LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LED SMD Pb Lead-Free Parts LG-110DBK/DUV-CT DATA SHEET DOC. NO : QW0905-LG-110DBK/DUV-CT REV. : A DATE : 17 - Jul - 2007 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/11 PART NO. LG-110DBK/DUV-CT Features: 1. Package in 8.0mm carrier tape on 7" diameter reel. 2. Compatible with automatic placement equipment. 3. Compatible with reflow solder process. Descriptions: 1. The LG-110DBK/DUV SMD Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. 2. Besides, lightweight makes them ideal for miniature applications. etc. Applications: 1. Automotive : backlighting in dashboard and switch. 2. Telecommunication : indicator and backlighting in telephone and fax. 3. Flat backlight for LCD, switch and symbol 4. General use. Device Selection Guide: PART NO LG-110DBK/DUV-CT MATERIAL COLOR Emitted InGaN/GaN Blue InGaN/GaN Violet Lens Water Clear LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-110DBK/DUV-CT Page 2/11 Package Dimensions 1.5 Cathode Mark 1.0 0.5 1 2 Resin 2 1 0.6 0.8 0.6 4 3.2 DIE2 DIE1 0.6 0.6 3 Soldering Terminal 4 0.4 4 0.4 PCB 1,2 DUV DBK 4 3 Note : 1.All dimension are in millimeter tolerance is ±0.1mm unless otherwise noted. 2.Specifications are subject to change without notice. Recommended Soldering Pad Dimensions 1.0 0.9 Cathode 1,2 5.0 1.5 4 1.0 1.5 3 1.0 Note : The tolerances unless mentioned is ±0.1mm,Angle ±0.5. Unit=mm. 3 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-110DBK/DUV-CT Page 3/11 Absolute Maximum Ratings at Ta=25 ℃ Ratings Parameter Symbol UNIT DBK DUV Power Dissipation PD 80 80 mW Peak Forward Current Duty 1/10@10KHz IFP 100 100 mA Forward Current IF 20 20 mA Reverse Current @5V Ir 50 50 μA Electrostatic Discharge ESD 150 150 V Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +90 ℃ Soldering Temperature Tsol Max 260 ℃ for 5 sec Max Typical Electrical & Optical Characteristics (Ta=25 ℃) Items Luminous Intensity Peak Wavelength Dominant Wavelength Spectral Line Half-Width Forward Voltage Viewing Angle Symbol Min. Typ. Max. UNIT DBK 50 125 ---- DUV 0.5 1.25 ---- DBK ---- 465 ---- DUV ---- 400 ---- DBK ---- 470 ---- DUV ---- ---- ---- DBK ---- 30 ---- DUV ---- 20 ---- DBK ---- 3.5 4.0 DUV ---- 3.5 4.0 DBK ---- 120 ---- DUV ---- 120 ---- Iv λP λD △λ VF 2θ 1/2 CONDITION mcd IF=20mA nm IF=20mA nm IF=20mA nm IF=20mA V IF=20mA deg IF=20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-110DBK/DUV-CT Page 4/11 Typical Electro-Optical Characteristics Curve DBK CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1 01 2.5 2.0 1.5 1.0 0.5 0.0 1.0 2.0 3.0 4.0 5.0 1 10 1.2 1.1 1.0 0.9 0.8 0 20 40 60 80 100 Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 400 450 500 Wavelength (nm) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 Ambient Temperature( ℃) Ambient Temperature( ℃) Relative Intensity@20mA Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25 ℃ Forward Voltage@20mA Normalize @25 ℃ Fig.3 Forward Voltage vs. Temperature -20 1000 Forward Current(mA) Forward Voltage(V) -40 100 550 Fig.6 Directive Radiation 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-110DBK/DUV-CT Page5/11 Typical Electro-Optical Characteristics Curve DUV CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vsForward Current 3.9 2.5 3.8 2.0 Relative Intensity Normalize @20mA Forward Voltage(V) 3.7 3.6 3.5 3.4 3.3 3.2 1.5 1.0 0.5 0 3.1 20 30 40 50 60 70 80 90 20 100 30 40 50 60 70 80 90 100 Forward Current(mA) Forward Current(mA) Fig.3 Forward Current vs. Wavelength Fig.4 Relative Intensity vs. Wavelength Relative Intensity@20mA 1.0 Wavelength(nm)WLP 420 410 400 390 380 20 40 60 80 Forward Current(mA) Fig.5 Directive Radiation 100 0.5 0.0 350 400 450 Wavelength (nm) 550 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-110DBK/DUV-CT Page 6/11 Carrier Tape Dimensions 4.0±0.2 0.25 2.0 1.5 1.75 3.5±0.2 8.0±0.3 5.3 3.4 Polarity 1.25 4.0±0.2 1.87 Note : The tolerances unless mentioned is ±0.1mm,Angle ± 0.5. Unit=mm. • Packing Specifications Label Aluminum Moist-Proof bag Label Part No. Description Quantity/Reel LG-110DBK/DUV-CT 8.0mm tape,7"reel 3000 devices LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-110DBK/DUV-CT Page 7/11 Label Explanation 立碁電子工業股份有限公司 LIGITEK LED LIGITEK ELECTRONICS CO., LTD. BIN Q : Blue Chip Luminous Intensity Pb BIN E : Violet Chip Luminous Intensity PART NO. : LG-110DBK/DUV-CT HUE 0B : Blue Chip Dominant Wavelength LOT NO. : 92000363 Q'TY(PCS) : 3000 PCS BIN/HUE : Q/0B-E/400 HUE 400 : Violet Chip Dominant Wavelength VF:2.8 - 3.6 VF:2.8 - 3.6 2.8 - 3.6 : Forward Voltage Reel Dimensions 0.2 0.4 0.8 0.8 0.6 0.2 0.4 0.6 2.0 ±0.5 178±1.5 60±1.0 9.0 ±1.0 ψ13.5 ±1.0 12.0 ±1.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 8/11 PART NO. LG-110DBK/DUV-CT Box Explanation 1. 5 BAG / INNER BOX 2. INNER BOX SIZE : L X W X H 23cm X 8.5cm x 26cm H W L 3. 10 INNER BOXES / CARTON 4. CARTON SIZE : L X W X H 49cm X 46cm x 29cm L W H LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-110DBK/DUV-CT Page 9/11 Recommended Soldering Conditions 1. Hand Solder Basic spec is ≦ 280 ℃ 3 sec one time only. 2. Wave Solder Soldering heat Max. 260 ℃ 245±5℃ within 5 sec Preheat 120 ~ 150 ℃ 120 ~ 180 sec 3-1. LEAD Reflow Solder Temp. ( ℃) 240 Rising +5℃/sec Cooling -5℃/sec Preheat 150 120 60 ~ 120 sec Time 5sec 3-2 PB-Free Reflow Solder 1~5° C/sec 1~5°C/sec Preheat 180~200°C 260°C MaX. 10sec.Max Above 220° C 60 sec.Max. 120 sec.Max. Reflow Soldering should not be done more than two times. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 10/11 PART NO. LG-110DBK/DUV-CT Precautions For Use: Storage time: 1.The operation of Temperatures and RH are : 5 ℃~35 ℃,RH60%. 2.Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with descanting agent. Considering the tape life, we suggest our customers to use our products within a year at ＜30 ℃ and ＜90% relative humidity(RH) (from production date). 3.If opened more than one week in an atmosphere 5 ℃ ~ 35 ℃,RH60%, they should be treated at 60 ℃±5 ℃fo r 15hrs. Drive Method: LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series with the LED. Consider worst case voltage variations than could occur across the current limiting resistor. The forward current should not be allowed to change by more than 40 % of its desired value. Circuit model A Circuit model B LED LED (A) Recommended circuit. (B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED. Cleaning: Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED. ESD(Electrostatic Discharge): Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-110DBK/DUV-CT Page 11/11 Reliability Test: Classification Test Item Test Condition Reference Standard Operating Life Test 1.Ta=Under Room Temperature As Per Data Sheet Maximum Rating. 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) MIL-STD-750D: 1026 MIL-STD-883D: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) MIL-STD-883D:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) JIS C 7021: B-12 High Temperature High Humidity Storage Test 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=1000hrs ±2hrs Endurance Test Thermal Shock Test Solderability Test Environmental Test Temperature Cycling IR Reflow 1.Ta=105 ℃±5℃&-40 ℃± 5℃ (10min) (10min) 2.total 10 cycles 1.T.Sol=235 ℃±5℃ 2.Immersion time 2 ±0.5sec 3.Coverage ≧95% of the dipped surface 1.105℃ ~ 25℃ ~ -55℃ ~ 25℃ 30mins 5mins 30mins 5mins 2.10 Cyeles 1.T=260° C Max. 10sec.Max. 2. 6 Min MIL-STD-202F:103B JIS C 7021: B-11 MIL-STD-202F: 107D MIL-STD-750D: 1051 MIL-STD-883D: 1011 MIL-STD-202F: 208D MIL-STD-750D: 2026 MIL-STD-883D: 2003 IEC 68 Part 2-20 JIS C 7021: A-2 MIL-STD-202F: 107D MIL-STD-750D: 1051 MIL-STD-883D: 1010 JIS C 7021: A-4 MIL-STD-750D:2031.2 J-STD-020