LIGITEK LPT3323-TRS-1

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
TAPE AND REEL TYPE LED LAMPS
LPT3323/TRS-1
DATA SHEET
DOC. NO :
QW0905- LPT3323/TRS-1
REV.
:
A
DATE
:
29 - Apr. - 2006
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO.LPT3323/TRS-1
Page 1/3
Package Dimension
P2
H2
5.0
5.9
7.6
8.6
ΔH
W2
H1
12.5MIN
L W0
1.EMITTER
2.COLLECTOR
W1 W3
1.0MIN
2.3TYP
1 2
D
P1
F
- +
P
T
Note:1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted
2.Specifications are subject to change without notice
Features
. High illumination sensitivity
. Stable characteristics
. Spectrally and mechanically
matched with IR emitter
Description
The LPT3323/TRS-1 series are silicon nitride passivated
NPN planar phototransistors with exceptionally table
characteristics and igh illumination sensitivity the cases of
LPT3323/TBS-1 are ncapsulated in water clear plastic T1 3/4
package individuallt
•MAXIMUM RATINGS(Ta=25℃)
MAXIMUM RATINGS
UNIT
100
mw
Collector-Emitter Voltage
30
V
Emitter-Collector Voltage
5
V
PARAMETER
Power Dissipation
Operating Temperature
-50℃ TO +100℃
Storage Temperature
-50℃ TO +100℃
260℃ for 5 seconds
Lead Soldering Temperature(1.6mm From Body)
•ELECTRICAL CHARACTERISTICS(Ta=25℃)
Typ.
UNIT
TEST CONDITION
30
V
Ic=1mA
Ee=0mw/c㎡
5
V
IE=100μA
Ee=0mw/c㎡
V
Ic=0.5mA
Ee=20mw/c㎡
PARAMETER
SYMBOL
Min.
Collector-Emitter
Breakdown Voltage
V(BR)CEO
Emitter-Collector
Breakdown Voltage
V(BR)ECO
Collector-Emitter
Saturation Voltage
VCE(sat)
Max.
0.4
Rise Time
Tr
5
μs
Fall Time
Tf
5
μs
Collector Dark
Current
On State Collector
Current
ICEO
Ip(on)
100
nA
1
2
mA
2
4
mA
4
8
mA
8
mA
VCE =30V
IC=800μA,RL=1K Ω
VCE =10V
Ee=0mw/c㎡
VCE =5v
Ee=1mw/c㎡
λP=940nm
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO.LPT3323/TRS-1
Page 2/3
•Dimensions Symbol Information
SPECIFICATIONS
OPTION
SYMBOL
CODE
SYMBOL ITEMS
Minimum
Maximum
mm
inch
mm
inch
Tape Feed Hole Diameter
-------
D
3.8
0.15
4.2
0.17
Component Lead Pitch
-------
F
2.3
0.09
3.0
0.12
Front-To-Rear Deflection
-------
△H
-------
-------
2.0
0.08
17.5
0.69
18.5
0.73
-------
-------
36
1.42
11.0
0.43
TRS-1
Feed Hole To Bottom Of Component
H1
Feed Hole To Overall Component Height
-------
H2
Lead Length After Component Height
-------
L
Feed Hole Pitch
-------
P
12.4
0.49
13.0
0.51
Lead Location
-------
P1
4.4
0.17
5.8
0.23
Center Of Component Location
-------
P2
5.1
0.2
7.7
0.3
Overall Taped Package Thickness
-------
T
-------
-------
1.42
0.06
Feed Hole Location
-------
W0
8.5
0.33
9.75
0.38
Adhesive Tape Width
-------
W1
14.5
0.57
15.5
0.61
Adhesive Tape Position
-------
W2
0
0
4.0
0.16
Tape Width
-------
W3
17.5
0.69
19.0
0.75
W0
REMARK:TRS=Tape And Reel Straight Leads
• Dimensions Symbol Information
• Package Dimensions
Specification
Description
Symbol
minimum
maxmum
D3
mm
inch
mm
inch
3.08
380
14.96
Reel Diameter
D
78.2
Core Diameter
D1
34.9
1.37
102
4.02
Hub Recess Inside Diameter
D2
28.6
1.13
88.0
3.46
Arbor Hole Diameter
D3
13.8
0.54
38.1
1.5
Overall Reel Thickness
T2
57.2
2.25
Iside Reel Flange Thickness
T1
50.0
1.97
Quantity/Reel
30.0
1.18
1000PCS
MARKING
D2
D1
T1
T2
D
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO.LPT3323/TRS-1
Page 3/3
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=85 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5℃
2.RH=90 %~95%
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hours.
1.Ta=105 ℃±5℃&-40 ℃±5℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5 ℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5 ℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11