LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only TAPE AND REEL TYPE LED LAMPS LPT3323/TRS-1 DATA SHEET DOC. NO : QW0905- LPT3323/TRS-1 REV. : A DATE : 29 - Apr. - 2006 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LPT3323/TRS-1 Page 1/3 Package Dimension P2 H2 5.0 5.9 7.6 8.6 ΔH W2 H1 12.5MIN L W0 1.EMITTER 2.COLLECTOR W1 W3 1.0MIN 2.3TYP 1 2 D P1 F - + P T Note:1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted 2.Specifications are subject to change without notice Features . High illumination sensitivity . Stable characteristics . Spectrally and mechanically matched with IR emitter Description The LPT3323/TRS-1 series are silicon nitride passivated NPN planar phototransistors with exceptionally table characteristics and igh illumination sensitivity the cases of LPT3323/TBS-1 are ncapsulated in water clear plastic T1 3/4 package individuallt •MAXIMUM RATINGS(Ta=25℃) MAXIMUM RATINGS UNIT 100 mw Collector-Emitter Voltage 30 V Emitter-Collector Voltage 5 V PARAMETER Power Dissipation Operating Temperature -50℃ TO +100℃ Storage Temperature -50℃ TO +100℃ 260℃ for 5 seconds Lead Soldering Temperature(1.6mm From Body) •ELECTRICAL CHARACTERISTICS(Ta=25℃) Typ. UNIT TEST CONDITION 30 V Ic=1mA Ee=0mw/c㎡ 5 V IE=100μA Ee=0mw/c㎡ V Ic=0.5mA Ee=20mw/c㎡ PARAMETER SYMBOL Min. Collector-Emitter Breakdown Voltage V(BR)CEO Emitter-Collector Breakdown Voltage V(BR)ECO Collector-Emitter Saturation Voltage VCE(sat) Max. 0.4 Rise Time Tr 5 μs Fall Time Tf 5 μs Collector Dark Current On State Collector Current ICEO Ip(on) 100 nA 1 2 mA 2 4 mA 4 8 mA 8 mA VCE =30V IC=800μA,RL=1K Ω VCE =10V Ee=0mw/c㎡ VCE =5v Ee=1mw/c㎡ λP=940nm LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LPT3323/TRS-1 Page 2/3 •Dimensions Symbol Information SPECIFICATIONS OPTION SYMBOL CODE SYMBOL ITEMS Minimum Maximum mm inch mm inch Tape Feed Hole Diameter ------- D 3.8 0.15 4.2 0.17 Component Lead Pitch ------- F 2.3 0.09 3.0 0.12 Front-To-Rear Deflection ------- △H ------- ------- 2.0 0.08 17.5 0.69 18.5 0.73 ------- ------- 36 1.42 11.0 0.43 TRS-1 Feed Hole To Bottom Of Component H1 Feed Hole To Overall Component Height ------- H2 Lead Length After Component Height ------- L Feed Hole Pitch ------- P 12.4 0.49 13.0 0.51 Lead Location ------- P1 4.4 0.17 5.8 0.23 Center Of Component Location ------- P2 5.1 0.2 7.7 0.3 Overall Taped Package Thickness ------- T ------- ------- 1.42 0.06 Feed Hole Location ------- W0 8.5 0.33 9.75 0.38 Adhesive Tape Width ------- W1 14.5 0.57 15.5 0.61 Adhesive Tape Position ------- W2 0 0 4.0 0.16 Tape Width ------- W3 17.5 0.69 19.0 0.75 W0 REMARK:TRS=Tape And Reel Straight Leads • Dimensions Symbol Information • Package Dimensions Specification Description Symbol minimum maxmum D3 mm inch mm inch 3.08 380 14.96 Reel Diameter D 78.2 Core Diameter D1 34.9 1.37 102 4.02 Hub Recess Inside Diameter D2 28.6 1.13 88.0 3.46 Arbor Hole Diameter D3 13.8 0.54 38.1 1.5 Overall Reel Thickness T2 57.2 2.25 Iside Reel Flange Thickness T1 50.0 1.97 Quantity/Reel 30.0 1.18 1000PCS MARKING D2 D1 T1 T2 D LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LPT3323/TRS-1 Page 3/3 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=85 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5 ℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5 ℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11