LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only TRIPLE DIGIT LED DISPLAY (0.56 Inch) Pb Lead-Free Parts LTD521/25-XX-PF DATA SHEET DOC. NO REV. DATE : : QW0905- LTD521/25-XX-PF A : 12 - Mar.- 2006 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/9 PART NO. LTD521/25-XX-PF Package Dimensions 37.6 (1.481") DIG.1 DIG.2 14.2 (0.56") 8.1 (0.319") DIG.3 19.0 (0.748") 15.28 (0.602") ψ1.7(0.067") A LTD521/25-XX-PF LIGITEK F B G E C D DP 4.1±0.5 Ø0.51 TYP 2.54X13=33.02(1.3") PIN NO.1 Note : 1.All dimension are in millimeters and (lnch) tolerance is ± 0.25(0.01") unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LTD521/25-XX-PF Page 2/9 Internal Circuit Diagram LTD5215-XX-PF 25 24 4 2 1 27 28 5 21 20 8 7 6 23 22 9 16 15 13 11 10 17 12 14 A DIG.1 B C 3,26 D E F G DP A DIG.2 B C 19 D E F G DP A DIG.3 B C 18 D E F G DP LTD5225-XX-PF 25 24 4 2 1 27 28 5 21 20 8 7 6 23 22 9 16 15 13 11 10 17 12 14 A DIG.1 B C 3,26 D E F G DP A DIG.2 B C 19 D E F G DP A DIG.3 B C 18 D E F G DP LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LTD521/25-XX-PF Page 3/9 Electrical Connection PIN NO. LTD5215-XX-PF PIN NO. LTD5215-XX-PF 1 Anode Dig.1 E 15 Anode Dig.3 B 2 Anode Dig.1 D 16 Anode Dig.3 A 3 Common Cathode Dig.1 17 Anode Dig.3 F 4 Anode Dig.1 C 18 Common Cathode Dig.3 5 Anode Dig.1 DP 19 Common Cathode Dig.2 6 Anode Dig.2 E 20 Anode Dig.2 B 7 Anode Dig.2 D 21 Anode Dig.2 A 8 Anode Dig.2 C 22 Anode Dig.2 G 9 Anode Dig.2 DP 23 Anode Dig.2 F 10 Anode Dig.3 E 24 Anode Dig.1 B 11 Anode Dig.3 D 25 Anode Dig.1 A 12 Anode Dig.3 G 26 Common Cathode Dig.1 13 Anode Dig.3 C 27 Anode Dig.1 F 14 Anode Dig.3 DP 28 Anode Dig.1 G LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LTD521/25-XX-PF Page 4/9 Electrical Connection PIN NO. LTD5225-XX-PF PIN NO. LTD5225-XX-PF 1 Cathode Dig.1 E 15 Cathode Dig.3 B 2 Cathode Dig.1 D 16 Cathode Dig.3 A 3 Common Anode Dig.1 17 Cathode Dig.3 F 4 Cathode Dig.1 C 18 Common Anode Dig.3 5 Cathode Dig.1 DP 19 Common Anode Dig.2 6 Cathode Dig.2 E 20 Cathode Dig.2 B 7 Cathode Dig.2 D 21 Cathode Dig.2 A 8 Cathode Dig.2 C 22 Cathode Dig.2 G 9 Cathode Dig.2 DP 23 Cathode Dig.2 F 10 Cathode Dig.3 E 24 Cathode Dig.1 B 11 Cathode Dig.3 D 25 Cathode Dig.1 A 12 Cathode Dig.3 G 26 Common Anode Dig.1 13 Cathode Dig.3 C 27 Cathode Dig.1 F 14 Cathode Dig.3 DP 28 Cathode Dig.1 G LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/9 PART NO. LTD521/25-XX-PF Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT SR Forward Current Per Chip IF 30 mA Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) IFP 100 mA Power Dissipation Per Chip PD 100 mW Ir 10 μA Operating Temperature Topr -25 ~ +85 ℃ Storage Temperature Tstg -25 ~ +85 ℃ Reverse Current Per Any Chip Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃ Part Selection And Application Information(Ratings at 25℃) common cathode Material Emitted or anode CHIP PART NO △λ Iv(mcd) Vf(v) (nm) IV-M Min. Typ. Max. Min. Typ. Common Cathode LTD5215-XX-PF GaAlAs LTD5225-XX-PF Electrical λP (nm) 660 Red 20 1.5 1.8 Common Anode Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ± 15% testing tolerance. 2.4 4.0 6.1 2:1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 6/9 PART NO. LTD521/25-XX-PF Test Condition For Each Parameter Symbol Unit Test Condition Forward Voltage Per Chip Vf volt If=20mA Luminous Intensity Per Chip Iv mcd If=10mA Peak Wavelength λp nm If=20mA △λ nm If=20mA Ir μA Vr=5V Parameter Spectral Line Half-Width Reverse Current Any Chip Luminous Intensity Matching Ratio IV-M LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LTD521/25-XX-PF Page 7/9 Typical Electro-Optical Characteristics Curve SR CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 2.5 2.0 1.5 1.0 0.5 0.0 0.1 1.0 2.0 3.0 4.0 1.0 5.0 10 Fig.4 Relative Intensity vs. Temperature 1.2 Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Fig.3 Forward Voltage vs. Temperature 1.1 1.0 0.9 0.8 -20 0 20 40 60 80 100 Relative Intensity@20mA Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 650 700 Wavelength (nm) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 Ambient Temperature( ℃) Ambient Temperature( ℃) 600 1000 Forward Current(mA) Forward Voltage(V) -40 100 750 80 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LTD521/25-XX-PF Page 8/9 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One Time) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260° C 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2° C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260° C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C Temp(°C) 260° C3sec Max 260° 5° /sec max 120° 25° 0° 0 2° /sec max Preheat 60 Seconds Max 50 100 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 9/9 PART NO. LTD521/25-XX-PF Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. Thermal Shock Test 1.Ta=105 ℃±5 ℃&-40 ℃±5 ℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11