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
B
C
DP
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LFD3J5/61-XX-PF
Page 2/8
Internal Circuit Diagram
LFD3J51-XX-PF
1
20
AM
PM
B
C
14
13
4
3
18
15
11
16
5
A
B
C
D
E
F
G
UC
A
B
C
D
E
F
G
LC
A
B
C
D
E
F
G
8
10
DP
ALM
LFD3J61-XX-PF
1
19
20
B
C
DIG. 1
2
DIG. 2
17
AM
PM
14
13
4
3
18
15
11
16
DIG. 3
6
5
A
B
C
D
E
F
G
UC
A
B
C
D
E
F
G
LC
A
B
C
D
E
F
G
DIG. 4
12
7
8
9
10
DP
ALM
19
DIG. 1
2
DIG. 2
17
DIG. 3
6
DIG. 4
12
7
9
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LFD3J5/61-XX-PF
Page 3/8
Electrical Connection
PIN NO.1
LFD3J51-XX-PF
PIN NO.1
LFD3J61-XX-PF
1
Anode AM
1
Cathode AM
2
Common Cathode Dig.1
2
Common Anode Dig.1
3
Anode D
3
Cathode D
4
Anode C
4
Cathode C
5
Anode LC
5
Cathode LC
6
Common Cathode Dig.3
6
Common Anode Dig.3
7
Cathode DP
7
Anode DP
8
Anode DP
8
Cathode DP
9
Cathode ALM
9
Anode ALM
10
Anode ALM
10
Cathode ALM
11
Anode G
11
Cathode G
12
Common Cathode Dig.4
12
Common Anode Dig.4
13
Anode B
13
Cathode B
14
Anode A
14
Cathode A
15
Anode F
15
Cathode F
16
Anode UC
16
Cathode UC
17
Common Cathode Dig.2
17
Common Anode Dig.2
18
Anode E
18
Cathode E
19
Common Cathode AM,PM
19
Common Anode AM,PM
20
Anode PM
20
Cathode PM
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LFD3J5/61-XX-PF
Page 4/8
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
H
Forward Current Per Chip
IF
15
mA
Peak Forward Current Per
Chip (Duty 1/10,0.1ms
Pulse Width)
IFP
60
mA
Power Dissipation Per Chip
PD
40
mW
Ir
10
μA
Operating Temperature
Topr
-25 ~ +85
℃
Storage Temperature
Tstg
-25 ~ +85
℃
Reverse Current Per Any Chip
Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃
Part Selection And Application Information(Ratings at 25℃)
common
cathode
Material Emitted or anode
CHIP
PART NO
△λ
(nm)
(nm)
Vf(v)
Iv(mcd)
IV-M
Min. Typ. Max. Min. Typ.
Common
Cathode
LFD3J51-XX-PF
GaP
LFD3J61-XX-PF
Electrical
λP
697
Red
90
1.7
2.1
Common
Anode
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
2.6
0.2
0.35
2:1
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LFD3J5/61-XX-PF
Page 5/8
Test Condition For Each Parameter
Symbol
Unit
Test Condition
Forward Voltage Per Chip
Vf
volt
If=20mA
Luminous Intensity Per Chip
Iv
mcd
If=10mA
Peak Wavelength
λP
nm
If=20mA
△λ
nm
If=20mA
Ir
μA
Vr=5V
Parameter
Spectral Line Half-Width
Reverse Current Any Chip
Luminous Intensity Matching Ratio
IV-M
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 6/8
PART NO. LFD3J5/61-XX-PF
Typical Electro-Optical Characteristics Curve
H CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
0.1
2.5
2.0
1.5
1.0
0.5
0.0
1.0
2.0
3.0
4.0
5.0
1.0
10
Fig.4 Relative Intensity vs. Temperature
1.2
Relative Intensity@20mA
Normalize @25℃
Forward Voltage@20mA
Normalize @25℃
Fig.3 Forward Voltage vs. Temperature
1.1
1.0
0.9
0.8
-20
0
20
40
60
80
100
Relative Intensity@20mA
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
700
800
900
Wavelength (nm)
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
Ambient Temperature( ℃)
Ambient Temperature( ℃)
600
1000
Forward Current(mA)
Forward Voltage(V)
-40
100
1000
80
100
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LFD3J5/61-XX-PF
Page 7/8
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350°C Max
Soldering Time:3 Seconds Max(One Time)
Distance:Solder Temperature 1/16 Inch Below Seating
Plane For 3 Seconds At 260°C
2.Wave Soldering Profile
Dip Soldering
Preheat: 120°C Max
Preheat time: 60seconds Max
Ramp-up
2° C/sec(max)
Ramp-Down:-5° C/sec(max)
Solder Bath:260°C Max
Dipping Time:3 seconds Max
Distance:Solder Temperature 1/16 Inch Below Seating
Plane For 3 Seconds At 260°C
Temp(°C)
260° C3sec Max
260°
5° /sec
max
120°
25°
0° 0
2° /sec
max
Preheat
60 Seconds Max
50
100
150
Time(sec)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LFD3J5/61-XX-PF
Page 8/8
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=10mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5 ℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5 ℃
2.RH=90 %~95%
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hours.
1.Ta=105 ℃±5℃&-40 ℃±5℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5 ℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5 ℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11