LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only FOUR DIGIT LED DISPLAY (0.33 Inch) Pb Lead-Free Parts LFD3J5/61-XX-PF DATA SHEET DOC. NO : QW0905- LFD3J5/61-XX-PF REV. : A DATE : 01 - Sep.- 2006 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFD3J5/61-XX-PF Page 1/8 Package Dimensions 7.0 (0.28") 30.0(1.18") DIG.1 DIG.3 DIG.2 DIG.4 UC AM 8.4 (0.33") 14.0 (0.55') LC 10.16 (0.4") PM DP ALM LFD3J5/61-XX-PF LIGITEK A F G E D 5.0±0.5 Ø 0.51 TYP 2.54*9=22.86(0.9") PIN NO.1 Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. B C DP LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFD3J5/61-XX-PF Page 2/8 Internal Circuit Diagram LFD3J51-XX-PF 1 20 AM PM B C 14 13 4 3 18 15 11 16 5 A B C D E F G UC A B C D E F G LC A B C D E F G 8 10 DP ALM LFD3J61-XX-PF 1 19 20 B C DIG. 1 2 DIG. 2 17 AM PM 14 13 4 3 18 15 11 16 DIG. 3 6 5 A B C D E F G UC A B C D E F G LC A B C D E F G DIG. 4 12 7 8 9 10 DP ALM 19 DIG. 1 2 DIG. 2 17 DIG. 3 6 DIG. 4 12 7 9 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFD3J5/61-XX-PF Page 3/8 Electrical Connection PIN NO.1 LFD3J51-XX-PF PIN NO.1 LFD3J61-XX-PF 1 Anode AM 1 Cathode AM 2 Common Cathode Dig.1 2 Common Anode Dig.1 3 Anode D 3 Cathode D 4 Anode C 4 Cathode C 5 Anode LC 5 Cathode LC 6 Common Cathode Dig.3 6 Common Anode Dig.3 7 Cathode DP 7 Anode DP 8 Anode DP 8 Cathode DP 9 Cathode ALM 9 Anode ALM 10 Anode ALM 10 Cathode ALM 11 Anode G 11 Cathode G 12 Common Cathode Dig.4 12 Common Anode Dig.4 13 Anode B 13 Cathode B 14 Anode A 14 Cathode A 15 Anode F 15 Cathode F 16 Anode UC 16 Cathode UC 17 Common Cathode Dig.2 17 Common Anode Dig.2 18 Anode E 18 Cathode E 19 Common Cathode AM,PM 19 Common Anode AM,PM 20 Anode PM 20 Cathode PM LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFD3J5/61-XX-PF Page 4/8 Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT H Forward Current Per Chip IF 15 mA Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) IFP 60 mA Power Dissipation Per Chip PD 40 mW Ir 10 μA Operating Temperature Topr -25 ~ +85 ℃ Storage Temperature Tstg -25 ~ +85 ℃ Reverse Current Per Any Chip Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃ Part Selection And Application Information(Ratings at 25℃) common cathode Material Emitted or anode CHIP PART NO △λ (nm) (nm) Vf(v) Iv(mcd) IV-M Min. Typ. Max. Min. Typ. Common Cathode LFD3J51-XX-PF GaP LFD3J61-XX-PF Electrical λP 697 Red 90 1.7 2.1 Common Anode Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. 2.6 0.2 0.35 2:1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFD3J5/61-XX-PF Page 5/8 Test Condition For Each Parameter Symbol Unit Test Condition Forward Voltage Per Chip Vf volt If=20mA Luminous Intensity Per Chip Iv mcd If=10mA Peak Wavelength λP nm If=20mA △λ nm If=20mA Ir μA Vr=5V Parameter Spectral Line Half-Width Reverse Current Any Chip Luminous Intensity Matching Ratio IV-M LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 6/8 PART NO. LFD3J5/61-XX-PF Typical Electro-Optical Characteristics Curve H CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 0.1 2.5 2.0 1.5 1.0 0.5 0.0 1.0 2.0 3.0 4.0 5.0 1.0 10 Fig.4 Relative Intensity vs. Temperature 1.2 Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Fig.3 Forward Voltage vs. Temperature 1.1 1.0 0.9 0.8 -20 0 20 40 60 80 100 Relative Intensity@20mA Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 700 800 900 Wavelength (nm) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 Ambient Temperature( ℃) Ambient Temperature( ℃) 600 1000 Forward Current(mA) Forward Voltage(V) -40 100 1000 80 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFD3J5/61-XX-PF Page 7/8 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One Time) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2° C/sec(max) Ramp-Down:-5° C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C Temp(°C) 260° C3sec Max 260° 5° /sec max 120° 25° 0° 0 2° /sec max Preheat 60 Seconds Max 50 100 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFD3J5/61-XX-PF Page 8/8 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5 ℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5 ℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5 ℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11