LIGITEK LG-110DBK-9UG-CT

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
LED SMD
Pb
Lead-Free Parts
LG-110DBK/9UG-CT
DATA SHEET
DOC. NO :
QW0905-LG-110DBK/9UG-CT
REV.
:
A
DATE
:
21 - May - 2009
發行
立碁電子
DCC
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LG-110DBK/9UG-CT
Page 1/11
Features:
1. Package in 8.0mm carrier tape on 7" diameter reel.
2. Compatible with automatic placement equipment.
3. Compatible with reflow solder process.
Descriptions:
1. The LG-110DBK/9UG SMD Taping is much smaller than
lead frame type components, thus enable smaller
board size, higher packing density, reduced storage
space and finally smaller equipment to be obtained.
2. Besides, lightweight makes them ideal for miniature
applications. etc.
Applications:
1. Automotive : backlighting in dashboard and switch.
2. Telecommunication : indicator and backlighting in telephone and fax.
3. Flat backlight for LCD, switch and symbol
4. General use.
Device Selection Guide:
COLOR
PART NO
LG-110DBK/9UG-CT
MATERIAL
Emitted
InGaN/GaN
Blue
AlGaInP
Green
Lens
Water Clear
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PART NO. LG-110DBK/9UG-CT
Page 2/11
Package Dimensions
1.5
Cathode
Mark
1.0
0.5
1
2
Resin
2
1
0.6
0.8
0.6
4
3.2
DIE2
DIE1
0.6
0.6
3
Soldering
Terminal
4
0.4
4
0.4
PCB
1,2
9UG
DBK
4
3
Note : 1.All dimension are in millimeter tolerance is ±0.1mm unless otherwise noted.
2.Specifications are subject to change without notice.
Recommended Soldering Pad Dimensions
1.0
0.9
Cathode
1,2
5.0
1.5
4 1.0
1.5
3
1.0
Note : The tolerances unless mentioned is ±0.1mm,Angle ±0.5. Unit=mm.
3
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 3/11
PART NO. LG-110DBK/9UG-CT
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Parameter
Symbol
UNIT
DBK
9UG
Power Dissipation
PD
80
78
mW
Peak Forward Current
Duty 1/10@10KHz
IFP
100
60
mA
Forward Current
IF
20
30
mA
Reverse Current @5V
Ir
50
10
μA
Electrostatic Discharge
ESD
150
2000
V
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +90
℃
Soldering Temperature
Tsol
Max 260 ℃ for 5 sec Max
Typical Electrical & Optical Characteristics (Ta=25 ℃)
Items
Luminous Intensity
Peak Wavelength
Dominant Wavelength
Spectral Line Half-Width
Forward Voltage
Viewing Angle
Symbol
Min. Typ.
Max. UNIT
DBK
20
50
----
9UG
20
40
----
DBK ----
465
----
9UG ----
575
----
DBK ----
470
----
9UG ----
574
----
DBK ----
30
----
9UG ----
20
----
DBK ----
3.5
4.0
9UG 1.7
----
2.6
DBK ----
120
----
9UG ----
120
----
Iv
λP
λD
△λ
VF
2θ 1/2
CONDITION
mcd
IF=20mA
nm
IF=20mA
nm
IF=20mA
nm
IF=20mA
V
IF=20mA
deg
IF=20mA
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Page 4/11
PART NO. LG-110DBK/9UG-CT
Typical Electro-Optical Characteristics Curve
DBK CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1
01
2.5
2.0
1.5
1.0
0.5
0.0
1.0
2.0
3.0
4.0
5.0
1
10
Fig.4 Relative Intensity vs. Temperature
1.2
Relative Intensity@20mA
Normalize @25 ℃
Forward Voltage@20mA
Normalize @25 ℃
Fig.3 Forward Voltage vs. Temperature
1.1
1.0
0.9
0.8
-20
0
20
40
60
80
100
Relative Intensity@20mA
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
450
500
Wavelength (nm)
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
80
Ambient Temperature( ℃)
Ambient Temperature( ℃)
400
1000
Forward Current(mA)
Forward Voltage(V)
-40
100
550
Fig.6 Directive Radiation
100
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Page 5/11
PART NO. LG-110DBK/9UG-CT
Typical Electro-Optical Characteristics Curve
9UG CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
0.1
2.5
2.0
1.5
1.0
0.5
0
2.0
1.0
3.0
4.0
5.0
10
1.0
1.2
1.1
1.0
0.9
0.8
0
20
40
60
80
100
Relative Intensity @20mA
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0
550
600
Wavelength (nm)
3.0
2.5
2.0
1.5
1.0
0.5
0
-40
-20
0
20
40
60
80
Ambient Temperature( ℃)
Ambient Temperature( ℃)
500
Fig.4 Relative Intensity vs. Temperature
Relative Intensity @20mA
Normalize @25 ℃
Forward Voltage@20mA
Normaliz @25 ℃
Fig.3 Forward Voltage vs. Temperature
-20
1000
Forward Current(mA)
Forward Voltage(V)
-40
100
650
Fig.6 Directive Radiation
100
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Page 6/11
PART NO. LG-110DBK/9UG-CT
Carrier Tape Dimensions
4.0±0.2
0.25
2.0
1.5
1.75
3.5±0.2
8.0±0.3
5.3
3.4
Polarity
1.25
4.0±0.2
1.87
Note : The tolerances unless mentioned is ±0.1mm,Angle ± 0.5. Unit=mm.
• Packing Specifications
Label
Aluminum Moist-Proof bag
Label
Part No.
Description
Quantity/Reel
LG-110DBK/9UG-CT
8.0mm tape,7"reel
3000 devices
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 7/11
PART NO. LG-110DBK/9UG-CT
Label Explanation
立碁電子工業股份有限公司
LIGITEK LED
LIGITEK ELECTRONICS CO., LTD.
BIN M : Blue Chip Luminous Intensity
Pb
BIN N : Green Chip Luminous Intensity
PART NO. : LG-110DBK/9UG-CT
HUE 0B : Blue Chip Dominant Wavelength
LOT NO. : 93000446
Q'TY(PCS) : 3000 PCS
HUE 8 : Green Chip Dominant Wavelength
VF:2.8 - 3.6
BIN/HUE : M/0B-N/8
VF:1.8 - 2.6
2.8 - 3.6 : Forward Voltage
Color Code For Visible SMD
Brighness Code For Visible SMD
(mcd) at 20mA
Group
Group
M
MIN
MAX
20
32
DBK
(nm) at 20mA
MIN
MAX
OD
465
468
OC
468
471
OB
471
474
DBK
N
32
50
M
20
32
OA
474
477
N
32
50
7
568
570
8
570
572
9
572
574
10
574
576
11
576
578
9UG
9UG
Reel Dimensions
0.2
0.4
0.8
0.8
0.6
0.2
0.4
0.6
2.0±0.5
178±1.5
6.0±1.0
9.0±1.0
ψ13.5±1.0
12.0±1.0
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LG-110DBK/9UG-CT
Page 8/11
Box Explanation
1. 5 BAG / INNER BOX
2. INNER BOX SIZE : L X W X H 23cm X 8.5cm x 26cm
H
W
L
3. 10 INNER BOXES / CARTON
4. CARTON SIZE : L X W X H 49cm X 46cm x 29cm
L
W
H
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LG-110DBK/9UG-CT
Page 9/11
Recommended Soldering Conditions
1. Hand Solder
Basic spec is ≦ 280℃ 3 sec one time only.
2. Wave Solder
Soldering heat Max. 260 ℃
245±5℃ within 5 sec
Preheat
120 ~ 150℃
120 ~ 180 sec
3-1. LEAD Reflow Solder
Temp.
( ℃)
240
Rising
+5℃/sec
Cooling
-5℃/sec
Preheat
150
120
60 ~ 120 sec
Time
5sec
3-2 PB-Free Reflow Solder
1~5° C/sec
Preheat
180~200° C
1~5° C/sec
260° C MaX.
10sec.Max
Above 220° C
60 sec.Max.
120 sec.Max.
Reflow Soldering should not be done more than two times.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LG-110DBK/9UG-CT
Page 10/11
Precautions For Use:
Storage time:
1.The operation of Temperatures and RH are : 5 ℃~35 ℃,RH60%.
2.Once the package is opened, the products should be used within a week.
Otherwise, they should be kept in a damp proof box with descanting agent.
Considering the tape life, we suggest our customers to use our products within
a year(from production date).
3.If opened more than one week in an atmosphere 5 ℃ ~ 35 ℃,RH60%,
they should be treated at 60 ℃±5 ℃fo r 15hrs.
Drive Method:
LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into
the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series
with the LED.
Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd
current should not be allowed to change by more than 40 % of its desired value.
Circuit model A
Circuit model B
LED
LED
(A) Recommended circuit.
(B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED.
Cleaning:
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED.
ESD(Electrostatic Discharge):
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
glove is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LG-110DBK/9UG-CT
Page 11/11
Reliability Test:
Classification
Test Item
Test Condition
Reference
Standard
Operating Life Test
1.Ta=Under Room Temperature As Per Data Sheet
Maximum Rating.
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-750D: 1026
MIL-STD-883D: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883D:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5 ℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
High Temperature
High Humidity
Storage Test
1.Ta=65 ℃±5 ℃
2.RH=90 %~95%
3.t=1000hrs ±2hrs
Endurance
Test
Thermal Shock Test
Solderability Test
Environmental
Test
Temperature
Cycling
IR Reflow
1.Ta=105 ℃±5℃&-40 ℃±5℃
(10min)
(10min)
2.total 10 cycles
1.T.Sol=235 ℃±5℃
2.Immersion time 2 ±0.5sec
3.Coverage ≧95% of the dipped surface
1.105 ℃ ~ 25℃ ~ -55 ℃ ~ 25 ℃
30mins 5mins 30mins 5mins
2.10 Cyeles
1.T=260 ° C Max. 10sec.Max.
2. 6 Min
MIL-STD-202F:103B
JIS C 7021: B-11
MIL-STD-202F: 107D
MIL-STD-750D: 1051
MIL-STD-883D: 1011
MIL-STD-202F: 208D
MIL-STD-750D: 2026
MIL-STD-883D: 2003
IEC 68 Part 2-20
JIS C 7021: A-2
MIL-STD-202F: 107D
MIL-STD-750D: 1051
MIL-STD-883D: 1010
JIS C 7021: A-4
MIL-STD-750D:2031.2
J-STD-020